TWI646183B - 研磨組合物及印刷電路板之製造方法 - Google Patents

研磨組合物及印刷電路板之製造方法 Download PDF

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Publication number
TWI646183B
TWI646183B TW103138577A TW103138577A TWI646183B TW I646183 B TWI646183 B TW I646183B TW 103138577 A TW103138577 A TW 103138577A TW 103138577 A TW103138577 A TW 103138577A TW I646183 B TWI646183 B TW I646183B
Authority
TW
Taiwan
Prior art keywords
polishing
copper
mass
polishing composition
printed circuit
Prior art date
Application number
TW103138577A
Other languages
English (en)
Chinese (zh)
Other versions
TW201527508A (zh
Inventor
西澤秀明
森山和樹
Original Assignee
霓塔哈斯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 霓塔哈斯股份有限公司 filed Critical 霓塔哈斯股份有限公司
Publication of TW201527508A publication Critical patent/TW201527508A/zh
Application granted granted Critical
Publication of TWI646183B publication Critical patent/TWI646183B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW103138577A 2013-11-06 2014-11-06 研磨組合物及印刷電路板之製造方法 TWI646183B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013230167A JP6400897B2 (ja) 2013-11-06 2013-11-06 研磨組成物
JP2013-230167 2013-11-06

Publications (2)

Publication Number Publication Date
TW201527508A TW201527508A (zh) 2015-07-16
TWI646183B true TWI646183B (zh) 2019-01-01

Family

ID=53041484

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103138577A TWI646183B (zh) 2013-11-06 2014-11-06 研磨組合物及印刷電路板之製造方法

Country Status (5)

Country Link
JP (1) JP6400897B2 (ja)
KR (1) KR102308637B1 (ja)
CN (1) CN105637986B (ja)
TW (1) TWI646183B (ja)
WO (1) WO2015068707A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015209523A (ja) * 2014-04-30 2015-11-24 株式会社フジミインコーポレーテッド 有機膜研磨用組成物および研磨方法
JP7057662B2 (ja) * 2017-12-26 2022-04-20 ニッタ・デュポン株式会社 研磨組成物、及び、研磨速度を調整する方法
JP7064870B2 (ja) * 2017-12-26 2022-05-11 ニッタ・デュポン株式会社 研磨組成物
KR20200128679A (ko) 2018-03-15 2020-11-16 니타 듀폰 가부시키가이샤 연마 조성물
JP7220532B2 (ja) * 2018-07-31 2023-02-10 ニッタ・デュポン株式会社 研磨用スラリー
WO2022185793A1 (ja) * 2021-03-03 2022-09-09 株式会社フジミインコーポレーテッド 研磨用組成物およびこれを用いた研磨方法
CN115975510B (zh) * 2022-12-30 2023-10-31 江苏山水半导体科技有限公司 一种硅抛光液的制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101177592A (zh) * 2003-09-30 2008-05-14 福吉米株式会社 抛光组合物
TW201042018A (en) * 2009-02-24 2010-12-01 Nitta Haas Inc Composition for metal polishing

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004179294A (ja) * 2002-11-26 2004-06-24 Hitachi Chem Co Ltd 研磨液及び研磨方法
DE10313517B4 (de) * 2003-03-25 2006-03-30 Atotech Deutschland Gmbh Lösung zum Ätzen von Kupfer, Verfahren zum Vorbehandeln einer Schicht aus Kupfer sowie Anwendung des Verfahrens
US7485162B2 (en) * 2003-09-30 2009-02-03 Fujimi Incorporated Polishing composition
KR20050109256A (ko) 2004-05-14 2005-11-17 한국과학기술원 버스형 연결과 센싱 데이터 피드백을 위한 ｒｃ서보장치
US20090056231A1 (en) * 2007-08-28 2009-03-05 Daniela White Copper CMP composition containing ionic polyelectrolyte and method
WO2010048139A2 (en) * 2008-10-21 2010-04-29 Advanced Technology Materials, Inc. Copper cleaning and protection formulations

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101177592A (zh) * 2003-09-30 2008-05-14 福吉米株式会社 抛光组合物
TW201042018A (en) * 2009-02-24 2010-12-01 Nitta Haas Inc Composition for metal polishing

Also Published As

Publication number Publication date
CN105637986B (zh) 2019-06-18
WO2015068707A1 (ja) 2015-05-14
KR20160082501A (ko) 2016-07-08
CN105637986A (zh) 2016-06-01
KR102308637B1 (ko) 2021-10-01
TW201527508A (zh) 2015-07-16
JP6400897B2 (ja) 2018-10-03
JP2015090922A (ja) 2015-05-11

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