TWI645914B - 用於基板之化學機械研磨之後段清潔該等基板之刷具、用於對半導體晶圓之表面進行化學機械研磨後段清潔之方法、及用於對晶圓進行化學機械研磨後段清潔之圓柱形泡沫滾筒 - Google Patents

用於基板之化學機械研磨之後段清潔該等基板之刷具、用於對半導體晶圓之表面進行化學機械研磨後段清潔之方法、及用於對晶圓進行化學機械研磨後段清潔之圓柱形泡沫滾筒 Download PDF

Info

Publication number
TWI645914B
TWI645914B TW104143352A TW104143352A TWI645914B TW I645914 B TWI645914 B TW I645914B TW 104143352 A TW104143352 A TW 104143352A TW 104143352 A TW104143352 A TW 104143352A TW I645914 B TWI645914 B TW I645914B
Authority
TW
Taiwan
Prior art keywords
protrusions
edge
central
brush
projections
Prior art date
Application number
TW104143352A
Other languages
English (en)
Chinese (zh)
Other versions
TW201615291A (zh
Inventor
克里斯多福 瓦歌
拉克許 辛
大衛 崔歐
艾瑞克 麥克納瑪拉
Original Assignee
美商恩特葛瑞斯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商恩特葛瑞斯股份有限公司 filed Critical 美商恩特葛瑞斯股份有限公司
Publication of TW201615291A publication Critical patent/TW201615291A/zh
Application granted granted Critical
Publication of TWI645914B publication Critical patent/TWI645914B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Brushes (AREA)
TW104143352A 2010-02-22 2011-02-22 用於基板之化學機械研磨之後段清潔該等基板之刷具、用於對半導體晶圓之表面進行化學機械研磨後段清潔之方法、及用於對晶圓進行化學機械研磨後段清潔之圓柱形泡沫滾筒 TWI645914B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US30658210P 2010-02-22 2010-02-22
US61/306,582 2010-02-22
US201061425644P 2010-12-21 2010-12-21
US61/425,644 2010-12-21

Publications (2)

Publication Number Publication Date
TW201615291A TW201615291A (zh) 2016-05-01
TWI645914B true TWI645914B (zh) 2019-01-01

Family

ID=44483614

Family Applications (2)

Application Number Title Priority Date Filing Date
TW104143352A TWI645914B (zh) 2010-02-22 2011-02-22 用於基板之化學機械研磨之後段清潔該等基板之刷具、用於對半導體晶圓之表面進行化學機械研磨後段清潔之方法、及用於對晶圓進行化學機械研磨後段清潔之圓柱形泡沫滾筒
TW100105743A TW201200256A (en) 2010-02-22 2011-02-22 Post-CMP cleaning brush

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW100105743A TW201200256A (en) 2010-02-22 2011-02-22 Post-CMP cleaning brush

Country Status (7)

Country Link
US (1) US20130048018A1 (enExample)
JP (1) JP5977175B2 (enExample)
KR (1) KR20130038806A (enExample)
CN (1) CN102792424A (enExample)
SG (1) SG183419A1 (enExample)
TW (2) TWI645914B (enExample)
WO (1) WO2011103538A2 (enExample)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4965253B2 (ja) 2003-08-08 2012-07-04 インテグリス・インコーポレーテッド 回転可能ベース上に鋳造されるモノリシック多孔性パッドを作製する方法および材料
US9202723B2 (en) 2011-11-29 2015-12-01 Illinois Tool Works, Inc. Brush with cantilevered nodules
US8778087B2 (en) 2012-04-03 2014-07-15 Illinois Tool Works Inc. Conical sponge brush for cleaning semiconductor wafers
US9704729B2 (en) * 2013-06-13 2017-07-11 K.C. Tech Co., Ltd. Substrate cleaning apparatus and method and brush assembly used therein
JP5685631B2 (ja) * 2013-09-04 2015-03-18 日東電工株式会社 光学フィルムの製造方法
JP6843621B2 (ja) * 2014-02-20 2021-03-17 インテグリス・インコーポレーテッド 目標とする高い洗浄性能を得るためのこぶの比率
JP6366544B2 (ja) 2014-07-04 2018-08-01 株式会社荏原製作所 洗浄装置及びロール洗浄部材
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
WO2016060712A1 (en) 2014-10-17 2016-04-21 Applied Materials, Inc. Cmp pad construction with composite material properties using additive manufacturing processes
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
WO2016067563A1 (ja) * 2014-10-31 2016-05-06 株式会社荏原製作所 基板洗浄ロール、基板洗浄装置、及び基板洗浄方法
US10271636B2 (en) * 2014-11-10 2019-04-30 Illinois Tool Works Inc. Archimedes brush for semiconductor cleaning
WO2016085703A1 (en) * 2014-11-24 2016-06-02 Corning Incorporated Method and apparatus for substrate surface cleaning
US9748090B2 (en) 2015-01-22 2017-08-29 Toshiba Memory Corporation Semiconductor manufacturing apparatus and manufacturing method of semiconductor device
JP6482891B2 (ja) * 2015-02-16 2019-03-13 日東電工株式会社 光学フィルムの製造方法
US10618141B2 (en) 2015-10-30 2020-04-14 Applied Materials, Inc. Apparatus for forming a polishing article that has a desired zeta potential
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
CN106583295B (zh) * 2016-12-23 2019-05-17 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） Cmp后清洗设备清洗刷同心卡接结构及使用方法
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
CN112654655A (zh) 2018-09-04 2021-04-13 应用材料公司 先进抛光垫配方
US10758946B2 (en) * 2019-01-23 2020-09-01 Tung An Development Ltd. Device of cleaning brush
US11694910B2 (en) * 2019-09-10 2023-07-04 Illinois Tool Works Inc. Brush with non-constant nodule density
US11470956B2 (en) 2020-03-06 2022-10-18 Applied Materials, Inc. Brush, method of forming a brush, and structure embodied in a machine readable medium used in a design process
CN113967888B (zh) * 2020-07-23 2022-06-24 长鑫存储技术有限公司 海绵刷的更换工具和安装方法、半导体化学机械抛光设备
WO2022115671A1 (en) * 2020-11-30 2022-06-02 Araca, Inc. Brush for cleaning a substrate
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
KR102727237B1 (ko) * 2021-08-20 2024-11-08 주식회사 브러쉬텍 웨이퍼 베벨 영역 세정용 브러쉬
US20230178360A1 (en) * 2021-12-06 2023-06-08 Tung An Development Ltd. Device Having Cleaning Bodies
KR102957850B1 (ko) * 2022-02-25 2026-04-28 삼성전자주식회사 기판 세정 장치 및 기판 세정 방법
CN115365183B (zh) * 2022-08-09 2024-05-17 重庆雄达铨瑛电子有限公司 一种铝箔化成自动生产线的清洗机构
KR20240024599A (ko) 2022-08-17 2024-02-26 삼성전자주식회사 기판 세정 장치 및 기판 세정 방법
TWI873778B (zh) * 2023-08-11 2025-02-21 碩晨生醫股份有限公司 清潔滾輪軸心
US12686035B2 (en) 2024-06-21 2026-07-21 Applied Materials, Inc. Chemical mechanical polisher cleaning unit

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1034091A (ja) * 1996-07-19 1998-02-10 Kanebo Ltd 洗浄用ローラ
US6299698B1 (en) * 1998-07-10 2001-10-09 Applied Materials, Inc. Wafer edge scrubber and method
JP2001358110A (ja) * 2000-06-13 2001-12-26 Hitachi Ltd スクラブ洗浄装置およびそれを用いた半導体装置の製造方法
US6616516B1 (en) * 2001-12-13 2003-09-09 Lam Research Corporation Method and apparatus for asymmetric processing of front side and back side of semiconductor substrates

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3403108B2 (ja) * 1999-02-26 2003-05-06 アイオン株式会社 洗浄用スポンジローラ
US6502273B1 (en) * 1996-11-08 2003-01-07 Kanebo, Ltd. Cleaning sponge roller
JP2009066527A (ja) * 2007-09-13 2009-04-02 Nec Electronics Corp 洗浄用ローラおよび洗浄装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1034091A (ja) * 1996-07-19 1998-02-10 Kanebo Ltd 洗浄用ローラ
US6299698B1 (en) * 1998-07-10 2001-10-09 Applied Materials, Inc. Wafer edge scrubber and method
JP2001358110A (ja) * 2000-06-13 2001-12-26 Hitachi Ltd スクラブ洗浄装置およびそれを用いた半導体装置の製造方法
US6616516B1 (en) * 2001-12-13 2003-09-09 Lam Research Corporation Method and apparatus for asymmetric processing of front side and back side of semiconductor substrates

Also Published As

Publication number Publication date
KR20130038806A (ko) 2013-04-18
TW201615291A (zh) 2016-05-01
CN102792424A (zh) 2012-11-21
SG183419A1 (en) 2012-09-27
WO2011103538A3 (en) 2011-11-17
WO2011103538A2 (en) 2011-08-25
JP2013520803A (ja) 2013-06-06
TW201200256A (en) 2012-01-01
JP5977175B2 (ja) 2016-08-24
US20130048018A1 (en) 2013-02-28

Similar Documents

Publication Publication Date Title
JP5977175B2 (ja) Ｃｍｐ後の洗浄ブラシ
TW201318779A (zh) 清潔基板之刷具
JP2013520803A5 (enExample)
US11694909B2 (en) Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method
JP4689241B2 (ja) スラリー利用度を高める溝を有する研磨パッド
JP6377758B2 (ja) 基板洗浄ロール、基板洗浄装置、及び基板洗浄方法
TWI670763B (zh) 一種用於在一化學機械研磨製程之後清潔晶圓之刷具與方法
JP7595907B2 (ja) 洗浄用スポンジローラ
CN102398212A (zh) 一种化学机械研磨设备
US12341015B2 (en) Apparatus for polishing a wafer and method for fabricating a semiconductor device using the same
US10758946B2 (en) Device of cleaning brush
KR101584427B1 (ko) 반도체 웨이퍼 세정용 브러쉬 유닛
JP2001009386A (ja) 基板洗浄装置
US11109667B2 (en) Device of bi-spiral cleaning brush
JP3221364U (ja) 掃除ばけ構造
TWM576921U (zh) Cleaning brush structure
US20120247508A1 (en) Brush and method for cleaning a substrate and scrubber employing the same
JP3225191U (ja) 清潔ブラシ構造
US20260060026A1 (en) Cleaning brush and wafer cleaning apparatus including the same
KR20200001954U (ko) 세척 솔의 장치
WO2022186227A1 (ja) ブラシローラ
KR20260037512A (ko) 기판 세정 브러시 및 이를 포함하는 기판 처리 장치.
TWM589004U (zh) 清潔刷具結構
KR20210000936U (ko) 이중-나선 세정 브러쉬 장치
KR20030057181A (ko) 막의 연마를 통한 파티클 제거방법