TWI645914B - 用於基板之化學機械研磨之後段清潔該等基板之刷具、用於對半導體晶圓之表面進行化學機械研磨後段清潔之方法、及用於對晶圓進行化學機械研磨後段清潔之圓柱形泡沫滾筒 - Google Patents

用於基板之化學機械研磨之後段清潔該等基板之刷具、用於對半導體晶圓之表面進行化學機械研磨後段清潔之方法、及用於對晶圓進行化學機械研磨後段清潔之圓柱形泡沫滾筒 Download PDF

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Publication number
TWI645914B
TWI645914B TW104143352A TW104143352A TWI645914B TW I645914 B TWI645914 B TW I645914B TW 104143352 A TW104143352 A TW 104143352A TW 104143352 A TW104143352 A TW 104143352A TW I645914 B TWI645914 B TW I645914B
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Taiwan
Prior art keywords
protrusions
edge
central
brush
projections
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TW104143352A
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English (en)
Chinese (zh)
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TW201615291A (zh
Inventor
克里斯多福 瓦歌
拉克許 辛
大衛 崔歐
艾瑞克 麥克納瑪拉
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美商恩特葛瑞斯股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Brushes (AREA)
TW104143352A 2010-02-22 2011-02-22 用於基板之化學機械研磨之後段清潔該等基板之刷具、用於對半導體晶圓之表面進行化學機械研磨後段清潔之方法、及用於對晶圓進行化學機械研磨後段清潔之圓柱形泡沫滾筒 TWI645914B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US30658210P 2010-02-22 2010-02-22
US61/306,582 2010-02-22
US201061425644P 2010-12-21 2010-12-21
US61/425,644 2010-12-21

Publications (2)

Publication Number Publication Date
TW201615291A TW201615291A (zh) 2016-05-01
TWI645914B true TWI645914B (zh) 2019-01-01

Family

ID=44483614

Family Applications (2)

Application Number Title Priority Date Filing Date
TW104143352A TWI645914B (zh) 2010-02-22 2011-02-22 用於基板之化學機械研磨之後段清潔該等基板之刷具、用於對半導體晶圓之表面進行化學機械研磨後段清潔之方法、及用於對晶圓進行化學機械研磨後段清潔之圓柱形泡沫滾筒
TW100105743A TW201200256A (en) 2010-02-22 2011-02-22 Post-CMP cleaning brush

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW100105743A TW201200256A (en) 2010-02-22 2011-02-22 Post-CMP cleaning brush

Country Status (7)

Country Link
US (1) US20130048018A1 (enExample)
JP (1) JP5977175B2 (enExample)
KR (1) KR20130038806A (enExample)
CN (1) CN102792424A (enExample)
SG (1) SG183419A1 (enExample)
TW (2) TWI645914B (enExample)
WO (1) WO2011103538A2 (enExample)

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JP4965253B2 (ja) 2003-08-08 2012-07-04 インテグリス・インコーポレーテッド 回転可能ベース上に鋳造されるモノリシック多孔性パッドを作製する方法および材料
US9202723B2 (en) 2011-11-29 2015-12-01 Illinois Tool Works, Inc. Brush with cantilevered nodules
US8778087B2 (en) * 2012-04-03 2014-07-15 Illinois Tool Works Inc. Conical sponge brush for cleaning semiconductor wafers
US9704729B2 (en) * 2013-06-13 2017-07-11 K.C. Tech Co., Ltd. Substrate cleaning apparatus and method and brush assembly used therein
JP5685631B2 (ja) * 2013-09-04 2015-03-18 日東電工株式会社 光学フィルムの製造方法
JP6843621B2 (ja) * 2014-02-20 2021-03-17 インテグリス・インコーポレーテッド 目標とする高い洗浄性能を得るためのこぶの比率
JP6366544B2 (ja) * 2014-07-04 2018-08-01 株式会社荏原製作所 洗浄装置及びロール洗浄部材
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
KR102436416B1 (ko) 2014-10-17 2022-08-26 어플라이드 머티어리얼스, 인코포레이티드 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 ｃｍｐ 패드 구성
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
JP6377758B2 (ja) * 2014-10-31 2018-08-22 株式会社荏原製作所 基板洗浄ロール、基板洗浄装置、及び基板洗浄方法
US10271636B2 (en) * 2014-11-10 2019-04-30 Illinois Tool Works Inc. Archimedes brush for semiconductor cleaning
JP7018768B2 (ja) * 2014-11-24 2022-02-14 コーニング インコーポレイテッド 基板表面洗浄方法および装置
US9748090B2 (en) 2015-01-22 2017-08-29 Toshiba Memory Corporation Semiconductor manufacturing apparatus and manufacturing method of semiconductor device
JP6482891B2 (ja) * 2015-02-16 2019-03-13 日東電工株式会社 光学フィルムの製造方法
US10618141B2 (en) 2015-10-30 2020-04-14 Applied Materials, Inc. Apparatus for forming a polishing article that has a desired zeta potential
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
CN106583295B (zh) * 2016-12-23 2019-05-17 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） Cmp后清洗设备清洗刷同心卡接结构及使用方法
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
WO2020050932A1 (en) 2018-09-04 2020-03-12 Applied Materials, Inc. Formulations for advanced polishing pads
US10758946B2 (en) * 2019-01-23 2020-09-01 Tung An Development Ltd. Device of cleaning brush
US11694910B2 (en) * 2019-09-10 2023-07-04 Illinois Tool Works Inc. Brush with non-constant nodule density
US11470956B2 (en) 2020-03-06 2022-10-18 Applied Materials, Inc. Brush, method of forming a brush, and structure embodied in a machine readable medium used in a design process
CN113967888B (zh) * 2020-07-23 2022-06-24 长鑫存储技术有限公司 海绵刷的更换工具和安装方法、半导体化学机械抛光设备
WO2022115671A1 (en) * 2020-11-30 2022-06-02 Araca, Inc. Brush for cleaning a substrate
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
KR102727237B1 (ko) * 2021-08-20 2024-11-08 주식회사 브러쉬텍 웨이퍼 베벨 영역 세정용 브러쉬
US20230178360A1 (en) * 2021-12-06 2023-06-08 Tung An Development Ltd. Device Having Cleaning Bodies
CN115365183B (zh) * 2022-08-09 2024-05-17 重庆雄达铨瑛电子有限公司 一种铝箔化成自动生产线的清洗机构

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JPH1034091A (ja) * 1996-07-19 1998-02-10 Kanebo Ltd 洗浄用ローラ
US6299698B1 (en) * 1998-07-10 2001-10-09 Applied Materials, Inc. Wafer edge scrubber and method
JP2001358110A (ja) * 2000-06-13 2001-12-26 Hitachi Ltd スクラブ洗浄装置およびそれを用いた半導体装置の製造方法
US6616516B1 (en) * 2001-12-13 2003-09-09 Lam Research Corporation Method and apparatus for asymmetric processing of front side and back side of semiconductor substrates

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US6502273B1 (en) * 1996-11-08 2003-01-07 Kanebo, Ltd. Cleaning sponge roller
JP3403108B2 (ja) * 1999-02-26 2003-05-06 アイオン株式会社 洗浄用スポンジローラ
JP2009066527A (ja) * 2007-09-13 2009-04-02 Nec Electronics Corp 洗浄用ローラおよび洗浄装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1034091A (ja) * 1996-07-19 1998-02-10 Kanebo Ltd 洗浄用ローラ
US6299698B1 (en) * 1998-07-10 2001-10-09 Applied Materials, Inc. Wafer edge scrubber and method
JP2001358110A (ja) * 2000-06-13 2001-12-26 Hitachi Ltd スクラブ洗浄装置およびそれを用いた半導体装置の製造方法
US6616516B1 (en) * 2001-12-13 2003-09-09 Lam Research Corporation Method and apparatus for asymmetric processing of front side and back side of semiconductor substrates

Also Published As

Publication number Publication date
US20130048018A1 (en) 2013-02-28
WO2011103538A3 (en) 2011-11-17
TW201200256A (en) 2012-01-01
JP2013520803A (ja) 2013-06-06
SG183419A1 (en) 2012-09-27
JP5977175B2 (ja) 2016-08-24
WO2011103538A2 (en) 2011-08-25
CN102792424A (zh) 2012-11-21
TW201615291A (zh) 2016-05-01
KR20130038806A (ko) 2013-04-18

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