CN102792424A - 化学机械抛光后清洁刷 - Google Patents

化学机械抛光后清洁刷 Download PDF

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Publication number
CN102792424A
CN102792424A CN2011800136311A CN201180013631A CN102792424A CN 102792424 A CN102792424 A CN 102792424A CN 2011800136311 A CN2011800136311 A CN 2011800136311A CN 201180013631 A CN201180013631 A CN 201180013631A CN 102792424 A CN102792424 A CN 102792424A
Authority
CN
China
Prior art keywords
tubercle
marginal
nodules
central
brush
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011800136311A
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English (en)
Chinese (zh)
Inventor
克里斯托弗·沃戈
拉克什·辛格
大卫·特里奥
埃里克·麦克纳马拉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Entegris Inc
Original Assignee
Entegris Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Entegris Inc filed Critical Entegris Inc
Publication of CN102792424A publication Critical patent/CN102792424A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Brushes (AREA)
CN2011800136311A 2010-02-22 2011-02-21 化学机械抛光后清洁刷 Pending CN102792424A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US30658210P 2010-02-22 2010-02-22
US61/306,582 2010-02-22
US201061425644P 2010-12-21 2010-12-21
US61/425,644 2010-12-21
PCT/US2011/025623 WO2011103538A2 (en) 2010-02-22 2011-02-21 Post-cmp cleaning brush

Publications (1)

Publication Number Publication Date
CN102792424A true CN102792424A (zh) 2012-11-21

Family

ID=44483614

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011800136311A Pending CN102792424A (zh) 2010-02-22 2011-02-21 化学机械抛光后清洁刷

Country Status (7)

Country Link
US (1) US20130048018A1 (enExample)
JP (1) JP5977175B2 (enExample)
KR (1) KR20130038806A (enExample)
CN (1) CN102792424A (enExample)
SG (1) SG183419A1 (enExample)
TW (2) TW201200256A (enExample)
WO (1) WO2011103538A2 (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104241167A (zh) * 2013-06-13 2014-12-24 K.C.科技股份有限公司 基板清洗装置及方法与基板清洗用清洗刷组件
CN104422981A (zh) * 2013-09-04 2015-03-18 日东电工株式会社 光学膜的制造方法
CN105891929A (zh) * 2015-02-16 2016-08-24 日东电工株式会社 光学膜的制造方法
CN106583295A (zh) * 2016-12-23 2017-04-26 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） Cmp后清洗设备清洗刷同心卡接结构及使用方法
CN106663620A (zh) * 2014-07-04 2017-05-10 株式会社荏原制作所 清洗装置及滚筒清洗部件
CN107078046A (zh) * 2014-10-31 2017-08-18 株式会社荏原制作所 基板清洗辊、基板清洗装置及基板清洗方法
CN113967888A (zh) * 2020-07-23 2022-01-25 长鑫存储技术有限公司 海绵刷的更换工具和安装方法、半导体化学机械抛光设备

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7984526B2 (en) 2003-08-08 2011-07-26 Entegris, Inc. Methods and materials for making a monolithic porous pad cast onto a rotatable base
US9202723B2 (en) 2011-11-29 2015-12-01 Illinois Tool Works, Inc. Brush with cantilevered nodules
US8778087B2 (en) * 2012-04-03 2014-07-15 Illinois Tool Works Inc. Conical sponge brush for cleaning semiconductor wafers
US10790167B2 (en) * 2014-02-20 2020-09-29 Entegris, Inc. Nodule ratios for targeted enhanced cleaning performance
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
CN113579992A (zh) 2014-10-17 2021-11-02 应用材料公司 使用加成制造工艺的具复合材料特性的cmp衬垫建构
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10271636B2 (en) * 2014-11-10 2019-04-30 Illinois Tool Works Inc. Archimedes brush for semiconductor cleaning
US20170312791A1 (en) * 2014-11-24 2017-11-02 Corning Incorporated Method and apparatus for substrate surface cleaning
US9748090B2 (en) 2015-01-22 2017-08-29 Toshiba Memory Corporation Semiconductor manufacturing apparatus and manufacturing method of semiconductor device
JP6940495B2 (ja) 2015-10-30 2021-09-29 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 所望のゼータ電位を有する研磨用物品を形成するための装置及び方法
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
US10758946B2 (en) * 2019-01-23 2020-09-01 Tung An Development Ltd. Device of cleaning brush
US11694910B2 (en) * 2019-09-10 2023-07-04 Illinois Tool Works Inc. Brush with non-constant nodule density
US11470956B2 (en) 2020-03-06 2022-10-18 Applied Materials, Inc. Brush, method of forming a brush, and structure embodied in a machine readable medium used in a design process
WO2022115671A1 (en) * 2020-11-30 2022-06-02 Araca, Inc. Brush for cleaning a substrate
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
KR102727237B1 (ko) * 2021-08-20 2024-11-08 주식회사 브러쉬텍 웨이퍼 베벨 영역 세정용 브러쉬
US20230178360A1 (en) * 2021-12-06 2023-06-08 Tung An Development Ltd. Device Having Cleaning Bodies
CN115365183B (zh) * 2022-08-09 2024-05-17 重庆雄达铨瑛电子有限公司 一种铝箔化成自动生产线的清洗机构

Citations (5)

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Publication number Priority date Publication date Assignee Title
JPH1034091A (ja) * 1996-07-19 1998-02-10 Kanebo Ltd 洗浄用ローラ
US6299698B1 (en) * 1998-07-10 2001-10-09 Applied Materials, Inc. Wafer edge scrubber and method
JP2001358110A (ja) * 2000-06-13 2001-12-26 Hitachi Ltd スクラブ洗浄装置およびそれを用いた半導体装置の製造方法
CN1341045A (zh) * 1999-02-26 2002-03-20 阿伊昂株式会社 洗净用的海绵辊
JP2009066527A (ja) * 2007-09-13 2009-04-02 Nec Electronics Corp 洗浄用ローラおよび洗浄装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6502273B1 (en) * 1996-11-08 2003-01-07 Kanebo, Ltd. Cleaning sponge roller
US6616516B1 (en) * 2001-12-13 2003-09-09 Lam Research Corporation Method and apparatus for asymmetric processing of front side and back side of semiconductor substrates

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1034091A (ja) * 1996-07-19 1998-02-10 Kanebo Ltd 洗浄用ローラ
US6299698B1 (en) * 1998-07-10 2001-10-09 Applied Materials, Inc. Wafer edge scrubber and method
CN1341045A (zh) * 1999-02-26 2002-03-20 阿伊昂株式会社 洗净用的海绵辊
JP2001358110A (ja) * 2000-06-13 2001-12-26 Hitachi Ltd スクラブ洗浄装置およびそれを用いた半導体装置の製造方法
JP2009066527A (ja) * 2007-09-13 2009-04-02 Nec Electronics Corp 洗浄用ローラおよび洗浄装置

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104241167A (zh) * 2013-06-13 2014-12-24 K.C.科技股份有限公司 基板清洗装置及方法与基板清洗用清洗刷组件
CN104422981A (zh) * 2013-09-04 2015-03-18 日东电工株式会社 光学膜的制造方法
CN104422981B (zh) * 2013-09-04 2020-11-03 日东电工株式会社 光学膜的制造方法
CN106663620A (zh) * 2014-07-04 2017-05-10 株式会社荏原制作所 清洗装置及滚筒清洗部件
US10453708B2 (en) 2014-07-04 2019-10-22 Ebara Corporation Cleaning device and roll cleaning member
CN106663620B (zh) * 2014-07-04 2020-03-27 株式会社荏原制作所 清洗装置及滚筒清洗部件
CN107078046A (zh) * 2014-10-31 2017-08-18 株式会社荏原制作所 基板清洗辊、基板清洗装置及基板清洗方法
US10892173B2 (en) 2014-10-31 2021-01-12 Ebara Corporation Substrate cleaning roll, substrate cleaning apparatus, and substrate cleaning method
CN105891929A (zh) * 2015-02-16 2016-08-24 日东电工株式会社 光学膜的制造方法
CN106583295A (zh) * 2016-12-23 2017-04-26 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） Cmp后清洗设备清洗刷同心卡接结构及使用方法
CN113967888A (zh) * 2020-07-23 2022-01-25 长鑫存储技术有限公司 海绵刷的更换工具和安装方法、半导体化学机械抛光设备
CN113967888B (zh) * 2020-07-23 2022-06-24 长鑫存储技术有限公司 海绵刷的更换工具和安装方法、半导体化学机械抛光设备

Also Published As

Publication number Publication date
SG183419A1 (en) 2012-09-27
TW201200256A (en) 2012-01-01
JP5977175B2 (ja) 2016-08-24
WO2011103538A3 (en) 2011-11-17
KR20130038806A (ko) 2013-04-18
TW201615291A (zh) 2016-05-01
WO2011103538A2 (en) 2011-08-25
US20130048018A1 (en) 2013-02-28
JP2013520803A (ja) 2013-06-06
TWI645914B (zh) 2019-01-01

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Effective date of abandoning: 20180629