SG183419A1 - Post-cmp cleaning brush - Google Patents
Post-cmp cleaning brush Download PDFInfo
- Publication number
- SG183419A1 SG183419A1 SG2012061719A SG2012061719A SG183419A1 SG 183419 A1 SG183419 A1 SG 183419A1 SG 2012061719 A SG2012061719 A SG 2012061719A SG 2012061719 A SG2012061719 A SG 2012061719A SG 183419 A1 SG183419 A1 SG 183419A1
- Authority
- SG
- Singapore
- Prior art keywords
- nodules
- edge
- central
- brush
- post
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title claims description 62
- 239000000758 substrate Substances 0.000 claims abstract description 107
- 235000012431 wafers Nutrition 0.000 claims description 60
- 239000006260 foam Substances 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 22
- 238000005498 polishing Methods 0.000 claims description 14
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000000126 substance Substances 0.000 claims description 4
- 239000012530 fluid Substances 0.000 claims description 3
- 230000008569 process Effects 0.000 description 10
- 239000004372 Polyvinyl alcohol Substances 0.000 description 9
- 229920002451 polyvinyl alcohol Polymers 0.000 description 9
- 239000002184 metal Substances 0.000 description 7
- 239000002002 slurry Substances 0.000 description 7
- 230000008901 benefit Effects 0.000 description 5
- 230000003749 cleanliness Effects 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 2
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229920002689 polyvinyl acetate Polymers 0.000 description 2
- 239000011118 polyvinyl acetate Substances 0.000 description 2
- 238000005201 scrubbing Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000009987 spinning Methods 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- 238000009827 uniform distribution Methods 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 244000185238 Lophostemon confertus Species 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000003377 acid catalyst Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- GINJFDRNADDBIN-FXQIFTODSA-N bilanafos Chemical compound OC(=O)[C@H](C)NC(=O)[C@H](C)NC(=O)[C@@H](N)CCP(C)(O)=O GINJFDRNADDBIN-FXQIFTODSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229920003169 water-soluble polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Brushes (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US30658210P | 2010-02-22 | 2010-02-22 | |
| US201061425644P | 2010-12-21 | 2010-12-21 | |
| PCT/US2011/025623 WO2011103538A2 (en) | 2010-02-22 | 2011-02-21 | Post-cmp cleaning brush |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG183419A1 true SG183419A1 (en) | 2012-09-27 |
Family
ID=44483614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG2012061719A SG183419A1 (en) | 2010-02-22 | 2011-02-21 | Post-cmp cleaning brush |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20130048018A1 (enExample) |
| JP (1) | JP5977175B2 (enExample) |
| KR (1) | KR20130038806A (enExample) |
| CN (1) | CN102792424A (enExample) |
| SG (1) | SG183419A1 (enExample) |
| TW (2) | TW201200256A (enExample) |
| WO (1) | WO2011103538A2 (enExample) |
Families Citing this family (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101158137B1 (ko) | 2003-08-08 | 2012-06-19 | 엔테그리스, 아이엔씨. | 회전식 기부 상에 주조된 일체형 다공성 패드를 제조하기위한 방법 및 재료 |
| US9202723B2 (en) | 2011-11-29 | 2015-12-01 | Illinois Tool Works, Inc. | Brush with cantilevered nodules |
| US8778087B2 (en) | 2012-04-03 | 2014-07-15 | Illinois Tool Works Inc. | Conical sponge brush for cleaning semiconductor wafers |
| US9704729B2 (en) * | 2013-06-13 | 2017-07-11 | K.C. Tech Co., Ltd. | Substrate cleaning apparatus and method and brush assembly used therein |
| JP5685631B2 (ja) * | 2013-09-04 | 2015-03-18 | 日東電工株式会社 | 光学フィルムの製造方法 |
| US10790167B2 (en) * | 2014-02-20 | 2020-09-29 | Entegris, Inc. | Nodule ratios for targeted enhanced cleaning performance |
| JP6366544B2 (ja) * | 2014-07-04 | 2018-08-01 | 株式会社荏原製作所 | 洗浄装置及びロール洗浄部材 |
| US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
| US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
| CN107078048B (zh) | 2014-10-17 | 2021-08-13 | 应用材料公司 | 使用加成制造工艺的具复合材料特性的cmp衬垫建构 |
| US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
| US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
| MY182464A (en) * | 2014-10-31 | 2021-01-25 | Ebara Corp | Substrate cleaning roll, substrate cleaning apparatus, and substrate cleaning method |
| US10271636B2 (en) * | 2014-11-10 | 2019-04-30 | Illinois Tool Works Inc. | Archimedes brush for semiconductor cleaning |
| CN107206438A (zh) * | 2014-11-24 | 2017-09-26 | 康宁股份有限公司 | 用于基材表面清洁的方法和设备 |
| US9748090B2 (en) | 2015-01-22 | 2017-08-29 | Toshiba Memory Corporation | Semiconductor manufacturing apparatus and manufacturing method of semiconductor device |
| JP6482891B2 (ja) * | 2015-02-16 | 2019-03-13 | 日東電工株式会社 | 光学フィルムの製造方法 |
| KR20230169424A (ko) | 2015-10-30 | 2023-12-15 | 어플라이드 머티어리얼스, 인코포레이티드 | 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법 |
| US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
| US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
| CN106583295B (zh) * | 2016-12-23 | 2019-05-17 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Cmp后清洗设备清洗刷同心卡接结构及使用方法 |
| US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
| WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
| CN112654655A (zh) | 2018-09-04 | 2021-04-13 | 应用材料公司 | 先进抛光垫配方 |
| US10758946B2 (en) * | 2019-01-23 | 2020-09-01 | Tung An Development Ltd. | Device of cleaning brush |
| US11694910B2 (en) * | 2019-09-10 | 2023-07-04 | Illinois Tool Works Inc. | Brush with non-constant nodule density |
| US11470956B2 (en) | 2020-03-06 | 2022-10-18 | Applied Materials, Inc. | Brush, method of forming a brush, and structure embodied in a machine readable medium used in a design process |
| CN113967888B (zh) * | 2020-07-23 | 2022-06-24 | 长鑫存储技术有限公司 | 海绵刷的更换工具和安装方法、半导体化学机械抛光设备 |
| WO2022115671A1 (en) * | 2020-11-30 | 2022-06-02 | Araca, Inc. | Brush for cleaning a substrate |
| US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
| KR102727237B1 (ko) * | 2021-08-20 | 2024-11-08 | 주식회사 브러쉬텍 | 웨이퍼 베벨 영역 세정용 브러쉬 |
| US20230178360A1 (en) * | 2021-12-06 | 2023-06-08 | Tung An Development Ltd. | Device Having Cleaning Bodies |
| CN115365183B (zh) * | 2022-08-09 | 2024-05-17 | 重庆雄达铨瑛电子有限公司 | 一种铝箔化成自动生产线的清洗机构 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3680185B2 (ja) * | 1996-07-19 | 2005-08-10 | アイオン株式会社 | 洗浄用ローラ |
| US6502273B1 (en) * | 1996-11-08 | 2003-01-07 | Kanebo, Ltd. | Cleaning sponge roller |
| JP3403108B2 (ja) * | 1999-02-26 | 2003-05-06 | アイオン株式会社 | 洗浄用スポンジローラ |
| US6299698B1 (en) * | 1998-07-10 | 2001-10-09 | Applied Materials, Inc. | Wafer edge scrubber and method |
| JP2001358110A (ja) * | 2000-06-13 | 2001-12-26 | Hitachi Ltd | スクラブ洗浄装置およびそれを用いた半導体装置の製造方法 |
| US6616516B1 (en) * | 2001-12-13 | 2003-09-09 | Lam Research Corporation | Method and apparatus for asymmetric processing of front side and back side of semiconductor substrates |
| JP2009066527A (ja) * | 2007-09-13 | 2009-04-02 | Nec Electronics Corp | 洗浄用ローラおよび洗浄装置 |
-
2011
- 2011-02-21 US US13/580,423 patent/US20130048018A1/en not_active Abandoned
- 2011-02-21 WO PCT/US2011/025623 patent/WO2011103538A2/en not_active Ceased
- 2011-02-21 CN CN2011800136311A patent/CN102792424A/zh active Pending
- 2011-02-21 KR KR1020127023563A patent/KR20130038806A/ko not_active Withdrawn
- 2011-02-21 SG SG2012061719A patent/SG183419A1/en unknown
- 2011-02-21 JP JP2012554082A patent/JP5977175B2/ja active Active
- 2011-02-22 TW TW100105743A patent/TW201200256A/zh unknown
- 2011-02-22 TW TW104143352A patent/TWI645914B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| TW201615291A (zh) | 2016-05-01 |
| JP2013520803A (ja) | 2013-06-06 |
| WO2011103538A2 (en) | 2011-08-25 |
| KR20130038806A (ko) | 2013-04-18 |
| WO2011103538A3 (en) | 2011-11-17 |
| TWI645914B (zh) | 2019-01-01 |
| CN102792424A (zh) | 2012-11-21 |
| US20130048018A1 (en) | 2013-02-28 |
| TW201200256A (en) | 2012-01-01 |
| JP5977175B2 (ja) | 2016-08-24 |
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