JP5977175B2 - Ｃｍｐ後の洗浄ブラシ - Google Patents

Ｃｍｐ後の洗浄ブラシ Download PDF

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Publication number
JP5977175B2
JP5977175B2 JP2012554082A JP2012554082A JP5977175B2 JP 5977175 B2 JP5977175 B2 JP 5977175B2 JP 2012554082 A JP2012554082 A JP 2012554082A JP 2012554082 A JP2012554082 A JP 2012554082A JP 5977175 B2 JP5977175 B2 JP 5977175B2
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JP
Japan
Prior art keywords
nodules
edge
nodule
central
elongated
Prior art date
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Active
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JP2012554082A
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English (en)
Japanese (ja)
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JP2013520803A5 (enExample
JP2013520803A (ja
Inventor
ワーゴ、クリストファー
シン、ラケシュ
トリオ、デイビッド
マクナマラ、エリック
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Entegris Inc
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Entegris Inc
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Publication date
Application filed by Entegris Inc filed Critical Entegris Inc
Publication of JP2013520803A publication Critical patent/JP2013520803A/ja
Publication of JP2013520803A5 publication Critical patent/JP2013520803A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Brushes (AREA)
JP2012554082A 2010-02-22 2011-02-21 Ｃｍｐ後の洗浄ブラシ Active JP5977175B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US30658210P 2010-02-22 2010-02-22
US61/306,582 2010-02-22
US201061425644P 2010-12-21 2010-12-21
US61/425,644 2010-12-21
PCT/US2011/025623 WO2011103538A2 (en) 2010-02-22 2011-02-21 Post-cmp cleaning brush

Publications (3)

Publication Number Publication Date
JP2013520803A JP2013520803A (ja) 2013-06-06
JP2013520803A5 JP2013520803A5 (enExample) 2016-01-28
JP5977175B2 true JP5977175B2 (ja) 2016-08-24

Family

ID=44483614

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012554082A Active JP5977175B2 (ja) 2010-02-22 2011-02-21 Ｃｍｐ後の洗浄ブラシ

Country Status (7)

Country Link
US (1) US20130048018A1 (enExample)
JP (1) JP5977175B2 (enExample)
KR (1) KR20130038806A (enExample)
CN (1) CN102792424A (enExample)
SG (1) SG183419A1 (enExample)
TW (2) TW201200256A (enExample)
WO (1) WO2011103538A2 (enExample)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101158137B1 (ko) 2003-08-08 2012-06-19 엔테그리스, 아이엔씨. 회전식 기부 상에 주조된 일체형 다공성 패드를 제조하기위한 방법 및 재료
US9202723B2 (en) 2011-11-29 2015-12-01 Illinois Tool Works, Inc. Brush with cantilevered nodules
US8778087B2 (en) 2012-04-03 2014-07-15 Illinois Tool Works Inc. Conical sponge brush for cleaning semiconductor wafers
US9704729B2 (en) * 2013-06-13 2017-07-11 K.C. Tech Co., Ltd. Substrate cleaning apparatus and method and brush assembly used therein
JP5685631B2 (ja) * 2013-09-04 2015-03-18 日東電工株式会社 光学フィルムの製造方法
US10790167B2 (en) * 2014-02-20 2020-09-29 Entegris, Inc. Nodule ratios for targeted enhanced cleaning performance
JP6366544B2 (ja) * 2014-07-04 2018-08-01 株式会社荏原製作所 洗浄装置及びロール洗浄部材
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
CN107078048B (zh) 2014-10-17 2021-08-13 应用材料公司 使用加成制造工艺的具复合材料特性的cmp衬垫建构
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
MY182464A (en) * 2014-10-31 2021-01-25 Ebara Corp Substrate cleaning roll, substrate cleaning apparatus, and substrate cleaning method
US10271636B2 (en) * 2014-11-10 2019-04-30 Illinois Tool Works Inc. Archimedes brush for semiconductor cleaning
CN107206438A (zh) * 2014-11-24 2017-09-26 康宁股份有限公司 用于基材表面清洁的方法和设备
US9748090B2 (en) 2015-01-22 2017-08-29 Toshiba Memory Corporation Semiconductor manufacturing apparatus and manufacturing method of semiconductor device
JP6482891B2 (ja) * 2015-02-16 2019-03-13 日東電工株式会社 光学フィルムの製造方法
KR20230169424A (ko) 2015-10-30 2023-12-15 어플라이드 머티어리얼스, 인코포레이티드 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
CN106583295B (zh) * 2016-12-23 2019-05-17 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） Cmp后清洗设备清洗刷同心卡接结构及使用方法
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
CN112654655A (zh) 2018-09-04 2021-04-13 应用材料公司 先进抛光垫配方
US10758946B2 (en) * 2019-01-23 2020-09-01 Tung An Development Ltd. Device of cleaning brush
US11694910B2 (en) * 2019-09-10 2023-07-04 Illinois Tool Works Inc. Brush with non-constant nodule density
US11470956B2 (en) 2020-03-06 2022-10-18 Applied Materials, Inc. Brush, method of forming a brush, and structure embodied in a machine readable medium used in a design process
CN113967888B (zh) * 2020-07-23 2022-06-24 长鑫存储技术有限公司 海绵刷的更换工具和安装方法、半导体化学机械抛光设备
WO2022115671A1 (en) * 2020-11-30 2022-06-02 Araca, Inc. Brush for cleaning a substrate
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
KR102727237B1 (ko) * 2021-08-20 2024-11-08 주식회사 브러쉬텍 웨이퍼 베벨 영역 세정용 브러쉬
US20230178360A1 (en) * 2021-12-06 2023-06-08 Tung An Development Ltd. Device Having Cleaning Bodies
CN115365183B (zh) * 2022-08-09 2024-05-17 重庆雄达铨瑛电子有限公司 一种铝箔化成自动生产线的清洗机构

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3680185B2 (ja) * 1996-07-19 2005-08-10 アイオン株式会社 洗浄用ローラ
US6502273B1 (en) * 1996-11-08 2003-01-07 Kanebo, Ltd. Cleaning sponge roller
JP3403108B2 (ja) * 1999-02-26 2003-05-06 アイオン株式会社 洗浄用スポンジローラ
US6299698B1 (en) * 1998-07-10 2001-10-09 Applied Materials, Inc. Wafer edge scrubber and method
JP2001358110A (ja) * 2000-06-13 2001-12-26 Hitachi Ltd スクラブ洗浄装置およびそれを用いた半導体装置の製造方法
US6616516B1 (en) * 2001-12-13 2003-09-09 Lam Research Corporation Method and apparatus for asymmetric processing of front side and back side of semiconductor substrates
JP2009066527A (ja) * 2007-09-13 2009-04-02 Nec Electronics Corp 洗浄用ローラおよび洗浄装置

Also Published As

Publication number Publication date
TW201615291A (zh) 2016-05-01
JP2013520803A (ja) 2013-06-06
SG183419A1 (en) 2012-09-27
WO2011103538A2 (en) 2011-08-25
KR20130038806A (ko) 2013-04-18
WO2011103538A3 (en) 2011-11-17
TWI645914B (zh) 2019-01-01
CN102792424A (zh) 2012-11-21
US20130048018A1 (en) 2013-02-28
TW201200256A (en) 2012-01-01

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