TWI645533B - 雷射標記裝置與方法 - Google Patents

雷射標記裝置與方法 Download PDF

Info

Publication number
TWI645533B
TWI645533B TW105122565A TW105122565A TWI645533B TW I645533 B TWI645533 B TW I645533B TW 105122565 A TW105122565 A TW 105122565A TW 105122565 A TW105122565 A TW 105122565A TW I645533 B TWI645533 B TW I645533B
Authority
TW
Taiwan
Prior art keywords
laser beam
sealing material
filler
wavelength
semiconductor element
Prior art date
Application number
TW105122565A
Other languages
English (en)
Chinese (zh)
Other versions
TW201707182A (zh
Inventor
金南成
沈赫鎭
金基赫
成圭棟
Original Assignee
南韓商Ｅｏ科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 南韓商Ｅｏ科技股份有限公司 filed Critical 南韓商Ｅｏ科技股份有限公司
Publication of TW201707182A publication Critical patent/TW201707182A/zh
Application granted granted Critical
Publication of TWI645533B publication Critical patent/TWI645533B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW105122565A 2015-07-20 2016-07-18 雷射標記裝置與方法 TWI645533B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
??10-2015-0102404 2015-07-20
KR1020150102404A KR101685428B1 (ko) 2015-07-20 2015-07-20 레이저 마킹방법

Publications (2)

Publication Number Publication Date
TW201707182A TW201707182A (zh) 2017-02-16
TWI645533B true TWI645533B (zh) 2018-12-21

Family

ID=57574082

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105122565A TWI645533B (zh) 2015-07-20 2016-07-18 雷射標記裝置與方法

Country Status (3)

Country Link
KR (1) KR101685428B1 (ko)
TW (1) TWI645533B (ko)
WO (1) WO2017014458A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114088982A (zh) * 2021-11-24 2022-02-25 胜科纳米(苏州)股份有限公司 一种用于scm截面样品无损定位的方法及系统

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201412503A (zh) * 2012-06-04 2014-04-01 Sabic Innovative Plastics Ip 摻有標記的熱塑性組成物、彼之製法、含彼之物件、以及彼之應用
TW201509659A (zh) * 2013-08-26 2015-03-16 Nitto Denko Corp 電子裝置封裝用樹脂片材及電子裝置封裝之製造方法
TW201517153A (zh) * 2013-09-19 2015-05-01 Applied Materials Inc 從晶圓背側及前側切割晶圓

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002283729A (ja) * 2001-03-26 2002-10-03 Mitsubishi Materials Corp マーキング基材及びそれを用いた積層基材
WO2008116134A2 (en) * 2007-03-22 2008-09-25 United Solar Ovonic Llc Method and apparatus for the laser scribing of ultra lightweight semiconductor devices
US7977213B1 (en) * 2010-03-31 2011-07-12 Electro Scientific Industries, Inc. Use of laser energy transparent stop layer to achieve minimal debris generation in laser scribing a multilayer patterned workpiece
US8756803B2 (en) * 2010-09-22 2014-06-24 Ibiden Co., Ltd. Method for manufacturing printed wiring board
JP6005125B2 (ja) * 2014-12-22 2016-10-12 イムラ アメリカ インコーポレイテッド 超短パルスレーザでの透明材料処理

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201412503A (zh) * 2012-06-04 2014-04-01 Sabic Innovative Plastics Ip 摻有標記的熱塑性組成物、彼之製法、含彼之物件、以及彼之應用
TW201509659A (zh) * 2013-08-26 2015-03-16 Nitto Denko Corp 電子裝置封裝用樹脂片材及電子裝置封裝之製造方法
TW201517153A (zh) * 2013-09-19 2015-05-01 Applied Materials Inc 從晶圓背側及前側切割晶圓

Also Published As

Publication number Publication date
TW201707182A (zh) 2017-02-16
KR101685428B1 (ko) 2016-12-12
WO2017014458A1 (ko) 2017-01-26

Similar Documents

Publication Publication Date Title
JP5443104B2 (ja) ウエーハの加工方法
US8198611B2 (en) Laser beam formatting module and method for fabricating semiconductor dies using same
US7444047B2 (en) Multiplexing optical system
KR101950725B1 (ko) 광 균질화 모듈 및 그를 포함하는 레이저 본딩장치
CN104607801B (zh) 激光加工方法以及激光加工装置
CN105789125A (zh) 晶片的加工方法
TWI645533B (zh) 雷射標記裝置與方法
JP2012164974A (ja) レーザー加工装置、及びレーザー加工方法
US20200176948A1 (en) Semiconductor laser component and method of producing a semiconductor laser component
WO2020166502A1 (ja) 光モジュール
EP3324229B1 (en) Semiconductor laser module and additive manufacturing device
KR101899107B1 (ko) 광 조사 장치
US9457415B2 (en) Water removing method, optical fiber soldering method, and semiconductor laser module manufacturing method
KR102157253B1 (ko) 레이저를 이용한 전자소자 접합장치
US6597714B2 (en) Semiconductor laser module
JP3773603B2 (ja) 半導体レーザ装置の製造方法
JP7383340B2 (ja) レーザー加工装置
JP4557133B2 (ja) 半導体光学装置
WO2023234004A1 (ja) レーザ光照射装置及びレーザ加工装置
US12128498B2 (en) Laser processing method, and laser processing device
US11545403B2 (en) Semiconductor package having a multilayer structure and a transport tray for the semiconductor structure
JP6607991B2 (ja) 素子基板の製造方法およびレーザクリーニング装置
US20210286158A1 (en) Light source device, optical lens, and method of manufacturing optical lens
JP5126711B2 (ja) ボンディング装置
JP6993563B2 (ja) 光学部品の製造方法