TWI640687B - Method and apparatus for warming up a vacuum pump arrangement - Google Patents
Method and apparatus for warming up a vacuum pump arrangement Download PDFInfo
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- TWI640687B TWI640687B TW102115762A TW102115762A TWI640687B TW I640687 B TWI640687 B TW I640687B TW 102115762 A TW102115762 A TW 102115762A TW 102115762 A TW102115762 A TW 102115762A TW I640687 B TWI640687 B TW I640687B
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- booster pump
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- 238000000034 method Methods 0.000 title claims abstract description 48
- 238000010792 warming Methods 0.000 title claims abstract description 14
- 238000012545 processing Methods 0.000 claims abstract description 40
- 239000007789 gas Substances 0.000 claims description 33
- 238000011010 flushing procedure Methods 0.000 claims description 12
- 230000008569 process Effects 0.000 claims description 9
- 230000003247 decreasing effect Effects 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000007796 conventional method Methods 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000009931 harmful effect Effects 0.000 description 2
- 230000000116 mitigating effect Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B49/00—Control, e.g. of pump delivery, or pump pressure of, or safety measures for, machines, pumps, or pumping installations, not otherwise provided for, or of interest apart from, groups F04B1/00 - F04B47/00
- F04B49/02—Stopping, starting, unloading or idling control
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B41/00—Pumping installations or systems specially adapted for elastic fluids
- F04B41/06—Combinations of two or more pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B23/00—Pumping installations or systems
- F04B23/04—Combinations of two or more pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B49/00—Control, e.g. of pump delivery, or pump pressure of, or safety measures for, machines, pumps, or pumping installations, not otherwise provided for, or of interest apart from, groups F04B1/00 - F04B47/00
- F04B49/20—Control, e.g. of pump delivery, or pump pressure of, or safety measures for, machines, pumps, or pumping installations, not otherwise provided for, or of interest apart from, groups F04B1/00 - F04B47/00 by changing the driving speed
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
- F04C23/00—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids
- F04C23/005—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids of dissimilar working principle
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
- F04C25/00—Adaptations of pumps for special use of pumps for elastic fluids
- F04C25/02—Adaptations of pumps for special use of pumps for elastic fluids for producing high vacuum
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
- F04C28/00—Control of, monitoring of, or safety arrangements for, pumps or pumping installations specially adapted for elastic fluids
- F04C28/02—Control of, monitoring of, or safety arrangements for, pumps or pumping installations specially adapted for elastic fluids specially adapted for several pumps connected in series or in parallel
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
- F04C28/00—Control of, monitoring of, or safety arrangements for, pumps or pumping installations specially adapted for elastic fluids
- F04C28/06—Control of, monitoring of, or safety arrangements for, pumps or pumping installations specially adapted for elastic fluids specially adapted for stopping, starting, idling or no-load operation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
- F04C28/00—Control of, monitoring of, or safety arrangements for, pumps or pumping installations specially adapted for elastic fluids
- F04C28/06—Control of, monitoring of, or safety arrangements for, pumps or pumping installations specially adapted for elastic fluids specially adapted for stopping, starting, idling or no-load operation
- F04C28/065—Capacity control using a multiplicity of units or pumping capacities, e.g. multiple chambers, individually switchable or controllable
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D19/00—Axial-flow pumps
- F04D19/02—Multi-stage pumps
- F04D19/04—Multi-stage pumps specially adapted to the production of a high vacuum, e.g. molecular pumps
- F04D19/046—Combinations of two or more different types of pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D27/00—Control, e.g. regulation, of pumps, pumping installations or pumping systems specially adapted for elastic fluids
- F04D27/02—Surge control
- F04D27/0261—Surge control by varying driving speed
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D27/00—Control, e.g. regulation, of pumps, pumping installations or pumping systems specially adapted for elastic fluids
- F04D27/02—Surge control
- F04D27/0292—Stop safety or alarm devices, e.g. stop-and-go control; Disposition of check-valves
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B2201/00—Pump parameters
- F04B2201/08—Cylinder or housing parameters
- F04B2201/0801—Temperature
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
- F04C2220/00—Application
- F04C2220/30—Use in a chemical vapor deposition [CVD] process or in a similar process
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
- F04C2270/00—Control; Monitoring or safety arrangements
- F04C2270/70—Safety, emergency conditions or requirements
- F04C2270/701—Cold start
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F05—INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF CLASSES F01-F04
- F05D—INDEXING SCHEME FOR ASPECTS RELATING TO NON-POSITIVE-DISPLACEMENT MACHINES OR ENGINES, GAS-TURBINES OR JET-PROPULSION PLANTS
- F05D2260/00—Function
- F05D2260/85—Starting
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
- Y02B30/70—Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
- Applications Or Details Of Rotary Compressors (AREA)
- Control Of Positive-Displacement Pumps (AREA)
Abstract
本發明揭示一種用於對一真空泵配置暖機之方法，該真空泵配置具有用於抽空一處理室之一增壓泵及在該增壓泵下游之一支援泵，該方法包含：將該增壓泵設定為高於當該增壓泵在一慢車模式中時該增壓泵之一慢車速度(idle speed；怠速)之一第一速度；及將該增壓泵之一出口處之一背壓(backing pressure；支援壓力)控制在自0.1 mbar至10 mbar之一範圍內至少達自當自該慢車模式啟動該真空泵配置時至當該增壓泵達到等於或超過一第一預定臨限值之一溫度時之一時間週期。此方法實施在一控制器經組態以實施上述動作之系統中。 A method for arranging a warming up of a vacuum pump having a booster pump for evacuating a processing chamber and a support pump downstream of the booster pump, the method comprising: The pump is set to be higher than one of the idle speeds of the booster pump when the booster pump is in an idle mode; and one of the outlets of the booster pump is back pressured The backing pressure is controlled in a range from 0.1 mbar to 10 mbar at least from when the vacuum pump configuration is initiated from the idle mode to when the boost pump reaches a first predetermined threshold One time period at one temperature. This method is implemented in a system in which the controller is configured to perform the above described actions.
Description
本發明係關於一種用於在將一真空泵配置置於一慢車模式中後對其暖機之方法及/或裝置。 The present invention relates to a method and/or apparatus for warming up a vacuum pump configuration after it has been placed in an idle mode.
用於製造半導體器件中之一系統除其他以外通常包含一處理工具、具有一增壓泵及一支援泵之一真空泵配置及一消減器件。該處理工具通常包含一處理室，在該處理室中將一半導體晶圓處理成一預定結構。該真空泵配置連接至該處理工具以用於抽空該處理室以在該處理室中形成一真空環境以便使各種半導體處理技術發生。可將由該真空泵配置自該處理室抽出之氣體導引至該消減器件，該消減器件在將該氣體釋放至環境之前破壞或分解其之有害或有毒成份。 One system for fabricating a semiconductor device typically includes, among other things, a processing tool, a vacuum pump configuration with a boost pump and a support pump, and a subtractive device. The processing tool typically includes a processing chamber in which a semiconductor wafer is processed into a predetermined structure. The vacuum pump configuration is coupled to the processing tool for evacuating the processing chamber to create a vacuum environment in the processing chamber for various semiconductor processing techniques to occur. The gas withdrawn from the processing chamber by the vacuum pump configuration can be directed to the abatement device, which destroys or decomposes its harmful or toxic components prior to releasing the gas to the environment.
期望管理及減小在半導體製造程序期間由真空泵及消減器件所消耗之公用設施，諸如電力、燃料及水。由真空泵及消減器件所消耗之電力表示在製造半導體晶圓期間由整個系統所消耗之總電力之一重要部分。半導體業內已做出諸多努力以改良真空泵之公用設施消耗之效率以便減小半導體晶圓之製造成本。除節省成本之外，新的環境規則將通常對半導體製造商施加壓力以改良其製造程序之能量效率。 It is desirable to manage and reduce utilities that are consumed by vacuum pumps and abatement devices during semiconductor manufacturing processes, such as electricity, fuel, and water. The power consumed by the vacuum pump and the abatement device represents an important part of the total power consumed by the entire system during the manufacture of the semiconductor wafer. Many efforts have been made in the semiconductor industry to improve the efficiency of utility of vacuum pumps in order to reduce the cost of manufacturing semiconductor wafers. In addition to cost savings, new environmental regulations will often put pressure on semiconductor manufacturers to improve the energy efficiency of their manufacturing processes.
用於改良效率之一習用方法係當處理工具不需要真空泵配置及消減器件以其正常能力操作時將真空泵配置及消減器件置於一慢車模式中。此處之術語「慢車模式(idle mode)」可與通常用於各種工業中 之其他術語(諸如睡眠模式、綠色模式、休眠、減小之/低電力模式、有效公用設施控制模式)互換使用。舉例而言，當將半導體晶圓轉移至處理室中或轉移出處理室時，可將真空泵配置及消減器件置於慢車模式中，其在慢車模式中比在一正常操作模式中消耗較少資源。當處理工具需要真空泵配置及消減器件以其正常能力操作時，可使其自慢車模式恢復至其正常操作模式。 One conventional method for improving efficiency is to place the vacuum pump configuration and abatement device in an idle mode when the processing tool does not require a vacuum pump configuration and the mitigation device operates at its normal capacity. The term "idle mode" here can be used in various industries. Other terms such as sleep mode, green mode, sleep, reduced/low power mode, active utility control mode are used interchangeably. For example, when transferring a semiconductor wafer into or out of a processing chamber, the vacuum pump configuration and abatement device can be placed in an idle mode, which consumes less resources in the slow mode than in a normal operating mode. . When the processing tool requires the vacuum pump configuration and the mitigation device to operate at its normal capacity, it can be restored from the slow mode to its normal operating mode.
習用方法之一個缺點係其通常花費一長時間來使真空泵配置及消減器件自慢車模式恢復至正常操作模式。當真空泵配置在慢車模式中時，其冷卻至一低溫度。在真空泵配置可在正常條件下操作之前，需要對其暖機至一特定溫度，此可花費一長時間。暖機花費時間越長，處理工具保持慢車、等待真空泵配置準備好之時間越長。此轉變成損失之生產力及降低之產量。 One disadvantage of the conventional method is that it typically takes a long time to return the vacuum pump configuration and the abatement device from the slow mode to the normal mode of operation. When the vacuum pump is configured in the idle mode, it cools to a low temperature. Before the vacuum pump configuration can be operated under normal conditions, it needs to be warmed up to a specific temperature, which can take a long time. The longer it takes to warm up, the longer the processing tool keeps the car and waits for the vacuum pump to be ready. This translates into lost productivity and reduced production.
因此，需要用於自慢車模式快速地對真空泵配置暖機之一方法，藉此縮短用於使一處理系統自慢車模式至正常操作模式所需之時間。 Therefore, there is a need for a method for quickly warming a vacuum pump from a slow mode, thereby reducing the time required to bring a processing system from the slow mode to the normal mode of operation.
本發明係關於一種用於在將一真空泵配置置於一慢車模式中後對其暖機之方法及/或裝置。在本發明之某些實施例中，一種用於對一真空泵配置(該真空泵配置具有用於抽空一處理室之一增壓泵及在該增壓泵下游之一支援泵)暖機之方法包含以下步驟：將該增壓泵設定為高於當該增壓泵在一慢車模式中時該增壓泵之一慢車速度之一第一速度；及將該增壓泵之一出口處之一背壓控制在自0.1 mbar至10 mbar之一範圍內至少達自當自該慢車模式啟動該真空泵配置時至當該增壓泵達到等於或超過一第一預定臨限值之一溫度時之一時間週期。 The present invention relates to a method and/or apparatus for warming up a vacuum pump configuration after it has been placed in an idle mode. In some embodiments of the present invention, a method for warming up a vacuum pump configuration having a boost pump for evacuating a processing chamber and supporting a pump downstream of the boost pump includes The following step: setting the booster pump to be higher than a first speed of one of the speeds of the booster pump when the booster pump is in a slow mode; and returning one of the outlets of the booster pump The pressure control is in a range from 0.1 mbar to 10 mbar at least one time from when the vacuum pump configuration is initiated from the idle mode to when the boost pump reaches a temperature equal to or exceeding a first predetermined threshold cycle.
在本發明之某些實施例中，一種裝置包含：一處理室；一增壓泵，其具有以流體方式連接至該處理室之一出口之一入口；一支援 泵，其具有以流體方式連接至該增壓泵之一出口之一入口，用於與該增壓泵一起抽空該處理室；及一控制器，其與該增壓泵及該支援泵電耦合，該控制器經組態以將該增壓泵之該出口處之一背壓控制在自0.1 mbar至10 mbar之一範圍內至少達自當自一慢車模式啟動該增壓泵及該支援泵時至當該增壓泵達到等於或超過一第一預定臨限值之一溫度時之一時間週期。 In some embodiments of the invention, a device includes: a processing chamber; a booster pump having an inlet fluidly connected to one of the outlets of the processing chamber; a pump having an inlet fluidly connected to one of the outlets of the booster pump for evacuating the processing chamber with the booster pump; and a controller electrically coupled to the booster pump and the support pump The controller is configured to control the back pressure of the outlet of the booster pump to be in a range from 0.1 mbar to 10 mbar at least until the booster pump and the support pump are activated from an idle mode It is a time period until the booster pump reaches a temperature equal to or exceeding a temperature of a first predetermined threshold.
然而，當結合附圖閱讀特定實施例之以下說明時將最佳地理解本發明之構造及操作方法以及其額外目的及優點。 The construction and operation of the present invention, as well as additional objects and advantages thereof, are best understood from the following description of the particular embodiments.
10‧‧‧系統 10‧‧‧System
12‧‧‧處理室 12‧‧‧Processing room
14a‧‧‧氣體源 14a‧‧‧ gas source
14b‧‧‧氣體源 14b‧‧‧ gas source
16a‧‧‧控制閥 16a‧‧‧Control valve
16b‧‧‧控制閥 16b‧‧‧Control valve
20‧‧‧真空泵配置 20‧‧‧vacuum pump configuration
22‧‧‧增壓泵 22‧‧‧ booster pump
24‧‧‧支援泵 24‧‧‧Support pump
30‧‧‧控制器 30‧‧‧ Controller
32‧‧‧沖洗氣體源/源 32‧‧‧ Flush gas source/source
34‧‧‧控制閥 34‧‧‧Control valve
圖1圖解說明根據本發明之某些實施例之一系統之一示意圖，其中除其他以外一處理室、一增壓泵及一支援泵串聯連接。 1 illustrates a schematic diagram of a system in accordance with some embodiments of the present invention in which a processing chamber, a booster pump, and a support pump are connected in series, among others.
圖2A及圖2B圖解說明根據本發明之某些實施例之展示用於對一真空泵配置暖機之各種程序之流程圖。 2A and 2B illustrate a flow chart showing various procedures for configuring a vacuum pump to warm up, in accordance with certain embodiments of the present invention.
圖3圖解說明根據本發明之某些實施例之展示用於對一真空泵配置暖機之程序之一流程圖。 3 illustrates a flow chart showing a procedure for warming up a vacuum pump in accordance with some embodiments of the present invention.
圖4係展示所揭示之方法及/或裝置縮短對一真空泵配置暖機之所需之時間之一圖表。 4 is a graph showing one of the times required for the disclosed method and/or apparatus to shorten the warm-up configuration of a vacuum pump.
本發明係關於一種用於在將一真空泵配置置於一慢車模式中後對其暖機之方法及/或裝置。真空泵配置在其簡化組態中具有一增壓泵及在其下游之一支援泵。增壓泵之一入口連接至一處理室之一出口，處理室可係需要一內部真空環境以便恰當發揮作用之一半導體處理工具或任何其他設備之部分。增壓泵之一出口連接至支援泵之一入口，支援泵之一出口通常與一消減器件(或在某些情形中直接與一大氣環境)流體連接。隨著真空泵配置暖機，增壓泵之速度提升至高於當增壓泵在慢車模式中時其之一慢車速度之一位準且維持在其處。與 由習用方法所採用之正常操作模式或在某些情形中慢車模式中之背壓相比，增壓泵之背壓(即，在增壓泵之出口處之壓力)亦提升至一相對高位準且維持在其處。因此，在暖機週期期間透過增壓泵壓縮氣體所需之電力將增加，且因此致使增壓泵之溫度更快速地增加。由於增壓泵通常比支援泵花費一較長時間來完全暖機，因此本發明之方法及/或裝置能夠縮短用於自慢車模式對整個真空泵配置暖機所需之時間。此又增加處理工具之產量。 The present invention relates to a method and/or apparatus for warming up a vacuum pump configuration after it has been placed in an idle mode. The vacuum pump configuration has a booster pump and one of the downstream support pumps in its simplified configuration. One of the inlets of the booster pump is connected to an outlet of a processing chamber which may require an internal vacuum environment to function properly as part of a semiconductor processing tool or any other device. One of the outlets of the booster pump is connected to one of the inlets of the support pump, and one of the outlets of the support pump is typically fluidly coupled to a subtractive device (or in some cases directly to an atmospheric environment). As the vacuum pump is warmed up, the booster pump speed is raised above and maintained at one of the slower speeds of the booster pump when it is in the idle mode. versus The back pressure of the booster pump (ie, the pressure at the outlet of the booster pump) is also raised to a relatively high level compared to the normal operating mode employed by the conventional method or, in some cases, the back pressure in the idle mode. And stay there. Therefore, the power required to compress the gas through the booster pump during the warm-up period will increase, and thus the temperature of the booster pump will increase more rapidly. Since the booster pump typically takes a longer time to fully warm up than the support pump, the method and/or apparatus of the present invention can reduce the time required to warm up the entire vacuum pump configuration from the slow mode. This in turn increases the throughput of the processing tool.
圖1圖解說明根據本發明之某些實施例之一系統10之一示意圖，其中除其他以外一處理室12及一真空泵配置20串聯連接。真空泵配置20將氣體抽出處理室12且在其中形成一真空環境以實施特定程序，諸如沈積、蝕刻、離子植入、外延等。可自一或多個氣體源(諸如此圖中由14a及14b指定之氣體源)將氣體引入至處理室12中。氣體源14a及14b可分別經由控制閥16a及16b連接至處理室12。將各種氣體引入至處理室12中之定時可藉由選擇性地接通或關斷控制閥16a及16b來控制。自氣體源14a及14b引入至處理室12中之氣體之流動速率可藉由調整控制閥16a及16b之流體導率來控制。 1 illustrates a schematic diagram of a system 10 in accordance with some embodiments of the present invention in which a processing chamber 12 and a vacuum pump configuration 20 are connected in series, among others. The vacuum pump configuration 20 draws gas out of the processing chamber 12 and forms a vacuum environment therein to perform a particular process, such as deposition, etching, ion implantation, epitaxy, and the like. Gas may be introduced into the processing chamber 12 from one or more gas sources, such as the gas sources specified by 14a and 14b in this figure. Gas sources 14a and 14b can be coupled to process chamber 12 via control valves 16a and 16b, respectively. The timing of introducing various gases into the processing chamber 12 can be controlled by selectively turning the control valves 16a and 16b on or off. The flow rate of gas introduced into the processing chamber 12 from the gas sources 14a and 14b can be controlled by adjusting the fluid conductivity of the control valves 16a and 16b.
真空泵配置20包含串聯連接之一增壓泵22及一支援泵24。增壓泵22之入口連接至處理室12之出口。增壓泵22之出口連接至支援泵24之入口。支援泵24之出口可連接至一消減器件(圖中未展示)，在消減器件中自支援泵24排放之廢氣經處理以便減小廢氣可對環境具有之有害影響。可在真空泵配置中實施感測器(圖中未展示)以收集各種量測之資料，諸如增壓泵22及支援泵24之溫度、電力消耗、泵速度等。亦可實施感測器以量測在增壓泵22及/或支援泵24之入口及/或出口處之氣體壓力。一控制器30經組態以回應於由感測器收集之資料而控制增壓泵22及支援泵24之各種參數。舉例而言，控制器30可在接收指示在處理室12中不預期執行立即處理之一信號後旋即將增壓泵22及支援泵 24置於一低公用設施消耗狀態(例如，慢車模式)中。此信號可由處理室12或由聯結處理室12之處理工具直接提供至控制器30。另一選擇係，此信號可由一半導體製造設施之一中央控制單元提供至控制器30。 The vacuum pump configuration 20 includes a boost pump 22 and a support pump 24 connected in series. The inlet of the booster pump 22 is connected to the outlet of the process chamber 12. The outlet of the booster pump 22 is connected to the inlet of the support pump 24. The outlet of the support pump 24 can be connected to a subtractive device (not shown) in which the exhaust gas discharged from the support pump 24 is treated to reduce the harmful effects of the exhaust gas on the environment. A sensor (not shown) may be implemented in the vacuum pump configuration to collect various measurements, such as the temperature of the boost pump 22 and the support pump 24, power consumption, pump speed, and the like. A sensor can also be implemented to measure the gas pressure at the inlet and/or outlet of boost pump 22 and/or support pump 24. A controller 30 is configured to control various parameters of boost pump 22 and support pump 24 in response to data collected by the sensor. For example, the controller 30 may spin the booster pump 22 and the support pump after receiving a signal indicating that the immediate processing is not expected to be performed in the processing chamber 12. 24 is placed in a low utility consumption state (eg, local mode). This signal may be provided directly to the controller 30 by the processing chamber 12 or by a processing tool coupled to the processing chamber 12. Alternatively, the signal may be provided to controller 30 by a central control unit of a semiconductor manufacturing facility.
在接收一喚醒信號後，控制器30旋即實現對真空泵配置20之電力供應之一增加，且將增壓泵22及支援泵24之速度自其各別慢車速度提升至較高位準。控制器30將在增壓泵22之出口處之背壓控制、提升且維持在自0.1 mbar至10 mbar之一範圍內至少達自當自慢車模式啟動真空泵配置20時至當增壓泵22達到等於或超過一預定臨限值之一溫度時之一時間週期，需要如此以便使增壓泵在正常情況下操作。本文中所揭示之壓力範圍高於典型、習用暖機程序中增壓泵22之背壓。 Upon receiving a wake-up signal, controller 30 immediately effects an increase in power supply to vacuum pump configuration 20 and raises the speed of boost pump 22 and support pump 24 from their respective idle speeds to a higher level. The controller 30 controls, raises and maintains the back pressure at the outlet of the booster pump 22 in a range from 0.1 mbar to 10 mbar at least from when the idle mode is activated to the vacuum pump configuration 20 to when the booster pump 22 is reached One time period equal to or exceeding one of the predetermined threshold temperatures is required to operate the booster pump under normal conditions. The pressure range disclosed herein is higher than the back pressure of the booster pump 22 in a typical, conventional warm-up procedure.
在數學上，增壓泵22之壓縮功率(W)等於其排氣量(V)乘以跨越其之壓差(dP)。假定增壓泵22之排氣量係恆定的，藉由提升背壓提升壓差將需要較高電力以透過增壓泵22壓縮氣體，且因此結果產生更多熱。此將致使增壓泵22之溫度自當增壓泵22在慢車模式中時之溫度更快速地達到適合於正常泵操作之預定臨限值。 Mathematically, the compression power (W) of the booster pump 22 is equal to its displacement (V) multiplied by the differential pressure (dP) across it. Assuming that the amount of exhaust of the booster pump 22 is constant, increasing the differential pressure by raising the back pressure will require higher power to compress the gas through the booster pump 22, and as a result generate more heat. This will cause the temperature of the booster pump 22 to reach a predetermined threshold suitable for normal pump operation more quickly from when the booster pump 22 is in the idle mode.
在本發明之某些實施例中，增壓泵22之背壓可藉由調整支援泵24之速度來控制。支援泵24之速度越慢，增壓泵22之背壓越高。圖2A中圖解說明用於控制增壓泵22之背壓之一例示性程序。程序在步驟200處開始。在步驟202處，判定真空泵配置20是否已接收用以自慢車模式喚醒之一信號。若判定真空泵配置20未接收到此信號，則真空泵配置20將保持在慢車模式中。若判定真空泵配置20已接收到此信號，則程序將繼續進行至步驟204，在步驟204處將增壓泵22之速度設定為高於其慢車速度之一第一速度。在步驟206處，將支援泵24之速度設定為高於其慢車速度之一第二速度。應注意，儘管圖2A中將步驟204及206圖解說明為兩個單獨動作，但在本發明之某些實施例中可 同時設定增壓泵22及支援泵24之速度。 In some embodiments of the invention, the back pressure of boost pump 22 can be controlled by adjusting the speed of support pump 24. The slower the speed of the support pump 24, the higher the back pressure of the booster pump 22. An exemplary procedure for controlling the back pressure of boost pump 22 is illustrated in FIG. 2A. The program begins at step 200. At step 202, it is determined if the vacuum pump configuration 20 has received a signal to wake up from the slow mode. If it is determined that the vacuum pump configuration 20 does not receive this signal, the vacuum pump configuration 20 will remain in the idle mode. If it is determined that vacuum pump configuration 20 has received this signal, then the program will proceed to step 204 where the speed of boost pump 22 is set to be higher than one of its idle speeds. At step 206, the speed of the assist pump 24 is set to be higher than one of its idle speeds. It should be noted that although steps 204 and 206 are illustrated in FIG. 2A as two separate actions, in some embodiments of the invention At the same time, the speeds of the booster pump 22 and the support pump 24 are set.
在步驟208處，判定增壓泵22之背壓是否在自0.1 mbar至10 mbar之預定範圍內。若背壓不在預定範圍內，則程序繼續進行至步驟210，在步驟210處降低支援泵24之速度以便使增壓泵22之背壓快速地下降至預定範圍內。在本發明之某些實施例中，一次性地降低支援泵24之速度，且程序等待增壓泵22之背壓移動至預定範圍內。在本發明之某些其他實施例中，在若干個時間間隔上以遞增方式降低支援泵24之速度直至增壓泵22之背壓移動至預定範圍內為止。在本發明之另外某些其他實施例中，可在步驟206處將支援泵24之第二速度設定得足夠低以供增壓泵22之背壓快速地上升，以使得可一起消除步驟210。所有此等實施例皆在本發明之範疇內。 At step 208, it is determined if the back pressure of booster pump 22 is within a predetermined range from 0.1 mbar to 10 mbar. If the back pressure is not within the predetermined range, the process proceeds to step 210 where the speed of the assist pump 24 is lowered to rapidly reduce the back pressure of the booster pump 22 to a predetermined range. In some embodiments of the invention, the speed of the assist pump 24 is reduced once and the program waits for the back pressure of the boost pump 22 to move within a predetermined range. In some other embodiments of the invention, the speed of the assist pump 24 is incrementally decreased over a number of time intervals until the back pressure of the booster pump 22 moves within a predetermined range. In still other embodiments of the present invention, the second speed of the assist pump 24 may be set low enough at step 206 for the back pressure of the boost pump 22 to rise rapidly so that step 210 may be eliminated together. All such embodiments are within the scope of the invention.
若判定增壓泵22之背壓在預定範圍內，則步驟繼續進行至步驟212。在步驟212處，判定增壓泵22及支援泵24之溫度是否等於或超過其各別臨限溫度。若是，則真空泵配置20將經設定以準備好在一正常操作模式中抽空處理室12。直到那時，真空泵配置20將保持在暖機程序中，等待溫度上升至合適位準。應注意，增壓泵22與支援泵24之預定臨限溫度值可相同或可不相同。其後，程序在步驟214處結束。 If it is determined that the back pressure of the booster pump 22 is within a predetermined range, the step proceeds to step 212. At step 212, it is determined whether the temperature of the booster pump 22 and the assist pump 24 is equal to or exceeds its respective threshold temperature. If so, the vacuum pump configuration 20 will be set to be ready to evacuate the process chamber 12 in a normal mode of operation. Until then, the vacuum pump configuration 20 will remain in the warm-up procedure, waiting for the temperature to rise to the appropriate level. It should be noted that the predetermined threshold temperature values of booster pump 22 and support pump 24 may or may not be the same. Thereafter, the program ends at step 214.
在本發明之某些實施例中，增壓泵22之背壓可藉由調整泵速度且比較增壓泵22之溫度與一臨限溫度來控制而不需直接量測背壓。圖2B圖解說明展示用於在不直接量測增壓泵22之背壓之情況下控制其之一例示性程序之一流程圖。圖2B中之程序類似於圖2A中之彼程序，其中差異在於：不量測增壓泵22之背壓。在步驟248處，量測增壓泵22之溫度且將其與增壓泵之臨限溫度比較。若所量測之溫度低於臨限溫度，則在步驟250處增加支援泵24之速度。週期性地重複步驟248及250直至增壓泵22之所量測之溫度等於或超過臨限溫度為止。其後，程序繼續進行至步驟252，在步驟252處判定支援泵24之溫度是否 等於或超過支援泵24之臨限溫度。若是，則真空泵配置20將經設定為準備好在一正常操作模式中抽空處理室12。直至那時，真空泵配置20將保持在暖機程序中，等待溫度上升至合適位準。其後，程序在步驟254處結束。 In some embodiments of the invention, the back pressure of the booster pump 22 can be controlled by adjusting the pump speed and comparing the temperature of the booster pump 22 to a threshold temperature without directly measuring the back pressure. 2B illustrates a flow chart showing one exemplary procedure for controlling the back pressure of boost pump 22 without directly measuring it. The procedure in Figure 2B is similar to the procedure in Figure 2A, with the difference that the back pressure of booster pump 22 is not measured. At step 248, the temperature of boost pump 22 is measured and compared to the threshold temperature of the boost pump. If the measured temperature is below the threshold temperature, the speed of the support pump 24 is increased at step 250. Steps 248 and 250 are repeated periodically until the measured temperature of boost pump 22 equals or exceeds the threshold temperature. Thereafter, the process proceeds to step 252 where it is determined whether the temperature of the support pump 24 is It is equal to or exceeds the threshold temperature of the support pump 24. If so, the vacuum pump configuration 20 will be set to be ready to evacuate the process chamber 12 in a normal mode of operation. Until then, the vacuum pump configuration 20 will remain in the warm-up procedure, waiting for the temperature to rise to the appropriate level. Thereafter, the program ends at step 254.
在本發明之某些其他實施例中，增壓泵22之背壓可藉由在增壓泵22之出口處或增壓泵22與支援泵24之間的導管中之一位置處注入一沖洗氣體來提升。如圖1中所展示，可視情況提供一沖洗氣體源32及一控制閥34。控制閥34可放置於源32與增壓泵22與支援泵24之間的導管之間。控制器30經組態以調整控制閥34之導率，藉此控制沖洗氣體自源32至增壓泵22之出口或其下游接近處之流動速率。此又變更增壓泵22之出口處之背壓。選擇穩定的且不與作為沖洗氣體流動穿過真空泵配置20之處理氣體反應之氣體係有利的。沖洗氣體之實例包含氮氣、氦氣及其他惰性氣體。 In certain other embodiments of the present invention, the back pressure of the booster pump 22 may be injected by flushing at one of the outlets of the booster pump 22 or one of the conduits between the booster pump 22 and the support pump 24. Gas to lift. As shown in FIG. 1, a source of purge gas 32 and a control valve 34 are provided as appropriate. Control valve 34 can be placed between source 32 and the conduit between boost pump 22 and support pump 24. The controller 30 is configured to adjust the conductance of the control valve 34, thereby controlling the flow rate of flushing gas from the source 32 to the outlet of the boost pump 22 or its downstream proximity. This in turn changes the back pressure at the outlet of the booster pump 22. It is advantageous to select a gas system that is stable and does not react with the process gas flowing through the vacuum pump configuration 20 as a flushing gas. Examples of flushing gases include nitrogen, helium, and other inert gases.
圖3圖解說明根據本發明之某些實施例之用於自慢車模式對真空泵配置20暖機之一程序。圖3中所圖解說明之程序類似於圖2中之彼程序，但不同在於：在後者中增壓泵22之背壓藉由調整支援泵24之速度來控制及維持，而在前者中增壓泵22之背壓藉由在增壓泵22之出口處注入沖洗氣體來控制及維持(如由步驟300所闡述)。在步驟302處，判定增壓泵22之背壓是否在預定範圍內。若否，則控制器30可增加控制閥34之導率以增加沖洗氣體之流動速率，直至增壓泵22之背壓移動至預定範圍內為止。如圖2中之程序，在步驟300處，可經過若干個時間間隔以遞增方式調整沖洗氣體之流動速率或立即突然將其調整至一預定位準。若判定增壓泵22之背壓在預定範圍內，則程序將繼續進行至步驟304。 3 illustrates a procedure for warming up a vacuum pump configuration 20 for a self-idle mode, in accordance with certain embodiments of the present invention. The procedure illustrated in Figure 3 is similar to the procedure in Figure 2, but with the difference that in the latter the back pressure of the booster pump 22 is controlled and maintained by adjusting the speed of the support pump 24, while in the former the boost The back pressure of pump 22 is controlled and maintained by injecting flushing gas at the outlet of booster pump 22 (as illustrated by step 300). At step 302, it is determined whether the back pressure of the booster pump 22 is within a predetermined range. If not, the controller 30 may increase the conductivity of the control valve 34 to increase the flow rate of the flushing gas until the back pressure of the booster pump 22 moves within a predetermined range. As in the procedure of FIG. 2, at step 300, the flow rate of the flushing gas may be incrementally adjusted over a number of time intervals or immediately adjusted to a predetermined level. If it is determined that the back pressure of booster pump 22 is within a predetermined range, then the routine will proceed to step 304.
在步驟304處，判定增壓泵22之溫度是否等於或超過一預定臨限溫度。若否，則程序將等待直至其是為止，然後繼續進行至步驟 306，在步驟306處切斷沖洗氣體流。在步驟308處，判定支援泵24之溫度是否等於或超過一預定臨限溫度。若否，則程序將等待直至其是為止，然後在步驟310處結束程序。如圖2中之程序，此處增壓泵與支援泵之臨限溫度可相同或可不相同。 At step 304, it is determined whether the temperature of the booster pump 22 is equal to or exceeds a predetermined threshold temperature. If not, the program will wait until it is, then proceed to the step 306, the flushing gas stream is shut off at step 306. At step 308, it is determined whether the temperature of the support pump 24 is equal to or exceeds a predetermined threshold temperature. If not, the program will wait until it is, then terminate the program at step 310. As shown in the procedure of Figure 2, the threshold temperature of the booster pump and the support pump may be the same or different.
圖4係展示所揭示之方法及/或裝置縮短在將一真空泵配置置於一慢車模式中後對其暖機所需之時間之一圖表。圖之左側圖解說明用於根據習用方法或裝置對一真空泵配置暖機之一時間線。圖之右側圖解說明用於根據本發明之方法或裝置對該真空泵配置暖機之一時間線。時間線之間的比較展示所揭示之方法或裝置由於暖機程序中增壓泵之增加之背壓而能夠比習用方法或裝置更加快速地將增壓泵及支援泵暖機至其期望之溫度。縮短之暖機週期意味著在指示真空泵配置自慢車模式喚醒之後處理工具可更加快速地投入操作。此又轉變成處理工具之較高產量。 4 is a graph showing one of the times required for the disclosed method and/or apparatus to shorten the warming up of a vacuum pump configuration after it is placed in an idle mode. The left side of the figure illustrates one timeline for configuring a vacuum pump for warming up according to conventional methods or devices. The right side of the figure illustrates one timeline for configuring the vacuum pump for warming up in accordance with the method or apparatus of the present invention. A comparison between timelines shows that the disclosed method or apparatus can warm the booster pump and the support pump to their desired temperature more quickly than conventional methods or devices due to the increased back pressure of the booster pump in the warm-up procedure. . The shortened warm-up period means that the processing tool can be put into operation more quickly after indicating that the vacuum pump is configured to wake up from the slow mode. This in turn translates into higher yields of processing tools.
儘管本文中將本發明圖解說明且闡述為體現於一或多個特定實例中，但其不意欲限制於所展示之細節，此乃因可在不背離本發明之精神且在申請專利範圍之等效內容之範疇及範圍內之情況下在其中做出各種修改及結構改變。因此，寬泛地且以與以下申請專利範圍中所陳述之本發明之範疇一致之一方式解釋隨附申請專利範圍係適當的。 The present invention has been illustrated and described herein as being embodied in a particular embodiment, and is not intended to be Various modifications and structural changes are made therein within the scope and scope of the content. Therefore, the scope of the accompanying claims is to be construed as broadly and in accordance with the scope of the invention as set forth in the following claims.
Claims (16)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ??1207721.0 | 2012-05-02 | ||
| GB1207721.0A GB2501735B (en) | 2012-05-02 | 2012-05-02 | Method and apparatus for warming up a vacuum pump arrangement |
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| Publication Number | Publication Date |
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| TW201407037A TW201407037A (en) | 2014-02-16 |
| TWI640687B true TWI640687B (en) | 2018-11-11 |
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| TW102115762A TWI640687B (en) | 2012-05-02 | 2013-05-02 | Method and apparatus for warming up a vacuum pump arrangement |
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| US (1) | US20150086387A1 (en) |
| EP (1) | EP2844879A2 (en) |
| JP (1) | JP6208219B2 (en) |
| KR (1) | KR20150005945A (en) |
| CN (1) | CN104246230B (en) |
| GB (1) | GB2501735B (en) |
| TW (1) | TWI640687B (en) |
| WO (1) | WO2013164571A2 (en) |
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| EP3245404B1 (en) * | 2015-01-15 | 2018-12-19 | Atlas Copco Airpower | Method for controlling a gas supply to a vacuum pump |
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| JP2017031892A (en) * | 2015-08-03 | 2017-02-09 | アルバック機工株式会社 | Vacuum evacuation device and its operation method |
| CN106762540A (en) * | 2015-11-24 | 2017-05-31 | 中国科学院沈阳科学仪器股份有限公司 | A kind of energy-saving type vacuum pump nitrogen purging device |
| CN105422454B (en) * | 2015-12-09 | 2017-12-19 | 攀枝花钢城集团瑞钢工业有限公司 | Vacuum-pumping system and vacuum suction method |
| DE102016005216A1 (en) * | 2016-04-28 | 2017-11-02 | Linde Aktiengesellschaft | Fluid energy machine |
| DE202016007609U1 (en) * | 2016-12-15 | 2018-03-26 | Leybold Gmbh | Vacuum pumping system |
| DE102017107601B4 (en) * | 2017-04-10 | 2019-11-07 | Gardner Denver Deutschland Gmbh | Method for controlling a screw compressor |
| GB2569314A (en) * | 2017-12-12 | 2019-06-19 | Edwards Ltd | A turbomolecular pump and method and apparatus for controlling the pressure in a process chamber |
| GB2583942A (en) * | 2019-05-14 | 2020-11-18 | Edwards Ltd | Heater control unit |
| CN111734615B (en) * | 2020-06-28 | 2022-03-18 | 安图实验仪器(郑州)有限公司 | Control system and control method for rear-stage pump of vacuum system |
| JP7502217B2 (en) * | 2021-02-26 | 2024-06-18 | 株式会社荏原製作所 | Vacuum evacuation method and vacuum evacuation system |
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Also Published As
| Publication number | Publication date |
|---|---|
| GB2501735B (en) | 2015-07-22 |
| KR20150005945A (en) | 2015-01-15 |
| TW201407037A (en) | 2014-02-16 |
| EP2844879A2 (en) | 2015-03-11 |
| WO2013164571A2 (en) | 2013-11-07 |
| GB2501735A (en) | 2013-11-06 |
| JP6208219B2 (en) | 2017-10-04 |
| CN104246230A (en) | 2014-12-24 |
| GB201207721D0 (en) | 2012-06-13 |
| JP2015516044A (en) | 2015-06-04 |
| US20150086387A1 (en) | 2015-03-26 |
| CN104246230B (en) | 2016-10-26 |
| WO2013164571A3 (en) | 2013-12-27 |
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