CN104246230B - For the method and apparatus preheating vacuum pump apparatus - Google Patents

For the method and apparatus preheating vacuum pump apparatus Download PDF

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Publication number
CN104246230B
CN104246230B CN201380022974.3A CN201380022974A CN104246230B CN 104246230 B CN104246230 B CN 104246230B CN 201380022974 A CN201380022974 A CN 201380022974A CN 104246230 B CN104246230 B CN 104246230B
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CN
China
Prior art keywords
pump
booster pump
vacuum pump
preheating
backing
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Expired - Fee Related
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CN201380022974.3A
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Chinese (zh)
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CN104246230A (en
Inventor
J.R.塔特萨尔
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BOC Group Ltd
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BOC Group Ltd
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B49/00—Control, e.g. of pump delivery, or pump pressure of, or safety measures for, machines, pumps, or pumping installations, not otherwise provided for, or of interest apart from, groups F04B1/00 - F04B47/00
    • F04B49/02—Stopping, starting, unloading or idling control
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B23/00—Pumping installations or systems
    • F04B23/04—Combinations of two or more pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B41/00—Pumping installations or systems specially adapted for elastic fluids
    • F04B41/06—Combinations of two or more pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B49/00—Control, e.g. of pump delivery, or pump pressure of, or safety measures for, machines, pumps, or pumping installations, not otherwise provided for, or of interest apart from, groups F04B1/00 - F04B47/00
    • F04B49/20—Control, e.g. of pump delivery, or pump pressure of, or safety measures for, machines, pumps, or pumping installations, not otherwise provided for, or of interest apart from, groups F04B1/00 - F04B47/00 by changing the driving speed
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C23/00—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids
    • F04C23/005—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids of dissimilar working principle
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C25/00—Adaptations of pumps for special use of pumps for elastic fluids
    • F04C25/02—Adaptations of pumps for special use of pumps for elastic fluids for producing high vacuum
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C28/00—Control of, monitoring of, or safety arrangements for, pumps or pumping installations specially adapted for elastic fluids
    • F04C28/02—Control of, monitoring of, or safety arrangements for, pumps or pumping installations specially adapted for elastic fluids specially adapted for several pumps connected in series or in parallel
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C28/00—Control of, monitoring of, or safety arrangements for, pumps or pumping installations specially adapted for elastic fluids
    • F04C28/06—Control of, monitoring of, or safety arrangements for, pumps or pumping installations specially adapted for elastic fluids specially adapted for stopping, starting, idling or no-load operation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C28/00—Control of, monitoring of, or safety arrangements for, pumps or pumping installations specially adapted for elastic fluids
    • F04C28/06—Control of, monitoring of, or safety arrangements for, pumps or pumping installations specially adapted for elastic fluids specially adapted for stopping, starting, idling or no-load operation
    • F04C28/065—Capacity control using a multiplicity of units or pumping capacities, e.g. multiple chambers, individually switchable or controllable
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D19/00—Axial-flow pumps
    • F04D19/02—Multi-stage pumps
    • F04D19/04—Multi-stage pumps specially adapted to the production of a high vacuum, e.g. molecular pumps
    • F04D19/046—Combinations of two or more different types of pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D27/00—Control, e.g. regulation, of pumps, pumping installations or pumping systems specially adapted for elastic fluids
    • F04D27/02—Surge control
    • F04D27/0261—Surge control by varying driving speed
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D27/00—Control, e.g. regulation, of pumps, pumping installations or pumping systems specially adapted for elastic fluids
    • F04D27/02—Surge control
    • F04D27/0292—Stop safety or alarm devices, e.g. stop-and-go control; Disposition of check-valves
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B2201/00—Pump parameters
    • F04B2201/08—Cylinder or housing parameters
    • F04B2201/0801—Temperature
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C2220/00—Application
    • F04C2220/30—Use in a chemical vapor deposition [CVD] process or in a similar process
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C2270/00—Control; Monitoring or safety arrangements
    • F04C2270/70—Safety, emergency conditions or requirements
    • F04C2270/701—Cold start
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F05—INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF CLASSES F01-F04
    • F05D—INDEXING SCHEME FOR ASPECTS RELATING TO NON-POSITIVE-DISPLACEMENT MACHINES OR ENGINES, GAS-TURBINES OR JET-PROPULSION PLANTS
    • F05D2260/00—Function
    • F05D2260/85—Starting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
    • Y02B30/70—Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
  • Applications Or Details Of Rotary Compressors (AREA)
  • Control Of Positive-Displacement Pumps (AREA)

Abstract

A kind of method for preheating vacuum pump apparatus, this vacuum pump apparatus has booster pump and the backing pump in this booster pump downstream, for evacuating process chamber, described method includes: be set in by booster pump at First Speed, and this First Speed is higher than booster pump idle speed at which when idle mode；And in time period when at least being reached the temperature equaling or exceeding the first predetermined threshold from vacuum pump apparatus to booster pump when starting from idle mode, the forepressure in the exit of booster pump is controlled in the range of 0.1 millibar to 10 millibar.A kind of equipment that is able to carry out the method is also claimed.

Description

For the method and apparatus preheating vacuum pump apparatus
Technical field
The present invention relates to a kind of method preheating (warm up) this vacuum pump apparatus after entering idle mode at vacuum pump apparatus and/or equipment.
Background technology
The system used when manufacturing semiconductor device typically comprises handling implement inter alia, has booster pump (booster pump) and the vacuum pump apparatus of backing pump (backing pump) and cancellation element.Handling implement typically comprises process chamber, and semiconductor wafer is processed into predetermined structure in the process chamber.Vacuum pump apparatus is connected to handling implement, is used for evacuating process chamber to form vacuum environment in the process chamber, thus various semiconductor processing techniques occurs.The gas extracted out from process chamber by vacuum pump apparatus can be directed to cancellation element, and this cancellation element was removed or being harmful to or toxic component in decomposition gas before gas is discharged into environment.
It is expected that manage and reduce the power utilization (utility) of such as electric power, fuel and the water that are consumed during semiconductor fabrication process by vacuum pump and cancellation element.When manufacturing semiconductor wafer, the power of vacuum pump and cancellation element consumption represent a large portion of the general power consumed by whole system.The efficiency that the power utilization having been carried out much making great efforts in semiconductor industry improving vacuum pump consumes, in order to reduce the manufacturing cost of semiconductor wafer.In addition to cost savings, semiconductor maker also can often be pressed, to improve the energy efficiency of their manufacturing process by new environmental legislation.
It is when handling implement need not, when vacuum pump apparatus and cancellation element operate with its normal capacity, vacuum pump apparatus and cancellation element are placed in idle mode for improving a conventional method of efficiency.Term " idle mode " is used interchangeably with other terms herein, and such as in various industries, frequent sleep pattern accustomed to using, green model, dormancy, reduction energy/low energy model, active power utilize control model.Such as, when semiconductor wafer is just being passed in process chamber or when passing out from process chamber, vacuum pump apparatus and cancellation element can be placed in idle mode, when the resource that they consume in this mode is under normal manipulation mode less than them.When handling implement needs vacuum pump apparatus and cancellation element to operate with its normal capacity, it is possible to make them return to its normal manipulation mode from idle mode.
One shortcoming of conventional method be it when usually spending long chien shih vacuum pump apparatus and cancellation element return to its normal manipulation mode from idle mode.When vacuum pump apparatus is in idle mode, it can be cooled to low temperature.Before vacuum pump apparatus can be under normal condition operates, needing it is preheating to uniform temperature, this can take a long time.The time that preheating spends is the longest, and handling implement is set to idle running, waits that the vacuum pump apparatus ready time is the longest.This is converted into cap loss and yield declines.
It is therefore desirable to be used for making vacuum pump apparatus from idle mode rapidly pre-warming, thus shorten the method that processing system returns to time required for normal manipulation mode from idle mode.
Summary of the invention
The present invention relates to a kind of method and/or equipment preheating this vacuum pump apparatus after entering idle mode at vacuum pump apparatus.In some embodiments of the invention, comprising the following steps for preheating the method for the vacuum pump apparatus for evacuating process chamber with booster pump and the backing pump in this booster pump downstream: be set in by booster pump at First Speed, this First Speed is higher than booster pump idle speed at which when idle mode；And in time period when at least being reached the temperature equaling or exceeding the first predetermined threshold from vacuum pump apparatus to booster pump when starting from idle mode, control the forepressure (backing pressure) in the exit of booster pump, in the range of 0.1 millibar to 10 millibar, wherein to select suitable forepressure by needing according to the size of booster pump.
In some embodiments of the invention, a kind of equipment includes: process chamber；Booster pump, its entrance is fluidly connected to the outlet of process chamber；Backing pump, its entrance is fluidly connected to supercharging delivery side of pump, and described backing pump is for evacuating process chamber together with booster pump；And controller, it electrically connects with booster pump and backing pump, in time period when this controller is configured at least be reached to booster pump when starting from idle mode the temperature equaling or exceeding the first predetermined threshold from booster pump and backing pump, the forepressure in the exit of booster pump is controlled in the range of 0.1 millibar to 10 millibar.
But, when read in conjunction with the accompanying drawings, structurally and operationally method and its additional purpose and the advantage of the present invention will be best understood from the following description of specific embodiment.
Accompanying drawing explanation
Fig. 1 illustrates the schematic diagram of the system according to some embodiments of the present invention, and process chamber, booster pump and backing pump are connected in series the most inter alia.
Fig. 2 A and 2B illustrates the flow chart showing the various processes for preheating vacuum pump apparatus according to some embodiments of the present invention.
Fig. 3 illustrates the flow chart showing the process for preheating vacuum pump apparatus according to some embodiments of the present invention.
Fig. 4 is to show that disclosed method and/or equipment shorten the chart preheating the time required for vacuum pump apparatus.
Detailed description of the invention
It relates to a kind of method and/or equipment preheating this vacuum pump apparatus after entering idle mode at vacuum pump apparatus.Vacuum pump apparatus has booster pump and at backing pump downstream in its structure simplified.The entrance of booster pump is connected to the outlet of process chamber, and process chamber can be a part for semiconductor processing tools or need inner vacuum environment so that any other correctly worked is equipped.Supercharging delivery side of pump is connected to the entrance of backing pump, and prime delivery side of pump typically fluidly connects with cancellation element or is directly connected with atmospheric environment in some cases.When vacuum pump apparatus is preheated, the speed of booster pump is increased to and is maintained above the level of booster pump idle speed at which when idle mode.Compared with the forepressure under normal manipulation mode or under the idle mode that certain situation is used by conventional method, the forepressure of booster pump (for the pressure in exit of booster pump) is also increased to and maintains relatively high level.As result, compress during preheating cycle and can be increased, hence in so that the temperature of booster pump raises more quickly by the power required for the gas of booster pump.Because booster pump typically to take longer time than backing pump and preheat completely, therefore disclosed method and/or equipment can shorten by whole vacuum pump apparatus from idle mode preheat required for time.This then add the yield of handling implement.
Fig. 1 illustrates the schematic diagram of the system 10 according to some embodiments of the present invention, and the most inter alia, process chamber 12 and vacuum pump apparatus 20 are connected in series.Gas is extracted out by vacuum pump apparatus 20 from process chamber 12, and vacuum environment formed therein that processes to perform some, such as deposits, etches, ion implanting, epitaxy etc..Gas can be introduced in process chamber 12 from one or more gas sources (gas source indicated by 14a and 14b the most in this figure).Gas source 14a and 14b can be connected to process chamber 12 via control valve 16a and 16b respectively.Various gases are incorporated into the timing in process chamber 12 can be by selectively turning on or closing control valve 16a and 16b controls.The flow velocity of the gas being incorporated into process chamber 12 from gas source 14a and 14b can be controlled by the fluid conductivity of adjusting control valve 16a and 16b.
Vacuum pump apparatus 20 includes booster pump 22 and the backing pump 24 being connected in series.The entrance of booster pump 22 is connected to the outlet of process chamber 12.The outlet of booster pump 22 is connected to the entrance of backing pump 24.The outlet of backing pump 24 may be coupled to cancellation element (not shown in FIG.), and processing the waste gas from backing pump 24 discharge in this cancellation element may be to the adverse effect of environment to reduce waste gas.Sensor (not shown in FIG.) can be used in vacuum pump apparatus, to collect the data of various measurement, such as booster pump 22 and the temperature of backing pump 24, power consumption, pump speed etc..It also is able to use sensor to measure booster pump 22 and/or the entrance of backing pump 24 and/or the gas pressure in exit.Controller 30 be configured in response to by the data of sensor collection to control the various parameters of booster pump 22 and backing pump 24.Such as, booster pump 22 and backing pump 24 can be placed in low dynamics when receiving the instant process of instruction and being expected in process chamber 12 signal performed and utilize consumption state by controller 30, such as idle mode.Such signal can provide by process chamber 12 or by the handling implement that process chamber 12 is incorporated directly in controller 30.Alternatively, such signal can be supplied to controller 30 by the central control unit of semiconductor manufacturing facility.
When receiving wake-up signal, controller 30 affects the increase of the power supply to vacuum pump apparatus 20, and from the idle speed of each of which, the speed of booster pump 22 and backing pump 24 is increased to higher level.At least when vacuum pump apparatus 20 is started from idle mode to booster pump 22 reach the temperature equaling or exceeding predetermined threshold time time period in (this for making booster pump operate under normal operation be need), controller 30 controls and raises the forepressure in exit of booster pump 22 and maintained in the range of 0.1 millibar to 10 millibar by this forepressure.Pressure limit disclosed herein is higher than the booster pump 22 forepressure in typical conventional warm.
Mathematically, the compression horsepower (W) of booster pump 22 is multiplied by, equal to its swept volume (V), the pressure differential (dP) striding across it.Assuming that the swept volume of booster pump 22 is constant, then by raise forepressure come liter high pressure differential may require that higher power with compression by the gas of booster pump 22, therefore its result is to produce more heat.This can cause the temperature of booster pump 22 temperature when booster pump 22 is in idle mode very quickly to reach to be suitable to the most pump operated predetermined threshold.
In some embodiments of invention, the forepressure of booster pump 22 can be controlled by the speed of regulation backing pump 24.The speed of backing pump 24 is the slowest, and the forepressure of booster pump 22 is the highest.Fig. 2 A illustrates the example process of forepressure for controlling booster pump 22.This process starts in step 200.In step 202, determine whether vacuum pump apparatus 20 has been received by the signal waken up up from idle mode.If it is determined that vacuum pump apparatus 20 does not receives such signal, then vacuum pump apparatus 20 will be still in idle mode.If it is determined that vacuum pump apparatus 20 has been received by such signal, then process proceeds to step 204, in step 204, the speed of booster pump 22 is set in the First Speed higher than its idle speed.In step 206, the speed of backing pump 24 is set in the second speed higher than its idle speed.Although it should be noted that step 204 and 206 is illustrated as two separate actions in fig. 2, but the speed of booster pump 22 and backing pump 24 can concurrently set in some embodiments of the invention.
In step 208, determine that whether the forepressure of booster pump 22 is in the preset range of 0.1 millibar to 10 millibar.If forepressure is not in this preset range, then process proceeds to step 210, in step 210, makes the speed of backing pump 24 reduce to make the forepressure of booster pump 22 drop into rapidly in preset range.In some embodiments of the invention, the speed of backing pump 24 reduces once, and process waits that the forepressure of booster pump 22 moves in preset range.In other embodiments of the present invention, the speed of backing pump 24 is incrementally decreased through plenty of time interval, until the forepressure of booster pump 22 moves in preset range.In also some embodiments of the present invention, the second speed of backing pump 24 is set to of a sufficiently low in step 206, for making the forepressure of booster pump 22 rise rapidly, enabling remove step 210 together.All these embodiments are within.
If it is determined that the forepressure of booster pump 22 is in preset range, then process proceeds to step 212.In step 212, determine whether the temperature of booster pump 22 and backing pump 24 equals or exceeds the threshold temperature of each of which.If it is, vacuum pump apparatus 20 will be set as being ready for evacuating process chamber 12 in a normal operation mode.Thitherto, vacuum pump apparatus 20 will remain in warm, and waiting temperature is increased to proper level.It should be noted that booster pump 22 and the value of the predetermined threshold of backing pump 24 can be identical or can differ.Afterwards, process terminates in step 214.
In some embodiments of the invention, the forepressure of booster pump 22 can be controlled by regulation pump speed the temperature contrasting booster pump 22 and threshold temperature, it is not necessary to directly measures forepressure.Fig. 2 B illustrates the flow chart of the example process illustrating the forepressure controlling booster pump 22, and this process is without directly measuring forepressure.Process in Fig. 2 B is similar to the process in Fig. 2 A, and difference is not measure the forepressure of booster pump 22.In step 248, the temperature of booster pump 22 is tested to be measured, and contrasts with the threshold temperature of booster pump.If the temperature measured is less than threshold temperature, then increase the speed of backing pump 24 in step 250.The temperature of the measurement that step 248 and 250 is periodically repeated until booster pump 22 equals or exceeds threshold temperature.Afterwards, process proceeds to step 252, in step 252, determines whether the temperature of backing pump 24 equals or exceeds the threshold temperature of backing pump 24.If it is, vacuum pump apparatus 20 will be set as being ready for evacuating process chamber 12 in a normal operation mode.Thitherto, vacuum pump apparatus 20 will remain in warm, and waiting temperature is increased to proper level.Afterwards, process terminates in step 254.
In other embodiments of the present invention, it is possible to inject purging gas by the position in the conduit between the exit of booster pump 22 or booster pump 22 and backing pump 24 and raise the forepressure of booster pump 22.As it is shown in figure 1, purge gas source 32 and control valve 34 can be optionally provided.Control valve 34 can be placed between the conduit between source 32 and booster pump 22 and backing pump 24.Controller 30 is configured to the conductivity of adjusting control valve 34, thus controls to purge gas from source 32 to exit or to the flow velocity in adjacent place downstream of booster pump 22.So then the forepressure in the exit of booster pump 22 can be changed.Advantageously, select gas that is stable and that do not react with the place's process gases flowing through vacuum pump apparatus 20 as purging gas.The example of purging gas includes nitrogen, helium or other noble gases.
Fig. 3 show according to some embodiments of the present invention for the process that vacuum pump apparatus 20 is preheated from idle mode.In Fig. 3, the process of diagram is similar with the process in Fig. 2 A and Fig. 2 B, expect control by the speed of regulation backing pump 24 and maintain the forepressure of booster pump 22 in the latter, and by controlling and maintain the forepressure of booster pump 22, as described by step 300 at the exit of booster pump 22 injection purging gas in the former.In step 302, determine that the forepressure of booster pump 22 is whether in preset range.If it is not, then controller 30 can increase the conductivity of control valve 34, to increase the flow velocity of purging gas, until the forepressure of booster pump 22 moves in preset range.Such as the process in Fig. 2 A and Fig. 2 B, in step 300, the flow velocity of purging gas can either gradually or abruptly be adjusted to predeterminated level through plenty of time interval.If it is determined that the forepressure of booster pump 22 is in preset range, then process proceeds to step 304.
In step 304, determine whether the temperature of booster pump 22 equals or exceeds predetermined threshold.If it is not, then the temperature waiting until booster pump 22 is equaled or exceeded predetermined threshold by process, then proceed to step 306, in step 306, cut off flow of purge gas.In step 308, determine whether the temperature of backing pump 24 equals or exceeds predetermined threshold.If it is not, then the temperature waiting until backing pump 24 is equaled or exceeded predetermined threshold by process, then process terminates in step 310.Such as the process in Fig. 2 A and Fig. 2 B, can be identical or can differ at this booster pump and the threshold temperature of backing pump.
Fig. 4 is to show the chart that disclosed method and/or equipment shortening preheat the time required for this vacuum pump apparatus after vacuum pump apparatus enters idle mode.The left side of figure illustrates according to conventional methods or equipment is for preheating the time shaft of vacuum pump apparatus.The right diagram of figure according to disclosed method or equipment for preheating the time shaft of vacuum pump apparatus.Contrast between time shaft shows that booster pump and backing pump can be preheating to they desired temperature than conventional method or equipment by disclosed method or equipment more rapidly, and its reason is to add the forepressure of booster pump in warm.Shorten preheating cycle and mean that handling implement can be command by after idle mode wakes up up being more rapidly introduced into operation at vacuum pump apparatus.For handling implement, this then be converted into higher yield.
Although the present invention illustrated and described herein is embodied in one or more particular example, but be not intended as being not limited to shown details, because the spirit without departing from the present invention and in the range of the equivalent of claim in the case of, can carry out wherein various amendment and structure change.Thus it is possible to be appreciated that, should broadly understand appended claim, and understand claim in the way of consistent with the scope of the present invention illustrated in claims.

Claims (16)

1., for the method preheating vacuum pump apparatus, described vacuum pump apparatus has booster pump and the backing pump in described booster pump downstream, is used for evacuating process chamber, and described method includes:
Being set at First Speed by described booster pump, described First Speed is higher than described booster pump idle speed at which when idle mode；And
At least when being started from described idle mode from described vacuum pump apparatus to described booster pump reach the temperature equaling or exceeding the first predetermined threshold time time period in, the forepressure in the exit of described booster pump is controlled in the range of 0.1 millibar to 10 millibar.
2. the method for preheating vacuum pump apparatus as claimed in claim 1, wherein, the described control to forepressure includes: regulate the speed of described backing pump, and the entrance of described backing pump is connected to described supercharging delivery side of pump.
3. the method for preheating vacuum pump apparatus as claimed in claim 2, wherein, when described vacuum pump apparatus is started from described idle mode, is set in described backing pump at second speed.
4. the method for preheating vacuum pump apparatus as claimed in claim 3, wherein, the described second speed of described backing pump is reduced to predeterminated level, in order to make the forepressure of described booster pump drop in the range of 0.1 millibar to 10 millibar.
5. the method for preheating vacuum pump apparatus as claimed in claim 4, wherein, interval of described second speed elapsed time is gradually lowered described predeterminated level.
6. the method for preheating vacuum pump apparatus as claimed in claim 1, wherein, the described control to forepressure includes: inject purging gas in the exit of described booster pump.
7. the method for preheating vacuum pump apparatus as claimed in claim 6, wherein, controls the flow velocity of described purging gas in the way of the forepressure by described booster pump is adjusted in the range of 0.1 millibar to 10 millibar.
8. the method for preheating vacuum pump apparatus as claimed in claim 1, wherein, it is set as described vacuum pump apparatus being ready for evacuating described process chamber in a normal operation mode, the temperature of the most described booster pump equals or exceeds described first predetermined threshold, and the temperature of described backing pump equals or exceeds the second predetermined threshold, wherein, described first predetermined threshold is identical with described second predetermined threshold or differs.
9. for preheating an equipment for vacuum pump apparatus, including:
Process chamber；
Booster pump, its entrance is fluidly connected to the outlet of described process chamber；
Backing pump, its entrance is fluidly connected to described supercharging delivery side of pump, and described backing pump is for evacuating described process chamber together with described booster pump；And
Controller, it electrically connects with described booster pump and described backing pump, described controller was configured in time period when at least being reached, to described booster pump, the temperature equaling or exceeding the first predetermined threshold when starting from idle mode from described booster pump and described backing pump, was controlled by the forepressure in the exit of described booster pump in the range of 0.1 millibar to 10 millibar.
10. the equipment for preheating vacuum pump apparatus as claimed in claim 9, wherein, described controller controls the forepressure of described booster pump by the speed regulating described backing pump.
11. as claimed in claim 10 for preheating the equipment of vacuum pump apparatus, and wherein, when described vacuum pump apparatus is started from described idle mode, described backing pump is set at predetermined speed by described controller.
12. as claimed in claim 11 for preheating the equipment of vacuum pump apparatus, and wherein, the predetermined speed of described backing pump is reduced to predeterminated level by described controller, in order to make the forepressure of described booster pump drop in the range of 0.1 millibar to 10 millibar.
13. as claimed in claim 12 for preheating the equipment of vacuum pump apparatus, and wherein, described controller makes interval of described predetermined speed elapsed time be gradually lowered described predeterminated level.
14., as claimed in claim 9 for preheating the equipment of vacuum pump apparatus, farther include to be fluidly coupled to the purge gas source in the exit of described booster pump.
15. as claimed in claim 14 for preheating the equipment of vacuum pump apparatus, wherein, described controller controls the flow velocity purging gas that the exit of the most described booster pump is injected, thus is controlled by the forepressure of described booster pump in the range of 0.1 millibar to 10 millibar.
16. as claimed in claim 9 for preheating the equipment of vacuum pump apparatus, wherein, described booster pump and described backing pump are set to be ready for evacuating described process chamber in a normal operation mode, the temperature of the most described booster pump equals or exceeds described first predetermined threshold, and the temperature of described backing pump equals or exceeds the second predetermined threshold, wherein, described first predetermined threshold is identical with described second predetermined threshold or differs.
CN201380022974.3A 2012-05-02 2013-04-24 For the method and apparatus preheating vacuum pump apparatus Expired - Fee Related CN104246230B (en)

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PCT/GB2013/051033 WO2013164571A2 (en) 2012-05-02 2013-04-24 Method and apparatus for warming up a vacuum pump arrangement

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WO2013164571A3 (en) 2013-12-27
JP2015516044A (en) 2015-06-04
KR20150005945A (en) 2015-01-15
GB2501735B (en) 2015-07-22
GB2501735A (en) 2013-11-06
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WO2013164571A2 (en) 2013-11-07
JP6208219B2 (en) 2017-10-04
TWI640687B (en) 2018-11-11

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