TWI640487B - Inverting device for brittle material substrate - Google Patents

Abstract

The inverting device of the present invention is used to invert a substrate in which functional regions are formed in an array in a longitudinal direction and a transverse direction, and the substrate is fractured except for a resin layer.

The solution is to hold the substrate 20 on the end material separation stage 15. The end material separation stage 15 includes a chamber 52 and a bottom plate 53 and an elastic plate 54 on the arm 51. The arm 51 is rotatable around a rotating shaft 55 as a center. In addition, the extension stage 16 is brought into contact from the upper part of the held substrate. Then, the end material separation stage 15 and the extension stage 16 are rotated in the same direction on the same rotation axis, thereby reversing the substrate 20 while holding it.

Description

Inverting device for brittle material substrate

The present invention relates to an inversion device for inverting a brittle material substrate, which is formed by coating a resin layer on a brittle material substrate such as a semiconductor substrate and a ceramic substrate.

In Patent Document 1, there is mentioned a substrate breaking device: by aligning the substrate on which the scribe line is formed, from the back surface of the surface on which the scribe line is formed, the scribe line is used along the scribe line and perpendicular to the surface Press the ground to break. When the substrate to be fractured is a semiconductor wafer and a plurality of functional regions are formed in an array, first, a scribe line is formed in the longitudinal direction and the lateral direction of the substrate at equal intervals between the functional regions. After breaking the brittle material substrate and removing the surrounding end material, it is necessary to invert the substrate in order to break the resin layer to completely separate the wafers into individual wafers. Patent Document 2 discloses a reversing mechanism for reversing a brittle material substrate using a robot arm. In this reversing operation, once the scribed substrate is placed on a stand with a robot arm, it is reversed by being supported from below.

Patent Document 1: Japanese Patent Application Laid-Open No. 2004-39931

Patent Document 2: Japanese Patent No. 3787489

On a brittle material substrate, such as a ceramic substrate, a plurality of functional regions are formed at a certain distance along the x-axis and the y-axis in a manufacturing step, and a cracking device is used to fill the upper surface of the ceramic substrate. The silicone-filled substrate is cracked. Once a scribe line is formed on the substrate in a grid pattern and cracked, only the ceramic substrate layer is separated along the scribe line, and the silicone resin layer remains in the original state and remains. Therefore, although it is necessary to invert the substrate and stretch the scribe on the silicone resin layer, there is a problem that it is difficult to invert the substrate which is almost separated, even if a part of the substrate does not fall off.

The present invention has been completed focusing on such a problem, and an object of the present invention is to be able to reverse while maintaining an original state without detaching a part of a substrate of a brittle material substrate that has been broken.

In order to solve the problem, the inverting device of the brittle material substrate of the present invention is an inverting device for inverting the brittle material substrate. The brittle material substrate is coated with resin on a brittle material substrate having a functional area on one side, and A scribe line is formed on the brittle material substrate to cut off the functional area; the reversing device includes a first stage provided to be rotatable freely and rotated on the same axis as the rotation axis of the first stage The second carrier is rotatable, and the first carrier and the second carrier are independently rotated by the first carrier and the second carrier. The stage includes a first arm that is rotatable by the first rotation mechanism, and an elastic plate provided on the upper surface of the first arm; the second stage includes a first arm that is rotatable by the second rotation mechanism. Two arms, and an elastic support plate attached to the second arm.

Here, the reversing device may include a vacuum adsorption device; the first stage may include a cavity having a recessed portion mounted on the first arm, and a plurality of openings provided on the cavity. A bottom plate; the elastic plate having an opening installed on the bottom plate and corresponding to the opening of the bottom plate; the arm having a duct communicating with the chamber in the arm and communicating with the vacuum adsorption device.

Here, it may also be: the brittle material substrate is located in the middle along the functional area It is broken by forming a grid-like scribe line in the form of a heart; the elastic support plate of the second carrier has a width equivalent to that of the brittle material substrate, and is provided to be surrounded by the grid-like scribe line. Protective holes in the center of the area.

According to the present invention having such characteristics, the fragile material substrate is disposed on an elastic member provided on the first stage, and is disposed on an elastic support plate having an opening like a protruding portion including a functional region from an upper portion thereof, Further, the second stage is brought into contact from above. In addition, the stages can be rotated in the same direction at the same time by using a coaxial rotation mechanism, so that the fragile material substrate can be reversed while maintaining the original state. At this time, since the substrate is sandwiched between the two stages, an effect that a part of the substrate does not fall off even during rotation can be obtained.

10‧‧‧ base

11‧‧‧ Liang

12‧‧‧ linear slider

13‧‧‧ transport head

14‧‧‧ cracked platform

15‧‧‧End material separation stage

16‧‧‧ Extended Carrier

17‧‧‧ Expansion Agency

20‧‧‧ substrate

21‧‧‧ceramic substrate

22‧‧‧ Functional Area

23‧‧‧ Silicone

24‧‧‧ Linear protrusions

31‧‧‧Hanging base

32‧‧‧ hanger

33, 34‧‧‧ hanger bracket

35‧‧‧ linear slider

40‧‧‧Head

41‧‧‧ floor

42‧‧‧Elastic sheet

43‧‧‧ Catheter

44‧‧‧ Blower

46‧‧‧Latch mechanism

47‧‧‧ Pusher

48‧‧‧ cylinder

51‧‧‧arm

52‧‧‧ Chamber

53‧‧‧ floor

54‧‧‧Elastic plate

55‧‧‧rotation axis

61‧‧‧arm

62‧‧‧box

63‧‧‧ septa

64‧‧‧ Sponge

65‧‧‧Extended rubber

67‧‧‧ holder

FIG. 1 is a perspective view showing an overall configuration of a conveyance mechanism that realizes an embodiment of the present invention.

Fig. 2 is a front view showing a conveying mechanism for realizing an embodiment of the present invention.

Fig. 3 is a front view showing an example of a substrate transferred by a transfer head of the present embodiment and a partial cross-sectional view taken along line A-A.

Fig. 4 is a perspective view showing a transfer head according to an embodiment of the present invention.

Fig. 5 is a front view of a transfer head according to this embodiment.

FIG. 6 is a bottom view of the transfer head according to this embodiment.

FIG. 7 is a perspective view showing a part of the transfer head according to the embodiment.

FIG. 8 is a perspective view showing an example of a dust collector used in the transfer device of this embodiment.

FIG. 9 is a perspective view showing an example of a push plate used in this embodiment.

FIG. 10 shows an end material separation stage and expansion of an embodiment of the substrate inversion device of the present invention. Side view of the exhibition platform.

FIG. 11 is a cross-sectional view showing a transfer head and an end material separation stage and an extension stage according to this embodiment.

FIG. 12 is a cross-sectional view showing a part of a transfer head and an end material separation stage according to this embodiment.

FIG. 13 is a perspective view showing an end material separation stage and an extension stage in this embodiment.

FIG. 14 is a perspective view showing a state in which the substrate is sandwiched and rotated in this embodiment.

FIG. 15 is a side view showing the extended stage and the end material separation stage after the rotation according to this embodiment.

The transport mechanism to which the embodiment of the present invention is applied will be described. FIG. 1 is a perspective view showing the overall configuration of a conveying device that realizes this embodiment, and FIG. 2 is a front view thereof. As shown in these drawings, on the base 10, the beam 11 is held in parallel with the upper surface of the base 10 by a pillar, and a linear slider 12 is provided on the side of the beam 11. The linear slider 12 moves the transport head 13 freely along the beam 11. As shown in FIGS. 1 and 2, the base 10 is provided with a breaking stage 14 that breaks a brittle material substrate (hereinafter referred to simply as a substrate), and an end material that is a first stage used for end material separation. The separation stage 15 and the extension stage 16 which is a second stage used for separation of the resin layer. The transfer head 13 sucks the substrate from the breaking stage 14 and transfers the substrate to the right end material separation stage 15 in the figure.

A substrate to be reversed in the embodiment of the present invention will be described. The substrate 20 is a substrate with a plurality of functional regions 22 formed on the ceramic substrate 21 along a x-axis and a y-axis at a certain distance in a manufacturing step, as shown in a front view and a partial cross-sectional view thereof in FIG. 3. The functional region 22 is, for example, a region having a function as an LED, and in each functional region, a circular crystal for LED is formed on each surface. This substrate is filled with silicone 23, but In order to keep the silicone resin 23 in the range of the functional area 22 where the LED is formed, linear protrusions 24 slightly higher than the surface of the ceramic substrate 21 are formed around the outside of the functional area 22. When the silicone resin 23 is filled, the silicone resin 23 may reach the upper surface of the linear protrusion 24 or the outside thereof.

In addition, in order to divide each functional area into an LED chip, before severing the substrate 20, a scoring device is used so that each functional area is located at the center and a scribe line S _y1 ~ S is made in the vertical direction. _yn and the horizontal scribe lines S _x1 to S _xm are scribed so that they are orthogonal to each other.

The scribed substrate 20 is placed on the cracked stage 14 shown in FIG. 2 with the surface on which the crystal is formed, and is cut along the scribe lines S _x1 ~ S _{xm '} , Line S _y1 ~ _{Syn '} to break it. The substrate 20 after being fractured is only the ceramic substrate 21 layer is divided along the scribe line, and the silicon resin 23 layer has not been fractured. In other words, the substrate 20 is connected only by the thinner layer of the silicone 23 layer, and the inner portion of the linear protrusion 24 having a plurality of functional regions arranged in the x and y axes is not necessary as the peripheral end material section.

Next, a transfer head 13 for attracting and transferring the substrate 20 will be described. FIG. 4 is a perspective view showing the conveying head 13, FIG. 5 is a side view thereof, FIG. 6 is a bottom view thereof, and FIG. 7 is a perspective view showing a part of the conveying head 13 cut away.

As shown in FIG. 4, a substantially L-shaped hanger 32 is vertically connected to the transfer head 13 in a substantially square horizontal hanger base 31. A rectangular hanger bracket 33 is connected to the side of the hanger 32, and a rectangular hanger bracket 34 is further mounted on the hanger bracket 33 so as to overlap with its surface. The hanger bracket 34 is provided on the hanger bracket 33. The linear slider 35 can be moved up and down freely. A head 40 is provided below the linear slider 35. The linear slider 35 is an elevating mechanism that has an inflow air flow inlet in two directions of the up direction and the down direction, and the head 40 can be moved up and down freely by switching its inflow. In addition, the linear slider 35 is only required to be capable of raising and lowering the head 40, Not only those who move them up and down by the inflow of air flow, but also those who move them up and down using a motor or the like.

The head 40 is a cuboid-shaped casing. The interior of the casing is hollow and the bottom is open. As shown in FIG. 7, a bottom plate 41 is provided below. The bottom plate 41 is a flat metal member on the lower surface, for example, made of aluminum. A plurality of openings arranged in an array in the xy direction are arranged at equal intervals in the bottom plate 41 so as to correspond to the functional region 22 of the broken substrate 20. The openings are set to be larger than the diameter of the crystal, respectively. In addition, an opening along the outer periphery is also provided in a portion corresponding to the outer peripheral end material of the functional region 22 of the substrate 20.

A thin elastic sheet 42 is mounted under the bottom plate 41. The elastic sheet 42 is a flat rubber plate. Further, as shown in FIG. 6, the elastic sheet 42 also has openings at regular intervals in the x-direction and the y-direction so as to correspond to the functional regions 22 of the substrate 20 to be transported, and further has a line shape around it. The portion facing the protrusion 24 has a quadrangular annular recess. In addition, a portion corresponding to the outer peripheral end material of the functional region 22 of the substrate 20 is provided with an opening along the outer periphery on the outer side of the annular recess. These openings become the same position when the bottom plate 41 and the elastic sheet 42 are overlapped. Here, the opening of the bottom plate 41 and the opening of the elastic sheet 42 are set to be slightly larger than the diameter of the crystal of the LED formed in the functional region 22, and when the broken substrate 20 is attracted, the functional region 22 is configured The crystal is not in direct contact with the elastic sheet 42.

Next, a duct 43 is attached to one side of the head 40, and a blower 44 of a dust collector shown in FIG. 8 is connected to the front end of the duct 43. Although a dust collector is used here, a single blower 44 may be used. In a state where the substrate 20 has contacted the elastic sheet 42, once the blower 44 is driven and air is drawn through the duct 43, the air is sucked through the openings of the bottom plate 41 and the elastic sheet 42 and the substrate 20 can be attracted. In addition, an air flow The inflow is switched to the outflow, whereby it is possible to switch to a state in which air is ejected from the opening of the elastic sheet 42.

A plurality of latch mechanisms 46 are provided on the side walls on the four sides of the head 40. The latch mechanism 46 is provided so that the bottom plate 41 and the elastic piece 42 are integrated under the head portion 40 so as to be detachable, and can be easily replaced when the rubber of the elastic piece 42 has deteriorated. In addition, the latch mechanism 46 can also be disposed on at least one pair of side walls of the head 40.

A frame-shaped push plate 47 shown in FIG. 9 is provided on the outer periphery of the lower portion of the head 40 so as to be movable up and down. The push plate 47 is a state in which the substrate 20 is held between the head 40 and the end material separation stage 15, and the push plate 47 is lowered, and an unnecessary portion around the substrate 20 is separated as an end material. The push plate 47 is a frame-like member having a size corresponding to the end material portion around the substrate 20. In addition, as shown in the figure, the upper surface has a certain height, and the thickness of a pair of opposite sides 47a, 47b is thick, and the thickness of the opposite two sides 47c, 47d, which are at right angles, is thin.

Next, the lifting mechanism of the push plate 47 will be described. Among the side walls of the head portion 40, an air cylinder 48 is provided as an elevating mechanism on two mutually parallel side walls except for one side wall of the connecting duct 43. The air cylinder 48 includes, as shown in FIG. 5, a main body portion 48 a that is bolted to the side wall of the head 40, a flat plate-like connecting member 48 b that can move up and down, and a frame-like connecting member 48 c connected thereto. In addition, a push plate 47 is connected below the connecting member 48c so as to be movable up and down.

Next, the end material separation stage 15 used for the separation of the end material and the inversion of the substrate will be described. As shown in FIGS. 10 to 12, the end material separation stage 15 includes a rectangular cavity 52 on the arm 51, a bottom plate 53 on the upper side thereof, and an elastic plate 54 having substantially the same shape. A large recess is formed in a central portion of the chamber 52 and communicates with a duct 51 a formed inside the arm 51. The bottom plate 53 is a rectangular flat plate equivalent to the full function area of the broken substrate, but it is preferably a little Slightly smaller than the fully functional area. The bottom plate 53 is made of, for example, aluminum. The bottom plate 53 is provided with a plurality of openings arranged in an array in the xy direction so as to correspond to the respective functional regions 22.

An elastic plate 54 is attached to the upper surface of the bottom plate 41. The elastic plate 54 is a flat plate made of rubber or the like having a shape corresponding to a rectangular area corresponding to the full-function area of the substrate 20, but is preferably slightly smaller than the full-function area. Except for the outer periphery of the four sides, the elastic plate 54 is provided with openings of the bottom plate 53, that is, a plurality of openings arranged in an array in the xy direction in a manner corresponding to the functional area of the broken substrate. It is preferable that the upper edge portion of the elastic plate 54 has a slightly curved structure.

In addition, since the openings of the elastic plate 54 and the bottom plate 53 are provided to correspond to the respective functional regions 22, it is possible to allow external air to flow through the openings and circulate through the recessed portions of the chamber 52 when they overlap. The duct 51a inside the arm 51 is connected to the vacuum suction device through a pipe (not shown), and the air can be ejected or sucked from the opening of the elastic plate 54 by driving the vacuum suction device.

In addition, the arm 51 is configured to be rotatable 180 ° clockwise from the state shown in FIG. 10 with the rotation axis 55 as the center. A rotation mechanism is provided on the shaft to rotate the arm 51 together with the upper chamber 52, the bottom plate 53, and the elastic plate 54. The rotation mechanism may be any one that can rotate the arm 51 by 180 °, and may be a rotary cylinder, or may be a motor and a reduction gear.

Next, the expansion stage 16 used when the substrate 20 is reversed and the silicone 23 layer is fractured will be described with reference to FIGS. 10, 11, and 13. As shown in FIG. 11, the expansion stage 16 includes an arm 61 and a cuboid-shaped cartridge 62 attached to the arm 61. The box 62 has L-shaped columnar portions at its four corners, and holds a spacer 63, a sponge 64, and an expansion rubber 65 inside. The spacer 63 and the expansion rubber 65 are flat plates of a size corresponding to the functional area of the substrate, and the expansion rubber 65 is a rubber-made elastic support plate. The expansion rubber 65 is arranged at regular intervals so as to correspond to the functional area 22 of the broken substrate 20. A plurality of openings are arranged in rows in the xy direction. This opening is set to be slightly larger than the diameter of the LED crystal formed in the functional region 22, and is configured so that the crystal of the functional region 22 does not directly contact the expansion rubber 65 when the broken substrate 20 is attracted.

Further, in FIG. 11, a flat flat pressing plate 66 having a frame shape almost the same as that of the cassette is provided below the expansion rubber 65. The pressing plate 66 is connected to the case 62 by bolts, and prevents the spacer 63, the sponge 64, and the expansion rubber 65 from falling off.

In addition, the arm 61 is configured to be rotatable 180 ° around the same rotation axis as the rotation axis 55 of the arm 51. A rotation mechanism is provided to rotate the arm 61 together with the box 62 or the spacer 63, the sponge 64, and the expansion rubber 65. The rotation mechanism may be any one that can rotate the arm 61 by 180 °, and may be a rotary cylinder or a motor and a reduction gear. A holder 67 is provided on the base 10 as shown in FIG. 13. The holder 67 supports the lower portion of the arm 61 at its position when the arm 61 of the expansion stage is rotated 180 ° clockwise.

Next, an operation of transferring the substrate 20 from the rupture stage 14 to the end material separation stage 15 and inverting the substrate 20 will be described. First, the conveying head 13 of the conveying device is moved directly above the substrate 20 on the breaking stage 14, and the head 40 is lowered to fit the substrate 20. Furthermore, positioning is performed so that the opening of the lowermost elastic sheet 42 of the head 40 corresponds to the crystal of the LED. Then, once the blower 44 is driven and the air is sucked through the duct 43, the air is sucked from the openings of the bottom plate 41 and the elastic sheet 42, and the substrate 20 in contact with the elastic sheet 42 can be sucked. Here, when the air is sucked from the opening of the elastic sheet 42, even if air leakage occurs, the air always flows in from the opening, so that the substrate 20 can be sucked. In addition, by raising the transfer head 13, the broken substrate 20 can be raised while maintaining the original state.

In this state, the entire transfer head 13 is moved by the linear slider 12, thereby enabling Enough to transport the substrate 20 to a desired position. In this manner, as shown in FIG. 10, after the transfer head 13 is moved directly above the end material separation stage 15, the head 40 is lowered by the linear slider 35. Then, the substrate 20 held under the head 40 is in contact with the upper part of the end material separation stage 15, and its functional areas 22 are positioned so as to correspond to the openings of the elastic plate 54 and stop descending. Then, the air is sucked through the arm 51 in a state where the lower surface of the substrate 20 is in contact with the elastic plate 54, so that the substrate 20 can be held on the end material separation stage 15. In this case, the blower 44 may be maintained in operation or may be stopped.

Next, an operation when the end materials are separated will be described. First, by blowing air from the air cylinder 48 of the lifting mechanism of the push plate 47, the push plate 47 at the lower portion of the head portion 15 can be lowered. Once the push plate 47 is lowered in parallel with the base plate 20, firstly, only the slender peripheral portions outside the functional area of the base plate 20 are subjected to downward pressure by the thicker edges 47a, 47b, and separated into end materials. Further, if the lowering is continued, the thin peripheral edges 47c, 47d and the slender peripheral portion outside the functional region of the substrate 20 are subjected to the downward pressure to separate into end materials. Fig. 13 shows the separated four end pieces. With such a single lowering operation such as pressing with the push plate 47, the end material around the substrate 20 can be completely separated. At this time, adjacent edges around the substrate 20 are not separated into end materials at the same time. In addition, the elastic plate 54 is slightly smaller than the push plate 47, and an upper edge portion thereof is bent. Therefore, the surrounding end material can be completely separated in a short time without damaging the functional area of the substrate 20.

After that, while the air is being sucked from the arm 51, the air is ejected from the blower 44 to raise the head 40. The head 40 is thereby separated from the substrate 20. In a state where the head 40 is raised, the linear head 12 moves the conveying head 13 to the left in FIG. 2, thereby returning to the original state.

In this manner, after the head 40 is moved away from above the end material separation stage 15, the expansion The arm 61 of the display stage 16 is rotated, so that the expansion rubber 65 contacts the upper surface of the base plate 20 on the end material separation stage 15. FIG. 13 is a diagram showing this state. At this time, it is positioned so that the crystal does not contact the inner wall of the opening of the expansion rubber 65. The substrate 20 is sandwiched between the end material separation stage 15 and the extension stage 16. In this state, the arms 51 and 61 are rotated along the same rotation axis as shown in FIG. 14. Accordingly, the substrate 20 can be reversed while the substrate 20 is completely held by the end material separation stage 15 and the expansion stage 16, and the substrate 20 does not fall off during rotation. FIG. 15 shows a state where the carriers are rotated by 180 °, and the lower surface of the extension carrier 16 is supported by the holder 67.

After the rotation is completed in this manner, air is ejected from the opening of the elastic plate 54 through the duct of the arm 51 of the end material separation stage 15 to separate the substrate 20 from the end material separation stage 15. Next, only the end material separation stage 15 is rotated 180 ° in the opposite direction, and returned to the original position. Thereby, although the substrate 20 is held on the expansion stage 16, the upper portion of the substrate 20 is opened.

In this embodiment, an example of reversing an LED wafer having an LED substrate having a functional region having a crystal thereon will be described, but the present invention is applicable not only to a wafer having a crystal on the surface, but also to a wafer having a crystal. Wafers with any protruding functional areas can also be applied to brittle material substrates that have functional areas with protrusions other than crystals.

Furthermore, in this embodiment, although a brittle material substrate coated with a silicon resin on a ceramic substrate is described, it may be a substrate of other various material layers. For example, a glass substrate may be laminated with a layer such as a polarizing plate.

In addition, in the embodiment described above, in order to also be used for the separation of the end material and the separation of the resin layer, the first stage is set as an end material separation stage, and the second stage is set as an extended stage. , But only used in the case of reversal, there is no need to share the end material separation or expansion.

The present invention can use a pair of stages to sandwich a ceramic that only breaks a brittle material substrate The substrate can be used as a substrate when the substrate is inverted.

Claims (3)

A reversing device for a brittle material substrate is a device for reversing a brittle material substrate, which is characterized in that the brittle material substrate is coated with a resin on a brittle material substrate having a functional area on one side, and is formed on the brittle material substrate A scribe line is used to cut off the functional area; the reversing device is provided with: a first carrier set to rotate freely, and a second carrier set to rotate freely, and can be wound around the first carrier First and second rotation mechanisms that rotate the same rotation axis to coincide with the first stage and rotate the first stage and the second stage independently; the first stage includes: A first arm that is rotatable by the first rotation mechanism, and an elastic plate provided on the first arm; the second stage includes a second arm that is rotatable by the second rotation mechanism, And an elastic support plate attached to the second arm. For example, the inverting device of the brittle material substrate of the first scope of the application for a patent, wherein the inverting device has a vacuum adsorption device; the first stage includes a cavity with a recess mounted on the first arm, and an installation A bottom plate having a plurality of openings on the chamber; the elastic plate having an opening installed on the bottom plate and corresponding to the opening of the bottom plate; the arm having a conduit in the arm communicating with the chamber and connected with the The vacuum adsorption device is in communication. For example, the inverting device of the brittle material substrate of the first scope of the patent application, wherein the brittle material substrate is fractured along a grid-like scribe line with the functional area at the center; the second carrier The elastic support plate has a width equivalent to the brittle material substrate, and has protective holes provided at each center position of an area surrounded by the grid-like scribe lines.