TWI639063B - 投影光學系統、曝光裝置及物品製造方法 - Google Patents
投影光學系統、曝光裝置及物品製造方法 Download PDFInfo
- Publication number
- TWI639063B TWI639063B TW106132027A TW106132027A TWI639063B TW I639063 B TWI639063 B TW I639063B TW 106132027 A TW106132027 A TW 106132027A TW 106132027 A TW106132027 A TW 106132027A TW I639063 B TWI639063 B TW I639063B
- Authority
- TW
- Taiwan
- Prior art keywords
- reflective surface
- concave
- optical system
- projection optical
- reflection
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 233
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 239000000758 substrate Substances 0.000 claims description 23
- 230000015572 biosynthetic process Effects 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 4
- 238000005286 illumination Methods 0.000 claims description 3
- 230000005499 meniscus Effects 0.000 claims description 3
- 230000009467 reduction Effects 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 124
- 229960001866 silicon dioxide Drugs 0.000 description 62
- 235000012239 silicon dioxide Nutrition 0.000 description 62
- 239000000377 silicon dioxide Substances 0.000 description 62
- 230000004075 alteration Effects 0.000 description 44
- 210000001747 pupil Anatomy 0.000 description 30
- 238000012937 correction Methods 0.000 description 13
- 238000013461 design Methods 0.000 description 10
- 230000007423 decrease Effects 0.000 description 5
- 238000005452 bending Methods 0.000 description 3
- 201000009310 astigmatism Diseases 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 206010010071 Coma Diseases 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000001475 halogen functional group Chemical group 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 230000004304 visual acuity Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B17/00—Systems with reflecting surfaces, with or without refracting elements
- G02B17/08—Catadioptric systems
- G02B17/0836—Catadioptric systems using more than three curved mirrors
- G02B17/084—Catadioptric systems using more than three curved mirrors on-axis systems with at least one of the mirrors having a central aperture
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B17/00—Systems with reflecting surfaces, with or without refracting elements
- G02B17/02—Catoptric systems, e.g. image erecting and reversing system
- G02B17/06—Catoptric systems, e.g. image erecting and reversing system using mirrors only, i.e. having only one curved mirror
- G02B17/0605—Catoptric systems, e.g. image erecting and reversing system using mirrors only, i.e. having only one curved mirror using two curved mirrors
- G02B17/0615—Catoptric systems, e.g. image erecting and reversing system using mirrors only, i.e. having only one curved mirror using two curved mirrors off-axis or unobscured systems in wich all of the mirrors share a common axis of rotational symmetry
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B17/00—Systems with reflecting surfaces, with or without refracting elements
- G02B17/02—Catoptric systems, e.g. image erecting and reversing system
- G02B17/06—Catoptric systems, e.g. image erecting and reversing system using mirrors only, i.e. having only one curved mirror
- G02B17/0647—Catoptric systems, e.g. image erecting and reversing system using mirrors only, i.e. having only one curved mirror using more than three curved mirrors
- G02B17/0657—Catoptric systems, e.g. image erecting and reversing system using mirrors only, i.e. having only one curved mirror using more than three curved mirrors off-axis or unobscured systems in which all of the mirrors share a common axis of rotational symmetry
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B17/00—Systems with reflecting surfaces, with or without refracting elements
- G02B17/08—Catadioptric systems
- G02B17/0852—Catadioptric systems having a field corrector only
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/64—Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
- G02B27/642—Optical derotators, i.e. systems for compensating for image rotation, e.g. using rotating prisms, mirrors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70141—Illumination system adjustment, e.g. adjustments during exposure or alignment during assembly of illumination system
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70225—Optical aspects of catadioptric systems, i.e. comprising reflective and refractive elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70233—Optical aspects of catoptric systems, i.e. comprising only reflective elements, e.g. extreme ultraviolet [EUV] projection systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70241—Optical aspects of refractive lens systems, i.e. comprising only refractive elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70316—Details of optical elements, e.g. of Bragg reflectors, extreme ultraviolet [EUV] multilayer or bilayer mirrors or diffractive optical elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B17/00—Systems with reflecting surfaces, with or without refracting elements
- G02B17/08—Catadioptric systems
- G02B17/0836—Catadioptric systems using more than three curved mirrors
- G02B17/0844—Catadioptric systems using more than three curved mirrors off-axis or unobscured systems in which all of the mirrors share a common axis of rotational symmetry
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Lenses (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016203033A JP6635904B2 (ja) | 2016-10-14 | 2016-10-14 | 投影光学系、露光装置及び物品の製造方法 |
| JP2016-203033 | 2016-10-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201826037A TW201826037A (zh) | 2018-07-16 |
| TWI639063B true TWI639063B (zh) | 2018-10-21 |
Family
ID=61903819
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106132027A TWI639063B (zh) | 2016-10-14 | 2017-09-19 | 投影光學系統、曝光裝置及物品製造方法 |
| TW107127048A TWI695232B (zh) | 2016-10-14 | 2017-09-19 | 投影光學系統、曝光裝置及物品製造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107127048A TWI695232B (zh) | 2016-10-14 | 2017-09-19 | 投影光學系統、曝光裝置及物品製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US10067325B2 (cg-RX-API-DMAC7.html) |
| JP (1) | JP6635904B2 (cg-RX-API-DMAC7.html) |
| KR (2) | KR102115279B1 (cg-RX-API-DMAC7.html) |
| CN (2) | CN111665688A (cg-RX-API-DMAC7.html) |
| TW (2) | TWI639063B (cg-RX-API-DMAC7.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10578846B2 (en) | 2016-10-14 | 2020-03-03 | Canon Kabushiki Kaisha | Projection optical system, exposure apparatus, and article manufacturing method |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11754822B2 (en) | 2018-08-01 | 2023-09-12 | Samsung Electro-Mechanics Co., Ltd. | Optical imaging system |
| JP2021015141A (ja) * | 2019-07-10 | 2021-02-12 | キヤノン株式会社 | 光学装置、投影光学系、露光装置、および、物品の製造方法 |
| KR102258458B1 (ko) * | 2019-07-20 | 2021-05-28 | 한남대학교 산학협력단 | 주간과 야간에 동시에 사용할 수 있으며 배율변화가 가능한 전방위 줌 광학계 |
| JP7332415B2 (ja) * | 2019-10-01 | 2023-08-23 | キヤノン株式会社 | 投影光学系、走査露光装置および物品製造方法 |
| JP7614962B2 (ja) * | 2021-07-08 | 2025-01-16 | キヤノン株式会社 | 投影光学系、露光装置、および物品の製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6072852A (en) | 1998-06-09 | 2000-06-06 | The Regents Of The University Of California | High numerical aperture projection system for extreme ultraviolet projection lithography |
| TW200903187A (en) | 2007-05-15 | 2009-01-16 | Canon Kk | Exposure device |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3748015A (en) * | 1971-06-21 | 1973-07-24 | Perkin Elmer Corp | Unit power imaging catoptric anastigmat |
| JPS6039205B2 (ja) | 1975-07-02 | 1985-09-05 | キヤノン株式会社 | 反射光学系 |
| US4812028A (en) * | 1984-07-23 | 1989-03-14 | Nikon Corporation | Reflection type reduction projection optical system |
| US4711535A (en) * | 1985-05-10 | 1987-12-08 | The Perkin-Elmer Corporation | Ring field projection system |
| EP0452963B1 (en) * | 1990-04-20 | 1996-07-31 | Dainippon Screen Mfg. Co., Ltd. | Objective lens system for use within microscope |
| US5078502A (en) | 1990-08-06 | 1992-01-07 | Hughes Aircraft Company | Compact afocal reimaging and image derotation device |
| JPH0553057A (ja) * | 1991-08-26 | 1993-03-05 | Nikon Corp | 反射光学系 |
| JP3348467B2 (ja) | 1993-06-30 | 2002-11-20 | 株式会社ニコン | 露光装置及び方法 |
| DE19910724A1 (de) * | 1999-03-11 | 2000-09-14 | Zeiss Carl Fa | Mikrolithographie-Projektionsobjektiveinrichtung sowie Projektionsbelichtungsanlage |
| JP2002329655A (ja) * | 2001-05-01 | 2002-11-15 | Canon Inc | 反射型縮小投影光学系、露光装置及びデバイス製造方法 |
| JP2003243277A (ja) * | 2002-02-13 | 2003-08-29 | Canon Inc | 反射型縮小投影光学系、露光装置及びデバイス製造方法 |
| JP2004029625A (ja) * | 2002-06-28 | 2004-01-29 | Nikon Corp | 投影光学系、露光装置及び露光方法 |
| JP3938040B2 (ja) * | 2002-12-27 | 2007-06-27 | キヤノン株式会社 | 反射型投影光学系、露光装置及びデバイス製造方法 |
| KR101481935B1 (ko) * | 2003-05-06 | 2015-01-14 | 가부시키가이샤 니콘 | 투영 광학계, 노광 장치 및 노광 방법 |
| EP1513019B1 (en) * | 2003-09-02 | 2012-07-25 | Canon Kabushiki Kaisha | Projection optical system, exposure apparatus and device fabricating method |
| GB0423595D0 (en) * | 2004-10-23 | 2004-11-24 | Qinetiq Ltd | Scanning imaging apparatus |
| US7470033B2 (en) * | 2006-03-24 | 2008-12-30 | Nikon Corporation | Reflection-type projection-optical systems, and exposure apparatus comprising same |
| JP5654735B2 (ja) | 2008-05-15 | 2015-01-14 | カール・ツァイス・エスエムティー・ゲーエムベーハー | 結像光学器械及びその結像光学器械を含む投影露光装置 |
| DE102010004827A1 (de) * | 2009-01-21 | 2010-09-30 | Carl Zeiss Smt Ag | Katadioptrische Pupillen-Relaysysteme |
| JP2011039172A (ja) * | 2009-08-07 | 2011-02-24 | Canon Inc | 露光装置およびデバイス製造方法 |
| US8743342B2 (en) * | 2009-11-17 | 2014-06-03 | Nikon Corporation | Reflective imaging optical system, exposure apparatus, and method for producing device |
| JP5782336B2 (ja) * | 2011-08-24 | 2015-09-24 | キヤノン株式会社 | 投影光学系、露光装置及びデバイス製造方法 |
| CN103135356B (zh) * | 2011-11-23 | 2015-04-15 | 上海微电子装备有限公司 | 反射式光刻投影物镜 |
| JP6635904B2 (ja) * | 2016-10-14 | 2020-01-29 | キヤノン株式会社 | 投影光学系、露光装置及び物品の製造方法 |
-
2016
- 2016-10-14 JP JP2016203033A patent/JP6635904B2/ja active Active
-
2017
- 2017-09-19 TW TW106132027A patent/TWI639063B/zh active
- 2017-09-19 TW TW107127048A patent/TWI695232B/zh active
- 2017-09-26 KR KR1020170123990A patent/KR102115279B1/ko active Active
- 2017-10-10 US US15/728,631 patent/US10067325B2/en not_active Expired - Fee Related
- 2017-10-10 CN CN202010697850.7A patent/CN111665688A/zh active Pending
- 2017-10-10 CN CN201710934813.1A patent/CN107957658B/zh active Active
-
2018
- 2018-08-01 US US16/051,937 patent/US10578846B2/en active Active
-
2020
- 2020-05-20 KR KR1020200060144A patent/KR102266723B1/ko active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6072852A (en) | 1998-06-09 | 2000-06-06 | The Regents Of The University Of California | High numerical aperture projection system for extreme ultraviolet projection lithography |
| TW200903187A (en) | 2007-05-15 | 2009-01-16 | Canon Kk | Exposure device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10578846B2 (en) | 2016-10-14 | 2020-03-03 | Canon Kabushiki Kaisha | Projection optical system, exposure apparatus, and article manufacturing method |
| TWI695232B (zh) * | 2016-10-14 | 2020-06-01 | 日商佳能股份有限公司 | 投影光學系統、曝光裝置及物品製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201841078A (zh) | 2018-11-16 |
| CN107957658B (zh) | 2020-07-31 |
| TWI695232B (zh) | 2020-06-01 |
| JP6635904B2 (ja) | 2020-01-29 |
| JP2018063406A (ja) | 2018-04-19 |
| US10067325B2 (en) | 2018-09-04 |
| CN111665688A (zh) | 2020-09-15 |
| KR20200058356A (ko) | 2020-05-27 |
| KR102266723B1 (ko) | 2021-06-21 |
| KR102115279B1 (ko) | 2020-05-26 |
| US20180341093A1 (en) | 2018-11-29 |
| TW201826037A (zh) | 2018-07-16 |
| US10578846B2 (en) | 2020-03-03 |
| CN107957658A (zh) | 2018-04-24 |
| KR20180041567A (ko) | 2018-04-24 |
| US20180106989A1 (en) | 2018-04-19 |
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