TWI639057B - 曝光裝置及曝光方法、以及元件製造方法 - Google Patents
曝光裝置及曝光方法、以及元件製造方法 Download PDFInfo
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- TWI639057B TWI639057B TW101150758A TW101150758A TWI639057B TW I639057 B TWI639057 B TW I639057B TW 101150758 A TW101150758 A TW 101150758A TW 101150758 A TW101150758 A TW 101150758A TW I639057 B TWI639057 B TW I639057B
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- wafer
- measurement
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7049—Technique, e.g. interferometric
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49764—Method of mechanical manufacture with testing or indicating
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Atmospheric Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Toxicology (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Multimedia (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161581360P | 2011-12-29 | 2011-12-29 | |
| US201161581293P | 2011-12-29 | 2011-12-29 | |
| US61/581,293 | 2011-12-29 | ||
| US61/581,360 | 2011-12-29 | ||
| JPJP2012-248419 | 2012-11-12 | ||
| JP2012248419 | 2012-11-12 | ||
| US13/727,286 | 2012-12-26 | ||
| US13/727,286 US9207549B2 (en) | 2011-12-29 | 2012-12-26 | Exposure apparatus and exposure method, and device manufacturing method with encoder of higher reliability for position measurement |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201341966A TW201341966A (zh) | 2013-10-16 |
| TWI639057B true TWI639057B (zh) | 2018-10-21 |
Family
ID=48697662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101150758A TWI639057B (zh) | 2011-12-29 | 2012-12-28 | 曝光裝置及曝光方法、以及元件製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9207549B2 (enExample) |
| JP (1) | JP6016200B2 (enExample) |
| KR (1) | KR101698249B1 (enExample) |
| TW (1) | TWI639057B (enExample) |
| WO (1) | WO2013100202A1 (enExample) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8832916B2 (en) * | 2011-07-12 | 2014-09-16 | Lam Research Corporation | Methods of dechucking and system thereof |
| NL2009533A (en) * | 2011-10-27 | 2013-05-07 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method. |
| US8779635B2 (en) * | 2012-04-10 | 2014-07-15 | Kla-Tencor Corporation | Arrangement of reticle positioning device for actinic inspection of EUV reticles |
| EP3866184B1 (en) | 2012-11-30 | 2024-10-09 | Nikon Corporation | Carrier system, exposure apparatus and carry-in method |
| CN103207529B (zh) * | 2013-03-22 | 2015-04-29 | 京东方科技集团股份有限公司 | 曝光方法及曝光设备 |
| DE102013016065B4 (de) * | 2013-09-27 | 2016-02-18 | Mecatronix Ag | Positioniervorrichtung und Verfahren |
| US9529280B2 (en) * | 2013-12-06 | 2016-12-27 | Kla-Tencor Corporation | Stage apparatus for semiconductor inspection and lithography systems |
| IN2014CH00782A (enExample) | 2014-02-19 | 2015-08-28 | Kennametal India Ltd | |
| JP6429989B2 (ja) * | 2014-08-15 | 2018-11-28 | エーエスエムエル ネザーランズ ビー．ブイ． | リソグラフィ装置及び方法 |
| US9694545B2 (en) * | 2014-12-18 | 2017-07-04 | Stratasys, Inc. | Remotely-adjustable purge station for use in additive manufacturing systems |
| CN107278279B (zh) | 2015-02-23 | 2020-07-03 | 株式会社尼康 | 基板处理系统及基板处理方法、以及组件制造方法 |
| CN111158220A (zh) * | 2015-02-23 | 2020-05-15 | 株式会社尼康 | 测量装置及方法、光刻系统、曝光装置及方法 |
| TWI693477B (zh) | 2015-02-23 | 2020-05-11 | 日商尼康股份有限公司 | 測量裝置、微影系統及曝光裝置、以及元件製造方法 |
| JP6727556B2 (ja) * | 2015-09-30 | 2020-07-22 | 株式会社ニコン | 露光装置及び露光方法、並びにフラットパネルディスプレイ製造方法 |
| US10514617B2 (en) * | 2015-09-30 | 2019-12-24 | Nikon Corporation | Exposure apparatus, manufacturing method of flat-panel display, device manufacturing method, and exposure method |
| JP6656728B2 (ja) * | 2015-10-01 | 2020-03-04 | 学校法人 中村産業学園 | 相関顕微鏡 |
| CN205427436U (zh) * | 2016-03-23 | 2016-08-03 | 北京京东方光电科技有限公司 | 显示器件的对位检测设备及曝光工艺系统 |
| KR102181121B1 (ko) * | 2016-09-20 | 2020-11-20 | 주식회사 원익아이피에스 | 기판 이송 장치 및 기판 이송 장치의 제어 방법 |
| CN113504712B (zh) * | 2016-09-30 | 2023-09-19 | 株式会社尼康 | 曝光装置、平板显示器的制造方法、以及元件制造方法 |
| JP6981170B2 (ja) * | 2017-10-20 | 2021-12-15 | 株式会社ニューフレアテクノロジー | 荷電粒子ビーム描画装置及び荷電粒子ビーム描画方法 |
| KR102070756B1 (ko) * | 2018-03-15 | 2020-01-29 | 이노6 주식회사 | 다축 구조 스테이지 |
| KR102890305B1 (ko) * | 2019-02-11 | 2025-11-24 | 에이에스엠엘 네델란즈 비.브이. | 열 제어 시스템을 갖는 리소그래피 장치 및 방법 |
| US11626305B2 (en) * | 2019-06-25 | 2023-04-11 | Applied Materials, Inc. | Sensor-based correction of robot-held object |
| CN110411381B (zh) * | 2019-08-06 | 2021-07-13 | 许昌学院 | 一种适用电机定子的自动校正平整度多点检测设备 |
| CN115023655A (zh) * | 2020-02-06 | 2022-09-06 | Asml荷兰有限公司 | 使用双平台光刻设备的方法以及光刻设备 |
| CN112835269B (zh) * | 2021-01-19 | 2024-04-12 | 上海集成电路装备材料产业创新中心有限公司 | 一种光刻装置及曝光方法 |
| WO2022215692A1 (ja) * | 2021-04-09 | 2022-10-13 | 株式会社ニコン | 露光装置、デバイス製造方法、フラットパネルディスプレイの製造方法および露光方法 |
| CN118576903A (zh) * | 2024-06-07 | 2024-09-03 | 广州天力能医疗器械有限公司 | 一种仿生红外往复仪及远红外场效应生成方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1442757A (zh) | 2002-03-01 | 2003-09-17 | Asml荷兰有限公司 | 对准方法、对准基底,光刻装置和器件制造方法 |
| CN1782884A (zh) | 2004-11-29 | 2006-06-07 | Asml荷兰有限公司 | 衬底台、测量衬底位置的方法以及光刻装置 |
| TW201137531A (en) | 2009-09-30 | 2011-11-01 | Nikon Corp | Exposure apparatus and exposure method, and device manufacturing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57117238A (en) | 1981-01-14 | 1982-07-21 | Nippon Kogaku Kk <Nikon> | Exposing and baking device for manufacturing integrated circuit with illuminometer |
| JPS58113706A (ja) | 1981-12-26 | 1983-07-06 | Nippon Kogaku Kk <Nikon> | 水平位置検出装置 |
| US4780617A (en) | 1984-08-09 | 1988-10-25 | Nippon Kogaku K.K. | Method for successive alignment of chip patterns on a substrate |
| DE4033556A1 (de) | 1990-10-22 | 1992-04-23 | Suess Kg Karl | Messanordnung fuer x,y,(phi)-koordinatentische |
| US5196745A (en) | 1991-08-16 | 1993-03-23 | Massachusetts Institute Of Technology | Magnetic positioning device |
| JPH05102287A (ja) * | 1991-10-02 | 1993-04-23 | Hitachi Ltd | 板状物搬送装置 |
| KR100300618B1 (ko) | 1992-12-25 | 2001-11-22 | 오노 시게오 | 노광방법,노광장치,및그장치를사용하는디바이스제조방법 |
| US6624433B2 (en) | 1994-02-22 | 2003-09-23 | Nikon Corporation | Method and apparatus for positioning substrate and the like |
| JPH07270122A (ja) | 1994-03-30 | 1995-10-20 | Canon Inc | 変位検出装置、該変位検出装置を備えた露光装置およびデバイスの製造方法 |
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| KR101698249B1 (ko) | 2017-02-01 |
| TW201341966A (zh) | 2013-10-16 |
| KR20140107186A (ko) | 2014-09-04 |
| JP2015505154A (ja) | 2015-02-16 |
| US9207549B2 (en) | 2015-12-08 |
| JP6016200B2 (ja) | 2016-10-26 |
| US20130183623A1 (en) | 2013-07-18 |
| WO2013100202A1 (en) | 2013-07-04 |
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