TWI612692B - Optical device - Google Patents
Optical device Download PDFInfo
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- TWI612692B TWI612692B TW105102297A TW105102297A TWI612692B TW I612692 B TWI612692 B TW I612692B TW 105102297 A TW105102297 A TW 105102297A TW 105102297 A TW105102297 A TW 105102297A TW I612692 B TWI612692 B TW I612692B
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Abstract
本發明提出一種光學裝置,包括具有第一光軸之第一光學元件及具有第二光軸之第二光學元件。第一光學元件套設於第二光學元件。第一光學元件及第二光學元件之間無黏接劑。第一光學元件包覆第二光學元件之相對兩側面上各形成一列雷射焊點。第一光軸及第二光軸對準誤差不大於0.5微米。 The present invention provides an optical device comprising a first optical element having a first optical axis and a second optical element having a second optical axis. The first optical element is sleeved on the second optical element. There is no adhesive between the first optical element and the second optical element. The first optical element covers a pair of laser solder joints on opposite sides of the second optical element. The first optical axis and the second optical axis have an alignment error of no more than 0.5 micrometers.
Description
本發明是有關於光學裝置,且特別是有關於使用雷射焊接進行光學元件之間的連接或固定的光學裝置。 This invention relates to optical devices and, more particularly, to optical devices for connecting or securing optical elements using laser welding.
光學裝置的光學元件之間的組裝通常有嚴格的定位要求。現有常見之作法是使用紫外光黏接劑進行光學元件之間的連接或固定,但是其存在一些問題。例如,需要照射紫外光進行固化,且需要人工點膠提高良率,故較為耗時耗力。另外一種作法是使用雷射焊接進行光學元件之間的連接或固定,其較為省時、易自動化且連接強度較強,但是雷射焊接會在光學元件之間產生應力,造成光學元件的位置偏移。因此,後來還發展出一種作法是先使用黏接劑、再使用雷射焊接進行光學元件之間的連接或固定,例如台灣專利號I386268,可改善雷射焊接造成光學元件位置偏移的問題,但是更為耗時且耗費材料。 Assembly between the optical components of an optical device typically has stringent positioning requirements. A common practice is to use an ultraviolet light bonding agent to connect or fix optical elements, but there are some problems. For example, it is necessary to irradiate ultraviolet light for curing, and manual dispensing is required to improve the yield, which is time consuming and labor intensive. Another method is to use laser welding to connect or fix optical components. It is more time-saving, easy to automate and has strong connection strength. However, laser welding generates stress between optical components, which causes the position of optical components to be biased. shift. Therefore, a method has been developed to firstly use an adhesive and then use laser welding to connect or fix optical components. For example, Taiwan Patent No. I386268 can improve the positional deviation of optical components caused by laser welding. But it is more time consuming and costly.
有鑑於此,本發明的目的在提出光學裝置,其僅使用雷射焊接進行光學元件之間的連接或固定,即可使得光學元件在焊接過後,位置偏移不會過於擴大。 In view of the above, an object of the present invention is to propose an optical device which uses only laser welding to connect or fix optical elements, so that the positional shift of the optical element after soldering is not excessively enlarged.
為達到上述目的,本發明提出一種光學裝置,包括具有第一光軸之第一光學元件及具有第二光軸之第二光學元件。第一光學元件套設於第二光學元件。第一光學元件及第二光學元件之間無黏接劑。第一光學元件包覆第二光學元件之相對兩側面上各形成一列雷射焊點。第一光軸及第二光軸對準誤差不大於0.5微米(micrometer,um)。 To achieve the above object, the present invention provides an optical device comprising a first optical element having a first optical axis and a second optical element having a second optical axis. The first optical element is sleeved on the second optical element. There is no adhesive between the first optical element and the second optical element. The first optical element covers a pair of laser solder joints on opposite sides of the second optical element. The first optical axis and the second optical axis have an alignment error of no more than 0.5 micrometer (um).
本發明另提出一種光學裝置,包括光學單元及承載元件。光學單元包含兩對準誤差不大於0.5微米之光軸,且設置於承載元件之第一表面。承載元件相對之第二表面於對應光學單元之一處形成一排雷射焊點。 The invention further provides an optical device comprising an optical unit and a carrier element. The optical unit includes two optical axes having an alignment error of no more than 0.5 micrometers and is disposed on the first surface of the carrier member. The second surface of the carrier member forms a row of laser solder joints at one of the corresponding optical units.
為讓本發明上述和其他目的、特徵和優點能更明顯易懂,下文特舉較佳實施例,並配合所附圖式,作詳細說明如下。 The above and other objects, features and advantages of the present invention will become more <RTIgt;
1‧‧‧光學裝置 1‧‧‧Optical device
11‧‧‧第一光學元件 11‧‧‧First optical component
111‧‧‧透鏡支架 111‧‧‧ lens holder
112‧‧‧透鏡 112‧‧‧ lens
113‧‧‧側面 113‧‧‧ side
114‧‧‧雷射焊點 114‧‧‧Laser solder joints
12‧‧‧第二光學元件 12‧‧‧Second optical component
121‧‧‧二極體支架 121‧‧‧ diode bracket
122‧‧‧雷射二極體 122‧‧‧Laser diode
2‧‧‧光學裝置 2‧‧‧Optical device
21‧‧‧光學單元 21‧‧‧ Optical unit
22‧‧‧承載元件 22‧‧‧Loading components
221‧‧‧第一表面 221‧‧‧ first surface
222‧‧‧第二表面 222‧‧‧ second surface
223‧‧‧雷射焊點 223‧‧‧Ray solder joints
圖1為根據本發明第一實施例之光學裝置的分解圖;圖2為根據本發明第一實施例之光學裝置的組立圖;圖3為根據本發明第一實施例之光學裝置的剖視圖;及圖4為根據本發明第二實施例之光學裝置的組立圖。 1 is an exploded view of an optical device according to a first embodiment of the present invention; FIG. 2 is a perspective view of an optical device according to a first embodiment of the present invention; and FIG. 3 is a cross-sectional view of the optical device according to the first embodiment of the present invention; And Figure 4 is an assembled view of an optical device in accordance with a second embodiment of the present invention.
圖1至圖3分別為根據本發明第一實施例之光學裝置的分解圖、組立圖及剖視圖。請同時參照圖1至圖3,光學裝置1包括具有第一光軸之第一光學元件11及具有第二光軸之第二光學元件12。光學元件可能為具有光軸的發光元件,或是透鏡。在本實施例中,第一光學元件11為透鏡元件,其包括透鏡 支架111及設於透鏡支架111中之透鏡112。第一光學元件11之第一光軸即是透鏡112之光軸。第二光學元件12為雷射元件,其包括二極體支架121及設於二極體支架121上之雷射二極體122。第二光學元件12之第二光軸即是雷射二極體122之光軸。 1 to 3 are an exploded view, an assembled view, and a cross-sectional view, respectively, of an optical device according to a first embodiment of the present invention. Referring to FIGS. 1 through 3 together, the optical device 1 includes a first optical element 11 having a first optical axis and a second optical element 12 having a second optical axis. The optical element may be a light-emitting element having an optical axis, or a lens. In the present embodiment, the first optical element 11 is a lens element including a lens The bracket 111 and the lens 112 provided in the lens holder 111. The first optical axis of the first optical element 11 is the optical axis of the lens 112. The second optical component 12 is a laser component, and includes a diode holder 121 and a laser diode 122 disposed on the diode holder 121. The second optical axis of the second optical element 12 is the optical axis of the laser diode 122.
如圖2及圖3所示,第一光學元件11套設於第二光學元件12。第一光學元件11包覆第二光學元件12之相對兩側面113上各形成一列雷射焊點114(可能為黑色圓形斑點),而且第一光學元件11之第一光軸及第二光學元件12之第二光軸對準誤差不大於0.5um,以符合光學元件位置定位的規格。在雷射焊點114之處,第一光學元件11及第二光學元件12如圖3之示意產生了熔融而連接或固定在一起。此外,第一光學元件11及第二光學元件12之間無黏接劑。 As shown in FIGS. 2 and 3, the first optical element 11 is sleeved on the second optical element 12. The first optical element 11 covers the opposite side faces 113 of the second optical element 12 to form a column of laser solder joints 114 (possibly black circular spots), and the first optical axis and the second optical of the first optical element 11 The second optical axis alignment error of component 12 is no more than 0.5 um to conform to the specifications of the positional positioning of the optical components. At the point of the laser solder joint 114, the first optical element 11 and the second optical element 12 are melted to be connected or fixed together as schematically illustrated in FIG. Further, there is no adhesive between the first optical element 11 and the second optical element 12.
圖4為根據本發明第二實施例之光學裝置的組立圖。請參照圖4,光學裝置2包括光學單元21及承載元件22。在本實施例中,光學單元21包括三個如第一實施例所揭露之光學裝置1,例如分別用於發射紅光、綠光及藍光。光學裝置1包含兩對準誤差不大於0.5微米之光軸。承載元件22具有相對兩表面,即第一表面221及第二表面222。光學單元21設置於承載元件22之第一表面221。承載元件22相對之第二表面222於對應每個光學單元21之處形成一排雷射焊點223,雷射焊點223可能為一直線或是一條不規則線條。在雷射焊點223之處,光學單元21及承載元件22產生了熔融而連接或固定在一起。此外,光學單元21及承載元件22之間無黏接劑。 4 is a perspective view of an optical device in accordance with a second embodiment of the present invention. Referring to FIG. 4, the optical device 2 includes an optical unit 21 and a carrier member 22. In the present embodiment, the optical unit 21 includes three optical devices 1 as disclosed in the first embodiment, for example, for emitting red light, green light, and blue light, respectively. The optical device 1 includes optical axes having two alignment errors of no more than 0.5 micrometers. The carrier element 22 has opposite surfaces, namely a first surface 221 and a second surface 222. The optical unit 21 is disposed on the first surface 221 of the carrier element 22. The second surface 222 of the carrier member 22 forms a row of laser solder joints 223 corresponding to each of the optical units 21, and the laser solder joints 223 may be a straight line or an irregular line. At the laser solder joint 223, the optical unit 21 and the carrier element 22 are melted to be joined or fixed together. In addition, there is no adhesive between the optical unit 21 and the carrier element 22.
綜上所述,本發明藉由在第一光學元件11包覆第二光學元件12之相對兩側面113上各形成一列雷射焊點114,或藉由在承載元件22相對之第二表面222於對應光學單元21之一處形成一排雷射焊點223,因此可維持光學元件或光學單元位置定位的規格。 In summary, the present invention forms a row of laser pads 114 on opposite sides 113 of the first optical element 11 overlying the second optical element 12, or by opposing the second surface 222 of the carrier element 22. A row of laser solder joints 223 is formed at one of the corresponding optical units 21, so that the specifications of the optical element or optical unit positional positioning can be maintained.
雖然本發明已以較佳實施例揭露如上,然其並非用以限定本發明,任何本領域技術人員,在不脫離本發明的精神和範圍內,當可作些許更動與潤飾,因此本發明的保護範圍當視所附的申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and those skilled in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. The scope of protection is subject to the definition of the scope of the attached patent application.
1‧‧‧光學裝置 1‧‧‧Optical device
11‧‧‧第一光學元件 11‧‧‧First optical component
111‧‧‧透鏡支架 111‧‧‧ lens holder
113‧‧‧側面 113‧‧‧ side
114‧‧‧雷射焊點 114‧‧‧Laser solder joints
12‧‧‧第二光學元件 12‧‧‧Second optical component
121‧‧‧二極體支架 121‧‧‧ diode bracket
122‧‧‧雷射二極體 122‧‧‧Laser diode
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TW105102297A TWI612692B (en) | 2016-01-26 | 2016-01-26 | Optical device |
US15/262,098 US20170212319A1 (en) | 2016-01-26 | 2016-09-12 | Optical Device |
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TW105102297A TWI612692B (en) | 2016-01-26 | 2016-01-26 | Optical device |
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TW201727944A TW201727944A (en) | 2017-08-01 |
TWI612692B true TWI612692B (en) | 2018-01-21 |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM331238U (en) * | 2007-10-24 | 2008-04-21 | Lecc Technology Co Ltd | Laser module with endurance of insertion and unplugging |
TW201029787A (en) * | 2008-11-24 | 2010-08-16 | Corning Inc | Method of weldbonding and a device comprising weldbonded components |
TW201037929A (en) * | 2009-04-01 | 2010-10-16 | Lecc Technology Co Ltd | Manufacturing method of green-light laser module |
CN105201125A (en) * | 2015-09-22 | 2015-12-30 | 成都市凤庭环能科技有限公司 | Hollow brick with waterproof structure |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM331238U (en) * | 2007-10-24 | 2008-04-21 | Lecc Technology Co Ltd | Laser module with endurance of insertion and unplugging |
TW201029787A (en) * | 2008-11-24 | 2010-08-16 | Corning Inc | Method of weldbonding and a device comprising weldbonded components |
TW201037929A (en) * | 2009-04-01 | 2010-10-16 | Lecc Technology Co Ltd | Manufacturing method of green-light laser module |
CN105201125A (en) * | 2015-09-22 | 2015-12-30 | 成都市凤庭环能科技有限公司 | Hollow brick with waterproof structure |
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