TWI220808B - Connector with laser diode and manufacturing method thereof - Google Patents

Abstract

A connector is composed of a housing and a ring unit for optical communication. A laser diode has a conductive housing and at least one flange thereon. An example of the flange shape is a ring flange. During manufacturing, the conductive housing is conducted with a current and the flange is faced toward the ring unit so that the conductive housing and the ring unit are melded. Then, the ring unit is placed to the housing of the connector.

Description

1220808 V. Description of the invention (1) Technical field to which the invention belongs The present invention relates to an assembling method of an optical fiber communication device, and more particularly to an assembling method of an optical fiber communication device capable of precise positioning. [Prior technology] Laser Diode is referred to as semiconductor laser for short. Its principle is similar to that of Light Emission Diode, but it uses stimulated emission to emit light, and its intensity is much greater than that of light. And photodiodes. Laser diode systems are widely used in optical fiber communications, and most of them use long-wave lasers with wavelengths ranging from 950 nm to 1550 nm. Such laser diodes are often manufactured using indium phosphor (I np) substrate epitaxy Made. In addition, laser diodes can be classified into traditional edge-emitting (EELD) and surface-emitting (VCSEL) lasers according to the direction of their emitted light. Among them, VCSEL is a newer technology. It was not until 1997 that Honeywel 1 developed the first commercialized product. Due to the short optical cavity, the critical current is low and the required operating voltage is lower than that of traditional laser diodes. And the component has a long life and has many advantages, so it has great development potential in the future. The VCSEL can be roughly divided into gpiwafer, chip process, laser sub-module (OSA; including TOSA, ROSA) and common TO-Can modules according to the process. The TO-Can module referred to here is made by adding the crystals of the laser diode and a metal shell cover! 22〇08〇5. Description of the invention (2) For use in optical fiber communication, this This TO-Can laser diode element must be engaged with the ferrule of the connector in order to be assembled into the fiber optic system and then function. However, because optical fiber communication requires a high degree of precision, if the TO-Can components cannot be fixed to the connector accurately, even a small gap will cause the quality of the optical signals sent and received by the optical transceiver module to drop significantly, or even Causes the problem that the light signal cannot be received. Please refer to Fig. 1 (a) to Fig. 1 (c) '. These three figures disclose different methods of conventional technology for accurately assembling components such as TO-Can to the connector, which are briefly described below. In FIG. 1 (a), the TO-Can element 102 includes a light source 1023, a housing 1021, and a signal pin 1022. To enable the TO-Can component to be mounted on the connector, first mount the TO-Can component to an iron piece such as a ferrule 1 0 1. In this example, the iron piece 101 and the T 0-C a η element are fixed by using a glue 103. However, when the glue 103 is used for fixing, the reliability of the glue 103 is changed in different environments due to the physical properties of the glue 103. In particular, the sensitivity of the glue 103 to temperature and humidity is relatively high, and it is prone to hydrolysis and thermal expansion and contraction. In addition, if the surface roughness of the iron piece 101 is too small, glue! The binding force of 〇3 also deteriorates, so there are many problems with the method of using glue 103. In Fig. 1 (b), the TO-Can element 102 is fixed to a ferrule such as a ferrule using a YAG laser to generate a welding point 104. However, because the iron piece 101 and the housing 1021 are different materials, when melting between heterogeneous metals, the melting point between the compounds will be different, resulting in the surface of the solder joint.

Page 6 I22〇8〇8 5. Description of the invention (3) There are cracks. If this welding office is exposed to the environment for a long period of time, it will be damaged, in working milk, or other tests: $ kinds of cracks will expand and reduce the overall. In addition, in Figure 1 (C), TO ~ Can teeth Du 1 no distribution method group>% s% pieces 1 0 2 and iron pieces 1 0 1 use a tight T0Γ type combination. In other words, the thrust of the iron piece 101 through the material increases the friction force of the disk piece ::: ^ ... solid improvement :, and now = the precision iron piece structure, which will cause the cost of A 0 to pass through the tightly fixed T. -Can element, will also affect the optical power when undergoing 埶 m cold shrinkage. In terms of "1 calendar", and service, the current connection method of the connector, precision center = :: Γ, simple construction and high installation methods at the same time, has become an important task. [Summary of the Invention] f Therefore, the present invention is simple and has a method according to one of the present invention. The method of the lightning member and the connector shell is as if there is one less conductive bump. The contacts are in contact. 'L, by the current Electrical bumps are welded to one of the high-precision embodiments of the emitter diode. Next. First, then, convection flows through the contact electrical component. It is to provide a low-cost, construction connector assembly method. Provides that the laser diode is assembled on the connection housing, and the connector is conductive. The laser diode is formed on the housing of the laser diode to the conductive bump and the conductive member, and at least one of the conductive bump and the conductive member is applied. An electrical point, so that the laser diode's housing will conduct electricity after being conducted.

V. Description of the invention (4) The component is mounted on the connector shell. In this embodiment, the conductive element is made of TO-Can method. ^ It is a metal oblong ring or other number of T0-Cari element. And the #laser diode housing works. Therefore, "the present invention has at least the first" construction of the method, the housing of the laser diode and the two are in harmony. Secondly, this method generates cracks and covers the current. In addition, this method can use less expensive machine diodes. The shell, which is exemplified in the example, can be made of a conductive member to achieve a button arm or a machine. Force adjustment for heterogeneous metals. The action of this assembly is to use the ferrule as an example to complete the assembly of the connector. Laser The laser diode element, while the front case. As for the number of bumps and the shape of the mesh. In one embodiment, the bump is a mounting body, and the method described above has the following advantages. It is simple, it can be powered by the conductive member of the robot hand, and the accuracy fixed by the welding method is not dependent on the size. It can be completed according to the material using a low-priced machine. Therefore, it has low-cost characteristics. For the implementation of the first preferred embodiment, please refer to FIG. 2 (a), which shows the individual components to be assembled. These components are assembled to form a TO-Can laser diode element g connector. . It must be pointed out that this figure is for illustration purposes, and the skilled technician can adjust the size ratio to apply to various applications. 1 When these components include optical transceiver circuit 201, laser diode element 202, channel, conductive

Examples of the component 203 and the connector 204 〇La-one laser diode T 〇-Can laser diode element includes the front 2022 and the housing 2023, and its private ^ $ 号 线 2024, light source _ ^ # π- ? n91 The double body is a metal shell with at least A on the shell. Examples of the conductive member 203 include a ferrule, and the connector 204 has a portion of the connector housing 2041.套 安 ί 此 ΪΪ! 时 ’When the conductive bump 20 is oriented toward the conductive member 203 side: Red: flute 2 is in contact. For example, it can be achieved using a robot arm or a machine platform, as shown in Fig. 2 (b). 2 = Conductive bump when in contact with conductive member 1 ° 2

〇21 and the conductive member 203 apply a current, and the current flows through one or more contact points of the conductive bump · electric member 203. By controlling the large current, the conductive bump 2021 is melted and welded to the conductive member 203. Next, the conductive member 2 03 with the laser diode 2 02 is fixed to the connector 2 〇4 connector housing 2041, as shown in 2 @ (c). The laser diode 202 fixed by this method has high accuracy and can pass tests in various environments.

1 The structure of the conductive member 203 and the conductive bump 2021 is explained more clearly. 2 Please refer to the schematic diagrams of FIGS. 3 (a) to 3 (f). These six figures show the conductive member 2 in different directions. 3. Structure of the conductive bump 202 1. Figure 3 (a) is a top view of the ferrule-shaped conductive member 203, and Figure 3 (b) is a cross-sectional view of the conductive member 203 cut along the A direction. Fig. 3 (e) is a perspective view of the conductive member 203. Figure 3 (c) is a top view of TO-Can's laser diode 202, and Figure 3 is 1220808.

5. Description of the invention (6) (d) is a cross-sectional view of the laser diode 202 in the B direction. Figure 3 (f) is a perspective view of the laser diode 202. As shown in the figure, the ferrule-shaped conductive member 203 has a toroidal plane portion to correspond to the conductive bump 2021, and the conductive bump 2021 is a convex torus, and the conductive bump 2021 can be integrated with the housing 2023. Forming. As for the symbol numbers of the components in Figures (a)-(f) in ^ 3, if they are the same as those in Figure 2 (&)-((1) ', they represent the same or similar components and will not be repeated here. It must be pointed out It is to be noted that in Figs. 2 (a)-(d) and Figs. 3 (a)-(f), although γ pure ring bumps are taken as examples, they are not intended to limit the scope of the present invention. It can also be of any number or shape. For example, as shown in Figure 4, the bumps have various patterns. Moreover, the bumps can be blunt, and two are pointed, as shown in Figure 4 (b). It is within the scope of the present invention as long as the bump can generate the function of dissolving and welding when the current flows from the housing 2023 of the polar body 202 to the conductive member 2 03. In addition, although the foregoing The conductive member 20 3 is described by taking the shape of a ferrule as an example, but it is not intended to limit the scope of the present invention. For example, the guide member 203 can be changed to an appropriate shape according to the shape of the laser diode 202. The material of the conductive member 20 3 is preferably the same as that of the connector housing 2041, but it is of course not intended to limit the scope of the present invention. In addition, w Considering the volume when the bumps melt, you can also add a groove to the conductive member. In conclusion, please refer to Figure 5, which illustrates a flowchart of this method. First, in the laser diode, At least one conductive bump (two heads 502) is formed on the shell. The conductive bump and a conductive member are connected at least one contact point ^

1220808 Invention description (7) Step 5 0 4) As for the number of contact points, it is related to the conductive bumps. Example: If there are three conductive bumps, there will be at least three contact points. Then, an electric current is applied to the electric bump and the conductive member, so that the current flows through the contact point, and the electric bump is dissolved so that the housing of the laser diode is welded to the conductive member (step D. Ran, while conducting the current, At the same time, force can be applied at the same time to make the housing of the laser diode and the conductive member more densely. Finally, the conductive member with the laser diode attached to the housing of the connector (step 508). Two preferred embodiments In the previous example, the 'bumps' are placed on the housing of the laser diode. However, the bumps can of course also be placed on the aforementioned conductive members. Please refer to Figure 6 (a) and Figure 6 (b). In this embodiment, the conductive member 603 has at least one bump 603 1. The laser diode 602 has a signal line 6024, a light source 6022, and a housing 6023. 6〇31 is in contact with the housing 6023 and a current is passed, and the laser diode 602 can be welded to the conductive member 603. Regarding the laser diodes in Fig. 6 (a) and Fig. Β (b) The illustrations of 6Q2, the conductive member gw, and the directions of the bump 6031 can be further taken from FIG. 6

(c)-(f) ° Similarly, the same reference numerals represent the same or similar elements, and are not repeated here. The method for assembling the connector provided in the embodiment is as follows. Firstly, the first, W, and the like appear to be different. Refer to the flowchart in FIG. 7. First, at least one conductive bump is formed on the conductive member (step 702). Place the conductive bump and the laser diode housing

1220808 V. Description of the invention (8) Contact is made by one less contact point (step 704). Next, a current is applied to the conductive bump and the housing of the laser diode, and the conductive member is connected to the laser diode through the soldering of the bump by the current flowing through the contact point (step 706). Finally, the conductive member with the laser diode is mounted on the connector housing (step 708) 'to complete the assembly of the connector. Third preferred embodiment

The foregoing two specific embodiments are provided with the bumps on the outer shell of the laser diode and the conductive member, respectively. Therefore, another embodiment is that bumps are arranged on the outer shell and the conductive member of the laser diode, and the connector, the conductive member and the laser diode are assembled by the above-mentioned way of conducting current. Although the present invention has been disclosed as above with a preferred embodiment, it is not intended to limit the present invention. Anyone skilled in this art can make various changes and modifications without departing from the present invention. Therefore, this: The appended application patents shall prevail. Dried Ginger 1220808

Brief description of the drawings [Simplified description of the drawings] Figure 1 (a) is an example of a conventional technique for installing connector components; Figure 1 (b) is a different example—a conventional technique for installing a connector Fig. 1 (c) is an example of another conventional technique for installing and connecting. = 2 Fig. (A) is an illustration of various ideas according to a specific embodiment of the present invention. Fig. 2 (b) is an illustration of how to install and implement Example components;

Figure 2 (c) is a schematic diagram illustrating the structure of the assembled optical communication connector; Figure 3 (a) is a top view of the conductive member in the embodiment; Figure 3 (b) is a cross-sectional view of the conductive member in the embodiment; Figure 3 (c) is a top view of the laser diode in the embodiment; Figure 3 (d) is a cross-sectional view of the laser diode in the embodiment; Figure 3 (e) is a conductive member in the embodiment Perspective view; Figure 3 (f) is a perspective view of the laser diode in the embodiment; Figure 4 (a) is a variation example of the bump on the laser diode; Figure 4 (b) is a laser diode Variations of bumps on the body; Figure 5 is a flowchart of the embodiment;

Fig. 6 (a) is a side view before the component assembly of another embodiment; Fig. 6 (b) is a view after the component assembly of another embodiment; Fig. 6 (c) is a conductive member of another embodiment Top view; Figure 6 (d) is a side view of a conductive member of another embodiment; Figure 6 (e) is a top view of a laser diode of another embodiment; Figure 6 (f) is another embodiment Side view of a laser diode;

Page 13 1220808 Schematic illustration Figure 7 is a flowchart of another embodiment. [Simple description of component representative symbols]

Page 14 101 Iron parts 102 Laser diode 1021 Housing 1022 Signal pins 1023 Emission light source 103 Adhesive 104 Welding point 105 Tight place 201 Optical transceiver circuit 202 Laser diode 202 1 Bump 2022 Emission light source 2023 Shell Body 2024 Signal line 203 Conductive member 204 Connector 204 1 Connector housing 602 Laser diode 6022 Emitting light source 6023 Housing 1220808 Schematic description of 6024 signal wire 6 0 3 Conductive member 6 0 3 1 Bump

Claims (1)

1220808 VI. Scope of patent application 1. A method of assembling a laser diode to a connector, the laser diode has a housing, and the connector includes a conductive member and a connector salt body ' The steps include: forming at least one conductive bump on the housing; bringing the conductive bump into contact with the conductive member at at least one contact point; applying a current to the conductive bump and the conductive member, and by A current flows through the contact point, so that the casing is welded to the conductive member via the conductive bump; and the conductive member with the laser diode is mounted on the connector casing. 2. The method according to item 1 of the scope of patent application, wherein the laser diode is a component made by the To-Can method, and the case is a metal case. 3. The method according to item 2 of the scope of patent application, wherein the conductive member is a ring, and the ring has a ring plane portion, and the ring plane portion corresponds to the conductive bump. 4. The method according to item 3 of the scope of the patent application, wherein the conductive bump is a convex round body ', and the convex ring body corresponds to the plane portion of the soil of the far ferrule. 5. The method described in item 2 of the patent application scope, wherein the conductive member has at least one groove to correspond to the conductive bump. 6 · The method described in item 2 of the scope of patent application, wherein the bump and the shell 1220808 6. Scope of patent application The system is integrated. 7. The method as described in item 2 of the scope of patent application, further comprising applying a pressure to make the conductive member and the case tightly when applying the current to the conductive bump and the conductive member. 8. The method according to item 1 of the scope of patent application, further comprising forming the conductive bump on the conductive member. 9. A method of assembling a laser diode to a connector, the laser diode having a housing, and the connector including a conductive member and a connector housing, the steps include: Forming at least one conductive bump on the conductive member; bringing the conductive bump into contact with the casing at at least one contact point; applying a current to the conductive bump and the casing, and passing the current through the contact point, The conductive member is welded to the housing via the conductive bump; and the conductive member with the laser diode is mounted on the connector housing. 10. The method according to item 9 of the scope of patent application, wherein the laser diode is a component made by the To-Can method 'and the case is a metal case. 11 The method as described in item 10 of the scope of patent application, wherein the conductive member is a ring. Page 17 1220808 6. Scope of Patent Application 12-The method as described in Item 10 of the scope of patent application, wherein the housing has at least one groove to correspond to the conductive bump. 13. The method according to item 10 of the scope of patent application, wherein the conductive bump and the conductive member are integrally formed. 14. A connector having a laser diode, comprising: a laser diode; a casing, the casing partially covering the laser diode; a conductive member; At least one conductive bump, wherein the conductive bump and the shell are connected by the conductive bump; a connector peripheral ', the conductive member with the shell attached is connected to the connector housing. 15. The connector according to item 14 of the scope of patent application, wherein the conductive member is a set of loops. 16. The connector pole as described in item 15 of the scope of patent application and the casing constitute a To-Can element. The laser diode 41 uses the connector described in item 16 of the V-connected V / 'range, wherein the connector is used to connect at least one optical fiber. Page 18 1220808 6. The scope of patent application 18 · The connector as described in item 14 of the scope of patent application, wherein the conductive bump is a convex ring body, and the convex ring body corresponds to the ring surface of the ferrule. section. 19. The connector according to item 8 of the patent application scope, wherein the conductive member has at least one groove to correspond to the conductive bump. 2 The connector according to item 19 of the scope of patent application, wherein the conductive bump is integrally formed with the housing. 21 · —A connector having a laser diode, comprising: a laser diode; a casing, the casing partially covering the laser diode; a conductive member; and at least one conductive projection A block, wherein the conductive member and the shell are connected by the conductive bump. 22. The connector according to item 21 of the scope of patent application, wherein the conductive member is a ferrule. 23. The connector according to item 22 of the scope of patent application, wherein the laser body and the housing constitute a To-Can element. It is used to connect at least one optical fiber. Η Page 19