CN107102416A - Optical devices - Google Patents

Optical devices Download PDF

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Publication number
CN107102416A
CN107102416A CN201610092498.8A CN201610092498A CN107102416A CN 107102416 A CN107102416 A CN 107102416A CN 201610092498 A CN201610092498 A CN 201610092498A CN 107102416 A CN107102416 A CN 107102416A
Authority
CN
China
Prior art keywords
optical
optical module
module
axis
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610092498.8A
Other languages
Chinese (zh)
Inventor
郑彦方
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Megaforce Co Ltd
Original Assignee
Megaforce Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Megaforce Co Ltd filed Critical Megaforce Co Ltd
Priority to CN201610092498.8A priority Critical patent/CN107102416A/en
Publication of CN107102416A publication Critical patent/CN107102416A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20Bonding
    • B23K26/21Bonding by welding

Abstract

A kind of Optical devices(1), including the first optical module with primary optic axis(11)And the second optical module with the second optical axis(12).First optical module is sheathed on the second optical module.Adhesive-free between first optical module and the second optical module.First optical module coats one row laser solder joint of each formation on the opposite sides face of the second optical module(114).Primary optic axis and the second optical axis alignment error are not more than 0.5 micron.Connection or fixation between laser welding progress optical module is used only in it, you can so that optical module is after welding, position skew will not excessively expand.

Description

Optical devices
Technical field
The present invention is related to Optical devices, and in particular to the Optical devices that connection or fixation between optical module are carried out using laser welding.
Background technology
Assembling between the optical module of Optical devices generally has strict positioning requirements.The existing common practice is to use ultraviolet light bonding agent to carry out connection or fixation between optical module, but it be present.For example, it is desired to which irradiating ultraviolet light is solidified, and needs artificial dispensing to improve yield, therefore more take time and effort.Another practice is to carry out connection or fixation between optical module using laser welding, and it is more time saving, easy automation and bonding strength is stronger, but laser welding can produce stress between optical module, cause the position of optical module to offset.Therefore, later also develop a kind of practice be first using bonding agent, reuse laser welding carry out optical module between connection or fixation, such as TaiWan, China patent No. I386268, can improve laser welding and cause the problem of optical module position is offset, but more time-consuming and expend material.
The content of the invention
In view of this, the purpose of the present invention is proposing Optical devices, and connection or fixation between laser welding progress optical module is used only in it, you can so that optical module is after welding, position skew will not excessively expand.
To reach above-mentioned purpose, the present invention proposes an a kind of exemplary embodiment of Optical devices, including the first optical module with primary optic axis and the second optical module with the second optical axis.First optical module is sheathed on the second optical module.Adhesive-free between first optical module and the second optical module.First optical module coats one row laser solder joint of each formation on the opposite sides face of the second optical module.Primary optic axis and the second optical axis alignment error are not more than 0.5 micron(Micrometer, um).
The present invention also proposes an exemplary embodiment of another Optical devices, including an at least optical unit and bearing assembly.Bearing assembly has relative first surface and second surface.Each optical unit is not more than 0.5 micron of primary optic axis and the second optical axis comprising alignment error, and is arranged at the first surface of bearing assembly.The second surface of bearing assembly shape laser solder joint in a row at the one of correspondence optical unit.
For above and other objects, features and advantages of the invention can be become apparent, preferred embodiment cited below particularly, and coordinate accompanying drawing, it is described in detail below.
Brief description of the drawings
Fig. 1 is a kind of decomposition texture schematic diagram of an exemplary embodiment of Optical devices.
Fig. 2 is the assembly structure diagram of the Optical devices shown in Fig. 1.
Fig. 3 is the cross section structure diagram of the Optical devices shown in Fig. 1.
Fig. 4 is the assembly structure diagram of an exemplary embodiment of another Optical devices.
Identifier declaration:
1 Optical devices
11 first optical modules
111 lens carriers
112 lens
113 sides
114 laser solder joints
12 second optical modules
121 diode supports
122 laser diodes
2 Optical devices
21 optical units
22 bearing assemblies
221 first surfaces
222 second surfaces
223 laser solder joints.
Embodiment
Fig. 1 to Fig. 3 is respectively decomposition texture schematic diagram, assembly structure diagram and the cross section structure diagram of an a kind of exemplary embodiment of Optical devices.Referring to Fig. 1 to Fig. 3, Optical devices 1 include the first optical module 11 with primary optic axis and the second optical module 12 with the second optical axis.Optical module may be the luminescence component with optical axis, or lens subassembly.In the present embodiment, the first optical module 11 is lens subassembly, and it includes lens carrier 111 and the lens 112 in lens carrier 111.The primary optic axis of first optical module 11 is the optical axis of lens 112.Second optical module 12 is laser module, and it includes diode support 121 and the laser diode 122 on diode support 121.Second optical axis of the second optical module 12 is the optical axis of laser diode 122.
As shown in Figures 2 and 3, the first optical module 11 is sheathed on the second optical module 12.First optical module 11 coats one row laser solder joint 114 of each formation on the opposite sides face 113 of the second optical module 12(It may be black circular spot), and the second optical axis alignment error of the primary optic axis of the first optical module 11 and the second optical module 12 is not more than 0.5 um, to meet the specification of optical module position positioning.In the position of laser solder joint 114, the first optical module 11 and the second optical module 12 are coupled or fixed to together as Fig. 3 signal generates melting.In addition, adhesive-free between the first optical module 11 and the second optical module 12.
Fig. 4 is the assembly structure diagram of an exemplary embodiment of another Optical devices.Fig. 4 is refer to, Optical devices 2 include at least an optical unit 21 and bearing assembly 22.Each optical unit 21 is not more than 0.5 micron of primary optic axis and the second optical axis comprising alignment error.In the present embodiment, Optical devices 2 include three optical units 21, and these three optical units 21 are respectively used to transmitting feux rouges, green glow and blue light all using the Optical devices 1 as disclosed by Fig. 2.Bearing assembly 22 has relative first surface 221 and second surface 222.Optical unit 21 is arranged at the first surface 221 of bearing assembly 22.The second surface 222 of bearing assembly 22 shape laser solder joint 223 in a row at the one of each optical unit 21 of correspondence, this row's laser solder joint 223 is likely distributed on a straight line, or is distributed in an overall trend on the irregular lines of a straight line.In the position of laser solder joint 223, optical unit 21 and bearing assembly 22 generate melting and are coupled or fixed to together.In addition, adhesive-free between optical unit 21 and bearing assembly 22.
In summary, the present invention forms a row laser solder joint 114 by each on the opposite sides face 113 that the second optical module 12 is coated in the first optical module 11, or by the relative second surface 222 of bearing assembly 22 at the one of correspondence optical unit 21 shape laser solder joint 223 in a row, therefore the specification that optical module or optical unit position can be maintained to position.
Although the present invention is disclosed above with preferred embodiment; so it is not limited to the present invention, any those skilled in the art, without departing from the spirit and scope of the present invention; when can make a little change and retouching, therefore protection scope of the present invention depending on appended as defined in claim when being defined.

Claims (5)

1. a kind of Optical devices, it is characterised in that including:
The first optical module with primary optic axis;And
The second optical module with the second optical axis,
Wherein, first optical module is sheathed on second optical module,
Adhesive-free between first optical module and second optical module,
First optical module coats one row laser solder joint of each formation on the opposite sides face of second optical module, and
The primary optic axis and the second optical axis alignment error are not more than 0.5 micron.
2. Optical devices as claimed in claim 1, wherein, first optical module includes lens subassembly, and second optical module includes laser module.
3. a kind of Optical devices, it is characterised in that including:
An at least optical unit;And
Bearing assembly, with relative first surface and second surface,
Wherein, each optical unit is not more than 0.5 micron of primary optic axis and the second optical axis comprising alignment error, and is arranged at the first surface of the bearing assembly, and
The second surface of bearing assembly shape laser solder joint in a row at the one of the correspondence optical unit.
4. Optical devices as claimed in claim 3, wherein, each optical unit includes the first optical module with the primary optic axis and the second optical module with second optical axis, first optical module is sheathed on second optical module, adhesive-free between first optical module and second optical module, first optical module coats one row laser solder joint of each formation on the opposite sides face of second optical module.
5. Optical devices as claimed in claim 4, wherein, first optical module includes lens subassembly, and second optical module includes laser module.
CN201610092498.8A 2016-02-19 2016-02-19 Optical devices Pending CN107102416A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610092498.8A CN107102416A (en) 2016-02-19 2016-02-19 Optical devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610092498.8A CN107102416A (en) 2016-02-19 2016-02-19 Optical devices

Publications (1)

Publication Number Publication Date
CN107102416A true CN107102416A (en) 2017-08-29

Family

ID=59658590

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610092498.8A Pending CN107102416A (en) 2016-02-19 2016-02-19 Optical devices

Country Status (1)

Country Link
CN (1) CN107102416A (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1053298A (en) * 1990-01-05 1991-07-24 菲利浦光灯制造公司 Lens place the optoelectronic device having coupling comprising between optical fiber and semiconductor laser diode
CN1790077A (en) * 2004-12-17 2006-06-21 上海飞恩微电子有限公司 Optical module with photoelectric calibration
CN101601176A (en) * 2006-12-05 2009-12-09 韩国电子通信研究院 Planar lightwave circuit (PLC) device, the Wave division multiplexing passive optical network (WDM-PON) that comprises the Wavelength tunable light source of this device and adopt this light source
TW201029787A (en) * 2008-11-24 2010-08-16 Corning Inc Method of weldbonding and a device comprising weldbonded components
CN104459928A (en) * 2013-09-24 2015-03-25 三菱电机株式会社 Optical module and manufacturing method thereof
CN205581377U (en) * 2016-02-19 2016-09-14 英济股份有限公司 Optical device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1053298A (en) * 1990-01-05 1991-07-24 菲利浦光灯制造公司 Lens place the optoelectronic device having coupling comprising between optical fiber and semiconductor laser diode
CN1790077A (en) * 2004-12-17 2006-06-21 上海飞恩微电子有限公司 Optical module with photoelectric calibration
CN101601176A (en) * 2006-12-05 2009-12-09 韩国电子通信研究院 Planar lightwave circuit (PLC) device, the Wave division multiplexing passive optical network (WDM-PON) that comprises the Wavelength tunable light source of this device and adopt this light source
TW201029787A (en) * 2008-11-24 2010-08-16 Corning Inc Method of weldbonding and a device comprising weldbonded components
CN104459928A (en) * 2013-09-24 2015-03-25 三菱电机株式会社 Optical module and manufacturing method thereof
CN205581377U (en) * 2016-02-19 2016-09-14 英济股份有限公司 Optical device

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Application publication date: 20170829