JP2014066837A - Optical device and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical device which can be easily secured in airtightness, and which can be easily combined with another component such as a cover, and which can be easily fixed to a substrate with a stable fixing force and a method for manufacturing the optical device.SOLUTION: A substrate 30 has a connection part 34 to be fitted into the whole circumference of an opening end part 15 in an undercut state, that is, a groove 36 on a surface 31 side, and the whole circumference of the opening end part 15 of an optical component 10 is weld-fixed to the connection part 34 so that the fixing of the optical component 10 to the substrate 30 can be stabilized and secured, and the whole circumference of the opening end part 15 is fusion-fixed to the connection part 34 so that an internal space SP to be formed between the optical component 10 and the substrate 30 can be sealed. The groove 36 widened at the downside in the undercut state is used to enhance the fixing force, and to easily secure airtightness, and to prevent the opening end part 15 of a holder part from protruding to the outside. Thus, the optical device can be easily combined with another component such as a cover 71.

Description

  BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical device that performs optical operations such as light emission and light reception, and a method for manufacturing the same, and more particularly to an optical device in which a light emitting element and other optical active elements are combined and combined with a lens and other optical elements. About.

  As an optical device, for example, there is a light emitting device in which a light emitting element and a lens are combined and integrated. Such a light emitting device is manufactured by, for example, the technique disclosed in Patent Document 1. That is, by using a pair of molds, a cap with an optical component in which a lens and a cap (lens holder) are integrated is injection-molded in advance, and one mold for molding is separately set with a light-emitting component in advance. The lower end portion of the cap covers the outer periphery of the substrate of the light emitting component by exchanging with the mold and injection molding again. At this time, since the lower end portion of the cap is fused to the substrate by the heat of the molten resin, airtightness can be secured.

  As another optical device, there is an imaging device in which an imaging element and a lens are combined and integrated. Such an imaging device is manufactured, for example, by the technique disclosed in Patent Document 2. In other words, the package on which the image sensor is mounted is fixed to the wiring board by soldering, the mounting legs of the lens holder with the lens fixed in advance are inserted into the mounting through holes of the wiring board, and the mounting legs are heated from the back side. And fused to the wiring board.

  For example, as a general method for bonding resins or metals together, an ultrasonic fusion method can be used. Further, for example, an adhesive can be used to join the resin and the metal.

  By the way, from the viewpoint of productivity, it is desirable to mold an optical component composed of a lens and a holder with a resin. In this case, however, the optical component including the lens cannot be welded to the light-emitting component substrate, and is airtight. It is not easy to secure. In addition, optical components are rarely used alone and are often used in combination with other components such as a cover. When attaching the cover, the optical component is inserted so that the optical component is close to the cover. For example, as illustrated in Patent Document 1, if the optical component is the same size or larger than the light emitting component substrate, the cover is removed. It becomes difficult to fix to the light emitting component substrate. On the other hand, if the optical component is smaller than the light emitting component substrate, as in Patent Document 2, a plurality of through holes are provided in the light emitting component substrate so that the legs of the optical component can be passed through and the back surface of the light emitting component substrate can be melted. It is possible to wear it. In this case, the airtightness is maintained in the peripheral part of the leg part of the optical component, but the surface is only in contact with the other part, and the airtightness cannot be ensured. In addition, when the through holes are densely formed and welded around the entire circumference by the above method, the substrate is substantially separated at the central portion and the peripheral portion even if the airtightness is maintained. In addition to the increase in man-hours for manufacturing and management, it becomes extremely difficult to obtain the accuracy of the distance from the optical active element supported on the substrate to the lens. In addition, there is a method of fixing the light-emitting component substrate and the optical component with an adhesive which is a general method, but the method using the adhesive has a large number of assembly steps, and the stability of the adhesive force varies. There are disadvantages such as weakness in humidity and low airtightness compared to welding.

JP-A 63-62257 JP 2004-159110 A

  The present invention has been made in view of the above-described background art, is easy to ensure airtightness, can be easily combined with other parts such as a cover, is easily fixed to a substrate, and has a stable fixing force. It is an object of the present invention to provide an optical device and a manufacturing method thereof.

  An optical device according to the present invention includes an optical component, a substrate, and an optical active element that performs an optical operation. The optical component includes a lens portion and a holder portion, and the lens portion and the holder portion are made of resin and The holder part has an open end on the opposite side of the lens part, the substrate has an outer shape larger than the outer shape of the optical component viewed from the optical axis direction, and the optical component on the surface side. Supports the optical active element, and has a connection part that fits in the undercut state with the entire circumference of the open end of the optical component on the surface side, and the entire circumference of the open end of the optical component is welded to the connection It is fixed. Here, the undercut state means a three-dimensional shape that causes resistance when the holder of the optical component is pulled out in a direction perpendicular to the surface of the substrate. For example, the undercut state enters obliquely from the surface of the substrate. It means having such unevenness.

In the above optical device, the substrate has a connection portion that fits in the undercut state with the entire circumference of the opening end portion, and the entire circumference of the opening end portion of the optical component is welded and fixed to the connection portion. Therefore, the fixing of the optical component to the substrate becomes stable and reliable, and the internal space formed between the optical component and the substrate can be reliably sealed by the welding and fixing to the connection portion. By using such an undercut state, not only airtightness can be easily secured, but also the opening end of the holder part can be prevented from protruding outside, so that it can be easily combined with other parts such as a cover. become.
In addition, it becomes possible to fix the optical component to the substrate simply by pressing it with the welding apparatus, and the number of manual labor for fixing can be reduced. In addition, when using the above-mentioned methods, unlike adhesives, there is no decrease in adhesive strength due to variations in coating amount, changes in temperature and humidity, etc., so high bonding strength can be achieved, and optical components even under high load environments Will not come off. Furthermore, since no gap is generated at the joint even under a high load environment, when a sealing gas is used, the sealing gas does not leak out. It is possible to eliminate or reduce the protrusion of the adhesive as in the case of fixing mainly by the adhesive.

  According to a specific aspect of the present invention, in the optical device, the connection portion is an annular groove formed on the surface side of the substrate. In this case, the entire circumference of the opening end of the optical component is fitted into the annular groove and fixed by welding.

  According to another aspect of the present invention, the annular groove as the connection portion has a side surface that is inclined from a state perpendicular to the surface of the substrate. In this case, the undercut fitting can be realized by the inclined side surface.

  According to still another aspect of the present invention, the groove has a pair of parallel side surfaces, and the pair of parallel side surfaces are inclined in opposite directions at opposite positions across the optical axis. In this case, the optical component is reliably prevented from coming off.

  According to still another aspect of the present invention, the connection portion is an annular step formed on the surface side of the substrate. In this case, the entire circumference of the opening end of the optical component is fitted and fixed to the annular step.

  According to still another aspect of the present invention, the annular step as the connecting portion has a side surface that is inclined from a state perpendicular to the surface of the substrate. In this case, the undercut fitting can be realized by the inclined side surface.

  According to still another aspect of the present invention, the step has a shape that becomes lower on the outer side away from the photoactive element, and becomes higher on the inner side near the photoactive element, and protrudes outward in an eaves shape. In this case, the optical component is reliably prevented from coming off.

  According to still another aspect of the present invention, the connection portion has a roughened joint surface. In this case, the opening end of the optical component is reliably locked by the connecting portion, and the adhesion at the joint surface is increased.

  According to still another aspect of the present invention, the connection portion has a joint surface on which groove-like irregularities are formed. In this case, the opening end of the optical component is reliably locked by the connecting portion, and the adhesion at the joint surface is increased.

  According to still another aspect of the present invention, the photoactive element is any one of an LED (Light Emitting Diode), an LD (Laser Diode), a VCSEL (Vertical Cavity Surface Emitting LASER), and a PD (Photo Doide), The lens unit is a coupling lens. For example, when the optical active element is an LD, the optical device is a laser light emitting device, and laser light can be incident on an optical fiber or the like.

  According to yet another aspect of the invention, the substrate is formed of a ceramic material. In general, it is not easy to join a ceramic material and a resin material without an adhesive, but by providing the connection portion as described above, joining by welding is ensured.

  According to still another aspect of the present invention, the optical device is for optical communication. That is, the optical device can be used as a signal light output unit or a signal light detection unit of an optical communication system. Also, optical devices for optical communication are required to have high accuracy and high reliability, but according to the present invention, they can be sufficiently satisfied.

  An optical device manufacturing method according to the present invention includes an optical component having a lens portion and a holder portion, an opening end portion on the opposite side of the lens portion of the holder portion, and molded and integrated with a resin. And an optical component having an outer shape larger than the outer shape viewed from the axial direction of the optical component, supporting the optical component and the optical active element that performs optical operation on the surface side, and the entire circumference of the opening end of the optical component; A step of preparing a substrate having a connecting portion that can be fitted in an undercut state, and fitting and fixing the entire circumference of the opening end of the optical component to the connecting portion, And a step of sealing an internal space formed therebetween.

  In the method for manufacturing an optical device according to the present invention, a step of preparing a substrate having a connection portion that can be fitted in an undercut state with the entire circumference of the opening end of the optical component, and the entire circumference of the opening end of the optical component A step of fitting and welding and fixing to the connection portion, so that the fixing of the optical component to the substrate is stable and reliable, and is formed between the optical component and the substrate by welding and fixing to the connection portion. It is possible to securely seal the internal space. By using the undercut state in this way, it is easy not only to ensure airtightness but also to prevent the opening end of the holder from protruding outside, so it can be easily combined with other parts such as a cover. become.

(A) is a sectional side view of the optical device according to the first embodiment of the present invention, and (B) is a plan view of the optical device. (A) is side sectional drawing of an optical component among optical devices, (B) is a top view at the time of seeing an optical component from the surface direction (11b direction), (C) is an optical component. It is a top view at the time of seeing from the back direction (11a direction). (A) is a side sectional view of the assembly of the optical active element and the substrate in the optical device, and (B) is a plan view of the assembly of the optical active element and the substrate. (A) And (B) is a sectional side view explaining the assembly process of an optical apparatus notionally. It is side sectional drawing explaining the use condition which assembled | attached the optical apparatus to the other components. It is a sectional side view explaining the principal part of the optical apparatus which is 2nd Embodiment. It is a sectional side view explaining the principal part of the optical apparatus which is 3rd Embodiment. It is a partial expanded side sectional view explaining the principal part of the optical apparatus which is 4th Embodiment. It is a top view explaining the principal part of the optical apparatus which is 5th Embodiment. It is a top view explaining the principal part of the optical apparatus which is 6th Embodiment. It is a sectional side view explaining the optical apparatus which is 7th Embodiment. It is side sectional drawing explaining the optical apparatus of a modification.

  Hereinafter, specific embodiments of an optical device and a manufacturing method thereof according to the present invention will be described with reference to the drawings.

[First Embodiment]
As shown in FIGS. 1A and 1B, the optical device 100 has a cylindrical outer shape as a whole, and includes an optical component 10, a photoactive element 20, and a substrate 30. The optical component 10 is a cylindrical container-like member, the optical active element 20 is a chip of an electronic component that fits in the optical component 10, and the substrate 30 is a disk-like member also called a stem.

  As shown in FIG. 2A and the like, the optical component 10 is an integrally molded product formed by resin injection molding, and includes a top plate-shaped lens portion 11 and a cylindrical holder portion 12. The lens unit 11 is a biconvex optical lens, for example, and has a first optical surface 11a and a second optical surface 11b. The holder portion 12 has a uniform thickness and has a cylindrical outer side surface 12a and a cylindrical inner side surface 12b. A circular opening end 15 is provided on the opposite side of the holder 12 from the lens 11. The opening end portion 15 has a shape obtained by extending the main body portion 14 immediately after molding (the chain line in the figure), and has the same thickness as the main body portion 14 of the holder portion 12. It is transformed into one having an expanding shape. The main body portion 14 has a size that can accommodate the optical active element 20 and the electrode pin 26 therein and secures an adjustment allowance for centering the optical active element 20 and the lens unit 11. The height h2 of the holder portion 12 is higher than the reference height (that is, the height of the main body portion 14) h1 of the optical component 10 by the opening end portion 15. This is because the opening end 15 is embedded in the substrate 30 as will be described later.

  In the optical component 10 described above, the length of the lens leg portion in the holder portion 12 is usually 1 to 4 m. As shown in FIG. 2A, the length L of the lens leg is a reference surface (the surface 31 of the substrate 30 after fixing) from the portion of the recessed lens inner surface excluding the first optical surface 11a. To the optical axis OA direction. In a specific manufacturing example, the effective length h0 of the optical component 10 in the optical axis OA direction is 3.5 mm, its outer diameter D1 is 4.7 mm, and the length L of the lens leg is 2 mm.

  As shown in FIG. 3A and the like, the optical active element 20 is a part that performs an optical operation such as light emission and light detection. . In addition, when the optical active element 20 is a laser diode, the upper part 21 of the optical active element 20 becomes a light emission part which inject | emits the laser beam LB. The lens unit 11 provided in the optical component 10 so as to face the optical active element 20 can be a coupling lens for causing the laser light LB to enter an optical fiber or the like, for example.

  The substrate 30 is formed of a ceramic material having a uniform thickness, and has a surface 31 on the optical active element 20 side and a back surface 32 that is separated from the optical active element 20. The outer diameter D2 of the substrate 30 is larger than the outer diameter D1 of the holder portion 12 (see FIG. 1A). That is, the substrate 30 has an outer shape larger than the outer shape of the optical component 10 viewed from the axis AX direction. A plurality of through holes 30 a are formed in the substrate 30, and a plurality of electrode pins 26 extending from the optical active element 20 are respectively inserted therethrough. These electrode pins 26 are fixed by filling the gaps with solder, adhesive or the like so as to be airtight with respect to the substrate 30.

  An annular groove 36 is formed as a connecting portion 34 on the surface 31 side of the substrate 30. The groove 36 is similar to the opening end 15 of the optical component 10 and has a shape obtained by inverting it. That is, the annular groove 36 has a shape that spreads outward at the bottom. Specifically, 36 has a pair of side surfaces 36 a and 36 b inclined from a state perpendicular to the surface 31 of the substrate 30, and a bottom surface 36 c parallel to the surface 31 of the substrate 30. The pair of side surfaces 36a and 36b are inclined in opposite directions at opposite positions facing each other. In other words, the groove 36 including the pair of side surfaces 36 a and 36 b has an oblique arrangement or shape in which the diameter increases from d 1 to d 2 toward the back surface 32 of the substrate 30 and is separated from each other. Further, the groove 36 has a bottom surface 36 c, and no hole that penetrates the substrate 30 is formed in any part of the groove 36. That is, the connection portion 34 is configured not to be exposed on the back side 32 of the substrate 30.

  A method for manufacturing the optical device 100 shown in FIG. First, the optical component 10 integrally formed with resin is prepared (see FIG. 2A and the like). The optical component 10 includes an integrated lens portion 11 and a holder portion 12. Next, a disk-shaped substrate 30 having an outer shape larger than that of the optical component 10 is prepared (see FIG. 3A and the like). The optical active element 20 is mounted in advance on the surface 31 side of the substrate 30. That is, the photoactive element 20 is set and fixed at the center of the surface 31 of the substrate 30. The optical active element 20 is electrically connected to a plurality of electrode pins 26 penetrating from the back surface 32 of the substrate 30 to the front surface 31. At this time, the substrate 30 and the electrode pins 26 are sealed so that gas does not leak. Next, the substrate 30 is placed between the lower stage 91 and the upper vibrating portion 92 provided in the ultrasonic welding apparatus 90 in an alignment state in which the optical component 10 is placed on the substrate 30 and both are aligned. And the optical component 10 (see FIG. 4A). Then, by operating the ultrasonic welding apparatus 90 and vibrating while vibrating the vibration portion 92 downward, the opening end portion 15 of the optical component 10 enters and fits into the groove 36 of the substrate 30 (FIG. 4 (B)). That is, the optical component 10 can be fixed to the substrate 30 only by pressing the optical component 10 against the substrate 30 by using the ultrasonic welding apparatus 90, and the number of work steps can be reduced and the workability of bonding can be improved. it can. At this time, the surfaces 15a and 15b of the opening end 15 are partially melted by being heated by ultrasonic waves, and the surfaces 15a and 15b of the opening end 15 are in close contact with and fused to the side surfaces 36a and 36b of the groove 36. . Further, the end surface 15c of the open end 15 is also partially melted, and is in close contact with and fused to the bottom surface 36c of the groove 36. That is, the opening end 15 of the optical component 10 is welded and fixed to the groove 36 that is the connection portion 34 over the entire circumference, and the internal space SP formed between the optical component 10 and the substrate 30 can be sealed. it can. Moreover, the opening end 15 of the optical component 10 has a shape that fits into the groove 36 of the substrate 30 and increases in diameter on the tip side. That is, the opening end 15 of the optical component 10 and the groove 36 of the substrate 30 are fitted in an undercut state that spreads downward. If the adhesive is used, the optical component 10 may be peeled off from the substrate 30 due to a variation in coating amount or a decrease in adhesive force due to temperature / humidity changes. In addition, since it is fixed by welding in an undercut state, a high fixing strength can be realized, the optical component 10 is not detached from the substrate 30 even in a high load environment, and the joint portion is also in a high load environment. Since no gap is formed in the sealing gas, the sealing gas does not leak out. In addition, when an adhesive is used, the adhesive protrudes onto the surface 31 of the substrate 30 and may have an adverse effect. However, the adhesive is fixed in the groove 36 and is further fixed by welding. The possibility that the resin protrudes on the surface 31 can be greatly reduced. Note that the optical component 10 and the substrate 30 are placed in a nitrogen atmosphere during welding by the ultrasonic welding apparatus 90, and the internal space SP is filled and sealed with nitrogen. It is possible to suitably prevent deterioration due to the like.

  With reference to FIG. 5, a use state in which the optical device 100 is assembled to another component will be described. The apparatus of FIG. 5 is an apparatus for optical communication. Around the optical device 100, a metal-made cylindrical cover 71 is fixed so as to cover the optical component 10. The base portion 71 b of the cover 71 is directly fixed to the outer edge portion 37 of the substrate 30 instead of the optical component 10. Although it is conceivable that the cover 71 is fixed to the surface 31 of the substrate 30 with an adhesive, since the substrate surface 31 is usually coated with metal, it is fixed by welding. A centering seat is formed at the distal end portion 71 a of the cover 71, and is welded in alignment with the sleeve 75 that holds the optical fiber 73 a covered with the ferrule 73. In the apparatus shown in FIG. 5 (apparatus for optical communication), since the optical component 10 is not fixed using an adhesive, the adhesive cannot protrude and the welding resin hardly protrudes. The mounting accuracy of 71 can be increased. That is, the mounting accuracy of the cover 71 can be increased from the viewpoint that the optical component 10 is directly fixed to the substrate 30.

  In the apparatus of FIG. 5, the light emitted from the optical active element 20 of the optical device 100 is incident on the lens unit 11 of the optical component 10, is condensed, and is incident on the optical fiber 73 a.

  According to the optical device 100 of the present embodiment, the substrate 30 has the connection portion 34, that is, the groove 36 that fits in the undercut state with the entire circumference of the opening end portion 15 on the surface 31 side, and the opening end of the optical component 10. Since the entire circumference of the portion 15 is welded and fixed to the connecting portion 34, the optical component 10 is stably and reliably fixed to the substrate 30, and the optical component 10 and the substrate 30 are fixed by welding and fixing to the connecting portion 34. The internal space SP formed between the two can be reliably sealed. By using the undercut groove 36 that spreads on the lower side, not only airtightness can be easily secured, but also the opening end 15 of the holder portion can be prevented from protruding to the outside. It becomes easy to combine with parts.

[Second Embodiment]
Hereinafter, the optical device according to the second embodiment will be described. The optical device or the like of the second embodiment is a modification of the optical device or the like of the first embodiment, and the portions that are not specifically described are the same as those of the optical device or the like of the first embodiment.

As shown in FIG. 6, in the case of the optical device 100 of the second embodiment, the annular groove 236 formed so as not to penetrate on the front surface 31 side of the substrate 30 has a diameter d1 toward the back surface 32 of the substrate 30. It becomes the diagonal arrangement | positioning or shape which decreases to d3 and approaches mutually. Also in this case, at the time of joining, the open end 15 of the optical component 10 shown in FIG. 2A is fitted into the groove 236 in an undercut state. At this time, the surfaces 15a and 15b of the opening end 15 of the optical component 10 are partially melted, and the surfaces 15a and 15b of the opening end 15 are in close contact with and fused to the side surfaces 36a and 36b of the groove 236. Further, the end surface 15c of the open end 15 is also partially melted, and is in close contact with and fused to the bottom surface 36c of the groove 236. That is, the opening end 15 of the optical component 10 is welded and fixed to the groove 236 that is the connection portion 34 on the entire circumference, and the internal space SP formed between the optical component 10 and the substrate 30 can be reliably sealed. it can.
[Third Embodiment]

  Hereinafter, an optical device and the like according to the third embodiment will be described. The optical device or the like according to the third embodiment is a modification of the optical device or the like according to the first embodiment, and parts not specifically described are the same as those of the optical device or the like according to the first embodiment.

  As shown in FIG. 7, in the case of the optical device 100 of the third embodiment, an annular step 336 is formed on the surface 31 side of the substrate 30 as a connection portion 34 that does not penetrate. The annular step 336 has a side surface 336 a that is inclined from a state perpendicular to the surface 31 of the substrate 30. More specifically, the step 336 has a high step surface 336 s on the inner side close to the central optical active element 20, and a lower step surface 336 t or a bottom surface 36 c on the outer side away from the optical active element 20. Further, the step 336 has a shape in which the upper portion of the side surface 336 a is inclined outward and projects outwardly away from the optical active element 20.

  In the case of the optical device 100 of the third embodiment, the entire circumference of the opening end 15 of the optical component 10 shown in FIG. 2A is fitted and fixed to the annular step 336 from the outside. At the time of joining, the opening end 15 of the optical component 10 is fitted with the step 336 in an undercut state. Here, the surface 15b of the opening end 15 is in close contact with and fused to the side surface 336a of the step 336. Further, the end surface 15c of the opening end portion 15 is in close contact with and fused to the step surface 336t or the bottom surface 36c having a low step 336. Also in this embodiment, the optical component 10 is reliably prevented from coming off. Further, the processing of the substrate 30 is facilitated.

[Fourth Embodiment]
Hereinafter, an optical device and the like according to the fourth embodiment will be described. The optical device or the like of the fourth embodiment is a modification of the optical device or the like of the first to third embodiments, and parts not specifically described are the same as those of the optical device or the like of the first to third embodiments. .

  As shown in FIG. 8, in the case of the optical device 100 of the fourth embodiment, the grooves 36, 236 as the connection portion 34 or the side surfaces 36 a, 36 b, 336 a and the bottom surface 36 c of the step 336 are roughened. It has become. Thereby, the opening end 15 (see FIG. 1A) of the optical component 10 is reliably locked by the connecting portion 34, and the adhesion at the bonding surface 39 is increased. Roughening for forming the joint surface 39 is achieved by performing roughening processing by, for example, sandblasting.

[Fifth Embodiment]
Hereinafter, an optical device and the like according to the fifth embodiment will be described. The optical device or the like of the fifth embodiment is a modification of the optical device or the like of the fourth embodiment, and parts not specifically described are the same as those of the optical device or the like of the fourth embodiment.

  As shown in FIG. 9, in the case of the optical device 100 of the fifth embodiment, the joining surface 39 provided with groove-like irregularities in which the bottom surfaces 36 c of the grooves 36, 236 or the step 336 as the connecting portion 34 extend radially. have. As a result, similarly to the case where the surface is roughened, the opening end 15 (see FIG. 1A) of the optical component 10 is reliably locked by the connecting portion 34, and the adhesion at the joint surface 39 is increased. It is also possible to form groove-like irregularities on the grooves 36, 236 or the side surfaces 36a, 36b, 336a of the step 336. The uneven processing for forming the joint surface 39 is achieved by, for example, grinding.

[Sixth Embodiment]
Hereinafter, an optical device and the like according to the sixth embodiment will be described. The optical device or the like according to the sixth embodiment is a modification of the optical device or the like according to the first embodiment, and parts not specifically described are the same as those of the optical device according to the first embodiment.

  As shown in FIG. 10, in the case of the optical device 100 according to the sixth embodiment, the width of the groove 36 as the connecting portion 34 is not uniform along the circumference but locally changes. That is, it includes a portion P1 having a large groove width and a portion P2 having a narrow groove width. When the width of the groove 36 is changed in this way, the thickness of the opening end 15 (see FIG. 1A) of the optical component 10 is also locally changed in accordance with the width of the groove 36. In the case of the present embodiment, alignment in the rotation direction of the optical component 10 is facilitated.

[Seventh Embodiment]
Hereinafter, an optical device and the like according to the seventh embodiment will be described. The optical device or the like according to the sixth embodiment is a modification of the optical device or the like according to the first embodiment, and parts not specifically described are the same as those of the optical device according to the first embodiment.

  As shown in FIG. 11, in the optical device 100 of the seventh embodiment, the thickness of the opening end 15 of the optical component 10 is thinner than the thickness of the main body portion 14 as a whole. Thus, by forming only the opening end 15 thinly, it becomes easy to ensure the accuracy when the optical component 10 is fitted into the substrate 30 and positioned.

  Although the optical device and the like according to the embodiments have been described above, the optical device and the like according to the present invention are not limited to those described above, and various modifications can be made. For example, the connecting portion 34 is not limited to the grooves 36, 236 or the step 336, but may be a protrusion. Also in the case of a protrusion, an undercut state can be realized by providing an inclined side surface. For example, as shown in FIG. 12, an annular projection 38 inclined on the substrate 30 side is provided, and an annular groove 18 inclined on the optical component 10 side is provided correspondingly, and the projection 38 and the groove 18 are fitted. As a result, the optical component 10 can be connected to the substrate 30.

  Further, the side surfaces 36a, 36b, 336a of the grooves 36, 236 or the step 336 are not only uniformly inclined, but also the inclination can be changed, and a plurality of side surfaces having different inclination angles and positive / negative can be combined.

  The outline shapes of the optical component 10 and the substrate 30 constituting the optical device 100 are not limited to a circle, and may be a rectangle or other various shapes depending on the application.

  The optical component 10 does not necessarily have to be integrally molded as a whole, and the lens portion 11 and the holder portion 12 can be individually injection molded, and these can be integrated by welding later. Moreover, the lens part 11 and the holder part 12 can also be collectively formed by two-color molding.

  The fixing of the optical component 10 and the substrate 30 is not limited to ultrasonic welding, and the optical component 10 can be fixed by heating the fitting portion after the optical component 10 and the substrate 30 are fitted using some heat source. Can be welded and fixed.

  Moreover, in the said embodiment, although the photoactive element 20 is used as light emitting elements, such as a laser diode (LD) and LED, this can be replaced with a photodiode (PD).

  In addition, the shape of the lens unit 11 provided in the optical component 10 is merely an example, and the shape of the optical surface of the lens unit 11 and the like can be changed as appropriate according to the application and specifications of the optical device 100.

  DESCRIPTION OF SYMBOLS 10 ... Optical part, 11 ... Lens part, 12 ... Holder part, 14 ... Main-body part, 15 ... Opening edge part, 15a, 15b ... Surface, 15c ... End surface, 20 ... Photoactive element, 26 ... Electrode pin, 30 ... Board | substrate 30a ... through hole 31 ... front surface 32 ... back surface 34 ... connecting portion 36,236 ... groove 36a, 36b, 336a ... side surface 36c ... bottom surface 37 ... outer edge portion 39 ... joining surface 71 ... cover 73 ... Optical fiber, 75 ... Ferrule, 90 ... Ultrasonic welding device, 91 ... Stage, 92 ... Vibrating part, 100 ... Optical device, 336 ... Step, 336a ... Side, AX ... Axis, LB ... Laser light, SP ... Inside space

Claims (13)

An optical device,
The optical apparatus includes an optical component, a substrate, and an optical active element that performs an optical operation.
The optical component has a lens part and a holder part,
The lens part and the holder part are made of resin and integrally molded,
The holder part has an open end on the opposite side of the lens part,
The substrate has an outer shape larger than an outer shape of the optical component viewed from the optical axis direction, and supports the optical component and the optical active element on the surface side.
On the surface side, it has a connection portion that fits in an undercut state with the entire circumference of the opening end portion of the optical component,
An optical device characterized in that the entire circumference of the opening end of the optical component is welded and fixed to the connecting portion.   The optical device according to claim 1, wherein the connection portion is an annular groove formed on the surface side of the substrate.   The optical apparatus according to claim 2, wherein the annular groove serving as the connection portion has a side surface that is inclined from a state perpendicular to the surface of the substrate.   4. The optical device according to claim 3, wherein the groove has a pair of parallel side surfaces, and the pair of parallel side surfaces are inclined in opposite directions at opposite positions across the optical axis. .   The optical device according to claim 1, wherein the connection portion is an annular step formed on the surface side of the substrate.   The optical apparatus according to claim 5, wherein the annular step as the connecting portion has a side surface that is inclined from a state perpendicular to the surface of the substrate.   7. The step according to claim 6, wherein the step has a shape that becomes lower on the outer side away from the photoactive element, and becomes higher on the inner side near the photoactive element, and projects outward in an eave-like shape. Optical device.   The optical device according to claim 1, wherein the connection portion has a roughened bonding surface.   The optical device according to any one of claims 1 to 7, wherein the connection portion has a joint surface on which groove-like irregularities are formed.   The optical device according to any one of claims 1 to 9, wherein the photoactive element is any one of an LED, an LD, a VCSEL, and a PD, and the lens unit is a coupling lens. .   The optical device according to claim 1, wherein the substrate is made of a ceramic material.   The optical apparatus according to claim 1, wherein the optical apparatus is for optical communication. A step of providing an optical component having a lens portion and a holder portion, having an open end on the opposite side of the lens portion of the holder portion, and molded and integrated with a resin;
The optical component has an outer shape larger than that of the optical component viewed from the axial direction, supports the optical component and an optical active element that performs an optical operation on the surface side, and the entire circumference of the opening end of the optical component; Preparing a substrate having a connecting portion that can be fitted in an undercut state;
The inner space formed between the optical component and the substrate is sealed by fitting the entire circumference of the opening end portion of the optical component to the connection portion of the substrate and fixing it by welding. Process,
An optical device manufacturing method comprising:

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