JP6707867B2 - Wavelength conversion device, illumination device, projector, and method for manufacturing wavelength conversion device - Google Patents

Description

The present invention relates to a wavelength conversion device, a lighting device, a projector, and a method for manufacturing a wavelength conversion device.

A light-emitting wheel that has a phosphor layer that receives light and emits light in a predetermined wavelength range and is rotationally driven is known (for example, see Patent Document 1).

JP, 2010-256457, A

In the above light emitting wheel, the circular substrate on which the phosphor layer is provided may be warped. The warp of the circular substrate occurs in the rolling roll direction, for example, when the circular substrate is manufactured by using a rolled material such as aluminum. When the phosphor layer has a binder made of an inorganic material or when the phosphor layer is an inorganic material crystal, when the circular substrate is warped, stress is applied to the phosphor layer, and the phosphor layer is broken and damaged. was there.

One aspect of the present invention is made in view of the above problems, and a wavelength conversion device capable of suppressing damage to an inorganic wavelength conversion element, an illumination device including such a wavelength conversion device, and One of the objects is to provide a projector provided with such a lighting device. Another object of one aspect of the present invention is to provide a method for manufacturing a wavelength conversion device capable of suppressing damage to an inorganic wavelength conversion element.

One aspect of the wavelength conversion device of the present invention, a rotating device having a rotating portion that rotates around a predetermined axis, a substrate that rotates around the predetermined axis by the rotating device, and expands in the radial direction of the predetermined axis, An inorganic wavelength conversion element adhered to the base material via a thermosetting adhesive, and a fixing means for fixing the base material to the rotating portion, the rotating portion spreading in the radial direction and the fixing A fixing portion to which the base material is fixed by means, the heat-resistant temperature of the fixing means is higher than the curing temperature of the thermosetting adhesive, the fixing means, and the base material in the predetermined axial direction Through-holes are formed in the base material for fixing the base material in the predetermined axial direction, and holes are formed in the surface of the fixation portion to which the base material is fixed. The fixing means fixes the base material to the fixing portion via the through hole and the hole, the inorganic wavelength conversion element is a ring surrounding the predetermined axis, and the fixing means is the It is characterized by including an inner fixing means arranged radially inward of the inorganic wavelength conversion element.
The hole may be a screw hole, and the fixing means may be a screw tightened in the screw hole through the through hole.
One aspect of the wavelength conversion device of the present invention, a rotating device having a rotating portion that rotates around a predetermined axis, a substrate that rotates around the predetermined axis by the rotating device, and expands in the radial direction of the predetermined axis, An inorganic wavelength conversion element adhered to the base material via a thermosetting adhesive, and a fixing means for fixing the base material to the rotating portion, the rotating portion spreading in the radial direction and the fixing A fixing portion to which the base material is fixed by means, the heat-resistant temperature of the fixing means is higher than the curing temperature of the thermosetting adhesive, the fixing means, and the base material in the predetermined axial direction It is characterized in that the fixing portion is fixed.
The rotating portion may include a rotating portion main body that rotates around the predetermined axis, and the fixing portion may be fixed to the base material by the fixing means on a radially outer side of the rotating portion main body.
One aspect of the wavelength conversion device of the present invention, a rotating device having a rotating portion that rotates around a predetermined axis, and a base material that rotates around the predetermined axis by the rotating device and expands in the radial direction of the predetermined axis, An inorganic wavelength conversion element adhered to the base material via a thermosetting adhesive, and a fixing means for fixing the base material to the rotating portion, the rotating portion spreading in the radial direction and the fixing The base material is fixed to the base material by means of means, and the heat resistant temperature of the means for fixing is higher than the curing temperature of the thermosetting adhesive.

According to one aspect of the wavelength conversion device of the present invention, the heat-resistant temperature of the fixing means for fixing the base material and the rotating part is higher than the curing temperature of the thermosetting adhesive for bonding the wavelength conversion element to the base material. .. Therefore, even when the base material and the rotating portion (fixing portion) are fixed to each other before the wavelength conversion element is bonded to the base material, the base material is heated when the thermosetting adhesive is cured by heating. The rotation part does not come loose (or does not loosen). Therefore, according to one aspect of the wavelength conversion device of the present invention, it is possible to employ a manufacturing method in which the base material and the rotating part (fixing part) are fixed to each other before the wavelength conversion element is bonded to the base material.

By fixing the base material to the fixing portion that extends in the radial direction, the warped base material can be corrected. Therefore, the warp of the base material can be reduced. Since the base material and the fixing portion can be fixed to each other in this state, even if the wavelength conversion element is bonded to the base material, the stress applied by the warp of the base material can be reduced. Therefore, it is possible to prevent the wavelength conversion element from being broken and damaged.

The inorganic wavelength conversion element may have a ring shape surrounding the predetermined axis, and the fixing means may include an outer fixing means arranged radially outside the inorganic wavelength conversion element.
According to this structure, the warp of the base material can be further reduced.

The inorganic wavelength conversion element may have a ring shape surrounding the predetermined axis, and the fixing means may include an inner fixing means arranged radially inward of the inorganic wavelength conversion element.
According to this configuration, the moment of inertia about the predetermined axis of the coupling body of the rotating part of the wavelength conversion device, the base material and the fixing means can be reduced.

The rotating part may have a rotating part body provided with the fixing part, and the fixing part may be a member separate from the rotating part body.
According to this configuration, the portion of the rotating device that is heated when the thermosetting adhesive is cured can be only the fixing portion. As a result, it is not necessary to increase the heat-resistant temperature of the rotating device other than the fixed portion, and the labor and manufacturing cost of manufacturing the rotating device can be reduced.

The dimension of the fixing portion in the predetermined axial direction may be larger than the dimension of the base material in the predetermined axial direction.
According to this structure, the warp of the base material can be further reduced.

One aspect of an illuminating device of the present invention includes a light source that emits light and the wavelength conversion device described above, and the wavelength conversion device receives the light emitted from the light source, and the wavelength conversion device. Is characterized in that the wavelength of the incident light is converted by the inorganic wavelength conversion element and the light is emitted to the same side as the incident side.

According to one aspect of the illumination device of the present invention, since the wavelength conversion device is provided, it is possible to prevent the wavelength conversion element from being broken and damaged. Further, since the wavelength conversion device is of a reflection type, the fixing portion can be fixed to the surface of the base material on the side opposite to the wavelength conversion element where the wavelength conversion element is bonded. This makes it easier to reduce the warpage of the base material and further suppress the breakage and damage of the wavelength conversion element.

One mode of a projector of the present invention is the above-mentioned illumination device, a light modulation device that forms image light by modulating illumination light from the illumination device according to image information, and a projection that projects the image light. And an optical system.

According to one aspect of the projector of the invention, since the illumination device is provided, it is possible to prevent the wavelength conversion element from being broken and damaged.

One aspect of a method for manufacturing a wavelength conversion device of the present invention is a method for manufacturing a wavelength conversion device including a rotating device having a rotating portion that rotates about a predetermined axis, and a base material that expands in the radial direction of the predetermined axis. A first step of fixing the fixing part of the rotating part by a fixing means, and an inorganic wavelength conversion element bonded to the base material via an uncured thermosetting adhesive which is provided after the first step. It is characterized by having a second step and a third step of curing the uncured thermosetting adhesive by heating.

According to one aspect of the method for manufacturing the wavelength conversion device of the present invention, the wavelength conversion element can be bonded to the base material in the second step after the warpage of the base material is reduced in the first step. Therefore, it is possible to prevent the wavelength conversion element from being broken and damaged.

FIG. 1 is a schematic configuration diagram showing a projector of a first embodiment. It is sectional drawing which shows the wavelength converter of 1st Embodiment. It is a top view which shows the wavelength converter of 1st Embodiment. 5 is a flowchart showing an example of a procedure in the method of manufacturing the wavelength conversion device according to the first embodiment. It is sectional drawing which shows a part of manufacturing process in the manufacturing method of the wavelength converter of 1st Embodiment. It is sectional drawing which shows a part of manufacturing process in the manufacturing method of the wavelength converter of 1st Embodiment. It is sectional drawing which shows a part of manufacturing process in the manufacturing method of the wavelength converter of 1st Embodiment. It is sectional drawing which shows a part of manufacturing process in the manufacturing method of the wavelength converter of 1st Embodiment. It is sectional drawing which shows the wavelength converter of 2nd Embodiment. It is a top view which shows the wavelength converter of 2nd Embodiment. It is sectional drawing which shows the wavelength converter of 3rd Embodiment. It is a perspective view which shows the spacer of 3rd Embodiment. It is a figure for demonstrating the curvature of a disc.

Hereinafter, a projector according to an embodiment of the invention will be described with reference to the drawings. The scope of the present invention is not limited to the following embodiments, and can be arbitrarily changed within the scope of the technical idea of the present invention. Moreover, in the following drawings, in order to make each structure easy to understand, the scale and the number of each structure may be different from the actual structure.

<First Embodiment>
FIG. 1 is a schematic configuration diagram showing a projector 1 according to the present embodiment. The projector 1 shown in FIG. 1 is a projection type image display device that displays a color image on a screen SCR. As shown in FIG. 1, the projector 1 includes a first illumination device (illumination device) 100, a second illumination device 102, a color separation light guide optical system 90, and red light, green light, and blue light. Corresponding liquid crystal light modulators 400R, 400G, 400B (light modulators), a cross dichroic prism 500, and a projection optical system 600 are provided.

The first lighting device 100 includes a first light source (light source) 10, a collimating optical system 70, a dichroic mirror 80, a collimating condensing optical system 85, a wavelength converting device 30, a first lens array 81, and a second lens array 81. A lens array 82, a polarization conversion element 83, and a superimposing lens 84 are provided.

The first light source 10 is a semiconductor laser (light emitting element) that emits blue light (peak of emission intensity: about 445 nm) E in the first wavelength band, which is laser light, as excitation light. The first light source 10 may be composed of one semiconductor laser or may be composed of a large number of semiconductor lasers.
The first light source 10 may be a semiconductor laser that emits blue light having a wavelength other than 445 nm (for example, 460 nm).

In the present embodiment, the first light source 10 is arranged so that its optical axis is orthogonal to the illumination optical axis 100ax.
The collimating optical system 70 includes a first lens 72 and a second lens 74, and substantially collimates the light from the first light source 10. The first lens 72 and the second lens 74 are convex lenses.

The dichroic mirror 80 is arranged in the optical path from the collimating optical system 70 to the collimating condensing optical system 85 so as to intersect the optical axis of the first light source 10 and the illumination optical axis 100ax at an angle of 45°. There is. The dichroic mirror 80 reflects blue light and transmits yellow fluorescence including red light and green light.

The collimator condensing optical system 85 has a function of causing the blue light E from the dichroic mirror 80 to be substantially condensed and incident on the wavelength conversion device 30, and a function of substantially parallelizing the fluorescence emitted from the wavelength conversion device 30. Have. The collimator condensing optical system 85 includes a first lens 86, a second lens 87, and a third lens 88. The first lens 86, the second lens 87, and the third lens 88 are convex lenses.

The wavelength conversion device 30 is a reflection type wavelength conversion device. The blue light E in the first wavelength band emitted from the first light source 10 is incident on the wavelength conversion device 30 via the collimator condensing optical system 85. The wavelength conversion device 30 wavelength-converts the incident blue light E by the phosphor layer 42 described later, and emits it as the fluorescence Y in the second wavelength band to the same side as the side on which the blue light E is incident. The fluorescence Y is yellow light including red light and green light. The fluorescence Y emitted from the wavelength conversion device 30 enters the collimator condensing optical system 85. The wavelength conversion device 30 will be described in detail later.

The second lighting device 102 includes a second light source 710, a condensing optical system 760, a scattering plate 732, and a collimating optical system 770.

The second light source 710 is composed of, for example, the same semiconductor laser as the first light source 10 of the first lighting device 100.
The condensing optical system 760 includes a first lens 762 and a second lens 764. The condensing optical system 760 condenses the blue light from the second light source 710 near the scattering plate 732. The first lens 762 and the second lens 764 are convex lenses.

The scattering plate 732 scatters the blue light B from the second light source 710 to make the blue light B having a light distribution similar to that of the fluorescence Y emitted from the wavelength conversion device 30. As the scattering plate 732, for example, frosted glass made of optical glass can be used.

The collimating optical system 770 includes a first lens 772 and a second lens 774, and substantially collimates the light from the scattering plate 732. The first lens 772 and the second lens 774 are convex lenses.

In the present embodiment, the blue light B from the second illumination device 102 is reflected by the dichroic mirror 80, is combined with the fluorescence Y emitted from the wavelength conversion device 30 and transmitted through the dichroic mirror 80, and becomes the white light W. The white light W enters the first lens array 81.

The first lens array 81 has a plurality of first small lenses 81a for splitting the light from the dichroic mirror 80 into a plurality of partial light fluxes. The plurality of first small lenses 81a are arranged in a matrix in a plane orthogonal to the illumination optical axis 100ax.

The second lens array 82 has a plurality of second small lenses 82a corresponding to the plurality of first small lenses 81a of the first lens array 81. The second lens array 82, together with the superimposing lens 84, forms an image of each first small lens 81a of the first lens array 81 in the vicinity of the image forming area of each of the liquid crystal light modulators 400R, 400G, 400B. The plurality of second small lenses 82a are arranged in a matrix in a plane orthogonal to the illumination optical axis 100ax.

The polarization conversion element 83 converts each partial light flux split by the first lens array 81 into linearly polarized light. The polarization conversion element 83 has a polarization separation layer, a reflection layer, and a retardation plate. The polarization separation layer transmits one linearly polarized light component of the polarized light component included in the light from the wavelength conversion device 30 as it is and reflects the other linearly polarized light component toward the reflective layer. The reflection layer reflects the other linearly polarized light component reflected by the polarization separation layer in a direction parallel to the illumination optical axis 100ax. The retardation plate converts the other linearly polarized light component reflected by the reflective layer into one linearly polarized light component.

The superimposing lens 84 condenses the respective partial light fluxes from the polarization conversion element 83 and superimposes them on each other in the vicinity of the image forming areas of the liquid crystal light modulators 400R, 400G, 400B. The first lens array 81, the second lens array 82, and the superimposing lens 84 configure an integrator optical system that makes the in-plane light intensity distribution of the light from the wavelength conversion device 30 uniform.

The color separation/light guide optical system 90 includes dichroic mirrors 91 and 92, reflection mirrors 93, 94 and 95, and relay lenses 96 and 97. The color separation light guide optical system 90 separates the white light W from the first lighting device 100 and the second lighting device 102 into red light R, green light G, and blue light B, and red light R, green light G, and blue light. The light B is guided to the corresponding liquid crystal light modulators 400R, 400G, 400B.
Field lenses 300R, 300G and 300B are arranged between the color separation/light guide optical system 90 and the liquid crystal light modulators 400R, 400G and 400B.

The dichroic mirror 91 is a dichroic mirror that allows a red light component to pass therethrough and reflects a green light component and a blue light component.
The dichroic mirror 92 is a dichroic mirror that reflects a green light component and transmits a blue light component.
The reflection mirror 93 is a reflection mirror that reflects the red light component.
The reflection mirrors 94 and 95 are reflection mirrors that reflect the blue light component.

The red light that has passed through the dichroic mirror 91 is reflected by the reflection mirror 93, passes through the field lens 300R, and enters the image forming area of the liquid crystal light modulation device 400R for red light.
The green light reflected by the dichroic mirror 91 is further reflected by the dichroic mirror 92, passes through the field lens 300G, and enters the image forming area of the liquid crystal light modulation device 400G for green light.
The blue light that has passed through the dichroic mirror 92 passes through a relay lens 96, an incident side reflection mirror 94, a relay lens 97, an emission side reflection mirror 95, and a field lens 300B, and an image forming area of a blue light liquid crystal light modulator 400B. Incident on.

The liquid crystal light modulators 400R, 400G, 400B form image light by modulating the illumination light from the first illumination device 100, which is incident via the color separation/light guide optical system 90, according to the image information. The liquid crystal light modulators 400R, 400G, and 400B form image lights corresponding to the respective incident color lights. Although not shown, an incident side polarization plate is arranged between each field lens 300R, 300G, 300B and each liquid crystal light modulation device 400R, 400G, 400B, and each liquid crystal light modulation device 400R, 400G. , 400B and the cross dichroic prism 500, an emission side polarization plate is arranged respectively.

The cross dichroic prism 500 is an optical element that forms a color image by combining the image lights emitted from the liquid crystal light modulators 400R, 400G, and 400B.

The cross dichroic prism 500 has a substantially square shape in a plan view in which four right-angle prisms are bonded together, and a dielectric multilayer film is formed on a substantially X-shaped interface where the right-angle prisms are bonded together.

The color image emitted from the cross dichroic prism 500 is incident on the projection optical system 600. The projection optical system 600 magnifies and projects the incident color image (image light) toward the screen SCR. As a result, an image is formed on the screen SCR.

Next, the wavelength conversion device 30 will be described in detail.
FIG. 2 is a cross-sectional view showing the wavelength conversion device 30. FIG. 3 is a plan view showing the wavelength conversion device 30. As shown in FIG. 2, the wavelength conversion device 30 includes a motor (rotation device) 50, a disk (base material) 40, a reflection film 41, a phosphor layer (inorganic wavelength conversion element) 42, and an inner screw ( Inner fixing means) 56.

The motor 50 is, for example, an outer rotor type motor. The motor 50 has a stator 50a and a rotor (rotating part) 50b that rotates around a central axis (predetermined axis) J with respect to the stator 50a. The rotor 50b surrounds the stator 50a around the central axis J.

In the following description, a direction parallel to the central axis J may be simply referred to as “axial direction (predetermined axial direction)”, and a radial direction having the central axis J as a center may be simply referred to as “radial direction”. The circumferential direction around the central axis J (θ direction) may be simply referred to as “circumferential direction”. Further, in the axial relative relationship between the disk 40 and the motor 50, the disk 40 side is the “upper side” in the axial direction, and the motor 50 side is the “lower side” in the axial direction. It should be noted that the terms “upper side” and “lower side” are merely names used for description, and do not limit the actual positional relationship, usage mode, or the like.

The rotor 50b has a rotor main body (rotating portion main body) 55 and a spacer (fixed portion) 60. The rotor body 55 is a portion including the housing of the motor 50. The rotor main body 55 has a large diameter portion 55a and a small diameter portion 55b. The large diameter portion 55a and the small diameter portion 55b are both cylindrical with the central axis J as the center. The small diameter portion 55b is provided on the disk 40 side (the upper side in the figure) of the large diameter portion 55a. The outer diameter of the small diameter portion 55b is smaller than the outer diameter of the large diameter portion 55a. Therefore, on the outer peripheral surface of the rotor main body 55, a step having a smaller outer diameter is formed from the motor 50 side (lower side in the drawing) toward the disc 40 side (upper side in the drawing).

The spacer 60 is an annular member that passes through the center through the central axis J and expands in the radial direction. In this embodiment, the spacer 60 is a member separate from the rotor body 55, and is made of metal such as aluminum. The spacer 60 is provided on the rotor body 55. More specifically, the spacer 60 is provided at the step formed by the large diameter portion 55a and the small diameter portion 55b.

The upper surface 60a of the spacer 60 is in contact with the lower surface 40b of the disc 40. The lower surface 60b of the spacer 60 is in contact with the upper surface 55c of the large diameter portion 55a. As a result, the spacer 60 defines the axial distance between the large diameter portion 55a and the disc 40.

The spacer 60 is fitted to the small diameter portion 55b from the outside in the radial direction, and is fixed to the rotor body 55. The method of fixing the spacer 60 and the rotor main body 55 is not particularly limited. For example, the spacer 60 may be press-fitted and fixed to the small diameter portion 55b, may be fixed with an adhesive, or may be fixed with a screw. The axial dimension T2 of the spacer 60 is larger than the axial dimension T1 of the disc 40.

An inner screw hole 60d that is recessed downward is formed on the upper surface 60a of the spacer 60. The inner screw 56 is screwed into the inner screw hole 60d. Although illustration is omitted, in the present embodiment, for example, eight inner screw holes 60d are provided, and they are arranged at equal intervals along the circumferential direction (θ direction). The disk 40 is fixed to the spacer 60 by an inner screw 56.

The center axis J of the disc 40 passes through the center thereof and is expanded in the radial direction. A through hole 40c is formed at the center of the disc 40 so as to penetrate the disc 40 in the axial direction. The tip of the small diameter portion 55b of the rotor 50b is fitted into the through hole 40c. As shown in FIG. 3, the through hole 40c is a circular hole through which the central axis J passes. The inner peripheral surface of the through hole 40c overlaps with the inner peripheral surface 60c of the spacer 60 when viewed along the axial direction.

As shown in FIG. 2, an inner screw through hole 40d that axially penetrates the disc 40 is formed around the through hole 40c in the disc 40. The inner screw through hole 40d is located radially inward of the phosphor layer 42. Although illustration is omitted, in the present embodiment, for example, eight inner screw through holes 40d are provided, and are arranged at equal intervals along the circumferential direction (θ direction). The inner screw 56 is passed through the inner screw through hole 40d.

The peripheral portion of the through hole 40c of the lower surface 40b of the disc 40 is in contact with the upper surface 60a of the spacer 60. Since the disc 40 is fixed to the spacer 60 with the inner screw 56, the disc 40 is rotated about the central axis J (in the θ direction) by the motor 50. The disk 40 is made of metal, and is a material having excellent heat dissipation such as copper and aluminum. The disc 40 is manufactured, for example, by punching a rolled material by press working.

The reflective film 41 is provided on the upper surface 40 a of the disc 40. The reflective film 41 is located between the phosphor layer 42 and the disc 40 in the axial direction. The reflection film 41 is designed to reflect the fluorescence Y (see FIG. 1) excited by the phosphor layer 42 with high efficiency. The reflection film 41 is, for example, silver or the like, and is made of a film having a higher reflectance than at least the disc 40. Although illustration is omitted, the reflection film 41 has an annular shape centered on the central axis J. The reflective film 41 is formed by using, for example, a sputtering method, a vapor deposition method or the like.

As shown in FIG. 3, the phosphor layer 42 has a ring shape surrounding the central axis J. More specifically, the phosphor layer 42 has an annular shape with the central axis J passing through the center. The phosphor layer 42 is adhered to the disc 40 via a thermosetting adhesive. More specifically, the phosphor layer 42 is bonded to the disc 40 via the reflective film 41. The thermosetting adhesive that adheres the phosphor layer 42 has a translucency that allows the fluorescence Y emitted from the phosphor layer 42 to pass through. Examples of the thermosetting adhesive include epoxy resin and silicone resin. As shown in FIG. 2, the phosphor layer 42 is located radially outside the rotor body 55 and the spacer 60.

The phosphor layer 42 includes a phosphor and a binder that holds the phosphor. The phosphor contained in the phosphor layer 42 is excited by the blue light E in the first wavelength band from the first light source 10 and emits the fluorescence Y in the second wavelength band. The phosphor is, for example, a YAG (yttrium aluminum garnet)-based phosphor having a composition represented by (Y,Gd) ₃ (Al,Ga) ₅ O ₁₂ :Ce. The binder is, for example, ceramics obtained by sintering an inorganic material such as alumina, or glass. The phosphor layer 42 is formed by dispersing phosphors in a binder.

In the present embodiment, the blue light E is incident on the phosphor layer 42 from the upper surface 42a opposite to the motor 50. The incident blue light E is converted into fluorescence Y by the phosphor of the phosphor layer 42, and is reflected by the reflective film 41 toward the upper surface 42a side of the phosphor layer 42. Then, the fluorescence Y is emitted from the upper surface 42a of the phosphor layer 42. That is, in the present embodiment, the upper surface 42a of the phosphor layer 42 is a surface on which the blue light E is incident and a surface on which the fluorescence Y is emitted.

The inner screw 56 is a fixing means for fixing the disc 40 to the rotor 50b. The inner screw 56 is passed through the inner screw through hole 40d of the disc 40 from the upper surface 40a side of the disc 40, and is tightened in the inner screw hole 60d of the spacer 60. The inner screw 56 is arranged radially inward of the phosphor layer 42. The inner screw 56 axially overlaps the large diameter portion 55a of the rotor body 55.

As shown in FIG. 3, in the present embodiment, for example, eight inner screws 56 are provided. The inner screws 56 are arranged at equal intervals along the circumferential direction (θ direction). The heat resistant temperature of the inner screw 56 is higher than the curing temperature of the thermosetting adhesive that bonds the phosphor layer 42 and the disc 40.

In the present specification, the “heat resistant temperature of the fixing means” includes the highest temperature in the temperature range in which the fixing between the base material and the fixing portion by the fixing means does not come off or loosen. In the present embodiment, the heat resistant temperature of the inner screw 56 includes, for example, the temperature before reaching the melting point of the inner screw 56. For example, when the temperature of the inner screw 56 exceeds the heat resistant temperature of the inner screw 56, the inner screw 56 begins to melt and the disc 40 and the spacer 60 are disengaged or loosened.

In the wavelength conversion device 30, the motor 50 rotates the disc 40 around the central axis J (θ direction) via the rotor 50b. When the blue light E, which is a laser beam, is incident on the phosphor layer 42 via the collimating and condensing optical system 85, heat is generated in the phosphor layer 42. The motor 50 rotates the disc 40 to sequentially change the incident position of the blue light E on the phosphor layer 42. Accordingly, it is possible to suppress the occurrence of the problem that the same portion of the phosphor layer 42 is intensively irradiated with the blue light B and deteriorates.

Next, a method of manufacturing the wavelength conversion device 30 of this embodiment will be described.
FIG. 4 is a flowchart showing an example of a procedure in the method of manufacturing the wavelength conversion device 30 of this embodiment. 5A to 5D are cross-sectional views showing a part of the manufacturing process in the method of manufacturing the wavelength conversion device 30 of the present embodiment. In FIGS. 5A to 5D, the illustration of the reflective film 41 is omitted.

As shown in FIG. 4, the manufacturing method of the wavelength conversion device 30 of the present embodiment includes a preparatory step S1, a spacer fixing step (first step) S2, a phosphor layer bonding step (second step) S3, and a curing step. It has a step (third step) S4 and a disc mounting step S5.

The preparation step S1 is a step of preparing the disk 40 and the spacer 60. A part of the strip-shaped rolled material is punched by pressing to form the through hole 40c and the inner screw through hole 40d. Then, the outer shape of the disc 40 is punched out from the rolled material by press working. As a result, the disc 40 is formed.

Next, the outer shape of the spacer 60 is cut out from the metal ingot by cutting. A threaded hole is formed in the machined object to form an inner threaded hole 60d. As a result, the spacer 60 is formed.

As described above, the disk 40 and the spacer 60 are prepared by this step. In the preparation step S1, the manufacturing method of the disk 40 and the spacer 60 is not particularly limited, and the disk 40 and the spacer 60 manufactured in advance may be prepared.

Next, the spacer fixing step S2 is a step of fixing the disk 40 and the spacer 60 with the inner screw 56. As shown in FIG. 5A, the center of the disc 40 and the center of the spacer 60 are aligned, and the disc 40 and the spacer 60 are fixed by the inner screw 56. At this time, the disc 40 and the spacer 60 may be aligned by using a jig fitted into the through hole 40c of the disc 40 and the inner side of the spacer 60.

Next, the phosphor layer adhering step S3 is a step of adhering the phosphor layer 42 to the disc 40 via the uncured thermosetting adhesive 57. The phosphor layer bonding step S3 is provided after the spacer fixing step S2. The phosphor and particles of an inorganic material such as alumina are mixed at a predetermined ratio and sintered to form the phosphor layer 42. The phosphor layer 42 manufactured in advance may be prepared.

As shown in FIG. 5B, the uncured thermosetting adhesive 57 is applied to the surface (upper surface 40a) opposite to the surface of the disk 40 to which the spacers 60 are fixed, and the uncured thermosetting adhesive is applied. The phosphor layer 42 is adhered to the disc 40 via 57 (see FIG. 5C).

Although not shown in FIG. 5B, the reflective film 41 is formed on the upper surface 40 a of the disc 40, and the uncured thermosetting adhesive 57 is applied to the disc 40 via the reflective film 41. It is coated on the upper surface 40 a of the 40. The step of forming the reflective film 41 may be provided at any position before the application of the uncured thermosetting adhesive 57. The step of forming the reflective film 41 is provided, for example, between the preparation step S1 and the spacer fixing step S2.

Next, the curing step S4 is a step of curing the uncured thermosetting adhesive 57 by heating. As shown in FIG. 5C, the coupling body of the disc 40, the phosphor layer 42, and the spacer 60 is heated to cure the uncured thermosetting adhesive 57. Through this step, the disc 40 and the phosphor layer 42 can be fixed.

Next, the disk mounting step S5 is a step of mounting the disk 40 and the spacer 60 on the rotor body 55. As shown in FIG. 5D, the coupling body of the disc 40, the phosphor layer 42, and the spacer 60 is brought close to the assembly of the rotor body 55 and the stator 50a from the small diameter portion 55b side. While inserting the small diameter portion 55b inside the spacer 60, the coupling body is moved until the lower surface 60b of the spacer 60 contacts the upper surface 55c of the large diameter portion 55a. As a result, the spacer 60 is fitted to the small diameter portion 55b and attached to the rotor body 55. Note that, as described above, the method of fixing the spacer 60 and the rotor body 55 is not particularly limited.

Through the above steps, the wavelength conversion device 30 of this embodiment is manufactured.

FIG. 10 is a diagram for explaining the warp of the disc.
As shown in FIG. 10, for example, when the disc 340 is manufactured by punching it from a rolled material, the disc 340 is the main surface of the disc 340 in the rolling direction in which the rolled material is rolled (the horizontal direction in FIG. 10). The upper surface 340a and the lower surface 340b are warped in a direction orthogonal to the rolling direction (vertical direction in FIG. 10). In FIG. 10, the left and right ends of the disc 340 are warped upward.

The warp of the disc 340 differs depending on the radial position. The warp of the disc 340 at a certain radial position is evaluated by the amount of deformation in the warp direction at the certain radial position with respect to the diameter at the certain radial position. Specifically, the warp of the disc 340 at the location where the outer peripheral edge of the phosphor layer 342 is located is the deformation of the disc 340 at the location where the outer peripheral edge of the phosphor layer 342 is located relative to the outer diameter L of the phosphor layer 342. It is evaluated by the quantity D (ie D/L).

Here, the amount of deformation D is, for example, based on the position of the upper surface 340a of the disc 340 in the center of the rolling direction (the left-right direction in FIG. 10), the disc 340 at the position where the outer peripheral edge of the phosphor layer 342 is located. The amount of deformation is the amount of deformation of the upper surface 340a in the warp direction (vertical direction in FIG. 10). As an example, the warpage D/L of the disc 340 is preferably 0.001 or less.

If the disc 340 is largely warped at the location where the phosphor layer 342 is provided, a large amount of stress is likely to be applied to the phosphor layer 342, and the phosphor is likely to be assembled when the wavelength conversion device is assembled and when the disc 340 is rotated. The layer 342 was sometimes broken and damaged.

On the other hand, according to the present embodiment, the heat resistant temperature of the inner screw 56 for fixing the disc 40 and the rotor 50b is set to the curing temperature of the thermosetting adhesive 57 for adhering the phosphor layer 42 to the disc 40. Higher than. Therefore, even when the disc 40 and the rotor 50b (spacer 60) are fixed to each other before the phosphor layer 42 is adhered to the disc 40, when the thermosetting adhesive 57 is cured by heating. In addition, the disc 40 and the rotor 50b are not firmly fixed (or not loosened). Therefore, according to the wavelength conversion device 30 of the present embodiment, it is possible to employ a manufacturing method in which the spacer fixing step S2 is performed before the above-mentioned phosphor layer bonding step S3.

In the spacer fixing step S2, by fixing the disc 40 to the spacer 60 that expands in the radial direction, the warped disc 40 can be corrected along the upper surface 60a of the spacer 60. Therefore, the warp of the disc 40 can be reduced. Since the phosphor layer bonding step S3 can be performed in this state, even if the phosphor layer 42 is bonded to the disc 40, the stress applied by the warp of the disc 40 can be reduced. Therefore, according to the present embodiment, it is possible to prevent the phosphor layer 42 from being broken and damaged.

In particular, when the fixing means of the disc 40 and the spacer 60 is the inner screw 56 as in the present embodiment, the disc 40 and the spacer 60 can be firmly fixed and the warp of the disc 40 can be further corrected. Cheap. Further, for example, when the fixing means is an adhesive, the warp of the disc 40 may return before the adhesive is cured. Therefore, the disc 40 and the spacer 60 are pressed until the adhesive is cured. It is necessary to keep it, and it takes time. On the other hand, if the fixing means is the inner screw 56, the disc 40 and the spacer 60 can be fixed by tightening the inner screw 56, which is simple.

Further, by using the inner screw 56 as the fixing means, the heat resistance temperature of the fixing means can be made relatively higher than in the case where the fixing means is made of an adhesive, so that the thermosetting adhesive 57 has a relatively high curing temperature. Agents can also be used. Thereby, the selection range of the thermosetting adhesive 57 can be widened.

The warp of the disc may occur due to a reason other than that the disc is manufactured from a rolled material. According to the present embodiment, since the warp that occurs in such a case can be reduced, the wavelength conversion device 30 of the present embodiment is useful even when the disc 40 is manufactured from a material other than a rolled material. Is.

Further, since the spacer 60 is made of metal, the upper surface 60a and the lower surface 60b of the spacer 60 can be accurately formed by machining. Since the disc 40 is fixed to the spacer 60 by the inner screw 56, the disc 40 is corrected along the upper surface 60a of the spacer 60, so that the warp correction accuracy of the disc 40 can be improved. Further, the disc 40 can be accurately attached to the rotor main body 55 via the spacer 60.

Further, for example, when the motor 50 is an inner rotor type motor, the spacer 60 is directly or indirectly fixed to the upper end of the shaft of the motor. In this case, since the weight of the spacer 60 or the like is concentrated and applied to the upper end of the shaft, the rotation axis is deviated and the rotor 50b, the disc 40, the inner screw 56, the phosphor layer 42, and the reflection film 41 in the wavelength conversion device 30 are shaken. The rotation of the connected body (hereinafter, simply referred to as a rotating body) may become unstable.

On the other hand, according to the present embodiment, since the motor 50 is the outer rotor type motor, the rotor body 55 can receive the weight of the spacer 60 and the like, and the rotation shaft of the rotating body of the wavelength conversion device 30. It is possible to suppress blurring. Therefore, it is easy to stably rotate the rotating body of the wavelength conversion device 30. Further, by bringing the spacer 60 into contact with the upper surface 55c of the rotor body 55 (large-diameter portion 55a), it is easy to stably support the spacer 60 and the disc 40.

Further, according to the present embodiment, the fixing means includes the inner screw 56 arranged radially inside the phosphor layer 42. Therefore, the radial position of the inner screw 56 can be brought closer to the central axis J. Accordingly, for example, the moment of inertia about the central axis J in the rotating body of the wavelength conversion device 30 can be made smaller than in the case where all the inner screws 56 are provided radially outside the phosphor layer 42. Therefore, the rotating body of the wavelength conversion device 30 can be easily rotated about the central axis J.

Further, when all the inner screws 56 are arranged radially inward of the phosphor layer 42 as in the present embodiment, the outer diameter of the spacer 60 can be reduced, and the spacer 60 can be downsized. Thereby, the weight of the spacer 60 can be reduced, and the weight of the rotating body of the wavelength conversion device 30 can be reduced. Therefore, the rotation torque of the motor 50 required to rotate the rotating body can be reduced, and the motor 50 can be easily miniaturized.

Further, since the outer diameter of the spacer 60 can be reduced, the spacer 60 can be arranged radially inward of the phosphor layer 42. Thereby, for example, even when the wavelength conversion device 30 is used as a transmission type wavelength conversion device and the fluorescence Y is emitted from the phosphor layer 42 through the disc 40, the spacer 60 may block the fluorescence Y. Absent. Therefore, the wavelength conversion device 30 can be a transmission type wavelength conversion device while suppressing the warpage of the disk 40 by the spacer 60 and suppressing the damage of the phosphor layer 42.

Further, according to the present embodiment, the spacer 60 is a member separate from the rotor body 55. Therefore, in the curing step S4, it is not necessary to heat the portions of the motor 50 other than the spacer 60 (the stator 50a and the rotor body 55). Thereby, it is not necessary to increase the heat resistance of the stator 50a and the rotor main body 55, and the labor and manufacturing cost of manufacturing the motor 50 can be reduced. Further, since the material of the spacer 60 can be made different from the material of the rotor main body 55, the spacer 60 can be made of a metal that is easy to process. Accordingly, the spacer 60 can be easily manufactured by machining, and the molding accuracy of the spacer 60 can be improved.

Further, according to the present embodiment, the axial dimension T2 of the spacer 60 is larger than the axial dimension T1 of the disc 40. Therefore, the rigidity of the spacer 60 is easily increased, and the warp of the disc 40 is easily corrected by the spacer 60.

In addition, in the present embodiment, the following configuration may be adopted.

The fixing means is not limited to the inner screw 56, and may be a rivet or welding. Even when the fixing means is one of these, the fixing of the disc 40 and the spacer 60 is easier than when the fixing means is an adhesive.

Further, the fixing means may be an adhesive. The type of adhesive is not particularly limited as long as the heat resistant temperature after curing is higher than the curing temperature of the thermosetting adhesive 57 that bonds the phosphor layer 42 and the disc 40, and a photocurable adhesive is used. It may be a thermosetting adhesive. When the fixing means is a thermosetting adhesive, the fixing means may be an adhesive having the same composition as the thermosetting adhesive 57 or an adhesive having a different composition.

Further, the phosphor layer 42 may have a structure that does not include a binder. The phosphor layer 42 may be, for example, an inorganic material crystal.

The axial dimension T2 of the spacer 60 may be the same as the axial dimension T1 of the disc 40, or may be smaller than the axial dimension T1 of the disc 40.

Further, the rotor body 55 and the spacer 60 may be integrated. In this case, for example, the fixing portion (spacer 60) is a part of the housing of the motor 50.

The reflective film 41 may be provided on the entire upper surface 40 a of the disc 40.
Further, the motor 50 may be an inner rotor type motor.
Further, the disc 40 may be provided with a heat sink.

<Second Embodiment>
The second embodiment differs from the first embodiment in the shape of the spacer. It should be noted that the same configurations as those in the above-described embodiment are appropriately denoted by the same reference numerals, and the description thereof may be omitted.

FIG. 6 is a cross-sectional view showing the wavelength conversion device 130 of this embodiment. FIG. 7 is a plan view showing the wavelength conversion device 130. As shown in FIG. 6, the wavelength conversion device 130 includes a motor (rotating device) 150, a disc (base material) 140, a reflective film 41, a phosphor layer 42, an inner screw 56, and an outer screw (outer side). Fixing means) 157.

In the rotor 150b of the motor 150, the spacer 160 has a spacer body 161 and a flange 162. The spacer body 161 is similar to the spacer 60 of the first embodiment.

The flange portion 162 extends radially outward from the upper end of the spacer body 161. The flange portion 162 extends radially outward of the phosphor layer 42. As shown in FIG. 7, the flange portion 162 has an annular shape centered on the central axis J. As shown in FIG. 6, the upper surface 162 a of the flange portion 162 is in contact with the lower surface 140 b of the disc 40. Thereby, in the spacer 160, the area of the portion where the spacer 160 and the disc 140 contact each other is larger than the area of the portion where the spacer 160 contacts the rotor body 55.

The axial dimension T5 of the flange portion 162 is smaller than the axial dimension T4 of the spacer body 161 and larger than the axial dimension T3 of the disc 40. On the upper surface of the flange portion 162, a screw hole 162d that is recessed downward is formed. An outer screw 157 is screwed into the screw hole 162d.

An outer screw through hole 140d is formed in the disc 140 so as to penetrate the disc 140 in the axial direction. The outer screw through hole 140d is located radially outward of the phosphor layer 42. Although illustration is omitted, in the present embodiment, for example, eight outer screw through holes 140d are provided, and are arranged at equal intervals along the circumferential direction (θ direction). An outer screw 157 is passed through the outer screw through hole 140d. The other configuration of the disc 140 is the same as the configuration of the disc 40 of the first embodiment.

The outer screw 157 is a fixing means for fixing the disc 140 to the rotor 150b. The outer screw 157 is passed through the outer screw through hole 140d of the disc 140 from the upper surface 140a side of the disc 140, and is tightened in the screw hole 162d of the flange portion 162. In this embodiment, the spacer 160 and the disc 140 are fixed to each other by the inner screw 56 and the outer screw 157. The outer screw 157 is arranged radially outside the phosphor layer 42.

As shown in FIG. 7, in this embodiment, eight outer screws 157 are provided, for example. The outer screws 157 are arranged at equal intervals along the circumferential direction (θ direction). The heat resistant temperature of the outer screw 157 is higher than the curing temperature of the thermosetting adhesive that bonds the phosphor layer 42 and the disc 140. The outer screw 157 is arranged so as to be displaced from the inner screw 56 in the circumferential direction. The circumferential position of the outer screw 157 is the center position of the inner screws 56 adjacent to each other in the circumferential direction.

According to the present embodiment, the fixing means includes the outer screw 157 arranged radially outside the phosphor layer 42. Therefore, the outer screw 157 can be arranged at a position further away from the central axis J in the radial direction. Since the warp of the disc 140 is larger toward the outside in the radial direction, the warp of the disc 140 can be further corrected by providing the outer screw 157. Further, since a part of the spacer 160 can be arranged below the phosphor layer 42, the warp of the portion of the disc 140 to which the phosphor layer 42 is adhered can be more preferably corrected, and the phosphor layer It is possible to further suppress that 42 is broken and damaged.

When the wavelength conversion device 130 is a reflection type wavelength conversion device as in the present embodiment, it is not necessary to emit the fluorescence Y emitted from the phosphor layer 42 from the lower surface 140b side of the disc 140. Therefore, it is easy to adopt a configuration in which a part of the spacer 160 is arranged below the phosphor layer 42.

Further, according to the present embodiment, the inner screw 56 and the outer screw 157 can fix the disc 140 and the spacer 160 both on the radially inner side and the radially outer side of the phosphor layer 42. Therefore, the disc 140 and the spacer 160 can be firmly fixed to each other, and the warp of the disc 140 can be more easily corrected.

Further, according to the present embodiment, the outer screw 157 is arranged so as to be displaced in the circumferential direction with respect to the inner screw 56. Therefore, the outer screw 157 and the inner screw 56 can fix the disc 140 and the spacer 160 at different circumferential positions. As a result, the number of circumferential positions of the portion where the disk 140 and the spacer 160 are fixed can be increased as compared with the case where the circumferential position of the inner screw 56 and the circumferential position of the outer screw 157 are the same. Therefore, the disc 140 and the spacer 160 are more stably fixed and the warp of the disc 140 is more easily corrected. Further, as a result, the fixing strength between the disc 140 and the spacer 160 can be secured even if the total number of fixing means including the number of the inner screws 56 and the number of the outer screws 157 is reduced to some extent, and thus the wavelength conversion device 130. The weight of the rotating body can be reduced.

Further, according to the present embodiment, since the flange portion 162 is provided, the area of the portion of the spacer 160 that comes into contact with the disc 140 can be increased. Therefore, the spacer 160 can support the disk 140 more stably.

Further, according to the present embodiment, the axial dimension T5 of the flange portion 162 is smaller than the axial dimension T4 of the spacer body portion 161, and larger than the axial dimension T3 of the disc 140. Therefore, the weight of the spacer 160 (flange portion 162) can be reduced while the disc portion 140 is appropriately corrected by the flange portion 162.

In this embodiment, only the inner screw 56 may be provided as the fixing means. Even in this case, for example, when the disc 140 is warped downward, the disc 140 and the spacer 160 are fixed by the inner screw 56, so that the disc 140 is pressed against the flange portion 162. The warp of the disc 140 is corrected.

Further, in the present embodiment, only the outer screw 157 may be provided as the fixing means. Even in this case, for example, when the disc 140 is warped downward, the disc 140 and the spacer 160 are fixed by the outer screw 157, so that the disc 140 is pressed against the flange portion 162. The warp of the disc 140 is corrected.

<Third Embodiment>
The third embodiment differs from the first embodiment in that the spacer has ribs. It should be noted that the same configurations as those in the above-described embodiment are appropriately denoted by the same reference numerals, and the description thereof may be omitted.

FIG. 8 is a cross-sectional view showing the wavelength conversion device 130 of this embodiment. As shown in FIG. 8, the wavelength conversion device 230 includes a motor (rotation device) 250, a disk 140, a reflection film 41, a phosphor layer 42, an inner screw 56, and an outer screw 157. In the rotor 250b of the motor 250, the spacer 260 has a spacer body 161, a flange 162, and a plurality of ribs 263.

FIG. 9 is a perspective view of the spacer 260 viewed from the lower side. As shown in FIG. 9, the rib 263 is arranged on the lower surface 162b of the flange portion 162. The ribs 263 extend radially outward (radially from the central axis J) from the outer peripheral surface of the spacer body 161. The radial outer end of the rib 263 is located at the outer edge of the flange portion 162. The plurality of ribs 263 are arranged at equal intervals along the circumferential direction. In this embodiment, for example, 16 ribs 263 are provided. The cross section of the rib 263 is, for example, rectangular.

According to this embodiment, since the rib 263 is provided, the rigidity of the flange portion 162 can be improved. Thereby, the warp of the disc 140 can be further corrected. For example, if the axial dimension T5 of the flange portion 162 is increased, the rigidity of the flange portion 162 can be improved, but the weight of the spacer 260 increases. On the other hand, by providing the rib 263, the rigidity of the flange portion 162 can be improved while suppressing an increase in the weight of the spacer 260.

Further, the rib 263 functions as a heat radiation fin, and the heat of the phosphor layer 42 is easily radiated from the spacer 260. Further, when the spacer 260 rotates around the central axis J, the air flow is generated by the rib 263, and the motor 250 can be cooled.

In addition, in the present embodiment, the shape of the rib 263 is not particularly limited. For example, the rib 263 may have a shape that curves in the circumferential direction from the radially inner side toward the radially outer side. In this case, the curved rib 263 facilitates the flow of air, and the motor 250 is more easily cooled. The number of ribs 263 is not particularly limited.

In each of the above embodiments, an example in which the present invention is applied to a transmissive projector has been described, but the present invention can also be applied to a reflective projector. Here, "transmissive" means that a liquid crystal light valve including a liquid crystal panel or the like is a type that transmits light. “Reflective” means that the liquid crystal light valve is a type that reflects light.

Further, in each of the above-described embodiments, the projector 1 including the three liquid crystal light modulation devices 400R, 400G, and 400B is illustrated, but a projector that displays a color image with one liquid crystal light modulation device, and four or more liquid crystal lights. It is also possible to apply to a projector that displays a color image with a modulator. A digital mirror device (DMD) may be used as the light modulator. Further, the wavelength conversion element may be a wavelength conversion element using a quantum rod.

Further, the respective configurations described above can be appropriately combined within a range where they do not contradict each other.

DESCRIPTION OF SYMBOLS 1... Projector, 10... 1st light source (light source), 30, 130, 230... Wavelength conversion device, 40, 140... Disc (base material), 42... Phosphor layer (inorganic wavelength conversion element), 50, 150, 250... Motor (rotating device), 50b... Rotor (rotating part), 55... Rotor body (rotating part body), 56... Inner screw (fixing means, inner fixing means), 57... Thermosetting adhesive, 60... Spacer (Fixing part), 100... First illuminating device (illuminating device), 157... Outer screw (fixing means, outer fixing means), 400B, 400G, 400R... Liquid crystal light modulator (light modulator), 600... Projection optical system , J... Central axis (predetermined axis), T1, T2, T3, T4... Dimensions.

Claims (10)

A rotating device having a rotating portion that rotates around a predetermined axis,
A substrate that rotates around the predetermined axis by the rotating device and expands in the radial direction of the predetermined axis,
An inorganic wavelength conversion element adhered to the substrate via a thermosetting adhesive,
Fixing means for fixing the base material to the rotating part,
Equipped with
The rotating portion has a fixing portion that spreads in the radial direction and the base material is fixed by the fixing means,
The heat resistant temperature of the fixing means is higher than the curing temperature of the thermosetting adhesive,
The fixing means fixes the base material and the fixing portion in the predetermined axial direction ,
In the base material, a through hole that penetrates the base material in the predetermined axial direction is formed,
A hole is formed in the surface of the fixing portion to which the base material is fixed,
The fixing means fixes the base material to the fixing portion via the through hole and the hole,
The inorganic wavelength conversion element is a ring surrounding the predetermined axis,
The wavelength fixing device, wherein the fixing means includes an inner fixing means arranged radially inward of the inorganic wavelength conversion element . The hole is a screw hole,
The wavelength conversion device according to claim 1, wherein the fixing means is a screw tightened in the screw hole through the through hole. Before SL anchoring means includes an outer anchoring means are located radially outwardly of the inorganic wavelength converting element, the wavelength conversion device according to claim 1 or 2. A rotating device having a rotating portion that rotates around a predetermined axis,
A substrate that rotates around the predetermined axis by the rotating device and expands in the radial direction of the predetermined axis,
An inorganic wavelength conversion element adhered to the substrate via a thermosetting adhesive,
Fixing means for fixing the base material to the rotating part,
Equipped with
The rotating portion has a fixing portion that spreads in the radial direction and the base material is fixed by the fixing means,
The heat resistant temperature of the fixing means is higher than the curing temperature of the thermosetting adhesive,
The inorganic wavelength conversion element is a ring surrounding the predetermined axis,
The fixing means includes an outer fixing means arranged radially outside of the inorganic wavelength conversion element and an inner fixing means arranged radially inside of the inorganic wavelength conversion element. Wavelength converter. The rotating unit has a rotating unit body that rotates around the predetermined axis,
The wavelength conversion device according to any one of claims 1 to 4 , wherein the fixing portion is fixed to the base material by the fixing means on the outer side in the radial direction of the rotating portion main body. The rotating portion has a rotating portion main body provided with the fixing portion,
The wavelength fixing device according to claim 1, wherein the fixing portion is a member separate from the rotating portion main body. The wavelength conversion device according to claim 1, wherein a dimension of the fixing portion in the predetermined axial direction is larger than a dimension of the base material in the predetermined axial direction. A light source that emits light,
A wavelength conversion device according to any one of claims 1 to 7,
Equipped with
The light emitted from the light source is incident on the wavelength conversion device,
The wavelength conversion device wavelength-converts the incident light by the inorganic wavelength conversion element and emits the converted light to the same side as the incident side. A lighting device according to claim 8;
An optical modulator that forms image light by modulating illumination light from the illumination device according to image information,
A projection optical system for projecting the image light;
A projector comprising: A method for manufacturing a wavelength conversion device, comprising a rotating device having a rotating part rotating about a predetermined axis,
A first step of fixing the base material extending in the radial direction of the predetermined shaft and the fixing portion of the rotating portion by a fixing means;
A second step that is provided after the first step and that bonds the inorganic wavelength conversion element to the base material via an uncured thermosetting adhesive;
A third step of curing the uncured thermosetting adhesive by heating,
A method of manufacturing a wavelength conversion device, comprising:

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