TWI611996B - Substrate processing apparatus - Google Patents

Substrate processing apparatus Download PDF

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TWI611996B
TWI611996B TW102101597A TW102101597A TWI611996B TW I611996 B TWI611996 B TW I611996B TW 102101597 A TW102101597 A TW 102101597A TW 102101597 A TW102101597 A TW 102101597A TW I611996 B TWI611996 B TW I611996B
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substrate
photomask
rotating
rotation axis
mask
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TW102101597A
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Chinese (zh)
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TW201348106A (en
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鈴木智也
小宮山弘樹
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尼康股份有限公司
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/24Curved surfaces

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)

Abstract

本發明之基板處理裝置係將具有可撓性之長條基板(S)於藉由可旋轉之滾動體(30)之圓周面之一部分支撐之狀態下於長條方向上進行搬送,並且將形成於可旋轉之旋轉光罩之周面之圖案反覆轉印至基板之被處理面。該基板處理裝置具備:光罩保持部(MU1~MU5),其以旋轉光罩之外周面之關於轉印之部分與基板之被處理面以特定之間隔配置之方式相對於滾動體支撐旋轉光罩;及磁性齒輪傳遞系統(GD),其將滾動體及旋轉光罩之一者之旋轉力作為另一者之旋轉力以磁力傳遞。 The substrate processing apparatus of the present invention transports a long strip substrate (S) having flexibility in a long direction while being supported by a part of a circumferential surface of a rotatable rolling body (30), and will form The pattern on the peripheral surface of the rotatable rotating mask is repeatedly transferred to the processed surface of the substrate. The substrate processing apparatus includes a mask holding unit (MU1 to MU5) that supports the rotating light with respect to the rolling body in such a manner that a portion on the outer peripheral surface of the rotating mask is transferred with respect to the processed surface of the substrate at a specific interval A cover; and a magnetic gear transmission system (GD), which transmits the rotational force of one of the rolling body and the rotating photomask as the rotational force of the other by magnetic force.

Description

基板處理裝置 Substrate processing device

本發明係關於一種基板處理裝置。 The present invention relates to a substrate processing apparatus.

本申請案係基於2012年5月18日申請之美國專利臨時申請案第61/648,956號而主張優先權,並將其內容引用於此。 This application claims priority based on US Patent Provisional Application No. 61 / 648,956, filed on May 18, 2012, and the contents are incorporated herein by reference.

於液晶顯示元件等大畫面顯示元件中,於平面狀之玻璃基板上堆積ITO(Indium Tin Oxides,氧化銦錫)等透明電極或Si等半導體物質之後蒸鍍金屬材料,塗佈光阻劑而轉印電路圖案,於轉印後將光阻劑顯影,之後藉由進行蝕刻而形成電路圖案等。然而,伴隨顯示元件之大畫面化,而玻璃基板大型化,因此基板搬送亦變得困難。 In large-screen display elements such as liquid crystal display elements, a transparent electrode such as ITO (Indium Tin Oxides) or a semiconductor substance such as Si is deposited on a flat glass substrate, and then a metal material is vapor-deposited, and a photoresist is applied to the substrate. After the circuit pattern is printed, the photoresist is developed, and then a circuit pattern is formed by etching. However, with the enlargement of the display screen and the enlargement of the glass substrate, it is difficult to carry the substrate.

因此,提出有於具有可撓性之基板(例如,聚醯亞胺、PET(Polyethylene Terephthalate,聚對苯二甲酸乙二酯)、金屬箔等之膜構件等)上形成顯示元件之被稱作輥對輥(roll to roll)方式(以下,簡稱為「輥方式」)之技術(例如,參照專利文獻1)。 Therefore, it is proposed to form a display element on a flexible substrate (for example, a film member such as polyimide, PET (Polyethylene Terephthalate), metal foil, etc.), which is called A technology of a roll to roll method (hereinafter, simply referred to as a "roll method") (for example, refer to Patent Document 1).

又,專利文獻2中,提出有接近於可旋轉之圓筒狀之光罩之外周部而配置捲繞於進給輥而移行之可撓性之長條片材(基板),將光罩之圖案連續地曝光於基板之技術。 Further, Patent Document 2 proposes a flexible long sheet (substrate) which is arranged close to the outer periphery of a rotatable cylindrical mask and is wound around a feed roller and moves. A technique for continuously exposing a pattern to a substrate.

[先前技術文獻] [Prior technical literature] [專利文獻] [Patent Literature]

[專利文獻1]國際公開第2008/129819號 [Patent Document 1] International Publication No. 2008/129819

[專利文獻2]日本實開昭60-019037號公報 [Patent Document 2] Japanese Publication No. 60-019037

然而,如上所述之先前技術中存在如下之問題。 However, the prior art described above has the following problems.

作為使旋轉光罩之周速度與基板之進給速度(周速度)以特定之比率(例如1:1)同步移動之機構,例如考慮有使用齒輪傳遞旋轉力之方法,於此情形時,會產生起因於齒輪之嚙合之振動、磨耗等而難以高精度地保持速度之穩定性而使其同步驅動,甚至有對向基板轉印光罩之圖案時之精度(轉印忠實度)產生不良影響之可能性。 As a mechanism for synchronously moving the peripheral speed of the rotating photomask and the substrate feed speed (peripheral speed) at a specific ratio (for example, 1: 1), for example, a method using a gear to transmit a rotational force is considered. In this case, It is difficult to maintain the stability of the speed with high precision due to the vibration and abrasion of the gear meshing, so that it is driven synchronously, and it even adversely affects the accuracy (transfer fidelity) when transferring the pattern of the photomask to the substrate. Possibility.

例如,於在直徑30 cm之旋轉光罩之外周遍及全周長之90%左右形成應轉印之光罩圖案之情形時,光罩圖案之周方向之尺寸為約85 cm(30 cm×π×0.9)。若將旋轉光罩之圖案面(外周面)之周速度設為5 cm/秒,將應轉印之圖案之最少尺寸(線寬等)設為5μm,則光罩圖案整體之轉印時間大約為17秒(85/5),此期間之周速度之穩定性(等速性)變得重要。 For example, when a mask pattern to be transferred is formed on the periphery of a rotating mask with a diameter of 30 cm and about 90% of the entire circumference, the size of the mask pattern in the circumferential direction is about 85 cm (30 cm × π × 0.9). ). If the peripheral speed of the pattern surface (outer peripheral surface) of the rotating mask is set to 5 cm / sec, and the minimum size (line width, etc.) of the pattern to be transferred is set to 5 μm, the transfer time of the entire mask pattern is approximately At 17 seconds (85/5), the stability of the peripheral speed (constant velocity) during this period becomes important.

假如使周速度之絕對值平均變動0.05%,則每1秒產生2.5μm之進給誤差,若使此於轉印時間期間持續,則光罩圖案與基板之相對進給誤差最大約為43μm左右,此為於考慮考慮到最少圖案尺寸(5μm)之重疊曝光等之情形時無法容許者。 If the absolute value of the peripheral speed is changed by an average of 0.05%, a feed error of 2.5 μm will be generated every 1 second. If this is continued during the transfer time, the relative feed error of the mask pattern and the substrate will be about 43 μm at the maximum. This is an unacceptable situation when considering the case of overlapping exposures that take into account the minimum pattern size (5 μm).

又,於旋轉光罩之振動性之速度不均(速度不均勻性(wow and flutter))為±0.05%之情形時,由於可局部性地產生±2.5μm/秒之相對進給誤差,因此會使最少圖案尺寸(5μm)之轉印忠實度降低。 In addition, when the speed unevenness (wow and flutter) of the vibration of the rotating photomask is ± 0.05%, a relative feed error of ± 2.5 μm / sec can be locally generated, so It will reduce the transfer fidelity of the smallest pattern size (5 μm).

本發明之態樣之目的在於提供一種可使光罩與基板高精度地同步驅動之基板處理裝置。 An object of aspects of the present invention is to provide a substrate processing apparatus capable of driving a photomask and a substrate with high precision and synchronization.

根據本發明之一態樣,提供一種基板處理裝置,其係將具有可撓性之長條基板於藉由可旋轉之滾動體之圓周面之一部分支撐之狀態下 於長條方向上進行搬送,並且將形成於可旋轉之旋轉光罩之周面之圖案反覆轉印至基板之被處理面之基板處理裝置,其具備:光罩保持部,其以旋轉光罩之外周面之與轉印有關之部分與基板之被處理面以特定之間隔配置之方式相對於滾動體支撐旋轉光罩;及磁性齒輪傳遞系統,其將滾動體及旋轉光罩之一者之旋轉力作為另一者之旋轉力以磁力傳遞。 According to an aspect of the present invention, there is provided a substrate processing apparatus in which a long substrate having flexibility is supported by a part of a circumferential surface of a rotatable rolling body A substrate processing apparatus that transfers a pattern in a long direction and transfers a pattern formed on a peripheral surface of a rotatable rotating photomask to a processed surface of a substrate repeatedly. The substrate processing device includes a photomask holding section for rotating the photomask. The portion of the outer peripheral surface that is related to the transfer and the processed surface of the substrate are arranged at a specific interval from the rolling body to support the rotating photomask; and a magnetic gear transmission system that separates one of the rolling body and the rotating photomask. Rotating force is transmitted as magnetic force of the other by magnetic force.

根據本發明之另一態樣,提供一種基板處理裝置,其具有:基板搬送機構,其將具有可撓性之長條基板於藉由可旋轉之滾動體之圓周面之一部分支撐之狀態下於長條方向上進行搬送;光罩保持機構,其具有以特定半徑彎曲成圓筒狀之光罩圖案,且保持可繞圓筒之軸旋轉之旋轉光罩;轉印機構,其具有對形成於旋轉光罩之光罩圖案之一部分照射照明光之照明系統,且將光罩圖案之一部分轉印至基板之被處理面;及磁性齒輪傳遞系統,其將滾動體及旋轉光罩之一者之旋轉力作為另一者之旋轉力以磁力傳遞。 According to another aspect of the present invention, there is provided a substrate processing apparatus having a substrate transfer mechanism that supports a flexible long substrate in a state of being supported by a part of a circumferential surface of a rotatable rolling body at Conveying in a long direction; a mask holding mechanism having a mask pattern bent into a cylindrical shape with a specific radius and holding a rotating mask rotatable around a cylinder axis; a transfer mechanism having a pair of An illumination system that illuminates part of the mask pattern of the rotating photomask, and transfers part of the photomask pattern to the processed surface of the substrate; and a magnetic gear transmission system that transfers one of the rolling body and the rotating photomask. Rotating force is transmitted as magnetic force of the other by magnetic force.

本發明之態樣中,光罩與基板可高精度地同步驅動,可將光罩之圖案高精度地轉印至基板。 In one aspect of the present invention, the photomask and the substrate can be synchronously driven with high accuracy, and the pattern of the photomask can be transferred to the substrate with high accuracy.

20‧‧‧旋轉光罩 20‧‧‧Rotating Photomask

22‧‧‧氣墊(氣體供給部) 22‧‧‧Air cushion (gas supply department)

30‧‧‧旋轉筒(滾動體) 30‧‧‧rotating cylinder (rolling body)

40‧‧‧傳遞解放部 40‧‧‧ Pass the Ministry of Liberation

100‧‧‧基板處理裝置 100‧‧‧ substrate processing equipment

AX1A、AX1B‧‧‧旋轉軸線(第1旋轉軸) AX1A, AX1B‧‧‧‧Axis of rotation (1st rotation axis)

AX2‧‧‧旋轉軸線(第2旋轉軸) AX2‧‧‧rotation axis (second rotation axis)

MU、MU1~MU5‧‧‧光罩單元(光罩保持部) MU, MU1 ~ MU5‧‧‧ Mask unit (mask holding unit)

GD‧‧‧磁性齒輪傳遞機構 GD‧‧‧ Magnetic Gear Transmission

SU‧‧‧基板保持單元 SU‧‧‧ substrate holding unit

M‧‧‧光罩 M‧‧‧Photomask

S、P‧‧‧基板 S, P‧‧‧ substrate

圖1係本實施形態之基板處理裝置之概略性之外觀立體圖。 FIG. 1 is a schematic external perspective view of a substrate processing apparatus according to this embodiment.

圖2係基板處理裝置中之光罩單元之概略性之外觀立體圖。 FIG. 2 is a schematic external perspective view of a mask unit in a substrate processing apparatus.

圖3係以包含旋轉軸線之平面將光罩單元切斷的剖面圖。 3 is a cross-sectional view of the photomask unit cut along a plane including a rotation axis.

圖4係將圖3中之A部放大之圖。 FIG. 4 is an enlarged view of part A in FIG. 3.

圖5係表示設置於控制旋轉光罩之旋轉之驅動控制部內之伺服系統的圖。 FIG. 5 is a diagram showing a servo system provided in a drive control section that controls the rotation of the rotary photomask.

圖6係旋轉光罩之展開圖。 Fig. 6 is a development view of a rotating photomask.

圖7係捲繞於旋轉筒之基板的展開圖。 Fig. 7 is a development view of a substrate wound around a rotating drum.

圖8係說明磁性齒輪部之動作的圖。 FIG. 8 is a diagram illustrating the operation of the magnetic gear unit.

圖9係第2實施形態之基板處理裝置之概略性之外觀立體圖。 FIG. 9 is a schematic external perspective view of a substrate processing apparatus according to a second embodiment.

圖10係固定板及光罩單元的部分放大圖。 Fig. 10 is an enlarged view of a part of the fixing plate and the mask unit.

圖11係以包含旋轉軸線AX1B及旋轉軸線AX2之平面剖切光罩單元的圖。 11 is a view in which the mask unit is cut in a plane including a rotation axis AX1B and a rotation axis AX2.

圖12第3實施形態之磁性齒輪傳遞機構的概略構成圖。 Fig. 12 is a schematic configuration diagram of a magnetic gear transmission mechanism according to a third embodiment.

圖13第3實施形態之磁性齒輪傳遞機構的概略構成圖。 Fig. 13 is a schematic configuration diagram of a magnetic gear transmission mechanism according to a third embodiment.

圖14係表示器件製造系統之構成的圖。 FIG. 14 is a diagram showing a configuration of a device manufacturing system.

圖15係表示磁性齒輪傳遞機構之其他形態的圖。 Fig. 15 is a view showing another form of the magnetic gear transmission mechanism.

圖16係表示利用圖15之磁性齒輪傳遞機構之基板處理裝置之其他形態的圖。 FIG. 16 is a diagram showing another embodiment of a substrate processing apparatus using the magnetic gear transmission mechanism of FIG. 15.

以下,參照圖1至圖14說明本發明之基板處理裝置之實施形態。 Hereinafter, an embodiment of a substrate processing apparatus according to the present invention will be described with reference to FIGS. 1 to 14.

(第1實施形態) (First Embodiment)

第1實施形態中,對複數個光罩之圖案於基板上重疊而轉印之情形進行說明。 In the first embodiment, a case where a plurality of photomask patterns are superimposed on a substrate and transferred is described.

圖1係第1實施形態之基板處理裝置100之概略性之外觀立體圖,圖2係基板處理裝置100中之光罩單元MU之概略性之外觀立體圖,圖3係以包含旋轉軸線AX1A(AX1B)(第1旋轉軸)之平面將光罩單元MU切斷的剖面圖,圖4係將圖3中之A部放大的圖。 FIG. 1 is a schematic external perspective view of the substrate processing apparatus 100 of the first embodiment, FIG. 2 is a schematic external perspective view of the mask unit MU in the substrate processing apparatus 100, and FIG. 3 is a view including a rotation axis AX1A (AX1B) (First rotation axis) A cross-sectional view of the photomask unit MU cut by a plane, and FIG. 4 is an enlarged view of part A in FIG. 3.

基板處理裝置100係將以特定半徑彎曲成圓筒面狀之光罩M之圖案對具有可撓性之帶狀(長條)基板(例如,帶狀之膜構件)S進行曝光處理者,其係以照明部10(圖1中未圖示,參照圖3)、光罩單元MU1 ~MU5、基板保持單元SU、磁性齒輪傳遞機構GD、控制部(未圖示)為主體構成。再者,以下說明中,關於光罩單元MU1~MU5,適當地總稱為光罩單元MU。 The substrate processing apparatus 100 is a person who exposes a pattern of a mask M that is curved into a cylindrical shape with a specific radius to a flexible strip-shaped (long) substrate (for example, a strip-shaped film member) S. The lighting unit 10 (not shown in FIG. 1, see FIG. 3) and the mask unit MU1 MU5, the substrate holding unit SU, the magnetic gear transmission mechanism GD, and a control unit (not shown) are mainly constituted. In the following description, the mask units MU1 to MU5 are collectively referred to as a mask unit MU as appropriate.

再者,本實施形態中,將鉛垂方向設為Z方向,將光罩單元MU1~MU5之旋轉軸線AX1A、AX1B、及與基板保持單元SU之旋轉軸線AX2平行之方向設為Y方向,將正交於Z方向及Y方向之方向設為X方向而進行說明。 In this embodiment, the vertical direction is set to the Z direction, and the rotation axes AX1A and AX1B of the mask units MU1 to MU5 and the direction parallel to the rotation axis AX2 of the substrate holding unit SU are set to the Y direction. The direction orthogonal to the Z direction and the Y direction will be described as the X direction.

照明部10係向光罩單元MU中之旋轉光罩20之照明區域照射照明光者,使用與螢光燈同樣地以直管型放射狀地發出曝光用之照明光者、或自圓筒狀之石英棒之兩端導入照明光且於背面側設置有擴散構件者、或於Y方向上排列有複數個發出波長為400 nm以下之紫外線區域之光之LED等者,收容於支撐旋轉光罩20之內筒21之內部空間。 The illuminating section 10 is a person who irradiates the illumination light to the illumination area of the rotating reticle 20 in the mask unit MU, and uses a straight tube type to radiate the illumination light for exposure in the same manner as a fluorescent lamp, or a cylindrical shape. Both sides of the quartz rod are led with illumination light and a diffusing member is provided on the back side, or LEDs arranged in the Y direction with a plurality of LEDs emitting light in the ultraviolet region with a wavelength of 400 nm or less are housed in a supporting rotating mask The inner space of the inner cylinder 21 of 20.

作為照明光之光源,例如使用自燈光源射出之明線(g線、h線、i線)、KrF準分子雷射光(波長248 nm)等遠紫外光(DUV(Deep Ultraviolet)光)、ArF準分子雷射光(波長193 nm)、半導體雷射或LED等固體光源。 As the light source of the illumination light, for example, bright ultraviolet rays (g-line, h-line, i-line), KrF excimer laser light (wavelength 248 nm), and far-ultraviolet light (DUV (Deep Ultraviolet) light), such as ArF, are used. Solid-state light sources such as excimer laser light (wavelength 193 nm), semiconductor lasers, or LEDs.

光罩單元MU1~MU5中,光罩單元MU1~MU3係沿旋轉軸線AX1A依序排列。光罩單元MU1~MU5中,光罩單元MU4~MU5係沿旋轉軸線AX1B依序排列。又,光罩單元MU4關於Y方向配置於光罩單元MU1、MU2之中間位置,光罩單元MU5關於Y方向配置於光罩單元MU2、MU3之中間位置。 Among the mask units MU1 to MU5, the mask units MU1 to MU3 are sequentially arranged along the rotation axis AX1A. Among the mask units MU1 to MU5, the mask units MU4 to MU5 are sequentially arranged along the rotation axis AX1B. Moreover, the mask unit MU4 is arrange | positioned in the middle position of the mask units MU1, MU2 with respect to the Y direction, and the mask unit MU5 is arrange | positioned in the middle position with respect to the Y direction in the mask units MU2, MU3.

旋轉軸線AX1A、AX1B係於繞旋轉軸線AX2方向上間隔固定之角度間隔例如90°而配置。 The rotation axes AX1A and AX1B are arranged at fixed angular intervals around the rotation axis AX2 in the direction of, for example, 90 °.

各光罩單元MU1~MU5如圖2及圖3所示般,具備旋轉光罩20、內筒21、氣墊(光罩保持部)22、固持器23、驅動部MT、凸緣部25。於圓筒狀之旋轉光罩20之兩端部,緊固有圓環狀之固持器23,以一體 化之狀態設置。於該旋轉光罩20與固持器23之內側,於旋轉軸線AX1A(或AX1B)方向上,插入有圓筒狀之內筒21。 Each of the mask units MU1 to MU5 includes, as shown in FIGS. 2 and 3, a rotary mask 20, an inner tube 21, an air cushion (mask holding portion) 22, a holder 23, a driving portion MT, and a flange portion 25. To both ends of the cylindrical rotating reticle 20, a ring-shaped holder 23 is fastened to form an integrated body. The status setting. A cylindrical inner tube 21 is inserted inside the rotating photomask 20 and the holder 23 in the direction of the rotation axis AX1A (or AX1B).

旋轉光罩20由可透過照明光之圓筒狀之石英等形成,於其外周面(周面)20a形成有特定之圖案。又,藉由設置於與旋轉光罩20之內周面對向之內筒21之外周位置之作為流體軸承之氣墊22(氣體供給部,於下文詳細敍述),旋轉光罩20相對於內筒21於旋轉軸線AX1A(或AX1B)方向及繞旋轉軸線AX1A(或AX1B)方向上以非接觸(或低摩擦狀態)移動自由地被支撐。 The rotary photomask 20 is formed of a cylindrical quartz or the like that can transmit illumination light, and a specific pattern is formed on the outer peripheral surface (peripheral surface) 20a thereof. In addition, the rotary reticle 20 is opposed to the inner tube by an air cushion 22 (a gas supply unit, which will be described in detail below) as a fluid bearing provided at an outer peripheral position of the inner tube 21 facing the inner peripheral surface of the rotary photomask 20. 21 is supported freely in a non-contact (or low friction state) direction in the direction of the rotation axis AX1A (or AX1B) and in the direction about the rotation axis AX1A (or AX1B).

固持器23係由金屬材料形成為圓環狀,如圖4所示般,夾持而支撐旋轉光罩20之Y方向之端部外周面及內周面。 The holder 23 is formed in a circular shape from a metal material, and as shown in FIG. 4, the outer peripheral surface and the inner peripheral surface of the end portion in the Y direction of the rotary mask 20 are clamped and supported.

內筒21設置於未圖示之基底部(曝光裝置之主體構造體),於旋轉軸線AX1A(或AX1B)方向之兩端部經由空氣軸承26旋轉自由地支撐上述凸緣部25。 The inner tube 21 is provided on a base portion (the main structure of the exposure device) (not shown), and both ends of the rotation axis AX1A (or AX1B) direction are rotatably supported by the flange portion 25 via air bearings 26.

設置於凸緣部25之外周面之多孔質材料之氣墊AP係以旋轉光罩20之外周面20a之圖案區域與圖1所示之基板S之被處理面以特定之間隔配置之方式,相對於捲繞於旋轉筒30之基板S支撐旋轉光罩20與內筒21者。由於環狀之氣墊AP係由將作為氣體之空氣供給(噴出)至其外周面與基板S之間之多孔質墊形成,因此可不與基板S之表面接觸而支撐內筒21與旋轉光罩20。 The air cushion AP of a porous material provided on the outer peripheral surface of the flange portion 25 is arranged such that the pattern area of the outer peripheral surface 20 a of the rotary mask 20 and the processed surface of the substrate S shown in FIG. 1 are arranged at a specific interval. The substrate S wound around the rotating tube 30 supports the rotating photomask 20 and the inner tube 21. The ring-shaped air cushion AP is formed of a porous cushion that supplies (sprays) air as a gas between the outer peripheral surface and the substrate S, and thus can support the inner tube 21 and the rotating photomask 20 without contacting the surface of the substrate S. .

該多孔質氣墊AP係於設置於內筒21之旋轉軸線AX1A(或AX1B)方向之兩側部分之凸緣部25之各外周面上遍及繞旋轉軸線AX1A(或AX1B)方向之全周或於繞旋轉軸線AX1A(或AX1B)方向上間隔特定之間隔而設置。 The porous air cushion AP is located on each outer peripheral surface of the flange portion 25 provided on both sides of the rotation axis AX1A (or AX1B) direction of the inner cylinder 21 over the entire circumference of the rotation axis AX1A (or AX1B) direction. It is provided around the rotation axis AX1A (or AX1B) in a certain interval.

驅動部MT係經由固持器23於旋轉軸線AX1A(或AX1B)之延長方向(軸方向、Y方向)、及繞旋轉軸線AX1A(或AX1B)方向之各 個方向上給予推力而驅動旋轉光罩20者,於旋轉光罩20之旋轉軸線AX1A(或AX1B)方向之兩側設置一對。 The driving unit MT is each extended in the direction of rotation axis AX1A (or AX1B) (axis direction, Y direction) and the direction around the rotation axis AX1A (or AX1B) via the holder 23. A person who applies a thrust force in each direction to drive the rotary reticle 20 is provided with a pair on both sides of the rotation axis 20 in the direction of the rotation axis AX1A (or AX1B).

各驅動部MT係由對於旋轉軸線AX1A(或AX1B)之延長方向(軸方向)及繞旋轉軸線AX1A(或AX1B)方向之2軸方向獨立地賦予推力之例如音圈型之馬達而構成,具備發磁體(永久磁石)MG與線圈體CU。 Each drive unit MT is configured by, for example, a voice coil type motor that independently applies thrust to the two-axis directions of the extension direction (axial direction) of the rotation axis AX1A (or AX1B) and the rotation axis AX1A (or AX1B). Magnet (permanent magnet) MG and coil body CU.

再者,關於旋轉軸線AX1A(或AX1B)之延長方向(軸方向)之推力,只要一對驅動部MT中僅一者可賦予即可。 It should be noted that the thrust in the extension direction (axial direction) of the rotation axis AX1A (or AX1B) may be provided by only one of the pair of driving portions MT.

發磁體MG於固持器23之Y方向之外側之面遍及繞旋轉軸線AX1A(或AX1B)方向之全周且於旋轉軸線AX1A(AX1B)方向突出而設置。線圈體CU以相對於內筒21之外周面保持有間隙之狀態藉由環狀之連結部24一體化地固定於凸緣部25,具有關於以旋轉軸線AX1A(AX1B)為中心之徑方向插入發磁體MG之

Figure TWI611996BD00001
字狀之剖面形狀。 The surface of the magnet MG on the outer side of the holder 23 in the Y direction extends over the entire circumference around the rotation axis AX1A (or AX1B) direction and protrudes in the rotation axis AX1A (AX1B) direction. The coil body CU is integrally fixed to the flange portion 25 by a ring-shaped connecting portion 24 while maintaining a gap with respect to the outer peripheral surface of the inner cylinder 21, and has a radial direction centering on the rotation axis AX1A (AX1B). Hair magnet MG
Figure TWI611996BD00001
Z-shaped cross-sectional shape.

於圖2所示之環狀之連結部24之內部,如圖4詳細地所示般,構成磁性齒輪傳遞機構GD之一個磁性齒輪部GM1之磁石列於周方向上以固定間距配置。對線圈體CU之通電係藉由驅動控制部DC而控制。再者,線圈體CU不一定需要遍及全周而設置,亦可為於周方向上隔開特定間隔而設置複數個之構成(例如,以120°間隔設置3處之構成)。 Inside the ring-shaped connecting portion 24 shown in FIG. 2, as shown in detail in FIG. 4, magnets forming one magnetic gear portion GM1 of the magnetic gear transmission mechanism GD are arranged at a fixed pitch in the circumferential direction. The energization of the coil body CU is controlled by the drive control unit DC. In addition, the coil body CU does not necessarily need to be provided throughout the entire circumference, and a plurality of coil bodies CU may be provided at a specific interval in the circumferential direction (for example, a structure in which three locations are provided at 120 ° intervals).

又,線圈體CU係由如下構成:旋轉推力用之線圈群,其用於給予凸緣部25(連結部24)與旋轉光罩20(及固持器23)之間繞旋轉軸線AX1A(或AX1B)方向之推力(旋轉扭矩);及並進推力用之線圈群,其給予旋轉軸線AX1A之延長方向(軸方向、Y方向)之直線驅動力,藉由驅動控制部DC個別地調整各線圈群中通電之電流之大小,藉此可獨立地控制旋轉推力與並進推力。 The coil body CU is composed of a coil group for rotary thrust, which is provided between the flange portion 25 (connecting portion 24) and the rotating mask 20 (and the holder 23) about the rotation axis AX1A (or AX1B). ) Direction thrust (rotational torque); and coil groups for simultaneous thrust, which give a linear driving force to the extension direction (axis direction, Y direction) of the rotation axis AX1A, and each coil group is individually adjusted by the drive control section DC The magnitude of the current that is energized can independently control the rotary thrust and the parallel thrust.

於如以上之光罩單元MU之構成中,內筒21相對於曝光裝置本體固定地設置,凸緣部25(連結部24)與旋轉光罩20均相對於內筒 21以旋轉軸線AX1A(AX1B)為中心以非接觸(低摩擦)狀態旋轉自由地被支撐。 In the configuration of the photomask unit MU as described above, the inner tube 21 is fixedly disposed with respect to the exposure device body, and the flange portion 25 (connecting portion 24) and the rotating photomask 20 are both opposed to the inner tube. 21 is freely supported in a non-contact (low friction) state around the rotation axis AX1A (AX1B).

又,凸緣部25以相對於內筒21於旋轉軸線AX1A(AX1B)之延長方向(軸方向、Y方向)上紋絲不動之方式藉由軸承26拘束。因此,藉由驅動部MT之並進推力,旋轉光罩20於兩側之凸緣部25之間,於旋轉軸線AX1A(AX1B)之延長方向(軸方向、Y方向)上微動。 In addition, the flange portion 25 is restrained by the bearing 26 so as not to move in the extending direction (axial direction, Y direction) of the rotation axis AX1A (AX1B) with respect to the inner cylinder 21. Therefore, by the simultaneous thrust of the driving portion MT, the rotary mask 20 moves slightly between the flange portions 25 on both sides in the extension direction (axial direction, Y direction) of the rotation axis AX1A (AX1B).

進而,藉由經由沿環狀之連結部24之外周面所設置之磁性齒輪部GM1自外部所賦予之旋轉扭矩,而凸緣部25(及線圈體CU)以特定之旋轉速度繞內筒21滾動(旋轉)。 Furthermore, the flange portion 25 (and the coil body CU) is wound around the inner cylinder 21 at a specific rotation speed by a rotational torque imparted from the outside via a magnetic gear portion GM1 provided along the outer peripheral surface of the annular connection portion 24. Scroll (rotate).

此時,若同時對線圈體CU中之旋轉推力用之線圈群供給特定之電流,則旋轉光罩20亦以與凸緣部25(連結部24)同步(步調一致)之速度旋轉。 At this time, if a specific current is simultaneously supplied to the coil group for the rotary thrust in the coil body CU, the rotary reticle 20 also rotates at a speed synchronized with the flange portion 25 (the connection portion 24) (with the same pace).

藉由驅動控制部DC伺服控制該旋轉推力用之線圈群中流通之電流之大小與方向,可相對於經由磁性齒輪傳遞機構GD而旋動(旋轉)之凸緣部25(及連結部24與線圈體CU)給予旋轉光罩20之旋轉速度差異,或使相對旋轉之方向變相反,或將旋轉光罩20維持為靜止狀態。 The magnitude and direction of the current flowing in the coil group for the rotary thrust are controlled by the drive control unit DC servo. The flange portion 25 (and the connecting portion 24 and the flange portion 25) can be rotated (rotated) through the magnetic gear transmission mechanism GD. The coil body CU) gives the rotational speed difference of the rotating photomask 20, or reverses the direction of relative rotation, or maintains the rotating photomask 20 in a stationary state.

為了進行此種伺服控制,本實施形態中,設置如圖5所示之伺服系統。圖5係於YZ面內觀察圖4之部分切斷面的圖,為進行伺服控制,於旋轉光罩20之外周面遍及全周形成編碼器測量用之光柵刻度GS2,為了讀取該光柵刻度GS2,設置編碼器頭EH2,該編碼器頭EH2係設置於曝光裝置本體。 In order to perform such servo control, in this embodiment, a servo system as shown in FIG. 5 is provided. FIG. 5 is a view of a part of the cut surface of FIG. 4 viewed in the YZ plane. For servo control, a grating scale GS2 for encoder measurement is formed on the outer periphery of the rotary mask 20 over the entire circumference. In order to read the grating scale, GS2, the encoder head EH2 is set, and the encoder head EH2 is set on the exposure device body.

於驅動控制部DC內,設置有如下:計數電路201,其輸入來自編碼器頭EH2之雙相信號而逐次測量旋轉光罩20(光柵刻度GS2)之旋轉角度位置;運算電路202,其輸入來自計數電路201之測量值,於旋轉光罩20之旋轉速度與基於指令資訊200之旋轉速度指令值之差分自特定值(記憶部REF中所保持之基準值)產生變化之情形時,製造出其偏差信號;驅動電 路203,其將該偏差信號作為驅動信號給予線圈體CU內之旋轉推力用之線圈群;及驅動電路204,其給予線圈體CU內之並進推力用之線圈群驅動信號。 In the drive control section DC, the following are provided: a counting circuit 201 that inputs a two-phase signal from the encoder head EH2 and successively measures the rotation angle position of the rotary reticle 20 (grating scale GS2); an arithmetic circuit 202 whose input comes from The measurement value of the counting circuit 201 is manufactured when the difference between the rotation speed of the rotary mask 20 and the rotation speed command value based on the command information 200 changes from a specific value (the reference value held in the memory section REF). Deviation signal Circuit 203, which uses the deviation signal as a drive signal to the coil group for rotary thrust in the coil body CU; and drive circuit 204, which gives the coil group drive signal for the parallel thrust in the coil body CU.

圖5之伺服系統中,於凸緣部25(連結部24)經由磁性齒輪傳遞機構GD以固定之旋轉速度旋轉之情形時,能夠以其為基準使旋轉光罩20同步旋轉。但是,此處之所謂同步旋轉不一定限定於以相同速度旋轉之情況,亦包括凸緣部25之旋轉速度與旋轉光罩20之旋轉速度維持特定之比率之情形。 In the servo system of FIG. 5, when the flange portion 25 (the connecting portion 24) is rotated at a fixed rotation speed via the magnetic gear transmission mechanism GD, the rotating reticle 20 can be synchronously rotated based on this. However, the so-called synchronous rotation is not necessarily limited to the case where the rotation is performed at the same speed, and also includes the case where the rotation speed of the flange portion 25 and the rotation speed of the rotary mask 20 maintain a specific ratio.

又,於圖5之伺服系統中,曝光時重要的是旋轉光罩20之光罩圖案面(外周面20a)之周速度,於該周速度相對於預先規定之基準速度產生偏差時,亦可藉由驅動電路203給予線圈體CU內之旋轉推力用之線圈群驅動信號。 In the servo system of FIG. 5, it is important that the peripheral speed of the mask pattern surface (outer peripheral surface 20 a) of the rotary mask 20 is exposed during exposure. If the peripheral speed deviates from a predetermined reference speed, it may be used. The driving circuit 203 gives a coil group driving signal for the rotational thrust in the coil body CU.

若以此方式處理,則即便凸緣部25之旋轉速度與設定速度不同,或產生速度不均,亦可與此種誤差要因無關而使旋轉光罩20以固定速度穩定地旋轉。進而,無論凸緣部25之旋轉速度如何,均可使旋轉光罩20以所設定之任意之速度旋轉或靜止。 If handled in this way, even if the rotation speed of the flange portion 25 is different from the set speed, or speed unevenness occurs, the rotary mask 20 can be stably rotated at a fixed speed regardless of such an error. Furthermore, regardless of the rotation speed of the flange portion 25, the rotating photomask 20 can be rotated or stopped at an arbitrary set speed.

再者,若將光柵刻度GS2設為2維光柵,亦使編碼器頭EH2成為可測量Y方向(旋轉軸線AX1A、AX1B之延長方向(軸方向))之位移者,則能夠以曝光裝置本體(編碼器頭EH2)為基準高精度地測量旋轉光罩20之Y方向之位置位移,可簡單地構成經由驅動電路204給予線圈體CU內之並進推力用之線圈群驅動信號之伺服系統。 Furthermore, if the grating scale GS2 is set to a two-dimensional grating, the encoder head EH2 can also be used to measure the displacement in the Y direction (the extension directions (axial directions) of the rotation axes AX1A and AX1B), and the exposure device body ( The encoder head EH2) measures the position displacement in the Y direction of the rotary reticle 20 with high accuracy as a reference, and can simply constitute a servo system that provides a coil group drive signal to the parallel thrust in the coil body CU via the drive circuit 204.

另一方面,基板保持單元SU如圖1所示般具備旋轉筒(滾動體)30。 On the other hand, as shown in FIG. 1, the substrate holding unit SU includes a rotating cylinder (rolling body) 30.

旋轉筒30與Y軸平行,形成為繞設置於旋轉軸線AX1B之-Z側且旋轉軸線AX1A之+X側之旋轉軸線AX2旋轉之圓柱狀。使旋轉筒30之外周面 成為接觸保持基板S之基板保持面31。於旋轉筒30之Y方向兩端面,設置有直徑小於旋轉筒30且以同軸突出之突出部32。 The rotating cylinder 30 is parallel to the Y axis and is formed into a cylindrical shape that rotates around a rotation axis AX2 provided on the −Z side of the rotation axis AX1B and on the + X side of the rotation axis AX1A. Make the outer peripheral surface of the rotating cylinder 30 It becomes the substrate holding surface 31 of the contact holding substrate S. On the two ends of the rotating cylinder 30 in the Y direction, protruding portions 32 having a diameter smaller than that of the rotating cylinder 30 and protruding coaxially are provided.

又,本實施形態中,如圖1所示般,設置有旋轉驅動旋轉筒30之驅動裝置33。驅動裝置33係藉由上述驅動控制部DC而控制。 In this embodiment, as shown in FIG. 1, a driving device 33 for rotationally driving the rotary cylinder 30 is provided. The drive device 33 is controlled by the drive control unit DC.

圖6係旋轉光罩20的展開圖。圖6中之符號Xs表示旋轉光罩20之移動方向(旋轉方向)。 FIG. 6 is a development view of the rotary photomask 20. A symbol Xs in FIG. 6 indicates a moving direction (rotating direction) of the rotary mask 20.

如圖6(a)所示般,光罩單元MU1~MU3中之照明部10關於Y方向具備照明遍及旋轉光罩20之圖案區域MA之範圍之照明區域IR1。同樣地,如圖6(b)所示般,光罩單元MU4~MU5中之照明部10關於Y方向具備照明遍及旋轉光罩20之圖案形成區域MA之範圍之照明區域IR2。 As shown in FIG. 6 (a), the illumination unit 10 in the mask units MU1 to MU3 is provided with an illumination region IR1 in the Y direction that illuminates the range of the pattern region MA of the rotary mask 20. Similarly, as shown in FIG. 6 (b), the illumination unit 10 in the mask units MU4 to MU5 includes an illumination region IR2 in the Y direction that illuminates the pattern formation region MA of the rotary mask 20.

各照明區域IR1、IR2於Y方向之兩端部形成為具備三角部之梯形狀。照明區域IR1、IR2中,上述三角部之方向(即,一對平行線之中短邊之位置)關於X方向相互逆向地形成。 Each of the illumination regions IR1 and IR2 is formed in a ladder shape having triangular portions at both ends in the Y direction. In the illumination areas IR1 and IR2, the directions of the above-mentioned triangular portions (that is, the positions of the short sides among a pair of parallel lines) are formed opposite to each other with respect to the X direction.

於本實施形態中,旋轉光罩20之圖案形成區域MA伴隨光罩保持部22之旋轉而於符號Xs之方向上移動,通過照明區域IR1(照明區域IR2)。圖7係捲繞於旋轉筒30之基板S的展開圖。圖7中之符號Xs表示旋轉筒30之移動方向(旋轉方向)。 In this embodiment, the pattern forming area MA of the rotary mask 20 moves in the direction of the symbol Xs with the rotation of the mask holding portion 22 and passes through the illumination area IR1 (illumination area IR2). FIG. 7 is a developed view of the substrate S wound around the rotating drum 30. A symbol Xs in FIG. 7 indicates a moving direction (rotating direction) of the rotary cylinder 30.

如圖7所示般,光罩單元MU1~MU5中,藉由透過旋轉光罩20之來自圖案之照明光(曝光光)所照明之轉印區域PA1~PA5係以關於Y方向相鄰之區域與端部(梯形之三角部分)重疊之方式交錯狀地配置。 As shown in FIG. 7, in the mask units MU1 to MU5, the transfer areas PA1 to PA5 illuminated by the illumination light (exposure light) from the pattern that passes through the rotating mask 20 are adjacent to each other in the Y direction. It is arranged in a staggered manner so as to overlap the end portion (the triangular portion of the trapezoid).

因此,例如,藉由旋轉筒30之旋轉而通過轉印區域PA1之基板S上之區域與藉由旋轉筒30之旋轉而通過轉印區域PA2之基板S上之區域一部分重複。轉印區域PA1與轉印區域PA2以於周方向上重複之區域中之曝光量與不重複之區域之曝光量實質性相同之方式設定各自之形狀等。 Therefore, for example, a region on the substrate S that passes through the transfer area PA1 by the rotation of the rotary drum 30 and a region on the substrate S that passes through the transfer area PA2 by the rotation of the rotary drum 30 overlap. The transfer area PA1 and the transfer area PA2 have their respective shapes and the like set such that the exposure amount in a region overlapping in the circumferential direction is substantially the same as the exposure amount in a region not overlapping.

磁性齒輪傳遞機構GD係將旋轉筒30之旋轉力作為旋轉光 罩20(連結部24)之旋轉力以非接觸(使用磁力)傳遞者,其具備帶式驅動機構VD、磁性齒輪部GM1、GM2。如圖1所示般,帶式驅動機構VD成為於旋轉筒30之突出部32及滑輪PL1、PL2上張設有(以具有張力之狀態設置)傳送帶VL之構成。 The magnetic gear transmission mechanism GD uses the rotating force of the rotating cylinder 30 as the rotating light The rotation force of the cover 20 (connection portion 24) is transmitted non-contactly (using magnetic force), and includes a belt drive mechanism VD, and magnetic gear portions GM1 and GM2. As shown in FIG. 1, the belt drive mechanism VD has a configuration in which a belt VL is provided (provided in a state of tension) on the protrusions 32 and the pulleys PL1 and PL2 of the rotating cylinder 30.

滑輪PL1於光罩單元MU1~MU3之-X側,一體化地設置於沿Y方向且繞軸旋轉自由地配置之軸ST1之-Y側之端部。滑輪PL2於光罩單元MU4~MU5之-X側,一體化地設置於沿Y方向且繞軸旋轉自由地配置之軸ST2之-Y側之端部。 The pulley PL1 is integrally provided on the -X side of the mask units MU1 to MU3 at an end portion of the -Y side of the shaft ST1 that is freely arranged in the Y direction and rotates about the axis. The pulley PL2 is integrally provided at an end portion on the -Y side of the shaft ST2 that is arranged freely in the Y direction and pivots about the axis, on the -X side of the mask units MU4 to MU5.

軸ST1中,如圖2所示般,於與環狀之連結部24之磁性齒輪部GM1對向之位置,圓板狀之磁性齒輪部GM2與磁性齒輪部GM1隔開間隙而配置。 In the shaft ST1, as shown in FIG. 2, the disk-shaped magnetic gear portion GM2 and the magnetic gear portion GM1 are arranged at a position opposed to the magnetic gear portion GM1 of the annular connection portion 24.

磁性齒輪部GM2於外周部如圖8所示般,具備S極S2與N極N2繞軸ST1(軸ST2)交替地以特定間距、特定周長配置有複數個(圖8中各為2個)之磁性圖案(永久磁石)。磁性齒輪部GM1具備S極S1與N極N1繞旋轉軸線AX1A(旋轉軸線AX1B)交替地於周面中以與磁性齒輪部GM2相同間距、相同周長配置複數個(圖8中各為8個)之磁性圖案(永久磁石)。 As shown in FIG. 8, the magnetic gear portion GM2 includes S poles S2 and N poles N2 alternately around the shaft ST1 (shaft ST2) at a predetermined pitch and a predetermined circumference (two in FIG. 8 each). ) 'S magnetic pattern (permanent magnet). The magnetic gear section GM1 includes S poles S1 and N poles N1 alternately around the rotation axis AX1A (rotation axis AX1B) on the peripheral surface, and a plurality of them are arranged at the same pitch and the same circumference as the magnetic gear section GM2 (eight of each in FIG. 8 ) 'S magnetic pattern (permanent magnet).

上述旋轉筒30之突出部32、滑輪PL1、PL2、磁性齒輪部GM1、GM2之各外徑係以旋轉光罩20(連結部24)之周速度與旋轉筒30之周速度(基板S之搬送速度)大致相同之方式設定。 The outer diameters of the protruding portion 32, the pulleys PL1, PL2, and the magnetic gear portions GM1 and GM2 of the rotating cylinder 30 are determined by the peripheral speed of the rotating reticle 20 (connecting portion 24) and the peripheral speed of the rotating cylinder 30 (conveyance of the substrate S). Speed) is set in approximately the same way.

對於上述構成之基板處理裝置100中之磁性齒輪傳遞機構GD之動作進行說明。若旋轉筒30藉由驅動裝置33之驅動而繞旋轉軸線AX2(第2旋轉軸)旋轉,則藉由帶式驅動機構VD,而滑輪PL1、PL2以對應於與突出部32之外徑比之速度各自旋轉。 The operation of the magnetic gear transmission mechanism GD in the substrate processing apparatus 100 configured as described above will be described. When the rotating cylinder 30 is rotated around the rotation axis AX2 (the second rotation axis) by the drive of the driving device 33, the pulleys PL1 and PL2 correspond to the ratio of the outer diameter of the protrusions 32 by the belt drive mechanism VD. The speeds rotate independently.

滑輪PL1、PL2之旋轉經由軸ST1、ST2傳遞而各磁性齒輪 部GM2旋轉。此時,於磁性齒輪部GM2中,例如,如圖8(a)所示般,於磁性齒輪部GM1與S極S2對向之情形時,藉由相互吸引之方向之磁力作用,而磁性齒輪部GM1之N極N1對向。 The rotation of the pulleys PL1 and PL2 is transmitted via the shafts ST1 and ST2, and each magnetic gear The part GM2 rotates. At this time, in the magnetic gear portion GM2, for example, as shown in FIG. 8 (a), when the magnetic gear portion GM1 and the S pole S2 face each other, the magnetic gear acts in the direction of mutual attraction, and the magnetic gear The N pole N1 of the part GM1 is opposed.

而且,若磁性齒輪部GM2例如於圖8中於順時針方向上旋轉,則如圖8(b)所示般,相對於N極N1發揮吸引之方向之磁力作用之S極S2遠離,並且相對於N極N1發揮排斥之方向之磁力作用之N極N2靠近,藉此,該等磁力對磁性齒輪部GM1之N極N1發揮作為牽引力之作用,磁性齒輪部GM1以對應於與磁性齒輪部GM2之外徑比(周長比)之速度旋轉。 Further, if the magnetic gear portion GM2 is rotated clockwise in FIG. 8, for example, as shown in FIG. 8 (b), the S pole S2 that exerts a magnetic force acting in the direction of attraction with respect to the N pole N1 is far away, and relatively The N-pole N2, which acts as a magnetic force in the direction of repulsion of the N-pole N1, approaches, whereby these magnetic forces act as a traction force on the N-pole N1 of the magnetic gear part GM1. The magnetic gear part GM1 corresponds to the magnetic gear part GM2. It rotates at the speed of the outer diameter ratio (perimeter ratio).

因此,旋轉光罩20藉由由發磁體MG與線圈體CU產生之驅動部MT所賦予之旋轉驅動力與藉由磁性齒輪傳遞機構GD以非接觸所傳遞之旋轉筒30之旋轉驅動力,而繞旋轉軸線AX1A(旋轉軸線AX1B)同步旋轉。 Therefore, the rotary reticle 20 uses the rotational driving force provided by the driving part MT generated by the magnetizer MG and the coil body CU and the rotational driving force of the rotating cylinder 30 transmitted by the non-contact by the magnetic gear transmission mechanism GD, and It rotates synchronously about the rotation axis AX1A (rotation axis AX1B).

如此,若藉由驅動裝置33之驅動而旋轉筒30繞旋轉軸線AX2旋轉,則藉由磁性齒輪傳遞機構GD,而光罩單元MU1~MU3中之旋轉光罩20繞旋轉軸線AX1A旋轉,並且光罩單元MU4~MU5中之旋轉光罩20繞旋轉軸線AX1B旋轉。 In this way, if the rotating cylinder 30 is rotated about the rotation axis AX2 by the driving of the driving device 33, the magnetic mask transmission mechanism GD rotates the rotation mask 20 in the mask units MU1 to MU3 about the rotation axis AX1A, and the light The rotating photomask 20 in the cover units MU4 to MU5 rotates about the rotation axis AX1B.

而且,若自照明部10照射照明光,則於照明區域IR1(照明區域IR2)中自內周側照明旋轉光罩20之圖案。來自光罩單元MU1~MU3中之各圖案之曝光光分別照射至基板S上之轉印區域PA1~PA5。 In addition, when the illumination light is radiated from the illuminating section 10, the pattern of the rotary mask 20 is illuminated from the inner peripheral side in the illumination region IR1 (illumination region IR2). The exposure light from each pattern in the mask units MU1 to MU3 is irradiated onto the transfer areas PA1 to PA5 on the substrate S, respectively.

因此,使光罩單元MU1~MU5中之旋轉光罩20之各自之圖案於基板S上於寬度方向上連接而轉印。而且,基板S藉由旋轉光罩20之連續之旋轉與旋轉筒30之連續之旋轉而連續搬送,藉此,旋轉光罩20之圖案反覆轉印至基板S。 Therefore, the respective patterns of the rotary mask 20 in the mask units MU1 to MU5 are connected to the substrate S in the width direction and transferred. Furthermore, the substrate S is continuously conveyed by the continuous rotation of the rotary photomask 20 and the continuous rotation of the rotary cylinder 30, whereby the pattern of the rotary photomask 20 is repeatedly transferred to the substrate S.

於上述曝光處理中,或曝光處理前,或曝光處理後,關於繞旋轉光罩20之旋轉軸線AX1A(旋轉軸線AX1B)方向之位置及旋轉軸線AX1A(旋轉軸線AX1B)方向之位置之校準例如藉由如下進行:基於測量 旋轉光罩20之光罩標記與基板S之基板標記之結果,藉由驅動控制部DC之通電控制,經由驅動部MT之發磁體MG,使固持器23及旋轉光罩20於繞旋轉軸線AX1A(旋轉軸線AX1B)方向或旋轉軸線AX1A(旋轉軸線AX1B)方向上微動。 In the above exposure processing, or before or after the exposure processing, the calibration about the position around the rotation axis AX1A (rotation axis AX1B) direction and the rotation axis AX1A (rotation axis AX1B) direction of the rotary reticle 20, for example Proceed as follows: based on measurement As a result of the mask mark of the rotary reticle 20 and the substrate mark of the substrate S, the holder 23 and the rotary reticle 20 are rotated around the rotation axis AX1A by the energization control of the drive control section DC and the magnet MG of the drive section MT. (Rotation axis AX1B) direction or rotation axis AX1A (rotation axis AX1B) direction micro-movement.

如以上所說明般,本實施形態中,由於藉由非接觸式之磁性齒輪傳遞機構GD經由非接觸之驅動部MT將旋轉筒30之旋轉力作為旋轉光罩20之旋轉力傳遞,因此不會如以齒輪等接觸式傳遞旋轉力時般產生振動或磨耗、噪音、粉塵等而可實現高精度之同步驅動。尤其是,本實施形態中,由於經由磁性齒輪部GM1、GM2傳遞旋轉力,因此不需要注油等,從而亦可有助於作業效率之提高及清潔化。 As described above, in this embodiment, since the non-contact magnetic gear transmission mechanism GD transmits the rotation force of the rotating cylinder 30 as the rotation force of the rotation mask 20 via the non-contact driving unit MT, it is not Vibration or abrasion, noise, dust, etc. are generated when the rotational force is transmitted by contact such as gears, and high-precision synchronous driving can be realized. In particular, in the present embodiment, since the rotational force is transmitted through the magnetic gear portions GM1 and GM2, oiling and the like are not required, which can also contribute to improvement of work efficiency and cleaning.

又,本實施形態中,由於藉由氣墊22而將旋轉光罩20以非接觸可旋轉地保持,因此可穩定地保持旋轉光罩20。 In addition, in this embodiment, since the rotary mask 20 is rotatably held in a non-contact manner by the air cushion 22, the rotary mask 20 can be stably held.

進而,本實施形態中,由於配置複數個光罩單元MU1~MU5且使各光罩單元MU1~MU5中所設定之圖案於基板S上於寬度方向上連接,因此可形成大面積之圖案。 Furthermore, in this embodiment, since a plurality of mask units MU1 to MU5 are arranged and the patterns set in the mask units MU1 to MU5 are connected on the substrate S in the width direction, a pattern with a large area can be formed.

又,本實施形態中,由於將圖案於基板S上於寬度方向上連接時係以各圖案之一部分相互重疊之狀態進行連接,因此即便於圖案之位置於寬度方向上存在誤差而被轉印之情形時,亦可防止與賦予非重複部之曝光能量產生較大之差之情況。 In addition, in this embodiment, when the patterns are connected on the substrate S in the width direction, they are connected in a state where one part of each pattern overlaps with each other. Therefore, even if there is an error in the position of the pattern in the width direction, the pattern is transferred. In such a case, it is also possible to prevent a situation where there is a large difference from the exposure energy given to the non-repeating portion.

(第2實施形態) (Second Embodiment)

繼而,關於基板處理裝置100之第2實施形態,參照圖9至圖11進行說明。上述第1實施形態中,例示了經由帶式驅動機構VD將旋轉筒30之旋轉力作為旋轉光罩20之旋轉力傳遞之構成,但本實施形態中,對於未使用帶式驅動機構VD之構成進行說明。 Next, a second embodiment of the substrate processing apparatus 100 will be described with reference to FIGS. 9 to 11. In the first embodiment described above, the configuration in which the rotational force of the rotary cylinder 30 is transmitted as the rotational force of the rotary photomask 20 via the belt drive mechanism VD is exemplified. However, in the present embodiment, the structure without the belt drive mechanism VD is used. Be explained.

於該等圖中,對於與圖1至圖8所示之第1實施形態之構成要素相同 之要素標附相同符號,省略其說明。 In these drawings, the same constituent elements as those of the first embodiment shown in Figs. 1 to 8 are used. The same symbols are attached to the elements, and descriptions thereof are omitted.

圖9所示之基板處理裝置100具備沿旋轉軸線AX1A而配置之光罩單元MU1~MU2、沿旋轉軸線AX1B配置之光罩單元MU3、基板保持單元SU、磁性齒輪傳遞機構GD(參照圖11)。 The substrate processing apparatus 100 shown in FIG. 9 includes mask units MU1 to MU2 arranged along the rotation axis AX1A, a mask unit MU3 arranged along the rotation axis AX1B, a substrate holding unit SU, and a magnetic gear transmission mechanism GD (see FIG. 11). .

本實施形態中,設置有3個光罩單元MU1~MU3,與第1實施形態同樣地,以使各光罩單元MU1~MU3之圖案於基板S之寬度方向(Y方向)以使端部重疊之狀態連接之方式設定基板S上之轉印區域,但省略其說明。 In this embodiment, three photomask units MU1 to MU3 are provided. As in the first embodiment, the patterns of the photomask units MU1 to MU3 are arranged in the width direction (Y direction) of the substrate S so that the ends overlap. The transfer mode on the substrate S is set in the state of connection, but the description is omitted.

旋轉軸線AX1A較旋轉軸線AX2偏-X側,關於繞旋轉軸線AX2方向相對於水平方向(XY面)配置於+Z側且成為角度θ 1之位置,旋轉軸線AX1B較旋轉軸線AX2偏+X側,關於繞旋轉軸線AX2方向相對於水平方向(XY面)配置於+Z側且成為角度θ 2之位置。 The rotation axis AX1A is located on the -X side from the rotation axis AX2. The rotation axis AX2 is positioned on the + Z side with respect to the horizontal direction (XY plane) at an angle θ1, and the rotation axis AX1B is located on the + X side from the rotation axis AX2. The position about the rotation axis AX2 with respect to the horizontal direction (XY plane) is arranged on the + Z side and at a position θ 2.

角度θ 1、θ 2作為一例設定為45度,但若將捲繞於旋轉筒30之基板S之捲繞角(基板S密接於旋轉筒30之外周面之角度)設為ω°,則只要成為180°-(θ 1+θ 2)<ω°之關係即可。 The angles θ 1 and θ 2 are set to 45 degrees as an example. However, if the winding angle of the substrate S wound around the rotating drum 30 (the angle at which the substrate S is in close contact with the outer peripheral surface of the rotating drum 30) is ω °, A relationship of 180 °-(θ 1 + θ 2) <ω ° is sufficient.

光罩單元MU1~MU2係於在旋轉筒30之-X側繞平行於旋轉軸線AX1A之軸線傾斜角度θ 1而配置之固定板15A上,以於正交於旋轉軸線AX1A與旋轉軸線AX2兩者之線段之方向(以下,簡稱為軸間方向)上離開、接近自由(移動自由)地設置。 The photomask units MU1 to MU2 are attached to a fixed plate 15A arranged on the -X side of the rotating cylinder 30 about an axis θ1 parallel to the axis of rotation AX1A, so as to be orthogonal to both the axis of rotation AX1A and the axis of rotation AX2 The direction of the line segment (hereinafter, simply referred to as the inter-axis direction) is provided so as to be separated and approached freely (freely moving).

同樣地,光罩單元MU3係於在旋轉筒30之+X側繞平行於旋轉軸線AX1B之軸線傾斜角度θ 2而配置之固定板15B上,以於旋轉軸線AX1B與旋轉軸線AX2之軸間方向上離開、接近自由(移動自由)地設置。 Similarly, the mask unit MU3 is mounted on the fixed plate 15B arranged on the + X side of the rotating cylinder 30 around the axis parallel to the axis of rotation AX1B at an angle of inclination θ 2 so as to be in the direction of the axis between the axis of rotation AX1B and the axis of rotation AX2 Set up and move freely (close to move).

再者,由於設置於固定板15A上之光罩單元MU1~MU2與設置於固定板15B上之光罩單元MU3為同樣之構成,因此以下之說明中,代表性地對設置於固定板15B之光罩單元MU3進行說明。 In addition, since the mask units MU1 to MU2 provided on the fixed plate 15A have the same configuration as the mask unit MU3 provided on the fixed plate 15B, the following description will be representative of the components provided on the fixed plate 15B. The mask unit MU3 will be described.

圖10係固定板15B及光罩單元MU3的部分放大圖。 FIG. 10 is a partially enlarged view of the fixing plate 15B and the mask unit MU3.

如圖10所示般,於固定板15B上,設置有載台部16,其將光罩單元MU3於凸緣部27中於Y方向及上述軸間方向上移動自由地支撐。 As shown in FIG. 10, a stage portion 16 is provided on the fixed plate 15B, and it supports the photomask unit MU3 in the flange portion 27 to move freely in the Y direction and the above-mentioned axis direction.

載台部16沿著沿Y方向所設置之Y導向板28Y而於Y方向上移動。於載台部16設置有沿軸間方向而設置之軸間導向板28J。光罩單元MU3中,設置於凸緣部27之滑動部29由軸間導向板28J引導而於軸間方向上移動。 The stage portion 16 moves in the Y direction along a Y guide plate 28Y provided in the Y direction. An inter-axis guide plate 28J is provided on the stage portion 16 and is provided in the inter-axis direction. In the mask unit MU3, the sliding portion 29 provided in the flange portion 27 is guided in the inter-axis direction by being guided by the inter-axis guide plate 28J.

於設置於凸緣部27之側端之滑動部29之附近,狹縫27a沿軸間方向遍及滑動部29之長度以上之範圍而形成。狹縫27a與滑動部29之間之壁厚設定為即便光罩單元MU3之自身重量施加時亦可彈性變形之厚度。 In the vicinity of the sliding portion 29 provided at the side end of the flange portion 27, a slit 27a is formed over the range of the length of the sliding portion 29 in the inter-axis direction. The thickness of the wall between the slit 27a and the sliding portion 29 is set to a thickness that can elastically deform even when the own weight of the mask unit MU3 is applied.

圖11係以包含旋轉軸線AX1B及旋轉軸線AX2之平面將光罩單元MU3切斷的剖面圖。如圖11所示般,光罩單元MU3具備:推力軸承TB,其設置於位於-Y側之固持器23與凸緣部25之間;及超音波馬達17:其設置於位於+Y側之固持器23與凸緣部25之間。 11 is a cross-sectional view of the photomask unit MU3 cut along a plane including the rotation axis AX1B and the rotation axis AX2. As shown in FIG. 11, the mask unit MU3 includes a thrust bearing TB provided between the holder 23 and the flange portion 25 on the −Y side, and an ultrasonic motor 17: provided on the + Y side. Between the holder 23 and the flange portion 25.

超音波馬達17係調整旋轉光罩20及磁性齒輪部GM1之繞旋轉軸線AX1B之位置者,其係由固定於凸緣部25之環狀之定子17A與連結於固持器23之環狀之轉子17B構成。 The ultrasonic motor 17 is a person who adjusts the positions of the rotating photomask 20 and the magnetic gear portion GM1 around the rotation axis AX1B. The ultrasonic motor 17 includes a ring-shaped stator 17A fixed to the flange portion 25 and a ring-shaped rotor connected to the holder 23. 17B composition.

轉子17B相對於固持器23不繞旋轉軸線AX1B旋轉,但於旋轉軸線AX1B之延長方向(軸方向)上可微動地結合,藉由預壓彈簧18而以特定之施加力與定子17A側接觸。 The rotor 17B does not rotate around the rotation axis AX1B with respect to the holder 23, but is movably coupled in the extension direction (axis direction) of the rotation axis AX1B, and contacts the stator 17A side with a specific applied force by a preload spring 18.

凸緣部27固定於內筒21之兩端部而設置,於與旋轉筒30對向之面,設置有具有旋轉筒30之基板保持面31之半徑加上基板S之厚度所得之值之半徑之切成圓弧狀之保持部34。保持部34與圖3或圖4中所示之氣墊AP同樣地由自圓弧狀之表面朝向徑方向噴出空氣之多孔質墊形成。 The flange portion 27 is fixed to both ends of the inner cylinder 21 and is provided. A radius obtained by adding the radius of the substrate holding surface 31 having the rotary cylinder 30 and the thickness of the substrate S to the surface facing the rotary cylinder 30 is provided. It is cut into an arc-shaped holding portion 34. Similarly to the air cushion AP shown in FIG. 3 or FIG. 4, the holding portion 34 is formed of a porous cushion that ejects air from a circular arc-shaped surface in a radial direction.

於旋轉筒30內,於Y方向上與磁性齒輪部GM1對向之位 置,磁性齒輪部GM2與基板保持面31同一平面地遍及全周而埋設。 Inside the rotating cylinder 30, facing the magnetic gear part GM1 in the Y direction The magnetic gear portion GM2 is buried over the entire circumference on the same plane as the substrate holding surface 31.

其他構成與上述第1實施形態相同。 The other structures are the same as those of the first embodiment.

於上述構成之基板處理裝置100中,光罩單元MU3以如下狀態被支撐:支撐於載台部16且光罩單元MU3之自身重量中對應於角度θ 2之分力之負重經由捲繞於旋轉筒30之表面之基板S作為預壓賦予旋轉筒30側。 In the substrate processing apparatus 100 configured as described above, the mask unit MU3 is supported in a state in which the weight of the component corresponding to the angle θ 2 of the self-weight of the mask unit MU3 is supported by the rotation by being wound around The substrate S on the surface of the cylinder 30 is applied to the rotating cylinder 30 side as a preload.

此時,因自保持部34噴出空氣,故光罩單元MU3以於旋轉光罩20與基板S之間形成特定量之間距(近接曝光時之間距)之狀態以非接觸支撐於基板S上。 At this time, since the air is ejected from the holding portion 34, the photomask unit MU3 is supported on the substrate S in a non-contact manner in a state where a certain amount of distance (the distance between close exposures) is formed between the rotating photomask 20 and the substrate S.

又,由於滑動部29及軸間導向板28J之製造誤差或設置誤差等,於保持部34支撐於旋轉筒30(基板S)時,保持部34與旋轉筒30(基板S)之位置產生偏移,於此情形時,有保持部34與旋轉筒30以失衡之狀態支撐之情況。 In addition, due to manufacturing errors or setting errors of the sliding portion 29 and the inter-axis guide plate 28J, when the holding portion 34 is supported by the rotating tube 30 (substrate S), the positions of the holding portion 34 and the rotating tube 30 (substrate S) are deviated. In this case, the holding portion 34 and the rotating cylinder 30 may be supported in an unbalanced state.

於此情形時,狹縫27a與滑動部29之間之薄壁部發揮作為板彈簧之功能,藉由往偏負重消除之方向進行彈性變形,可使保持部34以特定之位置關係支撐於旋轉筒30(基板S)之表面。 In this case, the thin-walled portion between the slit 27a and the sliding portion 29 functions as a leaf spring, and by elastically deforming in a direction in which the partial load is eliminated, the holding portion 34 can be supported to rotate in a specific positional relationship. The surface of the barrel 30 (substrate S).

此處,於光罩單元MU1、MU3中之保持部34(凸緣部27)之一者位於較基板S偏向外側之旋轉筒30上之情形時,其與保持部34之另一者之間產生基板S之厚度之階差而旋轉軸線AX1A(旋轉軸線AX1B)與旋轉軸線AX2變得不平行。 Here, in a case where one of the holding portions 34 (the flange portion 27) in the photomask units MU1 and MU3 is located on the rotating tube 30 which is biased to the outside from the substrate S, it is between the holding portion 34 and the other of the holding portions 34. A step difference in the thickness of the substrate S occurs, and the rotation axis AX1A (rotation axis AX1B) and the rotation axis AX2 become non-parallel.

於此情形時,於與該位於外側之保持部34對向之旋轉筒30之基板保持面31貼設與基板S相同厚度之填隙片,經由填隙片使其支撐於旋轉筒30,藉此可維持旋轉軸線AX1A(旋轉軸線AX1B)與旋轉軸線AX2之平行狀態。 In this case, an interstitial sheet having the same thickness as the substrate S is attached to the substrate holding surface 31 of the rotary cylinder 30 opposite to the holding part 34 located on the outside, and is supported by the rotary cylinder 30 via the interstitial sheet. This can maintain the parallel state of the rotation axis AX1A (rotation axis AX1B) and the rotation axis AX2.

而且,若旋轉筒30繞旋轉軸線AX2旋轉,則伴隨磁性齒輪 部GM2旋轉,旋轉力藉由磁力所產生之牽引力以非接觸傳遞至磁性齒輪部GM1。 When the rotating cylinder 30 rotates about the rotation axis AX2, a magnetic gear is attached. The part GM2 rotates, and the rotational force is transmitted to the magnetic gear part GM1 non-contact by the traction force generated by the magnetic force.

傳遞至磁性齒輪部GM1之旋轉力經由凸緣部25、超音波馬達17、固持器23、推力軸承TB而傳遞至旋轉光罩20,光罩單元MU1~MU2中之旋轉光罩20繞旋轉軸線AX1A同步旋轉,並且光罩單元MU3中之旋轉光罩20亦繞旋轉軸線AX1B同步旋轉。 The rotational force transmitted to the magnetic gear portion GM1 is transmitted to the rotary mask 20 through the flange portion 25, the ultrasonic motor 17, the retainer 23, and the thrust bearing TB. The rotary mask 20 in the mask units MU1 to MU2 around the rotation axis AX1A rotates synchronously, and the rotating photomask 20 in the photomask unit MU3 also rotates synchronously about the rotation axis AX1B.

於該構成中,為相對於基板S調整旋轉光罩20之繞旋轉軸線AX1A(旋轉軸線AX1B)方向之位置(旋轉方向之相位),只要給予超音波馬達17之定子17A周方向之振動行進波而使轉子17B相對於定子17A旋轉驅動特定量即可。 In this configuration, in order to adjust the position (phase of the rotation direction) of the rotating mask 20 about the rotation axis AX1A (rotation axis AX1B) with respect to the substrate S, the vibration traveling wave in the circumferential direction of the stator 17A of the ultrasonic motor 17 is only required. Instead, the rotor 17B may be rotationally driven with respect to the stator 17A by a specific amount.

又,相對於基板S之旋轉光罩20之旋轉軸線AX1A(旋轉軸線AX1B)方向之位置調整只要利用載台部16使光罩單元MU1~MU3整體於Y方向上移位即可。 In addition, the position adjustment with respect to the direction of the rotation axis AX1A (rotation axis AX1B) of the rotary mask 20 of the substrate S may be performed by displacing the entire mask units MU1 to MU3 in the Y direction by the stage portion 16.

又,由於保持部34之半徑(曲率)係根據預先所設定之基板S之厚度而設定,因此於基板S之厚度變更之情形時,基板S與保持部34之間之間距量根據保持部34之端部間之距離(即形成保持部34之圓弧部之弦之長度)而於周方向上產生偏差。 In addition, since the radius (curvature) of the holding portion 34 is set according to the thickness of the substrate S set in advance, when the thickness of the substrate S is changed, the distance between the substrate S and the holding portion 34 depends on the holding portion 34. The distance between the end portions (that is, the length of the chord forming the arc portion of the holding portion 34) is offset in the circumferential direction.

因此,保持部34之端部間之距離係根據基板S之厚度之變化範圍、間距量之容許偏差而設定。 Therefore, the distance between the ends of the holding portion 34 is set in accordance with the variation range of the thickness of the substrate S and the allowable deviation of the pitch amount.

例如若將旋轉筒30之基板保持面31之半徑設為125 mm,將基板S之厚度之變化範圍設為100μm,將間距量之容許偏差設為3μm,則藉由幾何計算可得使保持部34之端部間之距離小於基板保持面31之半徑之1/2左右,藉此,無需變更保持部34之半徑即可應對基板S之厚度變更。 For example, if the radius of the substrate holding surface 31 of the rotary cylinder 30 is set to 125 mm, the variation range of the thickness of the substrate S is set to 100 μm, and the allowable deviation of the pitch amount is set to 3 μm, then the holding portion can be obtained by geometric calculation. The distance between the end portions of 34 is smaller than about 1/2 of the radius of the substrate holding surface 31, so that the thickness of the substrate S can be changed without changing the radius of the holding portion 34.

如此,本實施形態中,除可獲得與上述第1實施形態同樣之作用、效果以外,由於在旋轉筒30上設置有磁性齒輪部GM2,因此無需另 外使用帶式驅動機構等裝置,可追求裝置之小型化、低價化。 As described above, in this embodiment, in addition to obtaining the same function and effect as the first embodiment described above, since the magnetic gear portion GM2 is provided on the rotary cylinder 30, it is not necessary to separately External use of a belt-type drive mechanism and other devices can reduce the size and cost of the device.

進而,由於可排除由帶式驅動機構所產生之誤差要因,因此可更高精度地同步驅動旋轉光罩20與旋轉筒30。 Furthermore, since the cause of the error caused by the belt drive mechanism can be eliminated, the rotary photomask 20 and the rotary cylinder 30 can be driven in synchronization with higher accuracy.

(第3實施形態) (Third Embodiment)

繼而,對於基板處理裝置100之第3實施形態,參照圖12及圖13進行說明。 Next, a third embodiment of the substrate processing apparatus 100 will be described with reference to FIGS. 12 and 13.

上述第1實施形態中,為旋轉筒30之旋轉力藉由磁性齒輪傳遞機構GD中之帶式驅動機構VD而作為旋轉光罩20之旋轉力隨時傳遞之構成,但本實施形態中,對設置中止旋轉力之傳遞之傳遞解放部之構成進行說明。 In the first embodiment described above, the rotation force of the rotating cylinder 30 is transmitted at any time as the rotation force of the rotating mask 20 by the belt drive mechanism VD in the magnetic gear transmission mechanism GD. However, in this embodiment, the The configuration of the transmission liberation unit that stops the transmission of the rotational force will be described.

於該圖中,對於與圖1至圖8所示之第1實施形態之構成要素相同之要素標附相同符號,省略其說明。 In this figure, the same components as those in the first embodiment shown in FIGS. 1 to 8 are denoted by the same reference numerals, and descriptions thereof will be omitted.

如圖12所示般,本實施形態中之磁性齒輪傳遞機構GD具備帶式驅動機構VD、傳遞解放部40。 As shown in FIG. 12, the magnetic gear transmission mechanism GD in this embodiment includes a belt drive mechanism VD and a transmission liberation unit 40.

於帶式驅動機構VD中之軸ST1(ST2)設置有直徑大於軸ST1(ST2)之接觸部41、直徑小於接觸部41之軸部42。接觸部41經由軸承43相對旋轉自由地支撐滑輪PL1(PL2)之內周側。於軸部42經由軸承44設置有推進器支撐部45。 The shaft ST1 (ST2) in the belt drive mechanism VD is provided with a contact portion 41 having a diameter larger than the shaft ST1 (ST2) and a shaft portion 42 having a diameter smaller than the contact portion 41. The contact portion 41 rotatably supports the inner peripheral side of the pulley PL1 (PL2) relatively via a bearing 43. A thruster support portion 45 is provided on the shaft portion 42 via a bearing 44.

傳遞解放部40具備離合器部46、推進器47、施力彈簧48。 The transmission and release section 40 includes a clutch section 46, a thruster 47, and a biasing spring 48.

離合器部46具備:筒部46a,其直徑小於形成於滑輪PL1(PL2)之端壁部39之貫通孔39a且插入於軸部42;接觸部46b,其設置於筒部46a之與接觸部41對向之側之端部且形成為直徑大於貫通孔39a;及大徑部46c,其設置於筒部46a之與推進器支撐部45對向之側之端部且形成為直徑大於貫通孔39a。 The clutch portion 46 includes a cylindrical portion 46a having a diameter smaller than the through hole 39a formed in the end wall portion 39 of the pulley PL1 (PL2) and inserted into the shaft portion 42; a contact portion 46b provided in the cylindrical portion 46a and the contact portion 41 An end portion on the side opposite to the through hole 39a is formed; and a large diameter portion 46c is provided on an end of the barrel portion 46a on the side opposite to the thruster support portion 45 and is formed to have a larger diameter than the through hole 39a. .

大徑部46c中,於與推進器47對向之位置,形成有錐面49,其伴隨朝向外徑側於軸部42之長度方向上往自推進器47離開之方向逐漸傾斜。 In the large-diameter portion 46c, a tapered surface 49 is formed at a position facing the pusher 47, and the tapered surface 49 gradually inclines in a direction away from the pusher 47 along the length direction of the shaft portion 42 toward the outer diameter side.

施力彈簧48係設置於大徑部46c與滑輪PL1(PL2)之端壁部39之間且賦予該等相互分離之方向之施加力者。 The urging spring 48 is provided between the large-diameter portion 46c and the end wall portion 39 of the pulley PL1 (PL2) and applies the urging force to these directions of separation.

推進器47夾持軸部42而設置一對,於與錐面49對向之位置具備有球部47a。 A pair of thrusters 47 is provided to sandwich the shaft portion 42, and a ball portion 47 a is provided at a position facing the tapered surface 49.

又,各推進器47於如圖12所示般接近於軸部42而球部47a卡合於錐面49之傳遞位置與如圖13所示般自軸部42離開而球部47a相對於錐面49之卡合解除之解放位置之間移動。 Further, each of the thrusters 47 approaches the transmission portion where the shaft portion 42 approaches the shaft portion 42 as shown in FIG. 12, and the ball portion 47 a engages with the tapered surface 49 as shown in FIG. 13, and the ball portion 47 a moves away from the shaft portion 42 as shown in FIG. 13. Move between the release positions where the engagement of face 49 is released.

推進器47於位於傳遞位置之情形時,使離合器部46之接觸部46b對抗施力彈簧48之施加力而與接觸部41接觸。 When the pusher 47 is located at the transmission position, the contact portion 46 b of the clutch portion 46 contacts the contact portion 41 against the urging force of the urging spring 48.

於上述構成之磁性齒輪傳遞機構GD中,於推進器47移動至傳遞位置,如圖12所示般離合器部46之接觸部46b與接觸部41接觸之情形時,若滑輪PL1(PL2)藉由旋轉筒30之旋轉力經由傳送帶VL而旋轉,則大徑部46c藉由伴隨施力彈簧48之施力之摩擦力而旋轉,並且接觸部41藉由相互接觸之接觸部46b、41間之摩擦力而旋轉。 In the magnetic gear transmission mechanism GD configured as described above, when the thruster 47 is moved to the transmission position and the contact portion 46b of the clutch portion 46 is in contact with the contact portion 41 as shown in FIG. 12, if the pulley PL1 (PL2) is When the rotational force of the rotating cylinder 30 is rotated via the conveyor belt VL, the large-diameter portion 46c is rotated by the frictional force accompanying the urging force of the urging spring 48, and the contact portion 41 is caused by friction between the contact portions 46b, 41 that are in contact with each other. Force while rotating.

藉此,經由軸ST1(ST2)而磁性齒輪部GM2旋轉,藉此,經由圖2所示之磁性齒輪部GM1,而旋轉筒30之旋轉力傳遞至旋轉光罩20。 Thereby, the magnetic gear portion GM2 is rotated via the shaft ST1 (ST2), whereby the rotational force of the rotating cylinder 30 is transmitted to the rotating photomask 20 via the magnetic gear portion GM1 shown in FIG. 2.

另一方面,於推進器47移動至解放位置,如圖13所示般離合器部46之接觸部46b自接觸部41離開之情形時,接觸部46b、41分離,藉此,軸ST及磁性齒輪部GM2不旋轉。因此,旋轉筒30之旋轉力不傳遞至旋轉光罩20。 On the other hand, when the thruster 47 is moved to the released position and the contact portion 46b of the clutch portion 46 is separated from the contact portion 41 as shown in FIG. 13, the contact portions 46b and 41 are separated, whereby the shaft ST and the magnetic gear The part GM2 does not rotate. Therefore, the rotating force of the rotating cylinder 30 is not transmitted to the rotating mask 20.

因此,於將推進器47定位於傳遞位置之狀態下,將旋轉筒30之旋轉力傳遞至旋轉光罩20而實施上述之曝光處理,藉由將推進器47定位於解放位置可中止旋轉筒30與旋轉光罩20之間之旋轉力之傳遞。 Therefore, in a state where the pusher 47 is positioned at the transmission position, the rotating force of the rotary tube 30 is transmitted to the rotary photomask 20 to perform the above-mentioned exposure processing, and the rotary tube 30 can be stopped by positioning the pusher 47 at the release position. Transmission of rotational force with the rotating mask 20.

(器件製造系統) (Device Manufacturing System)

繼而,參照圖14對具備上述基板處理裝置100之器件製造系統進行說 明。 Next, a device manufacturing system including the substrate processing apparatus 100 will be described with reference to FIG. 14. Bright.

圖14係表示器件製造系統(軟性顯示器製造線)SYS之一部分之構成的圖。此處,表示了自供給輥FR1抽出之可撓性基板P(片材、膜、極薄玻璃片材等)依序經過n台處理裝置U1、U2、U3、U4、U5、…Un,直至捲起於回收輥FR2之例。 FIG. 14 is a diagram showing a configuration of a part of a device manufacturing system (flexible display manufacturing line) SYS. Here, it is shown that the flexible substrate P (sheet, film, ultra-thin glass sheet, etc.) drawn from the supply roller FR1 passes through the n processing devices U1, U2, U3, U4, U5, ... Un in this order, until An example of winding up on the recovery roll FR2.

上位控制裝置CONT總括控制構成製造線之各處理裝置U1~Un。再者,此處,將之前之各實施形態中所說明之基板S設為基板P。 The higher-level control device CONT controls the processing devices U1 to Un constituting the manufacturing line in a comprehensive manner. Here, the substrate S described in each of the previous embodiments is referred to as a substrate P.

圖14中,正交座標系XYZ係以基板P之表面(或背面)成為垂直於XZ面之方式設定且將正交於基板P之搬送方向(長條方向)之寬度方向設定為Y方向者。再者,該基板P亦可為預先藉由特定之預處理將該表面進行改質而活化者,或於表面形成用於精密圖案化之微細之隔壁構造(凹凸構造)者。 In FIG. 14, the orthogonal coordinate system XYZ is set such that the front surface (or back surface) of the substrate P becomes perpendicular to the XZ surface and the width direction orthogonal to the transport direction (long direction) of the substrate P is set to the Y direction. . In addition, the substrate P may be modified by a specific pretreatment to activate the surface in advance, or a fine partition wall structure (concavo-convex structure) for precise patterning may be formed on the surface.

捲繞於供給輥FR1之基板P藉由夾持之驅動輥DR1被抽出而被搬送至處理裝置U1,基板P之Y方向(寬度方向)之中心係藉由邊緣位置控制器EPC1以相對於目標位置落入±十幾μm~幾十μm左右之範圍之方式被伺服控制。 The substrate P wound around the supply roller FR1 is drawn out by the nip driving roller DR1 and transported to the processing device U1. The center of the substrate P in the Y direction (width direction) is relative to the target by the edge position controller EPC1. The way that the position falls within the range of about a dozen μm to a few tens of μm is servo controlled.

處理裝置U1係藉由印刷方式於基板P之表面關於基板P之搬送方向(長條方向)連續性或選擇性地塗佈感光性功能液(光阻劑、感光性矽烷偶合材、UV(Ultraviolet,紫外線)硬化樹脂液等)之塗佈裝置。 The processing device U1 continuously or selectively coats the photosensitive functional liquid (photoresist, photosensitive silane coupling material, UV (Ultraviolet), etc.) on the surface of the substrate P by the printing method with respect to the conveying direction (long direction) of the substrate P. , UV) curing resin solution, etc.) coating device.

於處理裝置U1內,設置有捲繞有基板P之壓印輥DR2、位於該壓印輥DR2上且包含用於在基板P之表面上一樣地塗佈感光性功能液之塗佈用輥等之塗佈機構Gp1、及用於急速地去除基板P上所塗佈之感光性功能液中所包含之溶劑或水分之乾燥機構Gp2等。 In the processing device U1, an impression roller DR2 on which a substrate P is wound is provided, and an application roller, etc., which is located on the impression roller DR2 and is used to uniformly apply a photosensitive functional liquid on the surface of the substrate P is provided. A coating mechanism Gp1, a drying mechanism Gp2, etc. for quickly removing a solvent or moisture contained in the photosensitive functional liquid applied on the substrate P.

處理裝置U2係用於將自處理裝置U1搬送來之基板P加熱至特定溫度(例如,數10~120℃左右),從而使塗佈於表面之感光性功能 層穩定之加熱裝置。 The processing device U2 is used to heat the substrate P transferred from the processing device U1 to a specific temperature (for example, about 10 to 120 ° C), so as to make the photosensitive function coated on the surface Layer stable heating device.

於處理裝置U2內,設置有用於將基板P折回且搬送之複數個輥與轉空桿、用於加熱所搬入之基板P之加熱腔室部HA1、用於使經加熱之基板P之溫度以與後步驟(處理裝置U3)之環境溫度一致之方式降低之冷卻腔室部HA2、及夾持之驅動輥DR3等。 In the processing device U2, a plurality of rollers and emptying rods for folding back the substrate P and carrying it, a heating chamber portion HA1 for heating the substrate P carried in, and a temperature for heating the substrate P to The cooling chamber portion HA2, which is lowered in a manner consistent with the ambient temperature in the subsequent step (processing device U3), the driving roller DR3, etc., which are held.

作為基板處理裝置100之處理裝置U3係對自處理裝置U2搬送來之基板P(基板S)之感光性功能層照射對應於顯示器用之電路圖案或配線圖案之紫外線之圖案化光的曝光裝置。 The processing device U3 as the substrate processing device 100 is an exposure device that irradiates the photosensitive functional layer of the substrate P (substrate S) transferred from the processing device U2 with patterned light corresponding to ultraviolet rays of a circuit pattern or wiring pattern for a display.

於處理裝置U3內,設置有將基板P之Y方向(寬度方向)之中心控制於固定位置之邊緣位置控制器EPC、夾持之驅動輥DR4、藉由特定之張力將基板P部分性地捲繞而將基板P上之進行圖案曝光之部分支撐為一樣之圓筒面狀之旋轉筒DR5(旋轉筒30)、及用於給予基板P特定之鬆弛度(寬裕度)DL之2組驅動輥DR6、DR7等。 In the processing device U3, an edge position controller EPC that controls the center of the Y direction (width direction) of the substrate P to a fixed position, a driving roller DR4 that is clamped, and the substrate P is partially rolled by a specific tension. Around the pattern exposure on the substrate P, the rotating cylinder DR5 (rotating cylinder 30) with the same cylindrical surface is supported, and the two sets of driving rollers are used to give the substrate P a specific degree of relaxation (margin) DL. DR6, DR7, etc.

進而,於處理裝置U3內,設置有:透過型圓筒光罩DM(光罩單元MU);照明機構IU(照明部10),其設置於該圓筒光罩DM內而照明形成於圓筒光罩DM之外周面之光罩圖案;及對準顯微鏡AM1、AM2,其係為了於藉由旋轉筒DR5被支撐為圓筒面狀之基板P之一部分上將圓筒光罩DM之光罩圖案之一部分之像與基板P相對性地位置對準(對準)而檢測預先形成於基板P之對準標記等。 Furthermore, a transmissive cylindrical mask DM (mask unit MU) and an illumination unit IU (lighting unit 10) are provided in the processing device U3, and are formed in the cylindrical mask DM to illuminate the cylinder. Photomask pattern on the outer surface of the photomask DM; and alignment microscopes AM1 and AM2, which are used to place a photomask of the cylindrical photomask DM on a portion of the substrate P that is supported by a cylindrical tube DR5 by a rotating tube DR5 An image of a part of the pattern is relatively aligned (aligned) with the substrate P, and an alignment mark or the like formed in advance on the substrate P is detected.

處理裝置U4係對自處理裝置U3搬送來之基板P之感光性功能層進行濕式之顯影處理、無電解鍍敷處理等之濕式處理裝置。於處理裝置U4內,設置有於Z方向上階層化之3個處理槽BT1、BT2、BT3、將基板P折曲而搬送之複數個輥、及夾持之驅動輥DR8等。 The processing device U4 is a wet processing device that performs wet development processing, electroless plating processing, and the like on the photosensitive functional layer of the substrate P transferred from the processing device U3. In the processing device U4, three processing tanks BT1, BT2, and BT3, which are layered in the Z direction, a plurality of rollers that bend and transport the substrate P, and a driving roller DR8 that is held are provided.

處理裝置U5係將自處理裝置U4搬送來之基板P暖熱,從而將因濕式製程而變濕的基板P之水分含量調整為特定值之加熱乾燥裝 置,但省略詳細說明。 The processing device U5 is a heating and drying device that warms the substrate P transferred from the processing device U4 to adjust the moisture content of the substrate P that has been wetted by the wet process to a specific value. Set, but detailed description is omitted.

其後,經過幾個處理裝置,通過一連串製程之最後之處理裝置Un之基板P經由夾持之驅動輥DR1捲起於回收輥FR2。該捲起時亦以基板P之Y方向(寬度方向)之中心或Y方向之基板端不於Y方向上分散之方式,藉由邊緣位置控制器EPC2逐次修正控制驅動輥DR1與回收輥FR2之Y方向之相對位置。 Thereafter, after passing through several processing apparatuses, the substrate P passing through the last processing apparatus Un of the series of processes is wound up on the recovery roll FR2 through the nip driving roller DR1. During the rolling, the center of the Y direction (width direction) of the substrate P or the substrate end in the Y direction is not dispersed in the Y direction, and the edge position controller EPC2 is used to sequentially correct and control the driving roller DR1 and the recovery roller FR2. Relative position in the Y direction.

上述器件製造系統SYS中,由於使用上述基板處理裝置100作為處理裝置U3,因此以齒輪等之接觸式傳遞旋轉力時不產生振動或磨耗、噪音、粉塵等,可實現高精度之同步驅動,可將比較大尺寸之光罩圖案忠實地轉印於基板上。因此,可製造更高精細化之顯示面板或電子電路等之器件。 In the device manufacturing system SYS, since the substrate processing apparatus 100 is used as the processing apparatus U3, no vibration or abrasion, noise, dust, etc. are generated when the rotational force is transmitted by contact of a gear or the like, and high-precision synchronous driving can be achieved. The relatively large size mask pattern is faithfully transferred to the substrate. Therefore, it is possible to manufacture devices with higher definition display panels, electronic circuits, and the like.

以上,一面參照隨附圖式一面對本發明之較佳之實施形態進行說明,但當然本發明不限定於該例。上述之例中所表示之各構成構件之諸形狀或組合等係一例,可在不脫離本發明之主旨之範圍內根據設計要求等進行各種變更。 The preferred embodiment of the present invention has been described above with reference to the accompanying drawings, but the present invention is not limited to this example. The shapes and combinations of the constituent members shown in the above examples are examples, and various changes can be made in accordance with design requirements and the like without departing from the spirit of the present invention.

例如,上述實施形態中,例示了磁性齒輪部GM1、GM2之旋轉軸線為相互平行之構成,但並不限定於此。作為磁性齒輪之傳遞形態,如圖15所示般,即便於如接近於可繞平行於Z軸之旋轉軸旋轉之第1磁性齒輪GMa之外周面而配置可繞平行於Y軸之旋轉軸旋轉之第2磁性齒輪GMb之外周面之情形時,於2個磁性齒輪GMa、GMb間亦可傳遞旋轉力。 For example, in the said embodiment, although the structure where the rotation axes of the magnetic gear parts GM1 and GM2 are mutually parallel was illustrated, it is not limited to this. As the transmission form of the magnetic gear, as shown in FIG. 15, even if it is arranged close to the outer peripheral surface of the first magnetic gear GMa that can rotate around a rotation axis parallel to the Z axis, it can be rotated around a rotation axis parallel to the Y axis. In the case of the second magnetic gear GMb on the outer peripheral surface, a rotational force can also be transmitted between the two magnetic gears GMa and GMb.

如此,作為於相互正交之方向上配置有旋轉軸線之磁性齒輪傳遞機構,例如,於日本再公表公報WO2007-10780號(EP1906054A1)等中有記載。 As described above, the magnetic gear transmission mechanism in which rotation axes are arranged in mutually orthogonal directions is described in, for example, Japanese Republication Publication No. WO2007-10780 (EP1906054A1) and the like.

因此,於利用可將旋轉力變換為90度之磁性齒輪傳遞機構之情形時,例如,亦可如圖16所示般設為如下構成:分別於旋轉光罩20之外周面設置 磁性齒輪部GM1A,於旋轉筒30之外周面設置磁性齒輪部GM1B,將以於正交於磁性齒輪部GM1A及磁性齒輪部GM1B之旋轉軸線之方向上延伸之軸ST1(ST2)作為旋轉軸之磁性齒輪部GM2接近於磁性齒輪部GM1A、GM1B而設置。 Therefore, when a magnetic gear transmission mechanism capable of converting a rotational force to 90 degrees is used, for example, it may be configured as shown in FIG. The magnetic gear part GM1A is provided with a magnetic gear part GM1B on the outer peripheral surface of the rotating cylinder 30, and an axis ST1 (ST2) extending in a direction orthogonal to the rotation axes of the magnetic gear part GM1A and the magnetic gear part GM1B is used as the rotation axis. The magnetic gear portion GM2 is provided close to the magnetic gear portions GM1A and GM1B.

於此情形時,磁性齒輪部GM1A相當於第1磁性圖案部,磁性齒輪部GM1B相當於第2磁性圖案部,設置於軸ST1(ST2)之磁性齒輪部GM2相當於第3磁性圖案部。 In this case, the magnetic gear portion GM1A corresponds to the first magnetic pattern portion, the magnetic gear portion GM1B corresponds to the second magnetic pattern portion, and the magnetic gear portion GM2 provided on the shaft ST1 (ST2) corresponds to the third magnetic pattern portion.

若設為此種構成,則藉由延伸軸ST1(ST2)可使旋轉光罩20與旋轉筒30之間隔擴大,因此可設置用於將旋轉光罩20之圖案之像投影於捲繞於旋轉筒30之基板上之投影光學系統等。 With this configuration, the distance between the rotary mask 20 and the rotary cylinder 30 can be enlarged by the extension axis ST1 (ST2), so that an image of the pattern of the rotary mask 20 can be provided to be projected on the winding A projection optical system and the like on the substrate of the barrel 30.

又,上述第2實施形態中,例示了將支撐光罩單元MU1~MU3之固定板15A、15B之傾斜角度設為固定之構成,但不限定於此,例如,亦可設置調整固定板15A、15B之傾斜角度之角度調整裝置。該構成中,可根據固定板15A、15B之傾斜角度而調整光罩單元MU1~MU3之自身重量中作為預壓而賦予旋轉筒30之負重。 In the second embodiment described above, the configuration in which the inclination angles of the fixing plates 15A and 15B supporting the photomask units MU1 to MU3 are set to be fixed is not limited to this. For example, an adjustment fixing plate 15A, 15B angle adjustment device. In this configuration, the weight of the mask units MU1 to MU3 can be adjusted as a preload to the weight of the rotating cylinder 30 according to the inclination angles of the fixed plates 15A and 15B.

進而,上述實施形態中,設為於保持部34支撐於旋轉筒30時旋轉光罩20與基板S之間形成特定量之間距之構成,但亦可例如設為如下構成:不設置保持部34而設置相對於旋轉筒30分別獨立地驅動光罩單元MU1~MU3之驅動裝置,且藉由壓電致動器等驅動源根據旋轉光罩20與基板S之間應形成之間距量而調整光罩單元MU1~MU3之各自之軸間方向之位置。 Furthermore, in the above-mentioned embodiment, a structure in which a predetermined distance is formed between the rotary mask 20 and the substrate S when the holding portion 34 is supported by the rotating tube 30 is adopted. For example, the following configuration may be adopted: the holding portion 34 is not provided. A driving device for independently driving the photomask units MU1 to MU3 with respect to the rotating cylinder 30 is provided, and the light is adjusted by a driving source such as a piezoelectric actuator according to the distance between the photomask 20 and the substrate S. Positions of the cover units MU1 to MU3 in the respective inter-axis directions.

又,上述實施形態中,設為於旋轉光罩20形成圖案之構成,但不限定於此,亦可為將具有圖案之片材狀之光罩捲繞於透明之圓筒體(均勻之壁厚之石英製之管狀之筒體等)之構成。 Moreover, in the said embodiment, although it is set as the structure which forms a pattern on the rotating mask 20, it is not limited to this, It is good also as a sheet-shaped mask with a pattern wound on a transparent cylinder (uniform wall) Thick quartz tube, etc.).

之前之圖1或圖16中,設為於旋轉光罩20與旋轉筒30之 間藉由磁性齒輪而互相傳遞旋轉驅動力之構成,但亦可例如於圖16中,將軸ST1(ST2)連接於作為驅動源之旋轉馬達(旋轉驅動源)。 In the previous FIG. 1 or FIG. 16, it is set between the rotating mask 20 and the rotating cylinder 30. The magnetic driving gear is used to transmit the rotational driving force to each other. For example, in FIG. 16, the shaft ST1 (ST2) may be connected to a rotary motor (rotary driving source) as a driving source.

於此情形時,設置於軸ST1(ST2)之2個磁性齒輪部GM2之旋轉扭矩傳遞至與一個磁性齒輪部GM2以非接觸對向之磁性齒輪部GM1A(旋轉光罩20)及與另一個磁性齒輪部GM2以非接觸對向之磁性齒輪部GM1B(旋轉筒30),旋轉光罩20之圖案面(圓筒面)之周速度與基板S之搬送速度設定為特定之速度關係(同步速度)。 In this case, the rotational torque of the two magnetic gear portions GM2 provided on the shaft ST1 (ST2) is transmitted to the magnetic gear portion GM1A (rotating reticle 20) which is opposed to one magnetic gear portion GM2 in a non-contact manner and to the other The magnetic gear part GM2 is a non-contact magnetic gear part GM1B (rotating cylinder 30), and the peripheral speed of the pattern surface (cylindrical surface) of the rotary reticle 20 and the conveying speed of the substrate S are set to a specific speed relationship (synchronous speed ).

30‧‧‧旋轉筒(滾動體) 30‧‧‧rotating cylinder (rolling body)

31‧‧‧基板保持面 31‧‧‧ substrate holding surface

32‧‧‧突出部 32‧‧‧ protrusion

33‧‧‧驅動裝置 33‧‧‧Drive

AX1A、AX1B‧‧‧旋轉軸線(第1旋轉軸) AX1A, AX1B‧‧‧‧Axis of rotation (1st rotation axis)

AX2‧‧‧旋轉軸線(第2旋轉軸) AX2‧‧‧rotation axis (second rotation axis)

MU1~MU5‧‧‧光罩單元(光罩保持部) MU1 ~ MU5 ‧‧‧ Mask unit (mask holding unit)

ST1、ST2‧‧‧軸 ST1, ST2‧‧‧axis

GM2‧‧‧磁性齒輪部 GM2‧‧‧ Magnetic Gear

PL1、PL2‧‧‧滑輪 PL1, PL2‧‧‧ pulley

VD‧‧‧帶式驅動機構 VD‧‧‧Belt drive mechanism

GD‧‧‧磁性齒輪傳遞機構 GD‧‧‧ Magnetic Gear Transmission

SU‧‧‧基板保持單元 SU‧‧‧ substrate holding unit

VL‧‧‧傳送帶 VL‧‧‧ Conveyor

S‧‧‧基板 S‧‧‧ substrate

Claims (15)

一種基板處理裝置,其係將具有可撓性之長條基板於藉由可旋轉之滾動體之圓周面之一部分支撐之狀態下於上述長條方向上進行搬送,並且將形成於可旋轉之旋轉光罩之周面之圖案反覆轉印至上述基板之被處理面者;其具備:光罩保持部,其以上述旋轉光罩之外周面之關於轉印之部分與上述基板之被處理面以特定之間隔配置之方式能夠以第1旋轉軸作為中心旋轉地相對於上述滾動體支撐上述旋轉光罩;及氣體供給部,為了對上述基板與上述光罩保持部之間供給氣體而於上述氣體之噴出部分使用多孔質構件;傳遞機構,其將上述滾動體及上述旋轉光罩之一者之旋轉力作為另一者之旋轉力以磁力傳遞。 A substrate processing apparatus is configured to carry a flexible long substrate in a state of being supported by a part of a circumferential surface of a rotatable rolling body in the above-mentioned long direction, and form the rotatable rotation The pattern of the peripheral surface of the photomask is repeatedly transferred to the surface to be processed of the substrate; it includes a photomask holding portion that uses the portion on the outer peripheral surface of the rotating photomask to be transferred and the surface of the substrate to be processed. A specific spaced-apart arrangement can support the rotary photomask with respect to the rolling body around the first rotation axis as a center; and a gas supply unit configured to supply gas to the gas between the substrate and the photomask holding unit. The ejection portion uses a porous member; a transmission mechanism that transmits the rotational force of one of the rolling elements and the rotary photomask as the rotational force of the other by a magnetic force. 如申請專利範圍第1項之基板處理裝置,其中上述光罩保持部具有圓筒部;上述旋轉光罩相對於上述圓筒部可旋轉地保持。 For example, the substrate processing apparatus according to the first patent application range, wherein the mask holding portion has a cylindrical portion, and the rotating mask is rotatably held with respect to the cylindrical portion. 如申請專利範圍第1項或第2項之基板處理裝置,其中上述旋轉光罩具有磁性圖案作為上述傳遞機構之一部分。 For example, the substrate processing device of the first or second scope of the patent application, wherein the rotating photomask has a magnetic pattern as part of the transmission mechanism. 如申請專利範圍第3項之基板處理裝置,其中上述滾動體具有磁性圖案作為上述傳遞機構之一部分。 For example, the substrate processing apparatus of the third scope of the application, wherein the rolling element has a magnetic pattern as a part of the transmission mechanism. 如申請專利範圍第1項或第2項之基板處理裝置,其中上述傳遞機構具有使上述滾動體及上述旋轉光罩同步旋轉之磁性圖案。 For example, the substrate processing device of the first or second scope of the patent application, wherein the transmission mechanism has a magnetic pattern that synchronously rotates the rolling body and the rotating photomask. 如申請專利範圍第1項之基板處理裝置,其中上述傳遞機構具有中止上述滾動體與上述旋轉光罩之間之旋轉之傳 遞之傳遞解放部。 For example, the substrate processing apparatus of the scope of patent application, wherein the transmission mechanism has a transmission to stop the rotation between the rolling body and the rotating photomask. Passed to the Ministry of Liberation. 如申請專利範圍第1項之基板處理裝置,其中上述光罩保持部以將上述旋轉光罩之複數個保持於上述第1旋轉軸之方向之方式而構成,且上述複數個旋轉光罩以於各自之圖案轉印至上述基板之被處理面時上述圖案於上述基板之寬度方向上連接之方式而配置。 For example, the substrate processing apparatus of the first patent application range, wherein the photomask holding portion is configured to hold a plurality of the rotating photomasks in a direction of the first rotation axis, and the plurality of rotating photomasks are used for When the respective patterns are transferred to the processing surface of the substrate, the patterns are arranged so as to be connected in the width direction of the substrate. 如申請專利範圍第9項之基板處理裝置,其中上述複數個旋轉光罩係以上述各圖案之一部分於相互重疊之狀態下於上述基板之寬度方向上連接且轉印至上述被處理面之方式而配置於上述光罩保持部。 For example, the substrate processing device of the ninth scope of the patent application, wherein the plurality of rotating photomasks are connected in a width direction of the substrate and transferred to the surface to be processed in a state where one part of each of the patterns overlaps each other. It is arranged on the mask holding portion. 如申請專利範圍第7項之基板處理裝置,其中上述複數個旋轉光罩係以於上述基板之寬度方向上交錯狀地配置之方式保持於上述光罩保持部。 For example, the substrate processing apparatus according to the seventh aspect of the patent application, wherein the plurality of rotating photomasks are held on the photomask holding portion in a staggered arrangement in a width direction of the substrate. 如申請專利範圍第7項之基板處理裝置,其中上述滾動體設置成能夠以與上述第1旋轉軸平行之第2旋轉軸作為中心旋轉;上述複數個旋轉光罩之各自之上述第1旋轉軸以位於繞上述滾動體之上述第2旋轉軸離開既定角度之方式而配置。 For example, the substrate processing apparatus of the seventh scope of the patent application, wherein the rolling body is arranged to be rotatable about a second rotation axis parallel to the first rotation axis; and each of the first rotation axes of the plurality of rotating photomasks is provided. It is arrange | positioned so that the said 2nd rotation axis | shaft located around the said rolling body may be separated from a predetermined angle. 如申請專利範圍第1項與第7項中任一項之基板處理裝置,其中上述旋轉光罩為透過型光罩;上述光罩保持部具有照明上述旋轉光罩之圖案之照明裝置。 For example, the substrate processing apparatus according to any one of the scope of claims 1 and 7, wherein the rotating photomask is a transmissive photomask; the photomask holding portion has an illuminating device that illuminates a pattern of the rotating photomask. 如申請專利範圍第1項與第7項中任一項之基板處理裝置,其中上述光罩保持部具備使上述旋轉光罩於平行於上述第1旋轉軸之方向之方向上移動之驅動裝置。 For example, the substrate processing apparatus according to any one of claims 1 and 7, wherein the photomask holding portion includes a driving device that moves the rotary photomask in a direction parallel to the direction of the first rotation axis. 一種基板處理裝置,其具備:基板搬送機構,其將具有可撓性之長條基 板以藉由可繞旋轉軸線旋轉之滾動體之圓周面之一部分支撐之狀態於上述長條方向上進行搬送;光罩保持機構,其保持具有與上述滾動體之旋轉軸線平行地配置之旋轉軸線且具有從上述旋轉軸線以特定半徑彎曲成圓筒狀之光罩圖案之可旋轉之旋轉光罩;轉印機構,其具有對形成於上述旋轉光罩之光罩圖案之一部分照射照明光之照明系統,且將上述光罩圖案之一部分轉印至上述基板之被處理面;及可動機構,調整上述滾動體之旋轉軸線與上述旋轉光罩之旋轉軸線之間隔;傳遞機構,其以上述旋轉光罩之周速度與上述基板之長條方向之搬送速度成為特定之關係之方式將自旋轉驅動源之旋轉力以磁力傳遞至上述滾動體與上述旋轉光罩之各者。 A substrate processing apparatus includes a substrate conveying mechanism that will have a flexible long substrate The plate is transported in the above-mentioned long direction in a state of being supported by a part of the circumferential surface of the rolling body rotatable around the rotation axis; the photomask holding mechanism holds a rotation axis arranged parallel to the rotation axis of the rolling body And a rotatable rotating photomask that is curved into a cylindrical photomask pattern with a specific radius from the rotation axis; a transfer mechanism having illumination for illuminating a part of the photomask pattern formed on the rotating photomask System, and transferring a part of the photomask pattern to the processed surface of the substrate; and a movable mechanism that adjusts the interval between the rotation axis of the rolling body and the rotation axis of the rotary mask; a transmission mechanism that uses the rotating light The peripheral speed of the cover and the conveying speed in the strip direction of the substrate have a specific relationship, so that the rotational force of the self-rotation driving source is magnetically transmitted to each of the rolling body and the rotating photomask. 如申請專利範圍第13項之基板處理裝置,其中上述傳遞機構具備:第1磁性齒輪構件,其與上述旋轉光罩之旋轉軸線同軸地設置;第2磁性齒輪構件,其與上述滾動體之旋轉軸線同軸地設置;及第3磁性齒輪構件,其將自上述旋轉驅動源之旋轉力傳遞至上述第1磁性齒輪構件與上述第2磁性齒輪構件之各者。 For example, the substrate processing apparatus according to item 13 of the patent application, wherein the transmission mechanism includes: a first magnetic gear member provided coaxially with the rotation axis of the rotary photomask; and a second magnetic gear member rotated with the rolling body. The axis is provided coaxially; and a third magnetic gear member that transmits a rotational force from the rotary driving source to each of the first magnetic gear member and the second magnetic gear member. 如申請專利範圍第14項之基板處理裝置,其中上述轉印機構具備投影光學系統,其將上述旋轉光罩之光罩圖案之像投影至藉由上述滾動體之圓周面之一部分支撐之上述基板。 For example, the substrate processing apparatus of claim 14 in which the transfer mechanism is provided with a projection optical system that projects an image of the mask pattern of the rotating mask onto the substrate supported by a part of the circumferential surface of the rolling body .
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Families Citing this family (1)

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Publication number Priority date Publication date Assignee Title
TWI611996B (en) * 2012-05-18 2018-01-21 尼康股份有限公司 Substrate processing apparatus

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6019037U (en) * 1983-07-18 1985-02-08 株式会社リコー exposure equipment
JPH04150784A (en) * 1990-10-12 1992-05-25 Hishifusa Miura Magnetic force power apparatus
US6454908B1 (en) * 1997-12-22 2002-09-24 Unaxis Trading Ag Vacuum treatment system
JP2008290812A (en) * 2007-05-22 2008-12-04 Shoei Koki:Kk Conveying device
JP2011033907A (en) * 2009-08-04 2011-02-17 Nikon Corp Illuminating device, exposure device, illuminating method, exposure method, and method for manufacturing device

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02293754A (en) * 1989-05-08 1990-12-04 Sumitomo Bakelite Co Ltd Continuous exposing device
JPH0442159A (en) * 1990-06-08 1992-02-12 Kato Hatsujo Kaisha Ltd Method and device for exposing of photoresist
TW556044B (en) * 2001-02-15 2003-10-01 Sipix Imaging Inc Process for roll-to-roll manufacture of a display by synchronized photolithographic exposure on a substrate web
JP2003041361A (en) * 2001-08-02 2003-02-13 Sony Corp Film forming apparatus
JP4143866B2 (en) * 2006-01-30 2008-09-03 国際技術開発株式会社 Non-contact tape guide device
JP4984810B2 (en) * 2006-02-16 2012-07-25 株式会社ニコン Exposure method, exposure apparatus, and photomask
TW200830057A (en) * 2006-09-08 2008-07-16 Nikon Corp Mask, exposure apparatus and device manufacturing method
JP2008235470A (en) * 2007-03-19 2008-10-02 Nikon Corp Planar motor apparatus, stage apparatus, exposure apparatus, and device manufacturing method
JP2009026933A (en) * 2007-07-19 2009-02-05 Konica Minolta Holdings Inc Method of manufacturing electromagnetic wave shield film, and electromagnetic wave shield film
JP2009214381A (en) * 2008-03-10 2009-09-24 Fujifilm Corp Cylinder inner surface working method and rugged component manufacturing method
JP2009237305A (en) * 2008-03-27 2009-10-15 Mitsubishi Paper Mills Ltd Winding mechanism of mask pattern film and exposure apparatus
JP2009283694A (en) * 2008-05-22 2009-12-03 Nikon Corp Drive apparatus, stage apparatus, exposure apparatus and device manufacturing method
JP5151949B2 (en) * 2008-12-10 2013-02-27 株式会社ニコン MOBILE DEVICE, MOBILE DRIVING METHOD, EXPOSURE APPARATUS, AND DEVICE MANUFACTURING METHOD
CN102741754B (en) * 2010-02-12 2015-12-02 株式会社尼康 Substrate board treatment
JP2011183588A (en) * 2010-03-05 2011-09-22 Seiko Epson Corp Stamp forming device
JP2011221536A (en) * 2010-04-13 2011-11-04 Nikon Corp Mask moving device, exposure device, substrate processor and device manufacturing method
JP5724564B2 (en) * 2010-04-13 2015-05-27 株式会社ニコン Mask case, mask unit, exposure apparatus, substrate processing apparatus, and device manufacturing method
JP6019037B2 (en) 2011-01-20 2016-11-02 パーデュー・リサーチ・ファウンデーションPurdue Research Foundation System and method for synchronization of ion formation with a discontinuous atmospheric interface period
TWI611996B (en) * 2012-05-18 2018-01-21 尼康股份有限公司 Substrate processing apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6019037U (en) * 1983-07-18 1985-02-08 株式会社リコー exposure equipment
JPH04150784A (en) * 1990-10-12 1992-05-25 Hishifusa Miura Magnetic force power apparatus
US6454908B1 (en) * 1997-12-22 2002-09-24 Unaxis Trading Ag Vacuum treatment system
JP2008290812A (en) * 2007-05-22 2008-12-04 Shoei Koki:Kk Conveying device
JP2011033907A (en) * 2009-08-04 2011-02-17 Nikon Corp Illuminating device, exposure device, illuminating method, exposure method, and method for manufacturing device

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