TWI611192B - Docking apparatus for testing electronic devices - Google Patents

Abstract

The present invention relates to an electronic component test bonding device for connecting an electronic component supplied by a sorter to a test board. The combined device for testing electronic components of the present invention includes: a test cavity for receiving a test board, the test board for reading the eligibility of a plurality of electronic components; a moving cavity for receiving the conversion board, and the conversion The board converts feedback signals from a plurality of electronic components into readable read signals and provides them to the test board; and a module is provided to enable the mobile cavity to be set in a manner capable of relatively moving the test cavity. According to the present invention, since the moving cavity can relatively move the test cavity, product assembly, component replacement efficiency, and operation efficiency can be improved.

Description

Bonding device for testing electronic components

The present invention relates to a coupling device that combines a test board assembly having a test board with a sorter, and the test board tests electronic components supplied through the sorter.

Electronic components such as semiconductor components should be tested before shipment.

Generally, the produced semiconductor device is supplied to a tester through a handler. Therefore, there is a need for a coupling device (in the prior art, named as a conventional device) for combining a classifier and a tester as shown in FIG. 2 of Korean Published Utility Model No. 20-2009-0009426 (hereinafter referred to as "the prior art"). "Support" or "operator").

In the prior art, a technology for dividing a test machine into a test body and a test head, and combining a test head with a classification machine by a combining device is disclosed.

However, recently, a technology has been proposed in which a test board for performing a test of an electronic component is provided on a test head. That is, the test head itself can be made to function as a test machine.

Generally, the electronic components supplied through the sorter are electrically connected to a test socket provided in the tester. In addition, the test socket is provided on a contact board called an interface board.

On the other hand, if the specifications of the semiconductor device to be tested change In this case, it is also necessary to replace the parts of the testing machine combined with the sorting machine. In this case, since components such as the test socket are exposed to the outside, they are easy to replace, but the replacement of internal components that are isolated from the outside by the contact plate is cumbersome and troublesome. This problem also occurs in the event of failure of internal components that are isolated from the outside by the contact plate.

The present invention has the following objects.

First, there is provided a technology capable of minimizing interference of a contact plate during a work process, such as repairing or replacing an internal component of a test plate assembly provided with a test plate.

Secondly, a technique capable of simplifying the electrical connection operation between the test and the test socket is provided.

The combining device for testing an electronic component of the present invention, which aims to achieve the above-mentioned object, includes a conversion board, which sends a test signal to the electronic component under the control of the test board, converts a feedback signal from the electronic component into a readable read signal, and Provided to the test board, the test board is used to read the pass or fail of the electronic components supplied by the sorter; connect a cable to electrically connect the test board and the conversion board to each other; a contact board to electrically connect the conversion board, A plurality of test sockets in electrical contact with a plurality of electronic components supplied by the sorter; a test cavity for receiving the test board; a power supply module combined with the test cavity for supplying power to the test board; A moving cavity for receiving the conversion board so that the testing cavity can be relatively moved Set the module so that the moving cavity is set in a way that allows relative movement of the test cavity; the support is supported so that the test cavity, the moving cavity, and the setting module are at a predetermined height ; The mounting base is installed in such a manner that the supporting body can be moved in the direction that is the side of the sorter or the opposite direction, and the moving cavity is combined with the setting module.

The setting module includes: a first moving frame combined with the test cavity in a manner capable of moving forward and backward; and a second moving frame movable with the first movement in a manner capable of moving in a direction perpendicular to the front-rear direction Combining the frame and the moving cavity; and guiding the frame so that the second moving frame is movably combined with the first moving frame and guiding the second moving frame to be perpendicular to the front-rear direction Move in the direction.

The guide frame has a folding guide rail, and the folding guide rail is used to guide the second moving frame to move in a direction perpendicular to the front-rear direction.

Viewed from the front-rear direction, the moving cavity combined with the second moving frame by the folding guide rail can be arranged so as to be completely separated from the area of the test board.

The invention also includes a cable cavity, which is combined with the first moving frame in a manner between the test cavity and the moving cavity, and is provided with a plurality of the connecting cables.

The cable cavity includes: a first fixing plate, and the plurality of first connectors for connecting the cables are fixed to the first fixing plate, and the first fixing The board has a plurality of first setting holes, and the plurality of first setting holes are arranged at a first interval, so that the plurality of first connectors are fixedly arranged at a first interval; and a second fixing plate, a plurality of the connecting cables, A plurality of second connectors are fixed to the second fixing plate, the second fixing plate has a plurality of second setting holes, and the plurality of second setting holes are arranged at a second interval so that the plurality of second connectors are arranged in accordance with The second interval is fixed, and the first interval and the second interval are different from each other.

The contact plate is detachably combined with the conversion plate and the moving cavity.

The power supply module includes: a setting frame having a plurality of setting slots; a plurality of copper rods respectively inserted and fixed in the setting slots; and a cover to prevent the plurality of copper rods from being exposed to the outside, and the bottoms of the plurality of setting slots are mutually deep. Differently, the cover has a connection hole for connecting a plurality of power lines to the plurality of copper rods.

The present invention has the following effects.

First, with the movement of the contact plate and the moving cavity, a working space can be secured, so the internal work of the test board assembly becomes simpler.

Secondly, since the contact plate and the moving cavity move in a direction away from the area of the test cavity in the front-rear direction, the internal operation of the test plate assembly becomes simpler.

Third, since it is easy to realize the electrical connection of multiple test boards and multiple conversion boards, the time required for the operation is shortened and tediousness is eliminated.

100‧‧‧ combined device

R‧‧‧ track

SB‧‧‧Support

TA‧‧‧Test board assembly

EM‧‧‧ Electric Motor

MB‧‧‧Mounting base

MG‧‧‧Mobile guide

S ₁ ‧‧‧ detector / first detector

S ₂ ‧‧‧ Detector / Second Detector

S ₃ ‧‧‧ Detector

TM‧‧‧Test Module

TS‧‧‧Test socket

110‧‧‧test board

120‧‧‧ conversion board

130‧‧‧connecting cable

131‧‧‧first connector

132‧‧‧Second connector

133‧‧‧Connection section

140‧‧‧contact plate

150‧‧‧test cavity

160‧‧‧cable cavity

161‧‧‧Containment frame

162‧‧‧First fixing plate

163‧‧‧Second fixing plate

164‧‧‧handle

IH ₁ ‧‧‧First setting hole

IH ₂ ‧‧‧Second setting hole

D ₁ ‧‧‧ the first interval

D ₂ ‧‧‧Second interval

170‧‧‧Power supply module

171‧‧‧setting box

172a ~ 172c‧‧‧Bronze rod

IS ₁ ~ IS ₃ ‧‧‧Set slot

173‧‧‧cover

JH‧‧‧Connecting hole

180‧‧‧ Mobile cavity

181‧‧‧handle

GB‧‧‧Guide bush

IR‧‧‧ Set track

IH‧‧‧Insertion hole

ES‧‧‧ Containment Space

190‧‧‧setting module

191‧‧‧The first mobile frame

192‧‧‧Fixed frame

193‧‧‧Second Mobile Frame

194‧‧‧Guide Frame

194a‧‧‧rail

194b‧‧‧mobile section

GS‧‧‧Guide

FIG. 1 is a schematic diagram of a bonding device for testing electronic components according to an embodiment of the present invention.

FIG. 2 is a schematic diagram of one test module TM provided in a test board assembly which is a main structure of the coupling device of FIG. 1.

FIG. 3 is an external perspective view of a test board assembly as a main structure of the coupling device of FIG. 1.

FIG. 4 is an exploded perspective view of a main part of the test board assembly of FIG. 3.

FIG. 5 is an exploded perspective view of a cable cavity applicable to the test board assembly of FIG. 3.

FIG. 6 is a partially exploded perspective view of a power supply module applied to the test board assembly of FIG. 3.

FIG. 7 is an exploded perspective view of a setting module applied to the test board assembly of FIG. 3.

FIG. 8 shows a state where the operator pulls the moving cavity forward.

FIG. 9 shows a state where the worker moves the moving cavity to the right.

In the following, for the sake of brevity of description, repeated descriptions are omitted or compressed as much as possible, and preferred embodiments of the present invention are described.

FIG. 1 is a schematic diagram of an electronic device testing bonding device 100 (hereinafter simply referred to as a “bonding device”) according to an embodiment of the present invention.

The coupling device includes a test board assembly TA, a support SB, a mounting base MB, an electric motor EM, and a moving guide MG.

The test board assembly TA is combined with a sorter (not shown) and includes a plurality of test modules. The plurality of test modules includes a test board for testing a semiconductor element, which is a type of electronic component. This test board assembly TA will be described later.

The support SB is supported so that the test board assembly TA is positioned at a predetermined height, and the test board assembly TA is properly combined with the sorting machine.

The mounting base MB is mounted so as to move the support body SB in the direction of the sorter or in the opposite direction. Here, for convenience of explanation, the direction on the side of the classifier is defined as the forward direction, and the opposite direction is defined as the rear direction. Based on this direction definition, the support SB will move forward and backward.

The electric motor EM provides power for moving the support body SB forward and backward.

The moving guide MG includes four rails R, and guides the supporting body SB to move forward and backward.

On the other hand, the coupling device 100 of this embodiment may further include a plurality of detectors S ₁ , S ₂ , S ₃ and a control device ( _{1) for} identifying the position of the supporting body SB in movement when the supporting body SB moves forward and backward. (Not shown).

The plurality of detectors S ₁ , S ₂ , and S _{3 are} provided on the mounting base MB, and their functions are to remove the moving power of the support SB or to stop the movement of the support SB. Therefore, preferably, the support body SB is provided with a sensing device for detecting the position of the support body SB by a plurality of detectors S ₁ , S ₂ , and S ₃ .

The first detector S ₁ detects the support SB moving in the forward direction. If the first detector S ₁ detects the support SB, the controller turns off the power of the electric motor EM and removes the moving power.

The second detector S ₂ detects the support SB moving in the backward direction. When such a second detector S ₂ detects the support SB, the controller turns off the power of the electric motor EM.

The third detector S _{3 is} used to prevent excessive movement of the support SB due to inertia. In order to stop the movement of the support SB, this third detector S ₃ is used together with a braking device (not shown) that can control the rotating shaft of the electric motor EM. If the third detector S ₃ detects the support SB, then The controller activates the braking device to stop the support body SB from inertial movement.

Of course, further, in order to limit the impact and excessive movement caused by the inertial movement of the support SB, the coupling device 100 of this embodiment may have more than one brake (not shown) of a suitable material.

In the above coupling device 100, when the test board assembly TA and the sorter are combined, the electric motor EM is started and the support SB is moved forward. When the test board assembly TA needs to be operated, The electric motor EM is reversed, and the support SB is moved backward. In this case, the back and forth movement positions of the test board assembly TA can be appropriately controlled by the operations of the plurality of detectors S ₁ , S ₂ , and S ₃ and the controller.

For reference, the controller is used to perform the function of controlling the start of the electric motor EM, and the electric motor EM is activated according to a control signal from an operator operated by the operator or based on the information from the detectors S ₁ , S ₂ , and S ₃ To control the operation of the electric motor EM. In this case, the manipulator can be implemented in a form including several buttons operable by the operator. For example, the manipulator may include a plurality of selection buttons capable of selecting forward or backward movement of the support SB, and an activation button for activating the electric motor EM. Therefore, the operator can select the forward or backward direction by operating the selection button, and then operate the start button to move the support SB forward or backward in a predetermined direction. The manipulator is constructed as above to prevent mistakes caused by the operator's negligence and to ensure safety. In addition, the operator can set the support body SB to move only when the operator sequentially or simultaneously operates the start button while maintaining the operation of the selection button corresponding to the forward or backward movement. In addition, in a state where any one of the selection button and the start button is operated, the electric motor EM can be designed not to operate. In addition, if it is detected that the support body SB passes through a predetermined place by the plurality of detectors S ₁ , S ₂ , and S ₃ , the electric motor EM is not driven even if the operator maintains the operating state of the operator. This setting is to prevent a conflict of the test board assembly TA caused by an operator's inadvertent startup operation.

On the other hand, the controller can be located inside the operator. In this case, it is possible to prevent an increase in the cost and an increase in the size of the equipment due to the additional computer or server provided inside the coupling device 100.

For reference, FIG. 1 shows an embodiment in which the moving shaft MS rotates together with the driving of the electric motor EM and moves the supporting body SB. However, during the implementation process, the moving structure of the supporting body SB can be variously modified. For example, the support body can also be moved by providing a long rack in the mounting base along the front-rear direction and a pinion that is rotated by an electric motor on the support body side. When a rack and a pinion are used, it may be comprised so that an electric motor and a pinion may move together, and a rack and a pinion may be provided on the left and right sides in a paired manner.

<Explanation on test module>

The test board assembly TA as the main structure of the bonding device 100 in FIG. 1 is provided with a plurality of test modules TM.

FIG. 2 is a schematic diagram of a test module TM provided in the test board assembly TA.

The test module TM includes a test board 110, a conversion board 120, a connection cable, and a contact board 140.

The test board 110 reads the pass or fail of the electronic components supplied through the sorter, and controls the conversion board 120 so that the conversion board 120 sends test signals to a plurality of electronic components.

After the conversion board 120 sends a test signal to the electronic component through the control of the test board 110, it converts a feedback signal from the electronic component or a read signal readable by the test board 110 and provides it to the test board 110. Therefore, the conversion board 120 may be named a protocol board. Such a conversion board 120 can be electrically connected to the test board 110 through a connection cable 130 and can be combined with the connection cable 130 in a detachable manner.

The connection cable 130 electrically connects the test board 110 and the conversion board 120 to each other. This connection cable 130 includes a first connector 131, a second connector 132, and a connection portion 133.

The first connector 131 is electrically connected to the test board 110.

The second connector 132 is electrically connected to the conversion board 120.

The connecting portion 133 electrically connects the first connector 131 and the second connector 132. The connecting portion 133 is preferably made of a flexible flexible material such as a flexible printed circuit board coated with copper wires.

On the other hand, since the test board 110 in each test module TM When the signal moving time between the converter board 120 and the conversion board 120 are different from each other, the test result may be incorrect due to the time difference. Therefore, in order to eliminate the signal moving time difference or unplanned error, a connection cable provided in multiple test modules TM is provided. The plurality of copper wires of 130 preferably all have the same length and thickness. In addition, there is a gap between the test board 110 and the conversion board 120 due to the connection portion 133, and this gap plays a role of preventing direct transfer of heat that may occur during the test of the electronic component. Furthermore, the connection portion 133 of the flexible material prevents the transmission of a working impact force to the test board 110 when replacement or repair of components other than the test board 110 is performed.

The contact board 140 is electrically connected to the conversion board 120 and has a plurality of test sockets TS that are in electrical contact with a plurality of electronic components supplied by a sorter. Of course, one contact board 140 is provided with a plurality of test sockets TS. The contact plate 140 is detachably coupled to a moving cavity described later.

In the present invention, the combination with the contact plate in a detachable manner is to improve compatibility. For example, classification opportunities vary depending on the type of electronic component that needs to be tested. As a result, the interval between a plurality of electronic components supplied from the sorting machine also changes. However, buying a tester that includes a test socket with a corresponding interval each time is not worth choosing in terms of operation or cost. Therefore, in the present invention, when the sorting machine or the electronic component to be tested is replaced, the same testing machine can be used as usual by simply replacing the contact plate 140. That is, a contact board 140 having a test socket that is in electrical contact with a plurality of electronic components supplied from the sorting machine may be additionally provided, and the contact board 140 may be detached and used as necessary. And just in case, the conversion board 120 described above can also be replaced, so that the conversion board 120 can be replaced with more Compatible with a variety of electronic components.

<Explanation on test board assembly>

FIG. 3 is an external perspective view of the test board assembly TA, and FIG. 4 is an exploded perspective view of a main part of the test board assembly TA.

The test board assembly TA includes: multiple test boards 110, multiple conversion boards 120, multiple connection cables 130, multiple contact boards 140, test cavities 150, cable cavities 160, power supply modules 170, and mobile cavities 180 And setting module 190.

The plurality of test boards 110, the plurality of conversion boards 120, the plurality of connection cables 130, and the plurality of contact boards 140 have been described in the foregoing, and their omissions are omitted.

The test cavity 150 houses a plurality of test plates 110 therein. The test board 110 is moved from the rear to the front by the operation of the operator, and is housed inside the test cavity 150. To this end, a plurality of setting rails IR are provided inside the test cavity 150, and the plurality of setting rails IR have a setting groove for inserting and setting a plurality of test boards 110.

The cable cavity 160 is located between the test cavity 150 and the moving cavity 180 and is provided with a plurality of connection cables 130. As shown in the exploded perspective view of FIG. 5, the cable cavity 160 includes a receiving frame 161, a first fixing plate 162, a second fixing plate 163, and a handle 164.

The receiving frame 161 maintains a space between the first fixing plate 162 and the second fixing plate 163 to form a receiving space ES that can receive the connection portion 133 of the connection cable 130.

The first fixing plate 162 faces the test board 110 in the test cavity 150 and is used to fix the plurality of first connectors 131 of the plurality of connection cables 130. Such first fixing plate 162 having a plurality of first apertures disposed the IH _1, the plurality of first apertures disposed according to the IH _{1 1} D are formed are arranged a first interval, a first plurality of connectors 131 in accordance with a first fixed interval D ₁ Settings.

The second fixing plate 163 faces the conversion plate 120 side in the moving cavity 180 and is used to fix the plurality of second connectors 132 of the plurality of connection cables 130. And, a second plate 163 having a plurality of second fixing holes provided IH _2, the plurality of second holes provided IH ₂ D ₂ formed in the second spacer are arranged so that a plurality of second connector 132 according to a second fixed distance D ₂ Settings.

On the other hand, the space between the plurality of conversion plates 120 or the area of the internal space of the moving cavity 180 of the plurality of conversion plates 120 is limited by the arrangement of the plurality of test sockets TS. The area need not be limited by the arrangement of multiple test sockets TS. For example, the test board 110 should be equipped with a solid state hard disk (SSD) or a mini computer, etc. According to circumstances, it needs to be replaced with a new test board 110 that further expands the width of the existing test board 110. Therefore, preferentially, the interval between the plurality of test plates 110 accommodated in the internal space of the test cavity 150 should be wider than the interval between the plurality of conversion plates 120 subject to the interval between the test sockets TS. . Because of this necessity, and therefore preferably, a plurality of first apertures disposed a first distance D between the IH ₁₁ is greater than the second plurality of apertures disposed a second distance D between the IH _22. However, the first fixing plate 162 and the second fixing plate 163 should be disposed in parallel. In this case, the straight-line distances between the plurality of first setting holes IH ₁ and the plurality of second setting holes IH ₂ corresponding to each other are different from each other. In addition, in this structure, in order to make the lengths of the plurality of connection portions 133 of the plurality of connection cables 130 received in the accommodation space ES of the cable cavity 160 the same, it is preferable that the plurality of connection portions 133 be bent at least once. It is provided in a folded manner or a plurality of connecting portions 133 are made of a flexible flexible material. Therefore, the degree of bending or bending of the plurality of connection portions 133 of the plurality of connection cables 130 may be different from each other, or may have a nearly straight shape.

The handle 164 is used when an operator leads out of the cable cavity 160.

The power supply module 170 is combined with the outside of the test cavity 150. Such a power supply module 170 is provided for supplying an operating power source such as the test board 110. In the bonding device 100 of the present embodiment, since the operating voltages of the plurality of constituent components constituting the test board assembly TA are different from each other, a plurality of power sources are required. However, if three power cords are respectively extracted from dozens of test modules TM and directly connected to the power source, the setting of the power cords becomes complicated and the connection thereof is very tedious. Therefore, a power supply module 170 for relay power supply is connected between the power source and the plurality of test boards 110. As shown in FIG. 6, the power supply module 170 includes a setting frame 171, three copper rods 172 a, 172 b, and 172 c and a cover 173.

The installation frame 171 includes three installation slots IS ₁ , IS ₂ , and IS _{3 to} which three copper rods 172 a, 172 b, and 172 _c can be inserted and fixed. In addition, the depths of the bottoms of the three setting grooves IS ₁ , IS ₂ , and IS ₃ are also different. Accordingly, the lengths of the copper rods 172a, 172b, and 172c may be different from each other.

Three copper rods 172a, 172b, 172c are respectively inserted into the three grooves _{IS 1, IS 2, IS 3} . In this case, since the bottom depths of the three setting grooves IS ₁ , IS ₂ , and IS ₃ are different from each other, the setting depths of the three copper rods 172 a, 172 b, and 172 _c are also different from each other. Therefore, there is no need to worry about confusing the power supplied by the three copper rods 172a, 172b, 172c.

The cover 173 covers the three copper rods 172a, 172b, and 172c so as not to be exposed to the outside. Of course, since the plurality of power lines are to be connected to the three copper rods 172a, 172b, and 172c, the cover 173 is provided with a plurality of connection holes JH for connecting the plurality of power lines to the three copper rods 172a, 172b, and 172c. .

Since the power supply module 170 is provided as above, the necessary power can be obtained from the three copper rods 172a, 172b, and 172c provided in the power supply module 170, so the assemblability is improved, and there is no need to worry about confusion such as incorrectly connecting the power supply.

The moving cavity 180 houses a plurality of conversion plates 120 in the interior thereof. The conversion plate 120 is moved from the front to the rear by the operation of an operator, and is accommodated inside the moving cavity 180. For this purpose, an insertion hole IH for inserting and providing a plurality of conversion plates 120 is provided inside the moving cavity 180. This moving cavity 180 is combined with the setting module 190.

On the other hand, a plurality of contact plates 140 are detachably provided in front of the moving cavity 180. In addition, the plurality of test sockets TS provided in the plurality of contact plates 140 are electrically connected to the plurality of conversion plates 120 accommodated in the moving cavity 180. A handle 181 is provided in the moving cavity 180. The handle 181 can pull the moving cavity 180 forward or push the moving cavity 180 backward, and can also push the moving cavity 180 in the left-right direction.

The setting module 190 is configured to relatively move the moving cavity 180 and the test cavity 150. To this end, as shown in an exploded perspective view of FIG. 7, the setting module 190 includes a first moving frame 191, a fixed frame 192, a second moving frame 193, and a guide frame 194.

The first moving frame 191 is combined with the test cavity 150 in a manner capable of moving forward and backward.

The fixing frame 192 is disposed so as to move the cable cavity 160 relative to the test cavity 150 in the front-rear direction. This fixed frame 192 includes six guide rods GS that are combined with the first moving frame 191 and are long in the front-rear direction. Such six guide rods GS are inserted into six guide bushes GB (refer to FIG. 4) provided in the test cavity 150 to guide the first moving frame 191 and the fixed frame 192 to move forward and backward. In addition, the six guide rods GS can combine the fixed frame 192 and the first moving frame 191 with the test cavity 150 to move relative to each other in the front-rear direction.

The second moving frame 193 is combined with the first moving frame 191 so as to be able to move in a direction perpendicular to the front-rear direction (left-right direction in the figure). The front side of this second moving frame 193 is combined with the moving cavity 180.

The guide frame 194 is combined with the first moving frame 191 so that the second moving frame 193 moves in the left-right direction. To this end, the guide frame 194 includes a guide rail 194a and a moving portion 194b.

The guide rail 194a is a folding type, and is combined with the first moving frame 191 so as to move a predetermined interval in the left-right direction, and guides the left-right movement of the moving portion 194b. That is, the guide rail 194a itself also moves a predetermined distance in the left-right direction, and also guides the movement of the moving portion 194b in the left-right direction.

The moving portion 194b is combined with the guide rail 194a so as to move a predetermined distance in the left-right direction. And, the second moving frame 193 is fixedly coupled to this moving portion 194b.

Next, the main parts of the coupling device 100 having the above-mentioned structure are described. The work is explained.

When the coupling device 100 is required to perform the operation inside the test board assembly TA while the test board assembly TA and the sorter are combined, the electric motor EM is activated to move the test board assembly TA backward.

For example, FIG. 3 can be understood as a perspective view of a main part of the test board assembly TA in a state where the test board assembly TA is retracted.

In the state shown in FIG. 3, the operator pulls and moves the cavity 180 forward by holding the handle 181, thereby increasing the interval between the test cavity 150 and the cable cavity 160. For related content, refer to FIG. 8.

In the state shown in FIG. 8, after separating the contact plate 140 from the moving cavity 180, the worker pulls the conversion plate 120 accommodated in the moving cavity 180 forward to separate it. Then, as shown in FIG. 9, the moving cavity 180 is pushed to the right to move the moving cavity 180 to the right. In this case, since the moving distance of the moving cavity 180 is sufficiently secured by the folding guide 194a, the moving cavity 180 is disposed so as to be completely separated from the area of the test board 110 when viewed from the front-rear direction.

In the state shown in FIG. 9, the operator can replace the cable cavity 160 on which the plurality of connection cables 130 are installed as a whole, or perform an operation to replace the individual connection cables 130 that have failed. In addition, if work on the rear side of the cable cavity 160 is required, the cable cavity 160 may be removed together and then performed.

After the work is completed, the moving cavity 180 is moved in the reverse direction by the reverse operation of the above operation. In this case, with the function of the cable cavity 160, the multiple test boards 110 and multiple conversion boards 120 can accurately perform electrical connection. Of course, since the conversion board 120 is electrically connected to the test socket TS, the electrical connection between the test board 110 and the test socket TS is achieved in a simple manner after all.

Then, the operator activates the electric motor EM and the like, and combines the test board assembly TA and the sorter.

As described above, the present invention is specifically described based on the embodiments with reference to the drawings. However, the above embodiments are merely preferred examples of the present invention. The present invention is not limited to the above embodiments. The scope of protection of the invention and its equivalent shall prevail.

190‧‧‧setting module

191‧‧‧The first mobile frame

192‧‧‧Fixed frame

193‧‧‧Second Mobile Frame

194‧‧‧Guide Frame

194a‧‧‧rail

194b‧‧‧mobile section

GS‧‧‧Guide

Claims (8)

A bonding device for testing electronic components, comprising: a conversion board; after sending a test signal to an electronic component through the control of the test board, converting a feedback signal from the electronic component into a readable readout signal and providing it to the aforementioned test board, the aforementioned The test board is used to read the pass or fail of the electronic components supplied by the sorting machine; connect the cable to electrically connect the test board and the conversion board to each other; the contact board is electrically connected to the conversion board, Multiple test sockets in which multiple electronic components are in electrical contact; a test chamber for receiving the test board; a power supply module combined with the test chamber for supplying power to the test board; a moving chamber for receiving The conversion board is provided in a manner capable of relatively moving the test cavity; a module is provided so that the mobile cavity is provided in a manner capable of relatively moving the test cavity; and a support body is provided for the test cavity , The moving cavity and the setting module are supported at a predetermined height; the base is installed so that the aforementioned support can be oriented forward Front-rear direction or in the opposite direction of movement of the sorter side is mounted, the cavity and the movable module is provided in combination. The electronic device test bonding device according to claim 1, wherein the aforementioned setting module includes: The first moving frame is combined with the test cavity in a manner capable of moving forward and backward; the second moving frame is combined with the first moving frame in a manner capable of moving in a direction perpendicular to the front-rear direction, and is Combining the moving cavity; and guiding the frame so that the second moving frame is movable with the first moving frame and guiding the second moving frame to move in a direction perpendicular to the front-rear direction. The bonding device for testing an electronic component according to claim 2, wherein the guide frame has a folding guide, and the folding guide is used to guide the second moving frame to move in a direction perpendicular to the front-rear direction. The bonding device for testing an electronic component according to claim 3, wherein the moving cavity combined with the second moving frame by the folding guide rail can be completely separated from the area of the test board when viewed from the front-rear direction. Way configuration. The electronic device test bonding device according to claim 2, further comprising a cable cavity, which is coupled to the first moving frame so as to be located between the test cavity and the moving cavity, and is provided with a plurality of The aforementioned connection cable. The bonding device for testing electronic components according to claim 5, wherein the cable cavity includes a first fixing plate, and the plurality of first connectors for connecting the plurality of cables are fixed to the first fixing plate, and the first fixing Board has multiple A first setting hole, and the plurality of first setting holes are arranged at a first interval so that a plurality of the first connectors are fixedly provided at the first interval; and a second fixing plate, a plurality of second The connector is fixed to the second fixing plate. The second fixing plate has a plurality of second setting holes. The plurality of second setting holes are arranged at a second interval, so that the plurality of second connectors are fixed at the second interval. Set; the aforementioned first interval and the aforementioned second interval are different from each other. The bonding device for testing an electronic component according to claim 1, wherein the contact plate is detachably coupled to the conversion plate and the moving cavity. The coupling device for testing electronic components according to claim 1, wherein the power supply module includes: a setting frame having a plurality of setting slots; a plurality of copper rods respectively inserted and fixed in the setting slots; and a cover to prevent the plurality of The copper rods are exposed to the outside; the depths of the bottoms of the plurality of the installation grooves are different from each other, and the cover has a connection hole for connecting a plurality of power lines to the plurality of copper rods.