CN2662261Y - Semiconductor test classifier temperature changing test device - Google Patents
Semiconductor test classifier temperature changing test device Download PDFInfo
- Publication number
- CN2662261Y CN2662261Y CN 200320120458 CN200320120458U CN2662261Y CN 2662261 Y CN2662261 Y CN 2662261Y CN 200320120458 CN200320120458 CN 200320120458 CN 200320120458 U CN200320120458 U CN 200320120458U CN 2662261 Y CN2662261 Y CN 2662261Y
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- semiconductor
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- seal space
- cylinder
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Abstract
The utility model relates to a temperature-testing device for a semiconductor testing sorter; wherein, all the testing systems except an air cylinder are arranged in a sealed chamber. The sealed chamber is divided into an upper half and a lower half (1, 11), both of which are opposite enclosed. The testing system except the cylinder is arranged in the lower half (11); a semiconductor refrigerator is arranged in the upper half so as to constitute a semiconductor air-conditioner. An airtight circumstance-controlled testing section is reconstructed from an open testing section in an average sorter, so that the temperature during the testing of semiconductor elements can be controlled. Because of adopting the semiconductor refrigerator operating principle, the temperature can be controlled according to test requirements; simultaneously, manipulations to the semiconductor such as positioning and clamping can be fully executed so as to complete an electrical performance test. Therefore, the utility model satisfies various semiconductor test requirements under normal temperature, high temperature or low temperature conditions.
Description
Technical field:
The utility model relates to a kind of semiconductor test separator.The temperature changing test device that particularly relates to a kind of semiconductor test separator.Be used for the electric performance test of semiconductor element under set point of temperature.Be applicable to the semiconductor element test that industry, automobile, military project etc. are had relatively high expectations.
Background technology:
The electromechanical integration equipment that the semiconductor test separator is made up of pneumatic element, motor, sensor etc.It mainly is made up of feed arrangement, conveyer, proving installation, sorting unit and device for discharging five major parts.The ordinary semiconductor Test handler all is under normal temperature condition semiconductor element to be tested and sorting.Its weak point is can not satisfy semiconductor element to test under high temperature or cryogenic conditions.
Summary of the invention:
The purpose of this utility model is to overcome above-mentioned deficiency, provides a kind of and can satisfy the semiconductor test separator temperature changing test device that semiconductor element is tested under normal temperature, high temperature or cryogenic conditions.
The purpose of this utility model is achieved in that a kind of semiconductor test separator temperature changing test device, be characterized in the mechanism for testing except that cylinder is placed in the annular seal space, involutory upper and lower two halves is divided in the sealing chamber, and the latter half is installed the mechanism for testing except that cylinder; And the first half is installed the semiconductor air-conditioner that semiconductor cooler constitutes, and realizes the function of freezing and heating by the semiconductor refrigerating principle.Whole temperature changing test device is designed to embedded physical construction.
Compare with the proving installation of routine, the beneficial effects of the utility model are:
This device is the ambient controlled test section that the open test section with common separator is designed to seal, and changes the temperature of semiconductor element when the test to reach.It has adopted the principle of work of semiconductor cooler, the time can come design temperature according to necessary requirement in test, finishes the actions such as location, clamping of semiconductor element simultaneously, to realize the test to electric property.Can satisfy the requirement that semiconductor element is tested under normal temperature, high temperature or cryogenic conditions.
The utility model has also been installed fan and has been entered room temperature and form dewfall from low temperature to prevent product outside annular seal space.Ion blower is adopted in circulation in the semiconductor air-conditioner, damages test products to prevent to produce static.Hinge-coupled is adopted in upper and lower semitight chamber, conveniently uses and matches.
Description of drawings:
Fig. 1 is the longitudinal profile organigram after annular seal space of the present utility model is opened.
Fig. 2 is an annular seal space unfolding state figure of the present utility model.
The multilevel semiconductor schematic diagram of refrigerating that Fig. 3 adopts for the utility model.
Embodiment:
As Fig. 1～2, the utility model is a kind of semiconductor test separator temperature changing test device.It is that the mechanism for testing except that cylinder is placed in the annular seal space, and involutory upper and lower two halves 1,11 is divided in the sealing chamber, and the shell of whole annular seal space all adopts heat-barrier material.The mechanism for testing that the latter half 11 is installed except that cylinder, the first half 1 is then installed semiconductor cooler 2.
Semiconductor cooler 2 is divided into two parts of inside and outside circulation to first annular seal space 1, interior cyclic part ion blower 7 is set and in the chamber exhaust outlet 9, formed the flow-type that forces of ion blower in the chamber.Outer circulation partly is provided with outdoor air inlet 5 and exhaust fan 6, has formed outdoor natural convection.
Be respectively arranged with screen pack and protective jacket 8 and 4 (ion blower 7 and exhaust fan 6 itself all with screen pack and protective jacket), the dust impurity in the absorbed air circulation at inside and outside round-robin import and export.By the change to the positive-negative polarity of the external power supply of semiconductor cooler, first annular seal space has been configured to a kind of semiconductor air-conditioner, and reaching can be to the effect of annular seal space heating or refrigeration.
The internal edge of first annular seal space 1 is installed sealing gasket 36, has improved the sealing after upper and lower semitight chamber is closed, also alleviated simultaneously first annular seal space 1 when closing to the acting force of second annular seal space 11, played the effect of buffering.First annular seal space 1 is connected the closure that realizes the two halves annular seal space with second annular seal space 11 usefulness hinges 10, outside first annular seal space 1 handle 3 has been installed, and is convenient to daily processing.Contactless temperature probe 39 has been installed in second annular seal space, can have accurately been measured test product and interior cavity temperature in the annular seal space, to realize temperature controlling.
Mechanism for testing mainly refers to that by test upper runner 12, test lower flow channel 13, photoelectric sensor 35, two pilot pins 33,34, two levers 32,37, two positioning cylinders 28,29, two golden fingers 14,21, insulating blanked clamper piece 15,22, cushion block 16,23, Hooks coupling universal coupling 18,25, back-up block 17,24, gripper cylinder 20,27 and cylinder block 30,31,19,26 etc. form.Test lower flow channel 13 is installed on the base plate in second annular seal space 11, upper/lower terminal is connected with the transmission district of separator and the runner in sorting constituency respectively, its test section part has adopted insulation runner 40, with the accuracy of guaranteeing test data and the security that guarantees test job, test upper runner 12 places test lower flow channel 13 tops.Insert before and after two pilot pins, 34,33 lower ends in the test upper runner 12, the upper end links to each other with lever 37,32 1 ends respectively, lever 37,32 other ends link to each other with the piston of positioning cylinder 28,29 respectively, positioning cylinder 28,29 installs respectively on cylinder block 30,31, and cylinder block 30,31 is fixed on second annular seal space 11 base plate outward.Photoelectric sensor 35 is arranged on the test upper runner 12 between two pilot pins 33,34.Positioning cylinder 28,29 upwards promotes lever 32,37, lever 32,37 compressing pilot pins 33,34 move downward under lever 32,37 point action power, embed between the adjacent semiconductor element to be measured, thereby guaranteed in the test runner, to transmit one by one, locate and test.Symmetry has been installed golden finger 14,21 respectively from the inside to the outside on the base plate of the both sides of the test lower flow channel 13 of pilot pin 33,34 belows, insulating blanked clamper refers to piece 15,22 and cushion block 16,23, on the base plate outside second annular seal space 11 cylinder block 19,26 has been installed, gripper cylinder 20,27 devices are on gripper cylinder seat 19,26, the piston rod of gripper cylinder 20,27 passes second annular seal space 11 walls and links to each other with cushion block 16,23 by Hooks coupling universal coupling 18,25, Hooks coupling universal coupling 18,25 is held on the back-up block 17,24, and back-up block 17,24 is connected on the base plate of second annular seal space.The running of golden finger 14,21 mainly promotes Hooks coupling universal coupling 18,25 horizontal slip on back-up block 17,24 by the gripper cylinder 20,27 that is installed on second annular seal space 11 Outer Bottom Platings, thereby promotion cushion block 16,23 and folder refer to piece 15,22 and oppress golden finger 14,21 (using electric connection between golden finger and the tester), to reach the function of test.
Figure 3 shows that the semiconductor cooler principle of work, DC current flows to the p N-type semiconductor N from the n N-type semiconductor N successively along the loop, flow to the n N-type semiconductor N from the p N-type semiconductor N again then, and the such continuous stream of electric current is gone over, and semi-conductive A, B two ends just produce suction, exothermic phenomenon.If constantly the heat of release end of heat B is removed, A end draw heat---refrigeration towards periphery constantly just so.If form current in loop in the other direction along flowing, be electric current by the p N-type semiconductor N to the n type, and then flowing to the p type by the n type, this moment, refrigerator promptly became heat-producing machine, therefore the effect that reaches refrigeration in the annular seal space or heat by the direction that changes current in loop.
Claims (9)
1, a kind of semiconductor test separator temperature changing test device, it is characterized in that it is that the mechanism for testing except that cylinder is placed in the annular seal space, involutory upper and lower two halves (1), (11) are divided in the sealing chamber, the latter half (11) is installed the mechanism for testing except that cylinder, and the first half (1) is then installed semiconductor cooler (2) and constituted semiconductor air-conditioner.
2, a kind of semiconductor test separator temperature changing test device according to claim 1, it is characterized in that semiconductor cooler (2) is divided into two parts of inside and outside circulation to first annular seal space (1), interior cyclic part fan blower (7) is set and in the chamber exhaust outlet (9), outer circulation partly is provided with outdoor air inlet (5) and exhaust fan (6).
3, a kind of semiconductor test separator temperature changing test device according to claim 2, round-robin fan blower (7) is an ion blower in it is characterized in that.
4, a kind of semiconductor test separator temperature changing test device according to claim 2 is characterized in that inside and outside round-robin import and export is respectively arranged with screen pack and protective jacket (8), (4).
5, a kind of semiconductor test separator temperature changing test device according to claim 1 is characterized in that on the outer base plate of annular seal space (1,11) fan (38) being installed.
6, a kind of semiconductor test separator temperature changing test device according to claim 1 is characterized in that first annular seal space (1) is connected with hinge (10) with second annular seal space (11).
7, a kind of semiconductor test separator temperature changing test device according to claim 1 is characterized in that in the annular seal space (1,11) temperature probe (39) being set.
8, a kind of semiconductor test separator temperature changing test device according to claim 7 is characterized in that temperature probe (39) is contactless temperature probe.
9, according to the wherein arbitrary described a kind of semiconductor test separator temperature changing test device of claim 1～8, it is characterized in that mechanism for testing comprises test upper runner (12), test lower flow channel (13), photoelectric sensor (35), pilot pin (33,34), lever (32,37), positioning cylinder (28,29), golden finger (14,21), folder refers to piece (15,22), cushion block (16,23), Hooks coupling universal coupling (18,25), back-up block (17,24), gripper cylinder (20,27) and cylinder block (30,31,19,26), test lower flow channel (13) is installed on the interior base plate of second annular seal space (11), on, following two ends are connected with the transmission district of separator and the runner in sorting constituency respectively, test upper runner (12) places test lower flow channel (13) top, two location (34), (33) insert in the test upper runner (12) before and after the lower end, the upper end respectively with lever (37), (32) one ends link to each other, lever (37), (32) other end respectively with positioning cylinder (28), (29) piston links to each other, positioning cylinder (28), (29) install respectively in cylinder block (30), (31) on, cylinder block (30), (31) be fixed on the outer base plate of second annular seal space (11), photoelectric sensor (35) is arranged at pilot pin (33), (34) on the test upper runner (12) between, pilot pin (33), (34) on the base plate of the both sides of Xia Fang test lower flow channel (13) from the inside to the outside respectively symmetry golden finger (14) has been installed, (21), folder refers to piece (15), (22) and cushion block (16), (23), on the base plate outside second annular seal space (11) cylinder block (19 has been installed, 26), gripper cylinder (20,27) device is at gripper cylinder seat (19,26) on, gripper cylinder (20,27) piston rod passes second annular seal space (11) wall by Hooks coupling universal coupling (18,25) with cushion block (16,23) link to each other, Hooks coupling universal coupling (18,25) be held on back-up block (17,24) on, back-up block (17,24) be connected on the base plate of second annular seal space (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200320120458 CN2662261Y (en) | 2003-11-07 | 2003-11-07 | Semiconductor test classifier temperature changing test device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200320120458 CN2662261Y (en) | 2003-11-07 | 2003-11-07 | Semiconductor test classifier temperature changing test device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2662261Y true CN2662261Y (en) | 2004-12-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200320120458 Expired - Fee Related CN2662261Y (en) | 2003-11-07 | 2003-11-07 | Semiconductor test classifier temperature changing test device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2662261Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106980079A (en) * | 2015-11-27 | 2017-07-25 | 泰克元有限公司 | Electronic unit test coupling apparatus |
| CN114152856A (en) * | 2021-12-01 | 2022-03-08 | 长电科技（滁州）有限公司 | High-low temperature test system and method for semiconductor device |
| CN114265443A (en) * | 2021-12-06 | 2022-04-01 | 广东利扬芯片测试股份有限公司 | Chip test temperature control device capable of reducing cost and having universality |
-
2003
- 2003-11-07 CN CN 200320120458 patent/CN2662261Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106980079A (en) * | 2015-11-27 | 2017-07-25 | 泰克元有限公司 | Electronic unit test coupling apparatus |
| CN106980079B (en) * | 2015-11-27 | 2019-09-13 | 泰克元有限公司 | Coupling apparatus is used in electronic component test |
| CN114152856A (en) * | 2021-12-01 | 2022-03-08 | 长电科技（滁州）有限公司 | High-low temperature test system and method for semiconductor device |
| CN114265443A (en) * | 2021-12-06 | 2022-04-01 | 广东利扬芯片测试股份有限公司 | Chip test temperature control device capable of reducing cost and having universality |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20041208 Termination date: 20101107 |