TW201719183A - Docking apparatus for testing electronic devices combining the assembly body of the test board and a sorting machine - Google Patents

Abstract

The present invention relates to a docking apparatus for testing electronic devices that connect electronic devices supplied by a sorting machine with test boards . The docking apparatus for testing electronic devices of the present invention includes: a test chamber, used for receiving the test board, the test board being used to read a plurality of electronic devices to be qualified or not; a moving chamber, used for receiving the conversion board, the conversion board being able to convert the feedback signals obtained from the plurality of electronic devices to readable signals, and supply same to the test board; and a setting module, configured in a way that the moving chamber can perform relative movement relative to the test chamber. According to the present invention, because the moving chamber can move relative to the test chamber, it can enhance assembly property of the product, replacement efficiency of the parts and working efficiency.

Description

Electronic component testing combined device

The present invention relates to a bonding apparatus that combines a test board assembly having a test board with a sorting machine that tests electronic components supplied through a sorter.

Electronic components such as semiconductor components should be tested before shipment after production.

In general, the produced semiconductor components are supplied to the tester through a dispenser. Therefore, a bonding device for combining a sorter and a testing machine shown in FIG. 2 of the Korean Laid-Open Utility Model No. 20-2009-0009426 (hereinafter referred to as "prior art") is required (in the prior art, it is named "Support device" or "operator").

In the prior art, a technique of dividing a test machine into a test body and a test head and combining the test head with a sorter is disclosed.

However, a technique of providing a test board for performing tests of electronic components on the test head has recently been proposed. That is, the test head itself can be made to function as a test machine.

The electronic components normally supplied by the sorter are electrically connected to the test socket provided in the test machine. Also, the test socket is placed on a contact plate called an interface board.

On the other hand, there are changes in the specifications of the semiconductor components to be tested. In this case, it is also necessary to replace the components of the test machine combined with the sorter. In this case, the components such as the test socket are easily replaced because they are exposed to the outside, but the replacement of the internal components separated from the outside by the contact plate is rather cumbersome and troublesome. This problem also occurs in the event of a failure of the internal components that are isolated from the outside by means of the contact plates.

The present invention has the following objects.

First, there is provided a technique capable of minimizing interference of a contact plate during work during repair or replacement of internal components of a test board assembly provided with a test board.

Secondly, there is provided a technique capable of simplifying the electrical connection work between the test and test sockets.

The electronic component testing bonding device of the present invention for achieving the above object includes: a conversion board that converts a feedback signal from the electronic component into a readable read signal after transmitting a test signal to the electronic component through control of the test board, and Provided to the above test board, the test board is used for reading the electronic components supplied by the sorting machine; the connecting cable is connected to the test board and the conversion board to be electrically connected to each other; and the contact board is electrically connected to the conversion board. a plurality of test sockets having electrical contact with a plurality of electronic components supplied by the sorter; a test cavity for receiving the test board; and a power supply module coupled with the test cavity for supplying power to the test board; Moving the cavity for accommodating the conversion plate to relatively move the test cavity Setting the module such that the moving cavity is disposed in a manner movable relative to the test cavity; the support body supports the test cavity, the moving cavity and the setting module at a predetermined height The base is attached so that the support body can be moved in a front-rear direction as a direction of the sorter side or an opposite direction, and the moving cavity body is combined with the setting module.

The setting module includes: a first moving frame coupled to the test cavity in a forward and backward direction; and a second moving frame movable in a direction perpendicular to the front-rear direction and the first movement The frame is combined and combined with the moving cavity; and the guiding frame is configured to movably couple the second moving frame with the first moving frame and guide the second moving frame to be perpendicular to the front and rear directions The direction of movement.

The guide frame has a folding rail for guiding the second moving frame to move in a direction perpendicular to the front-rear direction.

The moving cavity combined with the second moving frame by the folding rail can be disposed completely apart from the area of the test board as viewed from the front-rear direction.

The present invention also includes a cable cavity that is coupled to the first moving frame in a manner between the test chamber and the moving cavity and is provided with a plurality of the connecting cables.

The cable cavity includes: a first fixing plate, a plurality of first connectors of the plurality of connecting cables are fixed to the first fixing plate, and the first fixing The plate has a plurality of first setting holes, the plurality of first setting holes are arranged at a first interval, so that the plurality of first connectors are fixedly disposed according to the first interval; and the second fixing plate, the plurality of connecting cables are The plurality of second connectors are fixed to the second fixing plate, the second fixing plate has a plurality of second fixing holes, and the plurality of second setting holes are arranged at a second interval, so that the plurality of the second connectors are arranged according to the second connector The second interval is fixedly disposed, and the first interval and the second interval are different from each other.

The contact plate is detachably coupled to the conversion plate and the moving chamber.

The power supply module includes: a setting frame having a plurality of installation slots; a plurality of copper rods respectively inserted and fixed to the installation slots; and a cover for preventing the plurality of copper rods from being exposed to the outside, and the bottom depths of the plurality of the installation slots are mutually mutually Unlike the cover, the cover has a connection hole for connecting the plurality of power lines to the plurality of copper rods.

The present invention has the following effects.

First, as the contact plate and the moving cavity move, the working space can be secured, and thus the internal operation of the test board assembly becomes simpler.

Second, further, since the contact plate and the moving cavity move in a direction away from the region of the test cavity in the front-rear direction, the internal operation of the test board assembly becomes simpler.

Third, since it is easy to realize electrical connection of a plurality of test boards and a plurality of conversion boards, the time required for the operation is shortened, and the cumbersomeness is eliminated.

100‧‧‧ combined device

R‧‧ track

SB‧‧‧Support

TA‧‧‧ test board assembly

EM‧‧ electric motor

MB‧‧‧Installation base

MG‧‧‧Mobile Guide

S ₁ ‧‧‧Detector / First Tester

S ₂ ‧‧‧Detector/Second Detector

S ₃ ‧‧‧Detector/third detector

TM‧‧‧ test module

TS‧‧‧ test socket

110‧‧‧ test board

120‧‧‧ conversion board

130‧‧‧Connecting cable

131‧‧‧First connector

132‧‧‧Second connector

133‧‧‧Connected section

140‧‧‧Contact plate

150‧‧‧Test cavity

160‧‧‧ cable cavity

161‧‧‧ Containment frame

162‧‧‧First fixed plate

163‧‧‧Second fixed plate

164‧‧‧Handle

IH ₁ ‧‧‧First setting hole

IH ₂ ‧‧‧Second setting hole

D ₁ ‧‧‧First interval

D ₂ ‧‧‧second interval

170‧‧‧Power supply module

171‧‧‧Setting box

172a~172c‧‧‧Bronze rod

IS ₁ ~IS ₃ ‧‧‧Setting slot

173‧‧‧ cover

JH‧‧‧ connection hole

180‧‧‧moving cavity

181‧‧‧Handle

GB‧‧‧Guide bushing

IR‧‧‧Set track

IH‧‧‧ insertion hole

ES‧‧‧ containment space

190‧‧‧Setup module

191‧‧‧First mobile framework

192‧‧‧Fixed frame

193‧‧‧Second mobile framework

194‧‧‧Guide frame

194a‧‧‧rail

194b‧‧‧moving part

GS‧‧‧guide rod

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a bonding apparatus for testing electronic parts according to an embodiment of the present invention.

2 is a schematic diagram of a test module TM provided in a test board assembly which is the main structure of the bonding apparatus of FIG. 1.

Fig. 3 is an external perspective view of a test board assembly which is a main structure of the joining device of Fig. 1.

Fig. 4 is an exploded perspective view showing the main part of the test board assembly of Fig. 3 exploded.

Figure 5 is an exploded perspective view of a cable cavity suitable for use in the test board assembly of Figure 3.

6 is a partially exploded perspective view of a power supply module suitable for use in the test board assembly of FIG. 3.

Figure 7 is an exploded perspective view of a mounting module suitable for use in the test board assembly of Figure 3.

Fig. 8 shows a state in which the worker pulls the moving chamber forward.

Fig. 9 shows a state in which the worker moves the moving chamber to the right direction.

Hereinafter, for the sake of brevity of description, the repeated description will be omitted or compressed as much as possible, and a preferred embodiment of the present invention will be described.

1 is a schematic diagram of a bonding device 100 for electronic component testing (hereinafter simply referred to as "binding device") according to an embodiment of the present invention.

The bonding device includes a test board assembly TA, a support body SB, a mounting base MB, an electric motor EM, and a moving guide MG.

The test board assembly TA is combined with a sorting machine (not shown) and is provided with a plurality of test modules including test boards for testing semiconductor components as one type of electronic components. This test board assembly TA will be described below.

The support body SB is supported so that the test board assembly TA is at a predetermined height, so that the test board assembly TA is properly combined with the sorter.

The base MB is attached so that the support body SB is moved in the direction of the sorter side or in the opposite direction. Here, for convenience of explanation, the direction on the sorter side is defined as the front direction, and the opposite direction is defined as the rear direction. According to this direction definition, the support body SB will move in the forward and backward directions.

The electric motor EM provides power for moving the support body SB in the forward and backward directions.

The moving guide MG includes four rails R that guide the support body SB to move forward and backward.

On the other hand, the bonding apparatus 100 of the present embodiment may further include a plurality of detectors S ₁ , S ₂ , S ₃ and a controller for identifying the position of the moving support SB when the support body SB moves in the forward and backward directions ( Not shown).

The plurality of detectors S ₁ , S ₂ , and S _{3 are} provided in the mounting base MB, and function to remove the moving power of the support body SB or to stop the movement of the support body SB. Therefore, preferably, the support body SB is provided with an inductive device for detecting the positions of the support body SB by the plurality of detectors S ₁ , S ₂ , and S ₃ .

The first detector S ₁ detects the support SB moving in the forward direction. If the first detector S ₁ detects the support SB, the controller turns off the power of the electric motor EM to remove the moving power.

The second detector S ₂ detects the support SB moving in the backward direction. If the second detector S ₂ detects the support SB, the control unit turns off the power of the electric motor EM.

The third detector S ₃ serves to prevent excessive movement of the support body SB due to inertia. In order to stop the movement of the support body SB, the third detector S ₃ is used together with a brake device (not shown) that can control the rotary shaft of the electric motor EM, and if the third detector S ₃ detects the support body SB, The controller activates the brake device to stop the support body SB from moving inertially.

Of course, further, in order to limit the impact and excessive movement caused by the inertial movement of the support body SB, the bonding apparatus 100 of the present embodiment may have one or more brakes (not shown) of suitable materials.

In the above-described bonding apparatus 100, when the test board assembly TA is combined with the sorter, the electric motor EM is activated and the support body SB is moved in the forward direction, and when the work of the test board assembly TA is required, The electric motor EM is reversed to move the support body SB in the backward direction. In this case, the back and forth movement positions of the test board assembly TA can be appropriately controlled by the operation of the plurality of detectors S ₁ , S ₂ , S ₃ and the controller.

For reference, the controller is used to perform a function of controlling the operation of the electric motor EM to start, to start the electric motor EM or based on information from the detectors S ₁ , S ₂ , S ₃ according to a control signal from an operator operated by an operator. To control the work of the electric motor EM. In this case, the operator can be realized in the form of several buttons that are operable by the operator. For example, the operator may be provided with a plurality of selection buttons capable of selecting the advancement or retreat of the support body SB and a start button for activating the electric motor EM. Therefore, the operator can select the forward or reverse movement by operating the selection button, and operate the start button to advance or retract the support body SB in a predetermined direction. The operator is constructed as above to prevent mistakes caused by the operator's negligence and to ensure safety. Further, only the worker can set the support body SB to be movable by sequentially or simultaneously operating the start button while maintaining the operation of the selection button corresponding to the forward or backward movement. Further, in a state where any one of the selection button and the start button is operated, it is possible to design that the electric motor EM does not operate. Further, when the plurality of detectors S ₁ , S ₂ , and S ₃ described above detect that the support body SB has passed the predetermined position, the electric motor EM is not driven even if the operator holds the operation state of the operator. This setting is to prevent the conflict of the test board assembly TA due to the inadvertent start-up operation of the worker.

On the other hand, the control unit can be placed inside the operator, in which case the increase in cost and the increase in the size of the equipment due to the provision of an additional computer or server inside the bonding device 100 can be prevented.

For reference, FIG. 1 shows an embodiment in which the moving shaft MS rotates together and the support body SB is moved as the electric motor EM is driven, but in the course of implementation, the moving structure of the support body SB can be variously modified. For example, the movement of the support body may be realized by providing a long rack in the front-rear direction on the mounting base and a pinion having a rotation by the electric motor on the support side. When the rack and the pinion are used, the electric motor and the pinion can be moved together, and the rack and the pinion can be arranged in a paired manner on the left and right sides.

<About the description of the test module>

The test board assembly TA as the main structure of the bonding apparatus 100 in FIG. 1 is provided with a plurality of test modules TM.

2 is a simplified diagram of a test module TM disposed on the test board assembly TA.

The test module TM includes a test board 110, a conversion board 120, a connection cable, and a contact board 140.

The test board 110 reads the pass or fail with respect to the electronic components supplied by the sorter, and controls the conversion board 120 so that the conversion board 120 transmits a test signal to the plurality of electronic parts.

After the conversion board 120 transmits a test signal to the electronic component through the control of the test board 110, the feedback signal from the electronic component is converted into a read signal readable by the test board 110 and supplied to the test board 110. Therefore, the conversion board 120 can be named as a protocol board. Such a conversion board 120 can be electrically connected to the test board 110 through a connection cable 130 to be detachably coupled to the connection cable 130.

The connection cable 130 electrically connects the test board 110 and the conversion board 120 to each other. This connection cable 130 includes a first connector 131, a second connector 132, and a connection portion 133.

The first connector 131 is electrically connected to the test board 110.

The second connector 132 is electrically connected to the conversion board 120.

The connecting portion 133 electrically connects the first connector 131 and the second connector 132, and the connecting portion 133 is preferably made of a flexible material such as a flexible printed circuit board coated with a copper wire.

On the other hand, due to the test board 110 in each test module TM When the signal movement time between the conversion board 120 and the conversion board 120 are different from each other, the test result may be erroneous due to the time difference. Therefore, in order to eliminate the signal time difference or the unplanned error, the connection cable provided in the plurality of test modules TM is connected. The plurality of copper wires of 130 preferably all have the same length and thickness. Also, there is a gap between the test board 110 and the conversion board 120 due to the connection portion 133, which serves to prevent direct transfer of heat which may occur during the test of the electronic component. Further, the connection portion 133 of the flexible material prevents the work impact force from being transmitted to the test board 110 when replacement or repair of components other than the test board 110 is performed.

The contact plate 140 is electrically coupled to the conversion plate 120 and has a plurality of test sockets TS in electrical contact with a plurality of electronic components supplied by the sorter. Of course, one contact plate 140 is provided with a plurality of test sockets TS. Further, the contact plate 140 is detachably coupled to a moving cavity to be described later.

In the present invention, it is combined with the contact plate in a detachable manner in order to improve compatibility. For example, the classification opportunities vary depending on the type of electronic component that needs to be tested. Thereby, the interval between the plurality of electronic components supplied by the sorter also changes. However, each time a test machine including a test socket having an interval corresponding thereto is purchased, it is not worth selecting in terms of operation or cost. Therefore, in the present invention, in the case of replacing the sorter or the electronic component to be tested, the same tester can be used as usual simply by replacing the contact plate 140. That is, the contact plate 140 having the test socket in electrical contact with the plurality of electronic components supplied from the sorter is additionally provided for use in a manner of being detached as needed. And in case, just in case, the conversion board 120 as described above can also be replaced, so that the conversion board 120 can be more A variety of electronic components are compatible.

<About the description of the test board assembly>

3 is an external perspective view of the test board assembly TA, and FIG. 4 is an exploded perspective view of a main part of the test board assembly TA.

The test board assembly TA includes: a plurality of test boards 110, a plurality of conversion boards 120, a plurality of connection cables 130, a plurality of contact boards 140, a test cavity 150, a cable cavity 160, a power supply module 170, and a moving cavity 180. And setting the module 190.

The plurality of test boards 110, the plurality of conversion boards 120, the plurality of connection cables 130, and the plurality of contact sheets 140 have been described above, and thus the omission thereof is omitted.

The test chamber 150 houses a plurality of test panels 110 therein. The test board 110 is moved forward from the rear direction by the operation of the operator and is housed inside the test chamber 150. To this end, a plurality of setting rails IR are provided inside the test chamber 150, and the plurality of setting rails IR have setting grooves for inserting and setting a plurality of test boards 110.

The cable cavity 160 is located between the test cavity 150 and the moving cavity 180 and is provided with a plurality of connecting cables 130. As shown in the exploded perspective view of FIG. 5, the cable cavity 160 includes a receiving frame 161, a first fixing plate 162, a second fixing plate 163, and a handle 164.

The receiving frame 161 holds the space between the first fixing plate 162 and the second fixing plate 163 to form a receiving space ES in which the connecting portion 133 of the connecting cable 130 can be accommodated.

The first fixing plate 162 faces the test board 110 side in the test cavity 150 for fixing the plurality of first connectors 131 of the plurality of connection cables 130. Such first fixing plate 162 having a plurality of first apertures disposed the IH _1, the plurality of first apertures disposed according to the IH _{1 1} D are formed are arranged a first interval, a first plurality of connectors 131 in accordance with a first fixed interval D ₁ Settings.

The second fixing plate 163 faces the side of the conversion plate 120 in the moving cavity 180 and is used to fix the plurality of second connectors 132 of the plurality of connection cables 130. And, a second plate 163 having a plurality of second fixing holes provided IH _2, the plurality of second holes provided IH ₂ D ₂ formed in the second spacer are arranged so that a plurality of second connector 132 according to a second fixed distance D ₂ Settings.

On the other hand, the area between the plurality of conversion plates 120 or the inner space of the moving cavity 180 of the plurality of conversion plates 120 is limited by the arrangement of the plurality of test sockets TS, but the internal space of the test cavity 150 is The area does not need to be limited by the arrangement of multiple test sockets TS. For example, the test board 110 should be provided with a solid state drive (SSD) or a mini computer, etc., depending on the situation, and need to be replaced with a new test board 110 that further expands the width of the existing test board 110. Therefore, preferably, the interval between the plurality of test boards 110 accommodated in the internal space of the test chamber 150 should be wider than the interval between the plurality of conversion boards 120 subject to the interval between the test sockets TS. . Because of this necessity, and therefore preferably, a plurality of first apertures disposed a first distance D between the IH ₁₁ is greater than the second plurality of apertures disposed a second distance D between the IH _22. However, the first fixing plate 162 and the second fixing plate 163 should be disposed in parallel. In this case, each provided corresponding to a first plurality of holes and a plurality of second _{settings. 1} IH IH linear distance between the holes ₂ different from each other. Further, in this configuration, in order to make the lengths of the plurality of connection portions 133 of the plurality of connection cables 130 accommodated in the housing space ES of the cable cavity 160 the same, preferably, the plurality of connection portions 133 are bent at least once. The folded manner or the plurality of connecting portions 133 are formed of a flexible material that is bendable. Therefore, the degree of bending or bending of the plurality of connecting portions 133 of the plurality of connecting cables 130 may be different from each other, or may be in a nearly straight form.

The handle 164 is used when the operator pulls out the cable cavity 160.

The power supply module 170 is coupled to the outside of the test cavity 150. Such a power supply module 170 is provided to supply an operating power source such as the test board 110. In the bonding apparatus 100 of the present embodiment, since the operating voltages of the plurality of constituent members constituting the test board assembly TA are different from each other, a plurality of power sources are required. However, if three power supply lines are respectively extracted from dozens of test modules TM and directly connected to the power supply, the setting of the power supply line becomes complicated, and the connection is also very cumbersome. Therefore, a power supply module 170 for relay power supply is connected between the power source and the plurality of test boards 110. As shown in FIG. 6, the power supply module 170 includes a setting frame 171, three copper rods 172a, 172b, and 172c, and a cover 173.

The installation frame 171 includes three installation grooves IS ₁ , IS ₂ , and IS ₃ into which three copper bars 172a, 172b, and 172c can be inserted and fixed. Further, the depths of the bottoms of the three installation grooves IS ₁ , IS ₂ , and IS ₃ are also different. Accordingly, the lengths of the copper bars 172a, 172b, and 172c may be different from each other.

The three copper rods 172a, 172b, and 172c are respectively inserted into the three installation grooves IS ₁ , IS ₂ , and IS ₃ . In this case, since the bottom depths of the three installation grooves IS ₁ , IS ₂ , and IS ₃ are different from each other, the installation depths of the three copper bars 172a, 172b, and 172c are also different from each other. Therefore, there is no fear of confusing the power supplied from the three copper rods 172a, 172b, 172c.

The cover 173 is covered so that the three copper bars 172a, 172b, and 172c are not exposed to the outside. Of course, since a plurality of power lines are to be connected to the three copper rods 172a, 172b, and 172c, the cover 173 is provided with a plurality of connection holes JH for connecting the plurality of power lines to the three copper rods 172a, 172b, and 172c. .

Since the power supply module 170 is provided as described above, the necessary power can be obtained from the three copper rods 172a, 172b, and 172c provided in the power supply module 170, so that the assemblability is improved, and there is no fear of confusion such as an erroneous connection of the power supply.

The moving cavity 180 houses a plurality of conversion plates 120 therein. The conversion plate 120 is moved rearward and backward by the operation of the operator, and is housed inside the movement cavity 180. To this end, an insertion hole IH for inserting and providing a plurality of conversion plates 120 is provided inside the moving cavity 180. This moving cavity 180 is combined with the setting module 190.

On the other hand, a plurality of contact plates 140 are detachably provided in front of the moving cavity 180. Further, the plurality of test sockets TS provided on the plurality of contact plates 140 are electrically connected to the plurality of conversion plates 120 housed in the movable cavity 180. The moving chamber 180 is provided with a handle 181 which can pull the moving chamber 180 forward or push the moving chamber 180 rearward, and can also push the moving chamber 180 in the right and left direction.

The module 190 is disposed to dispose the moving cavity 180 and the test cavity 150 relative to each other. To this end, as shown in the exploded perspective view of FIG. 7, the setting module 190 includes a first moving frame 191, a fixed frame 192, a second moving frame 193, and a guiding frame 194.

The first moving frame 191 is combined with the test cavity 150 in such a manner as to be movable in the front-rear direction.

The fixing frame 192 is disposed such that the cable cavity 160 moves in the front-rear direction with respect to the test cavity 150. This fixing frame 192 is provided with six guide bars GS which are combined with the first moving frame 191 and which are long in the front-rear direction. Such six guide bars GS are inserted into the six guide bushings GB (refer to FIG. 4) provided to the test cavity 150 to guide the forward movement of the first moving frame 191 and the fixed frame 192. Also, the six guide bars GS may combine the fixed frame 192 and the first moving frame 191 in a manner of relative movement with the test cavity 150 in the front-rear direction.

The second moving frame 193 is combined with the first moving frame 191 in such a manner as to be movable in a direction perpendicular to the front-rear direction (left-right direction in the drawing). The front side of this second moving frame 193 is combined with the moving cavity 180.

The guide frame 194 is combined with the first moving frame 191 in such a manner that the second moving frame 193 is moved in the left-right direction. To this end, the guide frame 194 is provided with a guide rail 194a and a moving portion 194b.

The guide rail 194a is of a folded type, and is coupled to the first moving frame 191 so as to move in a predetermined interval in the left-right direction, and guides the left and right movement of the moving portion 194b. That is, the guide rail 194a itself also moves in the left-right direction by a predetermined distance, and also guides the movement of the moving portion 194b in the left-right direction.

The moving portion 194b is coupled to the guide rail 194a in such a manner as to move a predetermined distance in the left-right direction. And, the second moving frame 193 is fixedly coupled to the moving portion 194b.

Next, the main part of the bonding apparatus 100 having the above structure The work is explained.

When the bonding apparatus 100 needs to perform the work inside the test board assembly TA in a state where the test board assembly TA is combined with the sorter, the electric motor EM is activated to retract the test board assembly TA rearward.

For example, FIG. 3 can be understood as a perspective view of a main portion of the test board assembly TA in a state where the test board assembly TA is retracted.

In the state shown in FIG. 3, the operator holds the handle 181 to pull the moving cavity 180 forward, thereby widening the interval between the test cavity 150 and the cable cavity 160, as described in FIG.

In the state shown in FIG. 8, after the operator separates the contact plate 140 from the moving chamber 180, the operator pulls the conversion plate 120 accommodated in the moving chamber 180 forward to separate. Further, as shown in FIG. 9, the moving chamber 180 is pushed to the right side to move the moving chamber 180 to the right side. In this case, since the moving distance of the moving cavity 180 is sufficiently ensured by the folding rail 194a, the moving cavity 180 is disposed to be completely detached from the area of the test board 110 as viewed from the front-rear direction.

In the state shown in FIG. 9, the worker can replace the cable cavity 160 in which the plurality of connection cables 130 are mounted as a whole, or perform an operation of replacing the individual connection cable 130 that has failed. Further, if it is necessary to work behind the cable cavity 160, the cable cavity 160 can be removed together and the work can be performed.

After the completion of the work, the moving cavity 180 is moved in the reverse direction by the reverse operation of the above operation. In this case, the plurality of test boards 110 and the plurality of conversion boards 120 can be accurately powered by the action of the cable cavity 160. connection. Of course, since the conversion board 120 is electrically connected to the test socket TS, the electrical connection between the test board 110 and the test socket TS is finally realized in a simple manner.

Further, the operator activates the electric motor EM or the like to combine the test board assembly TA with the sorter.

As described above, the present invention has been specifically described based on the embodiments with reference to the accompanying drawings, but the above-described embodiments are merely preferred examples of the present invention, and the present invention is not limited to the above-described embodiments, and the scope of the present invention should be The scope of the claimed invention and its equivalents shall govern.

190‧‧‧Setup module

191‧‧‧First mobile framework

192‧‧‧Fixed frame

193‧‧‧Second mobile framework

194‧‧‧Guide frame

194a‧‧‧rail

194b‧‧‧moving part

GS‧‧‧guide rod

Claims (8)

A binding device for testing electronic components, comprising: a conversion board, after transmitting a test signal to the electronic component through control of the test board, converting a feedback signal from the electronic component into a readable read signal, and providing the test board to the aforementioned test board, The test board is used for reading the electronic component supplied by the sorting machine; connecting the cable to electrically connect the test board and the conversion board to each other; the contact board is electrically connected to the conversion board, and has a supply with the sorting machine. a plurality of test sockets electrically contacting the plurality of electronic components; a test cavity for accommodating the test board; and a power supply module coupled with the test cavity for supplying power to the test board; and moving the cavity for receiving The conversion plate is disposed in a manner capable of relatively moving the test cavity; the module is disposed such that the moving cavity is disposed in a manner capable of relatively moving the test cavity; and the support body is configured to enable the test cavity , moving the cavity and setting the module at a predetermined height; supporting the base to enable the support to be forward Front-rear direction or in the opposite direction of movement of the sorter side is mounted, the cavity and the movable module is provided in combination. The device for testing an electronic component according to claim 1, wherein the setting module comprises: a first moving frame coupled to the test cavity in a manner capable of moving in a forward and backward direction; and a second moving frame coupled to the first moving frame in such a manner as to be movable in a direction perpendicular to the front-rear direction, and The moving cavity is coupled; and the guiding frame is configured to movably couple the second moving frame to the first moving frame and guide the second moving frame to move in a direction perpendicular to the front-rear direction. The electronic component testing bonding device according to claim 2, wherein the guide frame has a folding guide rail for guiding the second moving frame to move in a direction perpendicular to the front-rear direction. The electronic component testing bonding device according to claim 3, wherein the moving cavity combined with the second moving frame by the folding rail and the second moving frame can be completely detached from the area of the test board as viewed from the front-rear direction. Mode configuration. The electronic component testing bonding device according to claim 2, further comprising a cable cavity, which is combined with the first moving frame in a manner of being located between the test cavity and the moving cavity, and is provided with a plurality of The aforementioned connecting cable. The electronic component testing bonding device according to claim 5, wherein the cable cavity comprises: a first fixing plate, wherein the plurality of first connectors of the plurality of connecting cables are fixed to the first fixing plate, the first fixing Board has multiple a first installation hole, the plurality of first installation holes are arranged at a first interval, so that a plurality of the first connectors are fixedly disposed at a first interval; and a second fixing plate, a plurality of the second plurality of the connection cables The connector is fixed to the second fixing plate, the second fixing plate has a plurality of second installation holes, and the plurality of second installation holes are arranged at a second interval, so that the plurality of the second connectors are fixed according to the second interval. The first interval and the second interval are different from each other. The electronic component testing bonding device according to claim 1, wherein the contact plate is detachably coupled to the conversion plate and the moving cavity. The electronic component testing bonding device according to claim 1, wherein the power supply module includes: a setting frame having a plurality of installation slots; a plurality of copper rods respectively inserted and fixed to the installation slots; and a cover to prevent the plurality of The copper rod is exposed to the outside; the depths of the bottoms of the plurality of the aforementioned grooves are different from each other, and the cover has a connection hole for connecting the plurality of power lines to the plurality of copper rods.