TWI607827B - Processing device - Google Patents

Processing device Download PDF

Info

Publication number
TWI607827B
TWI607827B TW105116575A TW105116575A TWI607827B TW I607827 B TWI607827 B TW I607827B TW 105116575 A TW105116575 A TW 105116575A TW 105116575 A TW105116575 A TW 105116575A TW I607827 B TWI607827 B TW I607827B
Authority
TW
Taiwan
Prior art keywords
support
support rod
workpiece
processing
position information
Prior art date
Application number
TW105116575A
Other languages
English (en)
Chinese (zh)
Other versions
TW201739571A (zh
Inventor
Hikaru Hatazawa
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of TW201739571A publication Critical patent/TW201739571A/zh
Application granted granted Critical
Publication of TWI607827B publication Critical patent/TWI607827B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
    • B23Q3/06—Work-clamping means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
    • B23Q1/03—Stationary work or tool supports
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Laser Beam Processing (AREA)
  • Jigs For Machine Tools (AREA)
  • Machine Tool Units (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
TW105116575A 2016-05-13 2016-05-27 Processing device TWI607827B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2016/064239 WO2017195342A1 (ja) 2016-05-13 2016-05-13 加工装置

Publications (2)

Publication Number Publication Date
TW201739571A TW201739571A (zh) 2017-11-16
TWI607827B true TWI607827B (zh) 2017-12-11

Family

ID=60268031

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105116575A TWI607827B (zh) 2016-05-13 2016-05-27 Processing device

Country Status (3)

Country Link
JP (1) JP6354931B2 (ja)
TW (1) TWI607827B (ja)
WO (1) WO2017195342A1 (ja)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5363308A (en) * 1992-12-02 1994-11-08 General Electric Company Method for automating the optimization of tool path generation for profile milling
JPH07299682A (ja) * 1994-04-28 1995-11-14 Nippei Toyama Corp 加工装置及び加工方法
TW200527522A (en) * 2003-06-20 2005-08-16 Sumitomo Electric Industries Method of producing semiconductor single crystal wafer and laser processing device for thereof
WO2009105608A1 (en) * 2008-02-20 2009-08-27 Automatic Feed Company Progressive laser blanking device for high speed cutting
CN101855061A (zh) * 2007-09-17 2010-10-06 3D系统公司 利用实体自由成形制造生产的零件的基于区域的支撑件
US20120109352A1 (en) * 2009-07-09 2012-05-03 Amada Company, Limited Nesting data generation device and nesting data generation method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0507033B1 (en) * 1991-04-05 1995-02-01 Manuel Torres Martinez Machine tool installation for supporting and machining workpieces
JP3113349B2 (ja) * 1991-11-28 2000-11-27 株式会社日平トヤマ レーザ加工機のワーク支持テーブル
WO2013104741A1 (en) * 2012-01-13 2013-07-18 Materialise N.V. Locator for supporting and/or positioning an object

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5363308A (en) * 1992-12-02 1994-11-08 General Electric Company Method for automating the optimization of tool path generation for profile milling
JPH07299682A (ja) * 1994-04-28 1995-11-14 Nippei Toyama Corp 加工装置及び加工方法
TW200527522A (en) * 2003-06-20 2005-08-16 Sumitomo Electric Industries Method of producing semiconductor single crystal wafer and laser processing device for thereof
CN101855061A (zh) * 2007-09-17 2010-10-06 3D系统公司 利用实体自由成形制造生产的零件的基于区域的支撑件
WO2009105608A1 (en) * 2008-02-20 2009-08-27 Automatic Feed Company Progressive laser blanking device for high speed cutting
US20120109352A1 (en) * 2009-07-09 2012-05-03 Amada Company, Limited Nesting data generation device and nesting data generation method

Also Published As

Publication number Publication date
JPWO2017195342A1 (ja) 2018-08-09
JP6354931B2 (ja) 2018-07-11
WO2017195342A1 (ja) 2017-11-16
TW201739571A (zh) 2017-11-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees