TWI607522B - Processing machine - Google Patents
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- TWI607522B TWI607522B TW105132175A TW105132175A TWI607522B TW I607522 B TWI607522 B TW I607522B TW 105132175 A TW105132175 A TW 105132175A TW 105132175 A TW105132175 A TW 105132175A TW I607522 B TWI607522 B TW I607522B
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Description
本發明係關於一種加工設備，尤指一種能用於自動化生產線之拋光設備或研磨設備。 The present invention relates to a processing apparatus, and more particularly to a polishing apparatus or a grinding apparatus that can be used in an automated production line.
習知半導體製程中，晶圓於製造完成後，會進行薄化加工，其包含研磨作業與拋光作業，之後才會進行切單、封裝等製程。在光學玻璃製程領域中，作為濾光片的濾光玻璃片(或稱為濾光晶片)亦需要經過研磨作業與拋光作業，以得到符合產品規格之尺寸。 In the conventional semiconductor manufacturing process, after the wafer is manufactured, the wafer is thinned, which includes the grinding operation and the polishing operation, and then the cutting and packaging processes are performed. In the field of optical glass manufacturing, filter glass sheets (or filter wafers) as filters also need to be subjected to grinding and polishing operations to obtain dimensions that meet product specifications.
一般而言，於研磨作業(或拋光作業)時，如第1A圖所示之機台1，係將複數晶片10以真空吸附方式置放於承載墊11上，再塗佈化學液，之後將加工治具12置放於該些晶片10上研磨(或拋光)該些晶片10。待研磨(或拋光)完成後，破真空以將該加工治具12往上移動而遠離該些晶片10，再取出該些晶片10。 Generally, in the polishing operation (or polishing operation), the machine 1 shown in FIG. 1A places the plurality of wafers 10 on the carrier pad 11 by vacuum adsorption, and then applies the chemical liquid, and then The processing jig 12 is placed on the wafers 10 to polish (or polish) the wafers 10. After the polishing (or polishing) is completed, the vacuum is broken to move the processing fixture 12 upward away from the wafers 10, and the wafers 10 are removed.
然而，於研磨(或拋光)該些晶片10時，需使用化學液，因而該些化學液與該些晶片10之間會產生表面張力f，使該些晶片10會貼附於該承載墊11與該加工治具12上，導致當該加工治具12往上移動時，部分該晶片10因 貼附於該加工治具12上而一併往上移動，如第1B圖所示，故於後續步驟需以人工方式取出該些晶片10，因而容易破壞該些晶片10，致使良率不易提高。 However, when the wafers 10 are ground (or polished), a chemical liquid is used, so that a surface tension f is generated between the chemical liquids and the wafers 10, so that the wafers 10 are attached to the carrier pads 11. And the processing jig 12, causing a portion of the wafer 10 to be caused when the processing jig 12 moves upward Attached to the processing jig 12 and moved upwards, as shown in FIG. 1B, the wafers 10 need to be manually removed in subsequent steps, thereby easily damaging the wafers 10, resulting in an unfavorable yield. .
再者，若以機器手臂(圖略)取出該些晶片10，由於該些晶片10分佈於該承載墊11與該加工治具12上，需花費更多時間一一取出該些晶片10，且該機器手臂需克服該表面張力f，但各該晶片10所對應之表面張力f係不相同，因而難以調控該機器手臂之抓取力，故難以用於自動化生產線。 Furthermore, if the wafers 10 are taken out by the robot arm (not shown), since the wafers 10 are distributed on the carrier pad 11 and the processing jig 12, it takes more time to take out the wafers 10 one by one, and The machine arm needs to overcome the surface tension f, but the surface tension f corresponding to each of the wafers 10 is different, so that it is difficult to adjust the gripping force of the robot arm, so it is difficult to use in an automated production line.
因此，如何克服習知技術之種種問題，實為一重要課題。 Therefore, how to overcome various problems of the prior art is an important issue.
為解決上述習知技術之問題，本發明遂揭露一種加工機台，係包括：機台本體，係具有相對之第一側與第二側；第一承載件，係設於該機台本體之第一側上並具有第一定位部與設於該第一定位部中之至少一第一分離部，且該第一定位部與該第一分離部係組構為供相對位移者；以及第二承載件，係設於該機台本體之第二側上並具有第二定位部與設於該第二定位部中之至少一第二分離部，且該第二定位部與該第二分離部係組構為供相對位移者，其中，於加工時，於該第一承載件與該第二承載件之間係夾設至少一加工件。 In order to solve the above problems in the prior art, the present invention discloses a processing machine, comprising: a machine body having opposite first and second sides; and a first carrier disposed on the machine body The first positioning portion has at least one first separating portion disposed on the first positioning portion, and the first positioning portion and the first separating portion are configured to be relatively displaced; and The second carrier is disposed on the second side of the machine body and has a second positioning portion and at least one second separation portion disposed in the second positioning portion, and the second positioning portion is separated from the second portion The faculty is configured as a relative displacement, wherein at least one workpiece is interposed between the first carrier and the second carrier during processing.
前述之加工機台中，該機台本體係為拋光機配備或研磨機配備。 In the aforementioned processing machine, the machine system is equipped with a polishing machine or a grinder.
前述之加工機台中，該第一定位部係為板體。 In the aforementioned processing machine, the first positioning portion is a plate body.
前述之加工機台中，該第一分離部係為柱體。 In the above processing machine, the first separating portion is a cylinder.
前述之加工機台中，於加工時，該第一定位部之表面係齊平該第一分離部之表面。 In the above processing machine, the surface of the first positioning portion is flush with the surface of the first separating portion during processing.
前述之加工機台中，該第一承載件係具有複數對應單一該加工件之第一分離部。 In the aforementioned processing machine, the first carrier has a plurality of first separating portions corresponding to a single workpiece.
前述之加工機台中，該第二定位部係為板體。 In the aforementioned processing machine, the second positioning portion is a plate body.
前述之加工機台中，該第二分離部係為柱體。 In the above processing machine, the second separation portion is a cylinder.
前述之加工機台中，於加工時，該第二定位部之表面係齊平該第二分離部之表面。 In the above processing machine, the surface of the second positioning portion is flush with the surface of the second separating portion during processing.
前述之加工機台中，該第二承載件係具有複數對應單一該加工件之第二分離部。 In the aforementioned processing machine, the second carrier has a plurality of second separating portions corresponding to a single workpiece.
由上可知，本發明之加工機台中，主要藉由該第一定位部與該第一分離部係組構為供相對位移者，且該第二定位部與該第二分離部係組構為供相對位移者，以於研磨或拋光該加工件後，依序移動該第二定位部、該第二分離部與該第一分離部，即可大幅減少該化學液之表面張力對該加工件之吸附力，使該加工件能順利脫離該第一定位部，且不會貼附於該第二承載件上，故於後續步驟能以機器手臂取出該加工件而無需以人工方式移取該加工件，且易於調控該機器手臂之抓取力，以利於應用於自動化生產線。 As can be seen from the above, in the processing machine of the present invention, the first positioning portion and the first separating portion are mainly configured to be relatively displaced, and the second positioning portion and the second separating portion are configured as For the relative displacement, after grinding or polishing the workpiece, sequentially moving the second positioning portion, the second separation portion and the first separation portion, the surface tension of the chemical liquid can be greatly reduced to the workpiece The adsorption force enables the workpiece to be smoothly separated from the first positioning portion and is not attached to the second carrier, so that the workpiece can be taken out by the robot arm in a subsequent step without manually removing the workpiece. The workpiece is machined and the grip of the robot arm is easily adjusted to facilitate application to an automated production line.
1‧‧‧機台 1‧‧‧ machine
10‧‧‧晶片 10‧‧‧ wafer
11‧‧‧承載墊 11‧‧‧ carrying mat
12‧‧‧加工治具 12‧‧‧Processing fixture
2‧‧‧加工機台 2‧‧‧Processing machine
20‧‧‧加工件 20‧‧‧Processed parts
21‧‧‧第一承載件 21‧‧‧First carrier
210‧‧‧第一定位部 210‧‧‧First Positioning Department
211‧‧‧第一分離部 211‧‧‧The first separation department
22‧‧‧第二承載件 22‧‧‧Second carrier
220‧‧‧第二定位部 220‧‧‧Second Positioning Department
221‧‧‧第二分離部 221‧‧‧Second Separation Department
A,B,C‧‧‧箭頭方向 A, B, C‧‧‧ arrow direction
f‧‧‧表面張力 f‧‧‧Surface tension
t‧‧‧距離 Distance from t‧‧‧
第1A至1B圖係為習知研磨或拋光作業之剖面示意圖； 第2A至2D圖係為使用本發明之加工機台進行加工製程之剖面示意圖；以及第3A及3B圖係為第2A圖之加工機台之局部上視平面圖。 1A to 1B are schematic cross-sectional views of conventional grinding or polishing operations; 2A to 2D are schematic cross-sectional views showing a processing process using the processing machine of the present invention; and Figs. 3A and 3B are partial top plan views of the processing machine of Fig. 2A.
以下藉由特定的具體實施例說明本發明之實施方式，熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本發明之其他優點及功效。 The other embodiments of the present invention will be readily understood by those skilled in the art from this disclosure.
須知，本說明書所附圖式所繪示之結構、比例、大小等，均僅用以配合說明書所揭示之內容，以供熟悉此技藝之人士之瞭解與閱讀，並非用以限定本發明可實施之限定條件，故不具技術上之實質意義，任何結構之修飾、比例關係之改變或大小之調整，在不影響本發明所能產生之功效及所能達成之目的下，均應仍落在本發明所揭示之技術內容得能涵蓋之範圍內。同時，本說明書中所引用之如「上」、「第一」、「第二」及「一」等之用語，亦僅為便於敘述之明瞭，而非用以限定本發明可實施之範圍，其相對關係之改變或調整，在無實質變更技術內容下，當亦視為本發明可實施之範疇。 It is to be understood that the structure, the proportions, the size, and the like of the present invention are intended to be used in conjunction with the disclosure of the specification, and are not intended to limit the invention. The conditions are limited, so it is not technically meaningful. Any modification of the structure, change of the proportional relationship or adjustment of the size should remain in this book without affecting the effects and the objectives that can be achieved by the present invention. The technical content disclosed in the invention can be covered. In the meantime, the terms "upper", "first", "second" and "one" are used in the description, and are not intended to limit the scope of the invention. Changes or adjustments in the relative relationship are considered to be within the scope of the present invention.
第2A圖係為本發明之加工機台2之剖面示意圖。如第2A圖所示，該加工機台2係包括：一機台本體、一第一承載件21以及一第二承載件22。 2A is a schematic cross-sectional view of the processing machine 2 of the present invention. As shown in FIG. 2A, the processing machine 2 includes a machine body, a first carrier 21 and a second carrier 22.
所述之機台本體係具有相對之第一側(如圖所示之下側)與第二側(如圖所示之上側)。 The machine system has a first side (the lower side as shown) and a second side (the upper side as shown).
於本實施例中，該機台本體係以拋光機配備或研磨機配備為例以加工至少一加工件20，且因其整體機構極為複雜，故於圖中係省略繪示該機台本體，但該機台本體之種類不限於上述。 In this embodiment, the machine system is exemplified by a polishing machine or a grinder, and at least one workpiece 20 is processed. Because the overall mechanism is extremely complicated, the machine body is omitted in the figure, but The type of the machine body is not limited to the above.
再者，該加工件20係為欲拋光件或欲研磨件，如玻璃、晶圓、晶片或其它結構等。 Moreover, the workpiece 20 is a piece to be polished or an object to be polished, such as glass, wafer, wafer or other structure.
所述之第一承載件21係設於該機台本體之第一側上並具有一第一定位部210與一設於該第一定位部210中之第一分離部211，且該第一定位部210與該第一分離部211係組構為供相對位移者。舉例而言，此相對位移包括該第一定位部210維持靜止，但第一分離部211向上移動，以推升該加工件20。 The first carrier 21 is disposed on the first side of the machine body and has a first positioning portion 210 and a first separating portion 211 disposed in the first positioning portion 210, and the first The positioning unit 210 and the first separating unit 211 are configured to be relatively displaced. For example, the relative displacement includes the first positioning portion 210 remaining stationary, but the first separating portion 211 is moved upward to push the workpiece 20.
於本實施例中，該第一定位部210係為板體，且該第一分離部211係為圓柱體，並於組裝後以及加工時，該第一定位部210接觸該加工件20之表面係齊平該第一分離部211接觸該加工件20之表面。 In the embodiment, the first positioning portion 210 is a plate body, and the first separating portion 211 is a cylinder, and the first positioning portion 210 contacts the surface of the workpiece 20 after assembly and processing. The first separating portion 211 is flushed to contact the surface of the workpiece 20.
所述之第二承載件22係設於該機台本體之第二側上並具有一第二定位部220與一設於該第二定位部220中之第二分離部221，且該第二定位部220與該第二分離部221係組構為供相對位移者。舉例而言，此相對位移包括該第二定位部220向上移動，但第二分離部221暫時維持靜止，以令該加工件20與第二定位部220分離。此外，在該加工件20與第二定位部220分離後，該第二分離部221接續向上移動，以脫離該加工件20。 The second carrier 22 is disposed on the second side of the machine body and has a second positioning portion 220 and a second separating portion 221 disposed in the second positioning portion 220, and the second The positioning unit 220 and the second separation unit 221 are configured to be relatively displaced. For example, the relative displacement includes the second positioning portion 220 moving upward, but the second separating portion 221 temporarily remains stationary to separate the workpiece 20 from the second positioning portion 220. In addition, after the workpiece 20 is separated from the second positioning portion 220, the second separating portion 221 is continuously moved upward to disengage the workpiece 20.
於本實施例中，該第二定位部220係為板體，且該第二分離部221係為圓柱體，並於組裝後以及加工時，該第二定位部220接觸該加工件20之表面係齊平該第二分離部221接觸該加工件20之表面。 In this embodiment, the second positioning portion 220 is a plate body, and the second separating portion 221 is a cylinder, and the second positioning portion 220 contacts the surface of the workpiece 20 after assembly and processing. The second separating portion 221 is flushed to contact the surface of the workpiece 20.
於使用該加工機台2進行加工時，如第2A圖所示，將至少一加工件20設於該第一承載件21上，再將化學液灑覆於該加工件20上，之後將該加工件20夾設於該第一承載件21與該第二承載件22之間，使該加工件20之下表面係貼合於該第一定位部210之表面與該第一分離部211之表面上，而該加工件20之上表面係貼合於該第二定位部220之表面與該第二分離部221之表面上，且該加工件20對應覆蓋於該第一與第二定位部210,220上。接著，於真空狀態下，研磨或拋光該加工件20。 When processing using the processing machine 2, as shown in FIG. 2A, at least one processing member 20 is disposed on the first carrier 21, and then chemical liquid is sprinkled on the workpiece 20, and then The workpiece 20 is disposed between the first carrier 21 and the second carrier 22 such that the lower surface of the workpiece 20 is attached to the surface of the first positioning portion 210 and the first separation portion 211. On the surface, the upper surface of the workpiece 20 is attached to the surface of the second positioning portion 220 and the surface of the second separation portion 221, and the workpiece 20 is correspondingly covered by the first and second positioning portions. 210,220. Next, the workpiece 20 is ground or polished under vacuum.
於完成拋光作業或研磨作業後，係於破真空狀態下，取出該加工件20，如第2B至2D圖所示，具體如下說明。 After the polishing operation or the polishing operation is completed, the workpiece 20 is taken out under vacuum, as shown in FIGS. 2B to 2D, and the details are as follows.
如第2B圖所示，藉由該第二定位部220與該第二分離部221係組構為供相對位移者，以利用一位移機構(圖略)向上移動(如第2B圖所示之箭頭方向A)該第二定位部220，令該第二分離部221相對地凸伸出該第二定位部220，使該加工件20之上表面僅接觸該第二分離部221。 As shown in FIG. 2B, the second positioning portion 220 and the second separating portion 221 are configured to be relatively displaced, and are moved upward by a displacement mechanism (not shown) (as shown in FIG. 2B). In the direction of the arrow A), the second positioning portion 220 protrudes from the second positioning portion 220 so that the upper surface of the workpiece 20 only contacts the second separating portion 221.
如第2C圖所示，向上移動(如第2C圖所示之箭頭方向B)該第二分離部221，令該加工件20之上表面與該第二分離部221相分離，使該加工件20僅接觸該第一定位部210與該第一分離部211。 As shown in FIG. 2C, the second separating portion 221 is moved upward (as indicated by the arrow direction B in FIG. 2C), so that the upper surface of the workpiece 20 is separated from the second separating portion 221, so that the workpiece is processed. 20 only contacts the first positioning portion 210 and the first separating portion 211.
應可理解地，亦可藉由該第一承載件21與該第二承載件22係組構為供相對位移者，以利用另一位移機構(圖略)向上移動(如第2C圖所示之箭頭方向B)該第二承載件22(即同時移動該第二定位部220與該第二分離部221)，令該加工件20之上表面與該第二分離部221相分離。 It should be understood that the first carrier 21 and the second carrier 22 can be configured as relative displacements to move upwards by using another displacement mechanism (not shown) (FIG. 2C). The direction of the arrow B) the second carrier 22 (ie, simultaneously moving the second positioning portion 220 and the second separating portion 221) separates the upper surface of the workpiece 20 from the second separating portion 221.
如第2D圖所示，藉由該第一定位部210與該第一分離部211係組構為供相對位移者，以利用其它位移機構(圖略)向上移動(如第2D圖所示之箭頭方向C)該第一分離部211，令該第一分離部211凸伸出該第一定位部210一距離t，使該加工件20之下表面僅接觸該第一分離部211。 As shown in FIG. 2D, the first positioning portion 210 and the first separating portion 211 are configured to be relatively displaced, and are moved upward by using other displacement mechanisms (not shown) (as shown in FIG. 2D). In the direction of the arrow C), the first separating portion 211 protrudes from the first positioning portion 210 by a distance t such that the lower surface of the workpiece 20 contacts only the first separating portion 211.
因此，本發明之加工機台2係藉由該第一定位部210與該第一分離部211係組構為供相對位移者，且該第二定位部220與該第二分離部221係組構為供相對位移者，以於研磨(或拋光)該加工件20後，依序移動該第二定位部220、該第二分離部221與該第一分離部211，即可大幅減少(幾乎沒有)該化學液之表面張力f對該加工件20之吸附力，使該加工件20順利脫離該第一定位部210，且不會貼附於該第二承載件22上，故於後續步驟能以機器手臂取出該加工件20而無需以人工方式移取該加工件20，且該化學液之表面張力f之影響有限(幾乎沒有)，因而易於調控該機器手臂之抓取力，以利於應用於自動化生產線。 Therefore, the processing machine 2 of the present invention is configured to be relatively displaced by the first positioning portion 210 and the first separating portion 211, and the second positioning portion 220 and the second separating portion 221 are grouped. When the workpiece 20 is ground (or polished), the second positioning portion 220, the second separation portion 221, and the first separation portion 211 are sequentially moved to be substantially reduced (almost The suction force of the surface tension f of the chemical liquid on the workpiece 20 is such that the workpiece 20 is smoothly separated from the first positioning portion 210 and is not attached to the second carrier 22, so in the subsequent steps. The workpiece 20 can be taken out by the robot arm without manually removing the workpiece 20, and the influence of the surface tension f of the chemical liquid is limited (nearly), so that the gripping force of the robot arm can be easily adjusted to facilitate the grasping force. Used in automated production lines.
再者，於加工複數該加工件20後，該些加工件20僅會分佈於該第一承載件21上，故該機器手臂能快速取出該加工件20，因而有利於量產。 Moreover, after processing the plurality of workpieces 20, the workpieces 20 are only distributed on the first carrier 21, so that the robot arm can quickly take out the workpiece 20, thereby facilitating mass production.
再者，該第一分離部211(或該第二分離部221)之形狀可依需求設計，例如第3A圖所示之矩形柱，因而該第一分離部211(或該第二分離部221)之形狀並無特別限制。 Furthermore, the shape of the first separating portion 211 (or the second separating portion 221) can be designed according to requirements, for example, a rectangular column shown in FIG. 3A, and thus the first separating portion 211 (or the second separating portion 221) The shape is not particularly limited.
又，該第一分離部211(或該第二分離部221)之數量可依需求設計，例如第3B圖所示之複數圓柱第一分離部211(或該第二分離部221)對應設於單一該加工件20上，因而該第一分離部211(或該第二分離部221)之數量並無特別限制。 Moreover, the number of the first separating portion 211 (or the second separating portion 221) can be designed according to requirements. For example, the plurality of first cylindrical separating portions 211 (or the second separating portion 221) shown in FIG. 3B are correspondingly disposed on The number of the first separating portion 211 (or the second separating portion 221) is not particularly limited.
綜上所述，本發明之加工機台係藉由該第一定位部與該第一分離部係組構為供相對位移者，且該第二定位部與該第二分離部係組構為供相對位移者，以藉由移動該第二定位部、該第二分離部與該第一分離部，即可使加工件順利脫離該第一定位部，且不會貼附於該第二承載件上，故於後續步驟能以機器手臂取出該加工件而無需以人工方式移取該加工件，且易於調控該機器手臂之抓取力，以利於應用於自動化生產線。 In summary, the processing machine of the present invention is configured to be relatively displaced by the first positioning portion and the first separating portion, and the second positioning portion and the second separating portion are configured as For the relative displacement, the workpiece can be smoothly separated from the first positioning portion by moving the second positioning portion, the second separating portion and the first separating portion, and is not attached to the second bearing portion. Therefore, in the subsequent step, the workpiece can be taken out by the robot arm without manually removing the workpiece, and the grasping force of the robot arm can be easily adjusted to facilitate application to an automated production line.
再者，於加工複數該加工件後，該些加工件僅會分佈於該第一承載件上，故該機器手臂能快速取出該加工件，因而有利於量產。 Moreover, after processing the plurality of workpieces, the workpieces are only distributed on the first carrier, so that the robot can quickly take out the workpiece, thereby facilitating mass production.
上述實施例係用以例示性說明本發明之原理及其功效，而非用於限制本發明。任何熟習此項技藝之人士均可在不違背本發明之精神及範疇下，對上述實施例進行修改。因此本發明之權利保護範圍，應如後述之申請專利範圍所列。 The above embodiments are intended to illustrate the principles of the invention and its effects, and are not intended to limit the invention. Any of the above-described embodiments may be modified by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as set forth in the appended claims.
2‧‧‧加工機台 2‧‧‧Processing machine
20‧‧‧加工件 20‧‧‧Processed parts
21‧‧‧第一承載件 21‧‧‧First carrier
210‧‧‧第一定位部 210‧‧‧First Positioning Department
211‧‧‧第一分離部 211‧‧‧The first separation department
22‧‧‧第二承載件 22‧‧‧Second carrier
C‧‧‧箭頭方向 C‧‧‧ arrow direction
f‧‧‧表面張力 f‧‧‧Surface tension
t‧‧‧距離 Distance from t‧‧‧
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105132175A TWI607522B (en) | 2016-10-05 | 2016-10-05 | Processing machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105132175A TWI607522B (en) | 2016-10-05 | 2016-10-05 | Processing machine |
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| Publication Number | Publication Date |
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| TWI607522B true TWI607522B (en) | 2017-12-01 |
| TW201814807A TW201814807A (en) | 2018-04-16 |
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| TW105132175A TWI607522B (en) | 2016-10-05 | 2016-10-05 | Processing machine |
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| TW (1) | TWI607522B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| TW201428314A (en) * | 2013-01-03 | 2014-07-16 | 矽品精密工業股份有限公司 | Testing apparatus and testing method |
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| TW201428314A (en) * | 2013-01-03 | 2014-07-16 | 矽品精密工業股份有限公司 | Testing apparatus and testing method |
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