JP6614701B2 - Peeling device - Google Patents

Description

  The present invention relates to a peeling apparatus for peeling a protective member from a wafer.

  When manufacturing a wafer having a flat surface in a semiconductor wafer manufacturing process, for example, a cylindrical ingot made of a raw material such as silicon is cut into thin pieces with a wire saw or the like to obtain a disk-shaped wafer. Since waviness is often present on both sides of this disk-shaped wafer, grinding is performed on the cut wafer, that is, a rotating grinding wheel is applied to the cut surface of the wafer with a wire saw. By making contact, a process of removing the waviness of the cut surface to make it a flat surface is performed.

  In performing the grinding process, for example, as shown in FIG. 11, a protective member is formed of the liquid resin S <b> 1 on one surface Wa of the disk-shaped wafer W. In order to form the protective member on the wafer W, for example, a circular film S2 having a diameter larger than the diameter of the wafer W is placed on the flat holding surface 90a of the holding table 90 of the protective member forming apparatus, and this film S2 A predetermined amount of liquid resin S <b> 1 is supplied from the resin supply device 91. For example, the resin S1 has a property of being cured by light (typically ultraviolet rays). Then, the holding means 92 sucks and holds the other surface Wb of the wafer W, and the wafer W is placed on the liquid resin S1 from above on the film S2 disposed so as to face the one surface Wa of the wafer W. By pressing, the liquid resin S1 is spread and the entire surface Wa of the wafer W is covered with the liquid resin S1. Next, the protective member S shown in FIG. 12 is formed by irradiating and curing the liquid resin S1 with, for example, ultraviolet rays from an ultraviolet irradiation mechanism 93 disposed inside the holding table 90. Further, a protruding portion S2a where the film S2 protrudes from the outer peripheral edge Wd of the wafer W is formed.

  Then, as shown in FIG. 12, the wafer W is placed on the holding surface of the chuck table 940 of the grinding device 94 so that the other surface Wb on which the protective member S is not formed is on the upper side, and the wafer W Grinding is performed while lowering the grinding wheel 941 rotating from above and bringing the grinding wheel 941a into contact with the other surface Wb of the wafer W. Thereafter, the protective member S is peeled off from the wafer W by a tape peeling device (for example, see Patent Document 1), and then one surface Wa of the wafer W protected by the protective member S is further ground to make both surfaces flat. A wafer W to be a surface can be produced.

JP2013-168488A

  In peeling off the protective member S from the wafer W, the holding means lifts the wafer W by sucking and holding the first ground surface Wb (the other surface Wb) of the wafer. Thus, the film S <b> 2 is sandwiched, the sandwiching means is moved, and the protective member S is peeled off from the wafer W. Therefore, the peeled protective member S is discarded in the trash box with the resin S1 stuck to the film S2 and integrated.

  Since a force for shrinking acts on the resin S1, the film S2 tends to curl toward the surface on which the resin S1 is adhered. Therefore, the protective member S dropped in the trash can has the surface on which the resin S1 is adhered, as shown in FIG. 13, due to the air resistance during dropping or the impact when landing on the bottom of the trash can. When the cylindrical shape is rounded from two directions on the outer periphery of the protective member S, and as shown in FIG. Sometimes it is rounded at an even angle.

  In this way, when the protective members S are stacked in the trash box as shown in FIG. 15, a larger number of gaps remain in the trash box than when the protective members S are stacked in a flat layer shape. Therefore, since the protective member S reaches the upper part in the trash box, there is a problem that many protective members S cannot be accommodated in the trash box.

  Therefore, when a protective member made of a film with a resin attached is discarded in the trash box, the discarded protective members are not rounded in the trash box, but the protective members are laminated in a flat state. There is a problem that a sufficient number of protective members can be disposed in the trash can.

  The present invention for solving the above-described problems is related to the resin in the case where the film is fixed to one surface of the wafer through the resin in a state in which the film protrudes from the outer peripheral edge of the wafer and a protruding portion is formed. A peeling apparatus for peeling a protective member made of the film from a wafer, the holding member having a holding surface for holding the other surface of the wafer with the protective member down, and the protruding portion of the protective member being sandwiched The holding means, the moving means for moving the holding means and the holding means relative to each other in the radial direction from the outer peripheral edge of the wafer toward the center, and the holding surface facing the holding surface. A mounting table mounted on the mounting surface with the resin side of the protective member peeled off from the wafer, and a plurality of the protective members stacked on the mounting table and then dropped from the mounting table And dropping means for a peeling apparatus comprising a box for housing the protective member in which a plurality of sheets stacked was dropped from the placing location table by 該落 under means.

  In the peeling device according to the present invention, the holding member holds the protective member with the other surface of the wafer facing down, and the moving member holds the protruding portion of the protective member between the holding member and the holding member in a state where the protruding portion of the protective member is held by the holding member. Is relatively moved radially from the outer peripheral edge of the wafer toward the center to peel off the protective member from the wafer. And it mounts on the mounting surface of the mounting table which faces the holding surface of a holding means with the resin side of the protection member peeled from the wafer facing down. Furthermore, after a plurality of protective members are stacked on the mounting table, the protective members stacked by the dropping means are dropped from the mounting table onto the box and accommodated in the box, so that the protective member is rounded in the box. Without being in a state, each protective member can be accommodated in a box in a state where the protective members are flat and layered. Therefore, since a large number of protective members can be accommodated in the box, it is possible to reduce the number of times the operator or the like collects the protective member from the box.

It is a perspective view which shows an example of a peeling apparatus. It is sectional drawing which shows the state which has clamped the protrusion part of the protection member of the wafer hold | maintained by the holding means by the clamping means. It is sectional drawing which shows the state which moved the clamping means which clamped the protrusion part of the protection member by the moving means, and started peeling of the protection member. It is sectional drawing which shows the state which moved the clamping means which clamped the protrusion part of the protection member by the moving means, and peeled most of the protection members from the wafer. It is sectional drawing which shows the state mounted on the mounting table with the resin side of the protection member peeled from the wafer facing down. It is sectional drawing which shows the state which laminated | stacked several protection members on the mounting table. It is sectional drawing which shows the state which made the dropping means contact the protective member laminated | stacked on the mounting table. It is sectional drawing which shows the state which has pushed and moved the protection member laminated | stacked on the mounting table by the dropping means toward the box upper direction. It is sectional drawing which shows the state which dropped the protection member laminated | stacked several sheets in the box with the dropping means, and was accommodated in the box. It is sectional drawing which shows the state with which the inside of a box was filled with the protection member. It is typical explanatory drawing explaining the state which forms the protection member with the liquid resin on one surface of a wafer. It is a side view which shows the state which hold | maintains the protection member and grinds the other surface of a wafer. It is a perspective view which shows the state which the protection member rounded cylindrical from two directions of the outer periphery. It is a perspective view which shows the state which the protection member rounded toward the center from three directions of outer periphery. It is a perspective view which shows the state in which the rounded protection member was piled up.

The peeling apparatus 1 shown in FIG. 1 is an apparatus that peels the protective member S from the wafer W. The protective member S is formed to have a larger diameter than the wafer W, is fixed to one surface of the wafer W, and includes a protruding portion S2a that protrudes to the outer peripheral side of the outer peripheral edge Wd of the wafer W.
The peeling apparatus 1 includes a holding means 2 having a holding surface 210a for holding the other surface Wb of the wafer W with the protective member S facing down, a holding means 3 for holding the protruding portion S2a of the protective member S, and a holding means 3 Moving means 4 for moving in the ± Y direction, a mounting table 5 provided with a mounting surface 5a facing the holding surface 210a, on which a protective member S peeled off from the wafer W is mounted, and a plurality of sheets on the mounting table 5 Dropping means 6 for dropping the stacked protective member S from the mounting table 5 and a box 7 for accommodating a plurality of stacked protective members S dropped from the mounting table 5 by the dropping means 6 are provided.

  A column 11 is erected on the rear side (−X direction side) on the base 10 of the peeling apparatus 1. A ball screw 120 is rotated by a motor 122 on the upper side of the + X direction side surface of the column 11. Thus, the holding means 2 provided on the movable plate 121 is reciprocated in the Y-axis direction, but the Y-axis direction moving means 12 is provided.

  On the movable plate 121, Z-axis direction moving means 13 for reciprocating the holding means 2 in the Z-axis direction is disposed. The Z-axis direction moving unit 13 rotates the ball screw 130 by the motor 132 to reciprocate the holding unit 2 disposed on the movable plate 131 in the Z-axis direction.

  The holding means 2 includes an arm part 20 having one end on the −X direction side fixed on the movable plate 131, and a holding pad 21 that is disposed on the lower surface of the other end on the + X direction side of the arm part 20 and sucks and holds the wafer W. And. The holding pad 21 shown in FIG. 2 includes a suction portion 210 that is made of a porous member and sucks the wafer W, and a frame body 211 that supports the suction portion 210. The suction unit 210 communicates with the suction source 213 through the suction pipe 212. Then, the suction force generated by the suction source 213 performing suction is transmitted to the holding surface 210a that is the exposed surface of the suction portion 210 and is flush with the lower surface of the frame 211, thereby holding the suction force. The means 2 sucks and holds the wafer W by the holding surface 210a.

  A rotating roller 18 having an axis in the X-axis direction in order from the + Z direction side and a moving means 4 in the middle of the side surface of the + X direction side of the column 11 shown in FIG. The placing table 5 and the dropping means 6 are arranged side by side. Further, in the vicinity of the moving means 4 on the + Y direction side, a table holding table 140 is fixedly disposed on the side surface of the column 11 on the + X direction side, and on the table holding table 140, the wafer W after grinding is processed. Is provided. The delivery table 141 can suck and hold the wafer W placed on the holding surface 141a.

  The moving means 4 includes a ball screw 40 having an axis in the Y-axis direction, a pair of guide rails 41 arranged in parallel to the ball screw 40, a motor 42 for rotating the ball screw 40, and an internal nut attached to the ball screw 40. The movable block 43 is configured such that the screwed side portion is in sliding contact with the guide rail 41. When the motor 42 rotates the ball screw 40, the movable block 43 is guided by the guide rail 41 and moves in the Y-axis direction, and the clamping means 3 disposed on the movable block 43 moves the movable block 43. Move in the Y axis direction.

  The clamping means 3 includes a spindle 30 whose axial direction is the X-axis direction, a housing 31 that rotatably supports the spindle 30, and a clamping clamp 32 that is disposed at the tip of the spindle 30 on the + X direction side. . The sandwiching clamp 32 can sandwich a sandwiching object between a pair of sandwiching plates 320 that can approach and separate from each other, and the angle with respect to the sandwiching object can be changed by rotating the spindle 30. For example, the clamping means 3 may be movable on the movable block 43 in the vertical direction.

  For example, the outer shape of the rotary roller 18 is formed in a columnar shape, and is rotated about an axis in the X axis direction by a motor (not shown). The rotating roller 18 is in contact with the protective member S, thereby preventing the resin S1 from being broken as shown in FIG. 12-15 that may occur when the protective member S is peeled off. The rotating roller 18 may be movable in the Y axis direction.

  The mounting table 5 has, for example, a substantially rectangular outer shape and includes a stool-shaped mounting surface 5a. That is, the mounting table 5 aligns the linear members 50 in parallel so that gaps are formed at equal intervals in the X-axis direction with the longitudinal direction as the Y-axis direction, and the + Y-axis direction of each linear member 50 One end on the side is connected and fixed by a rod-shaped connector (not shown). For example, the mounting table 5 is fixed to the side surface on the + X direction side of the column 11 by a bar-shaped coupling tool (not shown) that connects the linear members 50, or the side surfaces of a pair of guide rails 61 of the dropping unit 6 described later. By fixing a part of the lower surface 5b of the mounting table 5 on 61c, it is disposed under the moving path of the clamping means 3 and the holding means 2.

  The dropping means 6 includes a ball screw 60 having an axis in the Y-axis direction, a pair of guide rails 61 arranged in parallel to the ball screw 60, a motor 62 for rotating the ball screw 60, and an internal nut attached to the ball screw 60. The movable member 63 slidably contacting the guide rail 61 with the screwing side portion 630 and the protruding pin 64 disposed on the movable member 63 are configured.

  The movable member 63 includes, for example, a side portion 630 screwed into the ball screw 60 and a pin base portion 631 formed so as to protrude from the upper end of the side portion 630 toward the + X direction side. Two protruding pins 64 protruding in the + Z direction are disposed on the upper surface of the pin base portion 631. Each protruding pin 64 is disposed at a predetermined distance in the X-axis direction, and when the motor 62 rotates the ball screw 60, the movable member 63 is guided by the guide rail 61 along with this, and the Y-axis direction is moved accordingly. The protrusion pin 64 disposed on the movable member 63 moves in the Y-axis direction so as to pass through the gaps between the linear members 50 of the mounting table 5. The two protruding pins 64 may be movable from the pin base 631 in the Z-axis direction and the height position of the upper end of the protruding pin 64 may be changed. The number of protruding pins 64 is not limited to two. For example, three or more protruding pins 64 may be arranged on the pin base portion 631 so as to be separated in the X-axis direction.

  The box 7 disposed on the base 10 has, for example, a substantially rectangular parallelepiped shape, and is open below the + Y direction side end of the mounting table 5. In the upper part of the box 7, for example, a transmissive optical sensor 79 including a light emitting unit 790 (−Y direction side) and a light receiving unit 791 (+ Y direction side) is disposed. In the optical sensor 79, the protective member S is stacked up to a predetermined height in the box 7, and the inspection light between the light emitting part 790 and the light receiving part 791 is blocked by the protective member S, so that the inside of the box 7 is the protective member S. It is detected that the condition is satisfied.

  Hereinafter, the operation of the peeling apparatus 1 when the protective member S is peeled off from the wafer W by the peeling apparatus 1 will be described with reference to FIGS. 2 to 10, the configuration of the peeling device 1 is shown in a simplified manner.

  First, as shown in FIG. 1, the ground wafer W is placed on the delivery table 141 so that the other surface Wb, which is the ground surface, is on the upper side. The holding means 2 moves in the + Y direction, and is positioned above the wafer W so that the center of the holding surface 210a of the holding pad 21 substantially matches the center of the other surface Wb of the wafer W. Further, the holding means 2 descends in the −Z direction, and the holding surface 210 a of the holding pad 21 is brought into contact with the other surface Wb of the wafer W. Further, the suction force generated by the suction of the suction source 213 is transmitted to the holding surface 210a, so that the holding means 2 sucks and holds the other surface Wb of the wafer W with the protective member S facing down.

  As shown in FIG. 2, the holding means 2 that sucks and holds the wafer W moves in the −Y direction until it is positioned above the rotating roller 18, and then descends in the −Z direction. The side surface 18c of the rotating roller 18 is brought into contact with the vicinity of the outer peripheral portion on the + Y direction side. The clamping means 3 moves in the -Y direction, aligns the clamping clamp 32 and the protruding portion S2a of the protection member S, and the clamping clamp 32 clamps the protruding portion S2a. Here, the protective member S includes a resin S1 and a film S2, and the film S2 is fixed to one surface Wa of the wafer W via the resin S1.

  For example, as shown in FIG. 3, after the clamping clamp 32 clamps the protruding portion S <b> 2 a, the spindle 30 rotates 90 degrees in the clockwise direction when viewed from the + X direction side, so that the rotating roller 18 has the lower surface Sb of the protective member S. With the side supported, the protective member S is gently bent along the side surface 18c of the rotating roller 18 and the protective member S is pulled by the clamping clamp 32 toward the -Z direction, whereby the wafer W A part of the protective member S is peeled off from the one surface Wa.

Next, the holding means 3 and the holding means 2 are relatively moved in the radial direction from the outer peripheral edge Wd of the wafer W toward the center by the moving means 4 shown in FIG. 1, and the protective member S is peeled off from the wafer W. That is, the holding means 3 is moved to the −Y direction side by the moving means 4, the rotating roller 18 rotates about the axis in the X axis direction, and the resin S 1 of the protective member S follows the side surface 18 c of the rotating roller 18. The protective member S is peeled from the outer peripheral edge Wd of the wafer W on the + Y direction side toward the −Y direction side while maintaining the gently bent state.
If the resin S1 is broken during the peeling of the protective member S, the resin S1 partially remains on the wafer W even after the peeling, or the reaction from the resin folding causes the resin S1 to move to one surface Wa of the wafer W. On the other hand, there is a case in which an impact force is momentarily applied and one surface Wa of the wafer is damaged, but such a problem is prevented by the side surface 18c of the rotating roller 18 coming into contact with the film S2. be able to.

  As shown in FIG. 4, when the clamping means 3 moves to the vicinity of the outer peripheral edge Wd on the −Y direction side of the wafer W, the spindle 30 further rotates 90 degrees in the clockwise direction when viewed from the + X direction side. The resin S1 side is directed downward. Furthermore, the protective member S is completely peeled from the wafer W by moving the clamping means 3 to the −Y direction side by the moving means 4. When the protective member S is completely peeled from the wafer W, the clamping clamp 32 is opened, the clamping of the protruding portion S2a by the clamping means 3 is released, and the protective member S is placed with the resin S1 side down as shown in FIG. The protection member S is dropped toward the mounting table 5.

  When the resin S1 side of the protective member S falls and falls, the force that tries to curl toward the surface on which the resin S1 acting on the film S2 is adhered by the shrinkage of the resin S1 is protected during the fall. It is weakened by the air resistance acting on the member S. Therefore, as shown in FIG. 5, the protection member S dropped on the placement table 5 is not rounded but placed on the placement surface 5 a of the placement table 5 in an almost flat state. Become.

  Similarly, the protective member S is peeled off from the new wafer W, and a plurality of protective members S (for example, five or more are preferable) are stacked on the mounting table 5 as shown in FIG. As shown in FIG. 6, the protective members S are stacked on the mounting table 5 so that the horizontal centers of the protective members S substantially coincide with each other. When a plurality of protective members S (5 in the illustrated example) are stacked, the lower surface Sb of each protective member S and each resin S1 of each protective member S are in contact with each other. Since the friction coefficient of the resin S1 is generally high, each resin S1 of each protection member S plays a role of preventing slipping between the protection members S, so that the force that the resin S1 of the protection member S tries to curl is one. It is weakened by the lower surface Sb of the protection member S located on the lower side of the sheet. Accordingly, each protection member S is less likely to be rounded than being placed on the placement table 5 in a single state, and is placed on the placement table 5 in a flatter state.

  Next, the dropping means 6 drops the protective member S, which is a plurality of stacked layers, from the mounting table 5. As shown in FIG. 7, the height position of the upper end of the two protruding pins 64 (only one is shown in FIG. 7) of the dropping means 6 is the uppermost height position of the protective member S in which a plurality of layers are stacked. That is, in the illustrated example, the two protruding pins 64 rise in the + Z direction until reaching the height position of the fifth protective member S from the bottom. Further, the movable member 63 shown in FIG. 1 is guided by the guide rail 61 and moves in the + Y direction, and the two protruding pins 64 pass through the gaps between the straight members 50 of the mounting table 5 in the + Y direction. Move to. The protruding pins 64 abut against the protection member S stacked in a plurality of layers, and integrally push the protection member S stacked in a plurality of directions toward the + Y direction as shown in FIG.

  As shown in FIG. 9, when the protruding pin 64 moves to near the one end on the + Y direction side of the mounting table 5, the dropping means 6 integrally puts a plurality of stacked protective members S from the mounting table 5 to the box. Drop into 7 Since each protection member S falls in a state where a plurality of the protection members S are laminated with the resin S1 side facing down, the surface on which each resin S1 that works on each film S2 is adhered by contraction of each resin S1 The force to round toward the side is weakened by the air resistance acting on the protective member S during the fall. Moreover, since the protective member S laminated | stacked in multiple sheets by the role of the anti-slip | slip between each protective member S by each resin S1 falls integrally, each protection is compared with the case where the protective member S falls in the state of one sheet. The members S are less likely to be deformed, and the protective members S are accommodated in the box 7 while being stacked in a flat state without being rounded.

  Similarly, the protective member S is peeled off from the new wafer W, and a plurality of protective members S (for example, five or more are preferable) are stacked on the mounting table 5, and then the protective members S are stacked. Are housed in the box 7. As shown in FIG. 10, when the protective member S is appropriately accommodated in the box 7 up to the height position of the optical sensor 79, the inspection light between the light emitting unit 790 and the light receiving unit 791 is blocked by the protective member S. Therefore, it is detected that the inside of the box 7 is filled with the protective member S. Then, the worker recognizes that the protective member S is sufficiently collected in the box 7 by the optical sensor 79, and the worker takes out the protective member S from the box 7 and collects it.

  In the peeling apparatus 1 according to the present invention, the holding member 2 holds the other surface Wb of the wafer W with the protective member S down, the protruding portion S2a of the protective member S is held by the holding unit 3, and the moving unit 4 Then, the holding means 3 and the holding means 2 are relatively moved in the radial direction from the outer peripheral edge Wd of the wafer W toward the center, and the protective member S is peeled off from the wafer W. Then, the protective member S peeled from the wafer W is placed on the mounting surface 5a of the mounting table 5 facing the holding surface 210a of the holding unit 2 with the resin S1 side facing down. Then, after a plurality of protective members S are stacked on the mounting table 5, the protective members S stacked by the dropping means 6 are dropped from the mounting table 5 onto the box 7 and accommodated in the box 7. The protective member S accommodated in the box 7 can be accommodated in the box 7 in a state where the protective members S are laminated in a flat state without being in a rounded state. Therefore, since a large number of protective members S can be accommodated in the box 7, the number of operations for collecting the protective member S from the box 7 by an operator or the like can be reduced.

  The peeling device 1 according to the present invention is not limited to the above embodiment, and the size and shape of each component of the peeling device 1 illustrated in the accompanying drawings are not limited thereto. Modifications can be made as appropriate within a range in which the effects of the present invention can be exhibited. For example, the moving means 4 only needs to move the holding means 2 and the clamping means 3 relatively in the radial direction from the outer peripheral edge Wd of the wafer W toward the center, and peel off the protective member S from the wafer W. The clamping means 3 may be configured not to move in the Y-axis direction but to peel off the protective member S when the holding means 2 moves in the Y-axis direction.

90 holding table 90a: holding surface 91: resin supply device 92: holding means
93: Ultraviolet irradiation mechanism 94: Grinding device 940: Chuck table
941: Grinding wheel 941a: Grinding wheel W: Wafer
Wa: One surface of the wafer Wb: The other surface of the wafer Wd: The outer peripheral edge of the wafer
S: protective member S1: resin S2: film S2a: protrusion part 1: peeling device 10: base 11: column
12: Y-axis direction moving means 120: Ball screw 121: Movable plate 122: Motor 13: Z-axis direction moving means 130: Ball screw 131: Movable plate 132: Motor 140: Table holding base
141: Delivery table 141a: Holding surface 18 of the delivery table: Rotating roller 18c: Side surface of the rotating roller 2: Holding means 20: Arm portion 21: Holding pad 210: Suction portion
210a: holding surface 211: frame body 212: suction tube 213: suction source 3: clamping means 30: spindle 31: housing
32: clamping clamp 320: pair of clamping plates 4: moving means 40: ball screw 41: pair of guide rails 42: motor
43: Movable block 5: Placement table 5a: Placement surface of the placement table 50: Linear material 6: Drop means 60: Ball screw 61: A pair of guide rails 62: Motor
63: Movable member 631: Pin base part 64: Protruding pin 7: Box 79: Optical sensor 790: Light emitting part 791: Light receiving part

Claims (1)

The protective member made of the resin and the film is peeled off from the wafer when the film is fixed to one surface of the wafer through the resin in a state where the film protrudes from the outer peripheral edge of the wafer and the protruding portion is formed. A peeling device that
Holding means having a holding surface for holding the other surface of the wafer with the protective member facing down;
Clamping means for clamping the protruding portion of the protective member;
Moving means for moving the sandwiching means and the holding means relative to each other in the radial direction from the outer peripheral edge of the wafer toward the center, and separating the protection member from the wafer;
A mounting table mounted on the mounting surface facing the holding surface with the resin side of the protective member peeled from the wafer facing down;
Dropping means for dropping a plurality of the protective members on the mounting table and then dropping them from the mounting table;
A box for storing a plurality of stacked protective members dropped from the mounting table by the dropping means;
A peeling apparatus comprising:

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