JP5889025B2 - Grinding equipment - Google Patents

Description

  The present invention relates to a grinding apparatus for frame grinding that grinds a workpiece supported by an annular frame via an adhesive sheet.

  A grinding apparatus mainly used for grinding a back surface of a wafer such as a semiconductor wafer has a chuck table for holding the wafer and a grinding means for grinding the wafer held by the chuck table, and a protective tape is provided on the front side of the wafer. Grinding is carried out by holding the chuck table via the surface to expose the back surface and sliding the grinding wheel of the grinding means against the back surface.

  On the other hand, when grinding a workpiece with a shape different from the suction holding surface of the chuck table, grinding multiple workpieces simultaneously, or grinding a workpiece that is extremely difficult to handle after grinding, etc. Then, there is a case where the workpiece is pasted on the adhesive sheet, and the workpiece is ground with the workpiece attached to the annular frame via the adhesive sheet. Such a grinding mode is referred to as so-called frame grinding.

  In frame grinding, the annular frame is pulled down below the holding surface of the chuck table by screws, clamps or the like and fixed. Thereby, a to-be-processed object can be ground without an annular frame contacting a grinding wheel.

Japanese Patent Laid-Open No. 6-302569 JP 2004-247660 A

  However, the annular frame may not be fixed correctly due to screwing or clamping failure. If grinding is performed in a state where the upper surface of the fixing means for fixing the annular frame from the upper surface height position of the holding surface is lifted upward without being fixed normally, the fixing means and the annular frame are moved together with the workpiece. There is a problem that the grinding wheel, the fixing means and the annular frame are damaged by grinding with the grinding wheel.

  The present invention has been made in view of the above points, and an object of the present invention is to provide a grinding device capable of preventing damage to the grinding wheel and fixing means and the annular frame due to improper fixing of the annular frame. is there.

According to the present invention, there is provided a grinding apparatus for grinding the workpiece of the workpiece unit in a form in which the workpiece is attached to the adhesive sheet and attached to the annular frame via the adhesive sheet, A chuck table having a holding surface for holding a workpiece and holding the workpiece of the workpiece unit via the adhesive sheet, and the workpiece held by the chuck table via the adhesive sheet A frame having a support surface that supports the upper surface of the annular frame that is mounted so as to be below the holding surface of the chuck table, and a fixing portion that is disposed on the support surface that fixes the annular frame. A holding means, a grinding means for rotatably supporting a grinding wheel for grinding a workpiece held on the chuck table, and an upper surface of the annular frame fixed by the frame fixing means are connected to the chuck. A frame detection means for detecting whether or not positioned below the holding surface of the table, and detects the upper surface height position before grinding the workpiece held on the chuck table, with the grinding means A height position detecting means for detecting an upper surface height position of the work piece while grinding the work piece, and the frame detecting means is also used as the height position detecting means. A featured grinding apparatus is provided.

  Since the grinding device of the present invention includes frame detection means for detecting whether or not the upper surface of the annular frame is positioned below the holding surface of the chuck table, the fixing failure of the annular frame can be detected. It is possible to prevent the grinding wheel and the annular frame from being damaged due to improper fixing.

1 is a perspective view of a grinding apparatus according to an embodiment of the present invention. 2A is a plan view of the chuck table, and FIG. 2B is a longitudinal sectional view of the chuck table taken along line 2B-2B in FIG. 2A. It is a top view of the workpiece unit hold | maintained at the chuck table. It is a partial cross section side view which shows a mode that the upper surface height position of the cyclic | annular flame | frame fixed to the chuck table is measured. It is a partial cross section side view which shows the grinding process by a grinding device.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Referring to FIG. 1, a perspective view of a grinding apparatus 2 according to an embodiment of the present invention is shown. The grinding device 2 is a manual type grinding device in which an operator manually mounts a workpiece on a chuck table. Reference numeral 4 denotes a base of the grinding apparatus 2, and a column 6 is erected on the rear side of the base 4. A pair of guide rails 8 extending in the vertical direction is fixed to the column 6.

  A grinding unit (grinding means) 10 is mounted along the pair of guide rails 8 so as to be movable in the vertical direction. The grinding unit 10 includes a spindle housing 12 and a support portion 14 that holds the spindle housing 12, and the support portion 14 is attached to a moving base 16 that moves up and down along a pair of guide rails 8. Yes.

  The grinding unit 10 includes a spindle 18 rotatably accommodated in a spindle housing 12, a motor 20 that rotationally drives the spindle 18, a wheel mount 22 fixed to the tip of the spindle 18, and a detachable attachment to the wheel mount 22. And a mounted grinding wheel 24.

  The grinding apparatus 2 includes a grinding unit feed mechanism 34 including a ball screw 30 and a pulse motor 32 that move the grinding unit 10 in the vertical direction along the pair of guide rails 8. When the pulse motor 32 is driven, the ball screw 30 rotates and the moving base 16 is moved in the vertical direction.

  A recess 4a is formed on the upper surface of the base 4, and a chuck table mechanism 36 is disposed in the recess 4a. The chuck table mechanism 36 includes a chuck table 38 and is moved in the Y-axis direction between a workpiece attachment / detachment position A and a grinding position B facing the grinding unit 10 by a moving mechanism (not shown). 50 is a bellows. An operation panel 52 is provided on the front side of the base 4 so that an operator of the grinding apparatus 2 can input grinding conditions and the like.

  A contact-type height gauge 54 for detecting the height position of the workpiece being ground is rotatably mounted on an intermediate portion of the base 4. The height gauge 54 also serves as frame detection means for detecting whether the upper surface of the annular frame F fixed to the chuck table 38 is positioned below the holding surface of the chuck table 38.

  Next, the chuck table 38 for sucking and holding the workpiece unit 13 will be described with reference to FIG. 2A is a plan view of the chuck table 38, and FIG. 2B is a longitudinal sectional view taken along line 2B-2B of FIG. 2A.

  The chuck table 38 includes a metal frame 42 and a suction holding unit 40 formed of porous ceramics or the like surrounded by the frame 42. The holding surface 40 a of the suction holding unit 40 is formed flush with the upper surface of the frame body 42. The frame body 42 has a support surface 44 that is lower than the upper surface of the frame body 42 that supports the annular frame F of the workpiece unit 13 by a predetermined height.

  A plurality of permanent magnets 46 that act as fixing portions for fixing the annular frame F are disposed on the support surface 44. Reference numeral 48 denotes a positioning pin for positioning the annular frame F mounted on the chuck table 38. In the present embodiment, the support surface 44 of the chuck table 38 and the permanent magnet 46 constitute a frame fixing means.

  As shown in FIG. 3, the annular frame F has two notches 15, 17, and the work piece unit 13 is formed by fitting a positioning pin 48 into these notches 15, 17. It is positioned and mounted on the chuck table 38.

  In the grinding apparatus 2 of this embodiment, since the workpiece 11 has a shape different from the holding surface 40a of the chuck table 38, the workpiece 11 is adhered to the adhesive sheet T, and the outer peripheral portion of the adhesive sheet T is The workpiece unit 13 mounted on the annular frame F is placed on the chuck table 38, and the annular frame F is fixed by a permanent magnet 46 disposed on the support surface 44.

  In the embodiment described above, the plurality of permanent magnets 46 are provided on the holding surface 44 of the chuck table 38 to fix the annular frame F. However, the annular frame F may be vacuum-adsorbed instead of the permanent magnet 46. .

  In the grinding apparatus 2 of the present embodiment, the workpiece 11 of the workpiece unit 13 is sucked and held via the adhesive sheet T by the suction holding portion 40 of the chuck table 38 and the annular frame F is fixed by the permanent magnet 46. Before the workpiece 11 is ground, as shown in FIG. 4, the height gauge 54 is rotated to measure the upper surface height position of the annular frame F, and the height position of the upper surface of the annular frame F is determined as the chuck. It is detected whether it is lower than the height of the holding surface 40a of the table 38, that is, whether or not the annular frame F is normally fixed by the permanent magnet 46.

  It is desirable to measure the height position of the upper surface of the annular frame F at a plurality of locations, for example, at four points, and whether the height position of the upper surface of the annular frame F is lower than the height of the holding surface 40a of the chuck table 38. Detect whether or not.

  If it is detected that the height of the upper surface of the annular frame F is higher than the height of the holding surface 40a of the chuck table 38, the annular frame F is not normally fixed. The work of fixing the annular frame F of the article unit 13 is performed again.

  Next, with reference to FIG. 5, the grinding work of the workpiece 11 in which the workpiece 11 is attracted and held by the chuck table 38 via the adhesive sheet T and the annular frame F is fixed by the permanent magnet 46 will be described. To do.

  The chuck table 38 holding the workpiece 11 by suction is moved to the grinding position B shown in FIG. And as shown in FIG. 5, the height gauge 54 is rotated and the upper surface height position of the workpiece 11 before grinding is measured.

  Next, while rotating the chuck table 38 in the direction indicated by arrow a at 300 rpm, for example, the grinding wheel 24 is rotated in the direction indicated by arrow b at 6000 rpm, for example, and the grinding unit feed mechanism 34 is driven to grind the grinding wheel 24. The grindstone 28 is brought into contact with the surface to be ground of the workpiece 11.

  Then, the grinding wheel 24 is ground by a predetermined amount at a predetermined grinding feed speed. While measuring the height of the upper surface of the workpiece 11 with the height gauge 54, the workpiece 11 is ground to a desired thickness, for example, 100 μm.

  According to the grinding device 2 of the above-described embodiment, the height gauge 54 also serves as a frame detection unit that detects whether or not the upper surface of the annular frame F is positioned below the holding surface 40a of the chuck table 38. The height of the upper surface of the workpiece 11 being ground can be measured with the height gauge 54, and the improper fixing of the annular frame F can be detected by the measurement of the height gauge 54. Can be prevented from being damaged.

2 Grinding device 10 Grinding unit 11 Workpiece T Adhesive sheet F Annular frame 13 Workpiece unit 24 Grinding wheel 28 Grinding wheel 38 Chuck table 40a Holding surface 44 Support surface 46 Permanent magnet 54 Height gauge

Claims (1)

A grinding device that grinds the workpiece of the workpiece unit in a form in which the workpiece is attached onto the adhesive sheet and attached to the annular frame via the adhesive sheet,
A chuck table having a holding surface for holding the workpiece and holding the workpiece of the workpiece unit via the adhesive sheet;
A support surface for supporting the work piece held on the chuck table so that the upper surface of the annular frame on which the work piece is mounted via the adhesive sheet is below the holding surface of the chuck table, and the annular frame are fixed. A frame fixing means having a fixing portion disposed on the supporting surface;
Grinding means for rotatably supporting a grinding wheel for grinding a workpiece held on the chuck table;
Frame detecting means for detecting whether or not the upper surface of the annular frame fixed by the frame fixing means is positioned below the holding surface of the chuck table;
Height for detecting the upper surface height position of the workpiece held on the chuck table before grinding, and detecting the upper surface height position of the workpiece while the workpiece is being ground by the grinding means. A position detecting means ,
The grinding apparatus according to claim 1, wherein the frame detecting means is also used as the height position detecting means .

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