TWI606224B - 流體熱交換系統 - Google Patents

流體熱交換系統 Download PDF

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Publication number
TWI606224B
TWI606224B TW101110072A TW101110072A TWI606224B TW I606224 B TWI606224 B TW I606224B TW 101110072 A TW101110072 A TW 101110072A TW 101110072 A TW101110072 A TW 101110072A TW I606224 B TWI606224 B TW I606224B
Authority
TW
Taiwan
Prior art keywords
recess
heat
inlet
heat exchange
defines
Prior art date
Application number
TW101110072A
Other languages
English (en)
Chinese (zh)
Other versions
TW201305522A (zh
Inventor
吉夫 尚恩 里昂
Original Assignee
水冷系統公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/401,618 external-priority patent/US9453691B2/en
Application filed by 水冷系統公司 filed Critical 水冷系統公司
Publication of TW201305522A publication Critical patent/TW201305522A/zh
Application granted granted Critical
Publication of TWI606224B publication Critical patent/TWI606224B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
    • F28F2250/08—Fluid driving means, e.g. pumps, fans
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
    • F28F2260/02—Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW101110072A 2011-07-27 2012-03-23 流體熱交換系統 TWI606224B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161512379P 2011-07-27 2011-07-27
US13/401,618 US9453691B2 (en) 2007-08-09 2012-02-21 Fluid heat exchange systems

Publications (2)

Publication Number Publication Date
TW201305522A TW201305522A (zh) 2013-02-01
TWI606224B true TWI606224B (zh) 2017-11-21

Family

ID=46705693

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101110072A TWI606224B (zh) 2011-07-27 2012-03-23 流體熱交換系統

Country Status (3)

Country Link
JP (1) JP3179086U (enrdf_load_stackoverflow)
DE (1) DE202012002974U1 (enrdf_load_stackoverflow)
TW (1) TWI606224B (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11395443B2 (en) 2020-05-11 2022-07-19 Coolit Systems, Inc. Liquid pumping units, and related systems and methods
US12200914B2 (en) 2022-01-24 2025-01-14 Coolit Systems, Inc. Smart components, systems and methods for transferring heat
US12366870B2 (en) 2013-03-15 2025-07-22 Coolit Systems, Inc. Flow-path controllers and related systems

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014141162A1 (en) 2013-03-15 2014-09-18 Coolit Systems, Inc. Sensors, multiplexed communication techniques, and related systems
US10365667B2 (en) 2011-08-11 2019-07-30 Coolit Systems, Inc. Flow-path controllers and related systems
JP6124742B2 (ja) 2013-09-05 2017-05-10 三菱電機株式会社 半導体装置
US9445526B2 (en) * 2014-12-22 2016-09-13 Toyota Motor Engineering & Manufacturing North America, Inc. Modular jet impingement assemblies with passive and active flow control for electronics cooling
US11452243B2 (en) 2017-10-12 2022-09-20 Coolit Systems, Inc. Cooling system, controllers and methods
DE102018125375A1 (de) * 2018-10-14 2020-04-16 Han Xu Hardware Plastic Technological Co., Ltd. Wassergekühlte hocheffizienz-wärmeableitungsvorrichtung
US11662037B2 (en) 2019-01-18 2023-05-30 Coolit Systems, Inc. Fluid flow control valve for fluid flow systems, and methods
US11473860B2 (en) 2019-04-25 2022-10-18 Coolit Systems, Inc. Cooling module with leak detector and related systems
DE102020207966A1 (de) * 2019-11-25 2021-05-27 Volkswagen Aktiengesellschaft Kühlanordnung für elektronische Komponenten eines Kraftfahrzeugs
US11725886B2 (en) * 2021-05-20 2023-08-15 Coolit Systems, Inc. Modular fluid heat exchange systems
TWI854755B (zh) * 2022-12-01 2024-09-01 台灣光罩股份有限公司 用以測試半導體元件之測試系統

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4561040A (en) * 1984-07-12 1985-12-24 Ibm Corporation Cooling system for VLSI circuit chips
JPH10173114A (ja) * 1996-12-13 1998-06-26 Hitachi Ltd マルチチップモジュールの冷却構造
JP4141613B2 (ja) * 2000-03-09 2008-08-27 富士通株式会社 密閉サイクル冷凍装置および密閉サイクル冷凍装置用乾式蒸発器
JP2003243581A (ja) * 2002-02-15 2003-08-29 Fujikura Ltd ヒートシンク
JP2007531991A (ja) * 2004-03-31 2007-11-08 ハイドロクール ピーティーワイ リミテッド 熱交換器
JP2005351600A (ja) * 2004-06-14 2005-12-22 Nikkei Nekko Kk アルミ製熱交換器及びそのスケール付着防止方法
JP2007180505A (ja) * 2005-12-02 2007-07-12 Matsushita Electric Ind Co Ltd 電子部品の冷却装置
US7331378B2 (en) * 2006-01-17 2008-02-19 Delphi Technologies, Inc. Microchannel heat sink
CN101400959B (zh) * 2006-03-16 2010-09-29 贝洱两合公司 用于汽车的热交换器
JP4797954B2 (ja) * 2006-11-30 2011-10-19 アイコム株式会社 放熱フィンの冷却構造
US7762314B2 (en) * 2007-04-24 2010-07-27 International Business Machines Corporation Cooling apparatus, cooled electronic module and methods of fabrication employing a manifold structure with interleaved coolant inlet and outlet passageways
JP2011114206A (ja) * 2009-11-27 2011-06-09 Ryosan Co Ltd フィン一体型ヒートシンク

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12366870B2 (en) 2013-03-15 2025-07-22 Coolit Systems, Inc. Flow-path controllers and related systems
US11395443B2 (en) 2020-05-11 2022-07-19 Coolit Systems, Inc. Liquid pumping units, and related systems and methods
US12193193B2 (en) 2020-05-11 2025-01-07 Coolit Systems, Inc. Liquid pumping units, and related systems and methods
US12200914B2 (en) 2022-01-24 2025-01-14 Coolit Systems, Inc. Smart components, systems and methods for transferring heat

Also Published As

Publication number Publication date
JP3179086U (ja) 2012-10-18
DE202012002974U1 (de) 2012-07-23
TW201305522A (zh) 2013-02-01

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