TWI602096B - Touch panel and method of manufacturing the same - Google Patents

Description

Touch panel and method of manufacturing same

The present invention relates to a touch panel and a method of fabricating the same, and more particularly to a touch panel capable of improving a black matrix printing step and a method of manufacturing the same.

Thanks to the advancement of science and technology, people can see the traces of portable electronic devices everywhere, such as notebook computers, tablet computers, smart phones, etc., and with the increasing dependence of users, the functions of portable electronic devices are also It is increasingly powerful; the common feature of such products is to have a display screen, and to display a variety of multimedia audio and video to the user. Moreover, the trend of portable electronic devices in recent years is that the touch operation providing a larger screen makes the operation of the consumer more convenient and flexible.

In general, the touch screen can be divided into a resistive touch screen and a capacitive touch screen. The resistive touch screen is generated by the user's touch position, and the glass and the electrode are generated due to the application of pressure. The short-circuit phenomenon is sensed; and the capacitive touch screen is sensed by the position touched by the user, because the capacitance value of the electrode changes due to the touch. At present, the design of the capacitive touch panel is mainly divided into a film type (Film-type) and a glass type (Glass-type) touch panel, and generally includes a cover glass over the sensing electrode layer (Cover Glass or Cover Lens). A black matrix (BM) is also disposed around the lower surface of the protective glass, wherein the sensing electrode layer is used to detect the touch position, and a conductive line is disposed around the sensing electrode layer, and the black matrix is used. Blocking the surrounding conductive lines.

The current main method of manufacturing black matrices is to use black ink screen printing. For example, referring to FIG. 1 , the OGS or TOL glass touch panel 10 is manufactured by printing the black matrix 12 on the glass substrate 11 and then fabricating the touch sensing structure 13 . In addition, as shown in FIG. 2, the black matrix 22 of the thin film type touch panel 20 is printed by a single-chip printing method, before being printed on the protective glass 21, and then by the optical adhesive (OCA) 24 and the touch sensing structure 23. fit. However, since a height difference is generated after printing, bubbles generated when the optical adhesive 24 is attached are not easily removed, and the appearance of the panel is liable to cause chromatic aberration abnormality. In addition, in the application of the new generation of touch panels, the production method of such single-chip printing is not only inefficient, but also the thickness of the black matrix formed by the printing process is thick, about 10 to 25 micrometers (um), which easily leads to touch. The phenomenon of functional failure.

The current research also proposes a solution to this problem. For example, in the patent of Taiwan Patent Publication No. I504983, there are mainly defects in coating unevenness or microbubbles when printing or coating a shielding layer (ie, a black matrix), and it is easy to show fine pores under strong light irradiation, and the influence is affected. The appearance of the product is such that a non-transparent layer is disposed between the shielding layer and the light source below, and the non-transparent layer blocks the strong light from the lower light source from being irradiated to the holes to prevent the holes from being visible to the naked eye.

However, the above solution only covers the holes and does not directly address the structural or process problems. The degree of improvement implemented in practice is debatable. One of the main causes of bubble defects is caused by the difference in printing. The previous case did not propose an improvement plan for this part of the problem. Even if the cover method proposed in the previous case, the printing step difference still exists, and there is a film. Problems such as excessive thickness and poor productivity make the space that can be improved to be quite limited. Therefore, there is an urgent need to propose a method for effectively solving the problem of the printing step difference of the black matrix, and which can sufficiently improve the existing process or structure while improving the production efficiency and quality.

In view of this, the present invention is directed to the absence of the prior art, and its main object is to provide a touch panel and a method of manufacturing the same, which can effectively solve various problems such as bubble defects caused by a printing step difference of a black matrix.

Another object of the present invention is to provide a touch panel and a manufacturing method thereof, which can reduce the thickness of the light shielding layer through the yellow light lithography process, and can adopt multiple layout design to improve the productivity and performance simultaneously.

To achieve the above object, the present invention provides a touch device including first and second substrates, first and second sensing electrode layers, a plurality of first and second conductive lines, a light shielding layer, and a filling layer. According to the lamination sequence, the surface of the first substrate has a sensing area and a bezel area surrounding the periphery of the sensing area. The first sensing electrode layer and the first conductive line are disposed on the first substrate and respectively located in the sensing area and the frame area, and the first conductive line is electrically connected to the first sensing electrode layer. The light shielding layer covers the first conductive line and extends to the surface of the first substrate, and surrounds the sensing region to form a hollow recess, and the light shielding layer is formed by exposure and development of a black matrix resist (Black Matrix Resist); The flat hollow is recessed, and the height of the filling layer is flush with the light shielding layer. The second sensing electrode layer and the second conductive line are disposed under the first substrate and respectively located in the sensing area and the frame area, and the second conductive line is electrically connected to the second sensing electrode layer, and the first conductive line is electrically connected. A conductive line. The second substrate is disposed under the second sensing electrode layer and the second conductive line. In the present invention, a height difference is not generated between the light shielding layer and the filling layer, and it can be flatly bonded to the protective glass provided later, and the problem of bubble defects can be effectively solved.

In addition, the present invention also provides a method for manufacturing a touch device, the first step of providing a first substrate and a second substrate disposed on the upper and lower layers, the surface of the first substrate having a sensing region and surrounding the periphery of the sensing region a first sensing electrode layer and a plurality of first conductive lines are formed on the first substrate and are respectively located in the sensing area and the frame area, and the first conductive line is electrically connected to the first sensing electrode layer, and the second sensing layer The second conductive line is formed on the second substrate and is respectively located on the second substrate, and the second conductive line is electrically connected to the second sensing electrode layer, and the first conductive line is electrically connected to the first conductive layer. a line; then, using a black matrix resistor (Black Matrix Resist), forming a light shielding layer covering the first conductive line and extending to the surface of the first substrate via an exposure and development process, And surrounding the sensing region to form a hollow recess; afterwards, forming a filling layer to fill the hollow recess, so that the height of the filling layer is flush with the light shielding layer.

Compared with the prior art, the present invention does not directly print the light shielding layer on the protective glass, and then combines with the touch sensing structure to generate a height difference, but uses a yellow light lithography process to directly form a blackout on the touch sensing structure. The layer covers the conductive lines of the bezel area, and then fills the height drop with the filling layer. Therefore, in addition to avoiding the height difference caused by printing, the present invention avoids the problem of adhering the air bubbles and reduces the flaw of the appearance of the panel. At the same time, the thickness of the light shielding layer can be reduced by using the yellow light lithography process, thereby improving the touch performance. Combined with multi-type layout design, the production capacity can be greatly improved.

The purpose, technical content, features and effects achieved by the present invention will be more readily understood by the detailed description of the embodiments.

The invention discloses a touch panel and a manufacturing method thereof, such as a display device, a tablet computer, a smart phone, a notebook computer, a desktop computer, a television, a satellite navigation, an on-board display, an aviation display or A variety of electronic devices, such as a portable DVD player, and a touch screen can be divided into a resistive touch screen and a capacitive touch screen. The capacitive touch panel is mainly a film type (Film-type) and a glass type ( Glass-type touch panel, and the present invention mainly focuses on a thin film touch panel, and more particularly a structure of a Glass-Flim-Flim (GFF) touch panel.

Referring to FIG. 3, a cross-sectional structural view of a touch panel 100 according to an embodiment of the present invention is shown.

The touch panel 100 has a first substrate 110 and a second substrate 120. The first substrate 110 defines a sensing region 111 and a frame region 112 surrounding the periphery of the sensing region 111 for carrying the first sensing electrode layer 130 and the plurality of first conductive lines 131; The electrode layer 130 is located on the sensing region 111 on the first substrate 110, and the first conductive line 131 is located in the frame region 112 on the first substrate 110. The second substrate 120 is configured to carry the second sensing electrode layer 140 and the plurality of second conductive lines 141; the second sensing electrode layer 140 is located on the second substrate 120 corresponding to the sensing region 111 of the first substrate 110 The second conductive line 141 is located on the second substrate 120 corresponding to the frame region 112 of the first substrate 110. In this embodiment, the first sensing electrode layer 130 is a transmitting (TX) electrode layer, and the second sensing electrode layer 140 is a receiving (RX) electrode layer, respectively electrically connected to the first conductive line 131 and the second conductive line 141. The first conductive line 131 and the second conductive line 141 are also electrically connected.

The light shielding layer 150 covers the frame region 112 to coat the first conductive line 141. In detail, the light shielding layer 150 extends downward from the top of the first conductive line 141 to the surface of the first substrate 110, and surrounds the sensing. The region 111 forms a hollow recess, that is, the first sensing electrode layer 130 on the sensing region 111 is exposed.

The filling layer 160 covers the sensing region 111 and fills the hollow recess of the light shielding layer 150 so that the height of the filling layer 160 can be substantially flush with the height of the light shielding layer 150.

In addition, the protective glass 170 is adhered and fixed to the light shielding layer 150 and the filling layer 160 by the first adhesive layer 180; since the height of the light shielding layer 150 and the filling layer 160 is substantially flush, no height difference is formed, so protection After the glass 170 is attached to the light shielding layer 150 and the filling layer 160, bubbles are not present in the first adhesive layer 180, and the appearance of the panel can be avoided.

The two substrates can be adhered and fixed by the second adhesive layer 190 between the first substrate 110 and the second substrate 120.

As shown in FIG. 4, a plurality of pads 121 for externally transmitting telecommunications are disposed on the second substrate 120 corresponding to the frame region 112 of the first substrate 110, so that the pads 121 are partially electrically connected. The first conductive line 131 is connected, and the remaining pads 121 are electrically connected to the second conductive line 141. In particular, the present invention is not limited to a single planar wiring. In this embodiment, a plurality of through holes are formed in the first substrate 110, and a conductive via 113 is formed in the through hole by a conductive material to serve as the first conductive. The conductive medium overlapped between the line 131 and the second conductive line 141, and is electrically connected to the pad 121 to achieve double-layer overlapping wiring. More preferably, the first conductive line 131 and the second conductive line 141 are alternately arranged side by side, and the first substrate 110 and the second substrate 120 respectively located on the upper and lower layers are evenly distributed. Each plane reaches the frame shrinkage, and the design of the panel design of the narrow frame is realized; in practical applications, the effect of the double-layer wiring shunt can also be achieved by using the special-shaped substrate structure.

In the above embodiment, the material of the first substrate 110 and the second substrate 120 may be a polyethylene terephthalate (PET) film. Of course, the material thereof is not particularly limited, but is currently on the market. It is the most widely used type of PET film. The first sensing electrode layer 130 and the second sensing electrode layer 230 are mainly composed of a transparent conductive material, for example, indium tin oxide (ITO), indium zinc oxide (IZO), cadmium oxide. tin (cadmium tin oxide, CTO), aluminum zinc oxide (AZO), indium tin zinc oxide (ITZO), tin oxide, zinc oxide, cadmium Oxide, hafnium oxide (HfO), indium gallium zinc oxide (InGaZnO), indium gallium zinc magnesium oxide (InGaZnMgO), indium gallium magnesium oxide (indium gallium magnesium oxide, InGaMgO), indium gallium aluminum oxide (InGaAlO), carbon nanotubes (CNTs), silver nanotubes or copper nanotubes, or other transparent conductive materials and metals or A non-metallic composite. The first conductive line 131 and the second conductive line 141 may be the aforementioned transparent conductive material or metal, such as silver. The first most common layer of the first adhesive layer and the second adhesive layer is Optical Clear Adhesive (OCA), which can be cured by ultraviolet light to produce an adhesive effect, and the light transmittance is high (>99%). Applicable to this type of product. The filling layer may be formed of a transparent protective film or a transparent dry film photoresist. The above materials may be different according to actual needs, and are not limited by the present invention.

Herein, the height difference between the light shielding layer 150 and the filling layer 160 in the present invention is clearly defined. Referring to FIG. 5, the thickness of the first wire line 131 is usually less than about 1 micrometer (μm), and the light shielding layer 150 is The thickness a is about 1.5 to 5 micrometers, and the thickness b of the filling layer 160 is about 1.5 to 5 micrometers ± 1 micrometer. The difference in thickness between the light shielding layer 150 and the filling layer 160, that is, the height difference is about less than 1 micrometer. In addition, the angle c between the sidewall of the filling layer 150 and the light shielding layer 160 is about 15 to 90 degrees.

The following is a flowchart of a method for manufacturing a touch panel according to the present invention. Referring to FIG. 7A to FIG. 7H, the present invention provides an embodiment of the present invention. A cross-sectional structural view corresponding to each step in the method of manufacturing the touch panel. In order to clearly show the features of the method of the present invention, some of the components have been omitted from the seventh to seventh embodiments. For the composition of each component, please refer to the above figures 3 and 4. The production process includes the following steps: First, referring to step S10, as shown in FIG. 7A, the first substrate 110 is provided. The surface of the first substrate 110 defines a sensing area and a border area surrounding the periphery of the sensing area. At the same time, the aforementioned second substrate is also provided (omitted in the figure)

Then, in step S20, the dry film photoresist is coated on the first substrate 110, and the dry film photoresist is exposed, developed, etched and stripped by a yellow lithography technique to form the first sensing electrode layer 130. The sensing region on a substrate 110 is as shown in FIG. 7B; at the same time, the position of the second sensing electrode layer on the second substrate corresponding to the sensing region of the first substrate is formed (omitted in the drawing). Then, as shown in FIG. 7C, the first conductive line 131 may be formed on the frame region of the first substrate 110 by coating or printing, and the first conductive line 131 is electrically connected to the first sensing electrode layer 130; At the same time, the second conductive line is formed on the second substrate at a position corresponding to the frame region of the first substrate, and the second conductive line is electrically connected to the second sensing electrode layer (omitted in the drawing).

Referring to step S30, a plurality of holes are formed in the frame region of the first substrate 110 by using a laser drilling method, and the conductive material is plated in the through holes to form the conductive vias 113. At the same time, a plurality of pads 121 are formed on the second substrate. 120 corresponds to the position of the frame area of the first substrate 110; this portion is as shown in FIG.

Referring to step S40, as shown in FIG. 7D, the second adhesive layer 190 is coated between the first substrate 110 and the second substrate 120, and then the two substrates are laminated and laminated by the second adhesive layer 190. At this time, the first conductive line 131 and the second conductive line 141 respectively located in the upper and lower layers can be lapped through the conductive via holes, and electrically connected to the pads (omitted in the figure).

Then, in step S50, the black matrix photoresist is coated on the first substrate 110, and the black matrix photoresist is exposed and developed by the yellow lithography technique. As shown in FIG. 7E, the light shielding layer 150 is formed to cover the first layer. The frame region of the substrate 110 covers the first conductive line 131 and extends to the surface of the first substrate 110, and surrounds the sensing region to form a hollow recess to expose the sensing region of the first substrate 110.

Referring to step S60, as shown in FIG. 7F, the filling layer 160 is filled in the hollow recess, so that the height of the filling layer 160 is approximately flush with the light shielding layer 150.

Then, in step S70, as shown in FIG. 7G, the first adhesive layer 180 is applied to the surface of the light shielding layer 150 and the filling layer 160, and the protective glass 170 is laminated and fixed to the first layer by the first adhesive layer 180. Above the substrate 110.

Subsequently, see step S80, and then performing laser cutting and polishing to obtain the structure of the GFF (Glass-Flim-Flim) film type touch panel 100; and according to the manufacturing method of the embodiment, multiple layout design can be adopted. The production of a plurality of touch panels 100 contributes to an increase in productivity.

In summary, the touch panel and the method for fabricating the same according to the present invention are different from the conventional method of fabricating a black matrix on a protective glass by a single-chip printing, and using a yellow light lithography process. The light-shielding layer is formed on the touch sensing structure by using a black matrix photoresist to cover the frame region, and then filling the light-shielding layer with the filling layer to expose the concave portion of the sensing region, so that the height of the light-shielding layer and the filling layer are equivalent. Does not cause a step difference. In this way, in addition to overcoming the bubble defects caused by the printing step difference, the yellow light lithography process can further reduce the thickness of the light shielding layer, thereby improving the touch performance, and further, can adopt a multi-type layout design. Get higher production capacity and improve industrial competitiveness.

The above is only the preferred embodiment of the present invention and is not intended to limit the scope of the present invention. Therefore, any changes or modifications of the features and spirits of the present invention should be included in the scope of the present invention.

10‧‧‧glass touch panel

11‧‧‧ glass substrate

12‧‧‧Black matrix

13‧‧‧Touch sensing structure

20‧‧‧Film type touch panel

21‧‧‧protective glass

22‧‧‧Black matrix

23‧‧‧Touch sensing structure

24‧‧‧Optical adhesive

100‧‧‧ touch panel

110‧‧‧First substrate

111‧‧‧Sensing area

112‧‧‧Border area

113‧‧‧ conductive through holes

120‧‧‧second substrate

121‧‧‧ pads

130‧‧‧First sensing electrode layer

131‧‧‧First conductive line

140‧‧‧Second sensing electrode layer

141‧‧‧Second conductive line

150‧‧‧Lighting layer

160‧‧‧Filling layer

170‧‧‧protective glass

180‧‧‧First adhesive layer

190‧‧‧Second adhesive layer

a, b‧‧‧ thickness

C‧‧‧ angle

FIG. 1 is a cross-sectional structural view of a thin film type touch panel provided by the prior art.

FIG. 2 is a cross-sectional structural view of a glass touch panel provided by the prior art.

FIG. 3 is a cross-sectional structural view of a touch panel according to an embodiment of the present invention.

FIG. 4 is a schematic view showing the manner of overlapping the first substrate and the second substrate in the embodiment of the present invention.

Figure 5 is a schematic view showing the difference in height between the light shielding layer and the filling layer in the embodiment of the present invention.

6A and 6B are flowcharts showing a method of manufacturing a touch panel according to an embodiment of the present invention.

7A to 7G are cross-sectional structural views corresponding to respective steps in a method of manufacturing a touch panel according to an embodiment of the present invention.

100‧‧‧ touch panel

110‧‧‧First substrate

111‧‧‧Sensing area

112‧‧‧Border area

120‧‧‧second substrate

130‧‧‧First sensing electrode layer

131‧‧‧First conductive line

140‧‧‧Second sensing electrode layer

141‧‧‧Second conductive line

150‧‧‧Lighting layer

160‧‧‧Filling layer

170‧‧‧protective glass

180‧‧‧First adhesive layer

190‧‧‧Second adhesive layer

Claims (15)

A touch panel includes at least: a first substrate having a sensing area and a frame area surrounding a periphery of the sensing area; a first sensing electrode layer disposed on the first substrate and located a plurality of first conductive lines disposed on the first substrate and located in the frame region and electrically connected to the first sensing electrode layer; a light shielding layer covering the first conductive lines and extending to Forming a hollow recess on the first substrate surface and surrounding the sensing region; a filling layer filling the hollow recess, and the filling layer is flush with the light shielding layer; a second sensing electrode layer is disposed The second conductive line is disposed under the first substrate and disposed under the first substrate, and is electrically connected to the second sensing electrode layer, and the first conductive layers are disposed. The circuit is electrically connected to the first conductive lines; and a second substrate is disposed under the second sensing electrode layer and the second conductive lines. The touch panel of claim 1, further comprising a first adhesive layer and a protective glass, the first adhesive layer being coated on the light shielding layer and the surface of the filling layer, wherein the protective glass is The first adhesive layer is laminated and fixed on the light shielding layer and above the filling layer. The touch panel of claim 1, wherein the light shielding layer is formed by a black matrix resistor (Black Matrix Resist). The touch panel of claim 1, wherein the filling layer is formed by a transparent protective film or a transparent dry film photoresist. The touch panel of claim 1, wherein the first conductive lines and the second conductive lines are alternately arranged side by side in a direction parallel to the surface of the first substrate. The touch panel of claim 1, further comprising a plurality of pads disposed on the second substrate and located in the frame region, and electrically connecting the first conductive lines and the second conductive lines, The first substrate has a plurality of conductive vias in the frame region, and the pads are electrically connected to the first conductive lines and the second conductive lines via the conductive vias. The touch panel of claim 1, further comprising a second adhesive layer disposed between the second substrate and the second sensing electrode layer and the second conductive lines. The touch panel of claim 1, wherein the light shielding layer has a thickness of 1.5 to 5 micrometers (μm), and a difference in thickness between the light shielding layer and the filling layer is less than 1 micrometer. A method for manufacturing a touch panel includes the following steps: providing a first substrate and a second substrate disposed on the upper and lower layers, the first substrate surface having a sensing region and surrounding the periphery of the sensing region a first detection electrode layer and a plurality of first conductive lines are formed on the first substrate and are respectively located in the sensing area and the frame area, and the first conductive lines are electrically connected to the first a second sensing circuit layer and a plurality of second conductive lines are formed on the second substrate and are respectively located in the sensing area and the frame area, and the second conductive lines are electrically connected to the first a second sensing electrode layer, the first conductive lines are electrically connected to the first conductive lines; a black matrix resist is provided, and an exposure and development process is performed to form a light shielding layer covering the first a conductive line extends to the surface of the first substrate and surrounds the sensing region to form a hollow recess; forming a filling layer to fill the hollow recess, and the height of the filling layer is flush with the light shielding layer. The method of manufacturing the touch panel of claim 9, further comprising: applying a first adhesive layer to the light shielding layer and the surface of the filling layer; and protecting the first adhesive layer A glass laminate is fixed over the light shielding layer and the filling layer. The method of manufacturing a touch panel according to claim 9, wherein the filling layer is formed by a transparent protective film or a transparent dry film photoresist. The method of manufacturing the touch panel of claim 9, wherein the first conductive lines and the second conductive lines are alternately arranged side by side in a direction parallel to the surface of the first substrate. The method of manufacturing the touch panel of claim 9, further comprising: forming a plurality of pads on the second substrate and located in the frame region to electrically connect the first conductive lines and the second portions a conductive line; and the plurality of conductive vias are formed on the frame region of the first substrate, wherein the pads are electrically connected to the first conductive lines and the second conductive lines respectively via the conductive vias . The method of manufacturing the touch panel of claim 9, further comprising forming a second adhesive layer between the second substrate and the second sensing electrode layer and the second conductive lines. The method of manufacturing a touch panel according to claim 9, wherein the light shielding layer has a thickness of 1.5 to 5 micrometers (μm), and a difference in thickness between the light shielding layer and the filling layer is less than 1 micrometer.