TWI597746B - Tinting flux method and device - Google Patents

Tinting flux method and device Download PDF

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Publication number
TWI597746B
TWI597746B TW105109307A TW105109307A TWI597746B TW I597746 B TWI597746 B TW I597746B TW 105109307 A TW105109307 A TW 105109307A TW 105109307 A TW105109307 A TW 105109307A TW I597746 B TWI597746 B TW I597746B
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Taiwan
Prior art keywords
flux
tank
carrier
tin
fluxing
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TW105109307A
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Chinese (zh)
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TW201621943A (en
Inventor
Wei-Teng Zhang
Chong-Han Wang
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All Ring Tech Co Ltd
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Description

沾助銲劑方法及裝置 Dipping flux method and device

本發明係有關於一種沾助銲劑方法及裝置,尤指對完成繞線後線圈進行線端沾錫前沾助銲劑之沾助銲劑方法及裝置。 The invention relates to a method and a device for immersing a flux, in particular to a method and a device for immersing flux flux before the wire ends of the coil after the winding is completed.

按,一般線圈製作通常包括兩部份製程,一者為繞線製程,另一者為沾錫製程;繞線製程中必須在一「工」字型芯材上兩凸緣部間捲芯部捲繞線材,完成繞線的芯材再進行沾錫製程,使芯材置於震動送料機被循序送至錫槽沾附錫液於該芯材凸緣處二線端部位,沾錫完成後再排出收集。 Press, the general coil production usually consists of two parts, one is the winding process, the other is the dip soldering process; in the winding process, the core part of the two flanges must be wound on a "work" type core material. Winding the wire, completing the wound core material and then performing the dip soldering process, so that the core material is placed in the vibrating feeder and sent to the tin bath to adhere the tin liquid to the second line end portion of the core material flange. Then discharge and collect.

公告號碼第181713號「繞線式電感器之銲錫機」專利申請案提出一種線圈之沾錫製程,其提出在沾錫前之線圈先沾附松香水類助銲劑步驟,以及將線圈浸於錫槽中沾錫的先前技術,其包括導料裝置,拆帶裝置,導線輾直裝置,整理裝置,輸送裝置,傳動裝置,旋轉裝置,控制裝置,浸潤裝置,刮錫裝置,銲錫裝置,帶裝裝置等構成,藉左右旋轉裝置轉向、交接、浸潤、銲錫傳送動作,以完成繞線式電感線圈兩端銅絲連導線鍍錫一起完成,導線呈漸近式離開銲錫槽,避免附著在導線末端錫面拉長成針狀,再藉由齒形鏈條輸送、氣缸動作的配合、電磁閥線路控制、導螺桿傳送組合成一台繞線式電感器之銲錫機。 The patent application No. 181713, "Welding Machine for Wirewound Inductors" proposes a soldering process for a coil, which proposes a step of first attaching a loose perfume flux to a coil before soldering, and immersing the coil in tin Prior art for sinking tin in a tank, including a guiding device, a detaching device, a wire straightening device, a finishing device, a conveying device, a transmission device, a rotating device, a control device, an infiltration device, a scraping device, a soldering device, and a belt The device and the like are configured to perform the steering, the transfer, the wetting, and the solder transfer operation of the left and right rotating devices to complete the tin plating of the copper wire at both ends of the wound inductor, and the wire is gradually separated from the solder bath to avoid the solder attached to the end of the wire. The surface is elongated into a needle shape, and then combined by a toothed chain conveyor, a cylinder action, a solenoid valve line control, and a lead screw to form a wire wound inductor soldering machine.

先前技術中的沾錫製程採用左右組旋轉裝置位於助銲劑之浸 潤裝置與錫液之銲錫裝置上方,且作旋轉軸向與浸潤裝置、銲錫裝置平行,但與上下浸潤助銲劑及錫液之方向垂直之旋轉搬送方式,將待沾錫線圈在助銲劑之浸潤裝置與錫液之銲錫裝置間來回搬送,除機構複雜與龐大外,沾錫液及沾助銲劑並無法同時進行以提高整體製程效率;另由於左右組旋轉裝置來回往復搬送於助銲劑之浸潤裝置與錫液之銲錫裝置間,故浸潤裝置無法設置調節浸潤程度之裝置,銲錫裝置上方無法設置處理錫液滴懸落之裝置,因此難以使沾錫之品質獲得有效的提升。 The prior art soldering process uses a left and right set of rotating devices located in the flux immersion The soldering device and the soldering device of the tin liquid are above, and the rotating axial direction is parallel with the wetting device and the soldering device, but the rotating conveying method is perpendicular to the direction of infiltrating the flux and the tin liquid, and the tin coil to be wetted by the flux is wetted. The device and the tin soldering device are transported back and forth between the device and the soldering device. In addition to the complexity and bulk of the mechanism, the tin and the flux can not be simultaneously performed to improve the overall process efficiency; and the left and right rotating devices are reciprocated to the flux infiltration device. Between the soldering device and the tin soldering device, the wetting device cannot be provided with a device for adjusting the degree of wetting, and the device for handling the suspension of tin droplets cannot be disposed above the soldering device, so that it is difficult to effectively improve the quality of the soldering tin.

爰是,本發明之目的,在於提供一種可適用於以一搬送裝置將線圈以間歇性旋轉流路進行搬送於多個工作站進行沾錫製程,以使助銲劑浸潤與錫液沾附可同時進行之沾助銲劑方法。 Therefore, an object of the present invention is to provide a soldering process in which a coil is transported to a plurality of workstations by a transfer device in an intermittent rotating flow path, so that flux infiltration and tin liquid adhesion can be simultaneously performed. Dip flux method.

本發明的另一目的,在於提供一種可適用於以一搬送裝置將線圈以間歇性旋轉流路進行搬送於多個工作站進行沾錫製程,以使助銲劑浸潤與錫液沾附可同時進行之沾助銲劑裝置。 Another object of the present invention is to provide a soldering process in which a coil is transported to a plurality of workstations by a transfer device in an intermittent rotating flow path, so that flux infiltration and tin liquid adhesion can be simultaneously performed. Dip flux device.

本發明的又一目的,在於提供一種用以執行所述沾助銲劑方法之沾助銲劑裝置。 It is still another object of the present invention to provide a fluxing device for performing the fluxing method.

依據本發明目的之沾助銲劑方法,包括以下步驟:一初始步驟,以一載座載置一沾體浸潤於一助銲劑槽中;一第一上昇步驟,載座載置該沾體上昇而使沾體上表面位於助銲劑槽中助銲劑液面上方;一刮撥步驟,使一刮體被驅動對沾體進行刮撥,使過多之助銲劑被刮落;一第二上昇步驟,載座載置沾體再次上昇,而使沾體抵觸待沾錫元件之待沾錫面,完成沾助銲劑之製程。 The fluxing method according to the present invention includes the following steps: an initial step of depositing a body with a body to be infiltrated into a flux bath; and a first ascending step, the carrier is placed to raise the body The upper surface of the body is located above the flux level in the flux bath; a scraping step causes a scraper to be driven to scrape the body, causing excessive flux to be scraped off; a second step of raising the carrier The placed body is raised again, and the adhering body is in contact with the tin surface to be tinned to be tinned, and the fluxing process is completed.

依據本發明另一目的之沾助銲劑裝置,包括:一助銲劑槽,其內充填有助銲劑;一沾附機構,包括其上設有沾體的載座,載座受一昇降機構所連動可上昇使沾體移出助銲劑槽內助銲劑液面,或下降使沾體浸於助銲劑槽內助銲劑液面下;一刮撥機構,包括一刮片狀刮體,其設於受一驅動件作用而可作往復位移之載架上。 A flux-welding device according to another object of the present invention comprises: a flux bath filled with a flux; and an adhering mechanism comprising a carrier having a body attached thereto, the carrier being coupled by a lifting mechanism Raising to remove the adherent from the flux level in the flux bath, or lowering the dipper to immerse the flux in the flux bath; a scraping mechanism comprising a blade-like scraper disposed on a drive The member acts as a carrier for reciprocating displacement.

依據本發明又一目的之沾助銲劑裝置,包括:用以執行所述沾助銲劑方法之沾助銲劑裝置。 A fluxing device according to still another object of the present invention includes: a fluxing device for performing the fluxing method.

本發明實施例提供之沾助銲劑方法及裝置,由於可適用於搬送裝置採旋轉流路進行待沾錫元件之線圈的搬送,除使機構之動作流路較規律外,不同線圈之沾錫液及沾助銲劑可同時進行,大幅提高整體製程效率;另外,搬送裝置之旋轉流路並不干涉各工作站之作業空間,故各工件站可以對例如助銲劑浸潤程度進行控制、錫液滴進行截滴和壓扁、成品進行翻轉輸送及檢測---等,作有效之精細處理,因此使線圈沾錫之品質獲得有效的提升。 The method and device for fluxing flux provided by the embodiment of the invention are applicable to the conveying device adopting the rotating flow path for carrying the coil of the component to be tinned, and the tinting solution of the different coils is different except that the action flow path of the mechanism is regular. And the flux can be simultaneously carried out to greatly improve the overall process efficiency; in addition, the rotating flow path of the conveying device does not interfere with the working space of each workstation, so each workpiece station can control, for example, the degree of flux infiltration, and the tin droplets are cut. Dropping and flattening, the product is inverted and transported, and so on, for effective fine processing, so that the quality of the coil tin is effectively improved.

1‧‧‧線圈 1‧‧‧ coil

11‧‧‧芯材 11‧‧‧ core material

111‧‧‧第一凸緣 111‧‧‧First flange

112‧‧‧第二凸緣 112‧‧‧second flange

113‧‧‧捲芯部 113‧‧‧core core

114‧‧‧線槽 114‧‧‧ wire trough

12‧‧‧線材 12‧‧‧Wire

121‧‧‧第一線端 121‧‧‧First line end

122‧‧‧第二線端 122‧‧‧second line

13‧‧‧導電物質 13‧‧‧Conductive substances

2‧‧‧搬送裝置 2‧‧‧Transporting device

21‧‧‧工作站 21‧‧‧Workstation

22‧‧‧驅動機構 22‧‧‧ drive mechanism

23‧‧‧上表面 23‧‧‧ upper surface

A‧‧‧取放機構 A‧‧‧ pick-and-place mechanism

A1‧‧‧取放座 A1‧‧‧Removable seat

A11‧‧‧導軌 A11‧‧‧rail

A12‧‧‧彈性元件 A12‧‧‧Flexible components

A13‧‧‧軸筒 A13‧‧‧ shaft tube

A2‧‧‧吸附機構 A2‧‧‧Adsorption mechanism

A21‧‧‧吸附座 A21‧‧‧ adsorption seat

A211‧‧‧框體 A211‧‧‧ frame

A212‧‧‧底蓋 A212‧‧‧ bottom cover

A213‧‧‧氣腔 A213‧‧‧ air cavity

A214‧‧‧吸附面 A214‧‧‧Adsorption surface

A22‧‧‧磁性件 A22‧‧‧Magnetic parts

A23‧‧‧活動件 A23‧‧‧Activities

A231‧‧‧樞桿 A231‧‧‧ pivot

A232‧‧‧擋體 A232‧‧ ‧ body

A233‧‧‧彈性元件 A233‧‧‧Flexible components

A3‧‧‧感測元件 A3‧‧‧Sensor components

B‧‧‧助銲劑裝置 B‧‧‧weld device

B1‧‧‧助銲劑槽 B1‧‧‧flux tank

B11‧‧‧進液管路 B11‧‧‧Inlet line

B12‧‧‧出液管路 B12‧‧‧Drainage line

B13‧‧‧洩液管路 B13‧‧‧Drainage line

B2‧‧‧沾附機構 B2‧‧‧ Attachment

B21‧‧‧載座 B21‧‧‧ Carrier

B211‧‧‧沾體 B211‧‧‧ Body

B212‧‧‧連動件 B212‧‧‧ linkages

B22‧‧‧昇降機構 B22‧‧‧ Lifting mechanism

B221‧‧‧馬達 B221‧‧‧Motor

B222‧‧‧皮帶 B222‧‧‧Land

B223‧‧‧框架 B223‧‧‧Frame

B3‧‧‧刮撥機構 B3‧‧‧ scraping mechanism

B31‧‧‧刮體 B31‧‧‧Scratch

B32‧‧‧驅動件 B32‧‧‧ drive parts

B33‧‧‧載架 B33‧‧‧ Carrier

C‧‧‧沾錫裝置 C‧‧‧Staining device

C1‧‧‧錫爐 C1‧‧‧ Tin furnace

C11‧‧‧錫槽 C11‧‧‧ tin bath

C12‧‧‧錫渣槽 C12‧‧‧dew tank

C13‧‧‧錫渣槽 C13‧‧‧dew tank

C2‧‧‧沾錫槽 C2‧‧‧Dip tin bath

C21‧‧‧載架 C21‧‧‧ carrier

C22‧‧‧載架驅動件 C22‧‧‧carrier drive

C3‧‧‧刮液件 C3‧‧‧ scraping parts

C31‧‧‧載座 C31‧‧‧ Carrier

C32‧‧‧軌桿 C32‧‧‧ rails

C33‧‧‧刮液驅動件 C33‧‧‧Scrape driver

C34‧‧‧壓墊 C34‧‧‧ pressure pad

C35‧‧‧固定座 C35‧‧‧ fixed seat

C4‧‧‧截滴件 C4‧‧‧ cut pieces

C41‧‧‧托架 C41‧‧‧ bracket

C411‧‧‧繫孔 C411‧‧‧ hole

C412‧‧‧狹縫 C412‧‧‧Slit

C413‧‧‧滑座 C413‧‧‧ slide

C414‧‧‧第一螺固件 C414‧‧‧First screw firmware

C415‧‧‧第二螺固件 C415‧‧‧Second screw firmware

C42‧‧‧水平軌桿 C42‧‧‧Horizontal rail

C43‧‧‧截滴驅動件 C43‧‧‧ cut-off drive

C44‧‧‧除渣件 C44‧‧‧Slag removal parts

C45‧‧‧除渣驅動件 C45‧‧‧Slag removal drive

C46‧‧‧軌座 C46‧‧‧ rail seat

D‧‧‧掣抵裝置 D‧‧‧掣抵装置

D1‧‧‧座架 D1‧‧‧Rack

D2‧‧‧驅動件 D2‧‧‧ drive parts

D3‧‧‧掣抵件 D3‧‧‧掣掣件

D4‧‧‧懸臂 D4‧‧‧ cantilever

D5‧‧‧缸桿 D5‧‧‧Cylinder rod

D6‧‧‧驅動件 D6‧‧‧ drive parts

E‧‧‧排氣裝置 E‧‧‧Exhaust device

F‧‧‧排料裝置 F‧‧‧Discharge device

F1‧‧‧承接機構 F1‧‧‧Accommodating agency

F11‧‧‧轉座 F11‧‧‧Transposition

F12‧‧‧承接座 F12‧‧‧ socket

F121‧‧‧載置區間 F121‧‧‧Loading interval

F122‧‧‧負壓吸孔 F122‧‧‧ Negative pressure suction hole

F13‧‧‧昇降驅動件 F13‧‧‧ Lifting drive

F14‧‧‧旋轉驅動件 F14‧‧‧Rotary drive

F141‧‧‧皮帶 F141‧‧‧Leather belt

F15‧‧‧錯動驅動件 F15‧‧‧Displacement drive

F2‧‧‧輸送機構 F2‧‧‧Transportation agency

F21‧‧‧輸送帶 F21‧‧‧ conveyor belt

F22‧‧‧計測元件 F22‧‧‧Measurement components

F23‧‧‧影像檢測裝置 F23‧‧‧Image inspection device

G‧‧‧收集裝置 G‧‧‧Collection device

H‧‧‧清潔裝置 H‧‧‧ cleaning device

H1‧‧‧清潔槽 H1‧‧‧ cleaning tank

H2‧‧‧清潔元件 H2‧‧‧ cleaning components

H21‧‧‧移動座 H21‧‧‧Mobile seat

H22‧‧‧清潔驅動件 H22‧‧‧clean drive parts

H23‧‧‧吹乾機構 H23‧‧‧Blowing mechanism

第一圖係本發明實施例芯材上完成繞線之立體示意圖。 The first figure is a schematic perspective view of the winding of the core material of the embodiment of the present invention.

第二圖係本發明實施例之線圈成品立體示意圖。 The second figure is a perspective view of the finished coil product of the embodiment of the present invention.

第三圖係本發明實施例之搬送裝置立體示意圖。 The third figure is a schematic perspective view of a conveying device according to an embodiment of the present invention.

第四圖係本發明實施例取放機構之吸附機構剖面示意圖。 The fourth figure is a schematic cross-sectional view of the adsorption mechanism of the pick-and-place mechanism of the embodiment of the present invention.

第五圖係本發明實施例助銲劑裝置之立體示意圖。 The fifth figure is a schematic perspective view of a flux device according to an embodiment of the present invention.

第六圖係本發明實施例沾助銲劑製程之初始步驟示意圖。 Figure 6 is a schematic view showing the initial steps of the flux-welding process of the embodiment of the present invention.

第七圖係本發明實施例沾助銲劑製程之第一上昇步驟示意圖。 The seventh figure is a schematic diagram of the first rising step of the flux-welding process of the embodiment of the present invention.

第八圖係本發明實施例沾助銲劑製程之刮撥步驟示意圖。 The eighth figure is a schematic diagram of the scraping step of the flux-welding process of the embodiment of the present invention.

第九圖係本發明實施例沾助銲劑製程之第二上昇步驟示意圖。 The ninth drawing is a schematic diagram of the second rising step of the flux-welding process of the embodiment of the present invention.

第十圖係本發明實施例沾錫、掣抵、排氣等裝置示意圖。 The tenth figure is a schematic view of a device for immersing tin, smashing, and exhausting according to an embodiment of the present invention.

第十一圖係本發明實施例沾錫裝置之示意圖。 The eleventh drawing is a schematic view of a dip soldering apparatus according to an embodiment of the present invention.

第十二圖係本發明實施例沾錫槽之示意圖。 Twelfth is a schematic view of a dip tank according to an embodiment of the present invention.

第十三圖係本發明實施例刮液件之示意圖。 Figure 13 is a schematic view of a wiper member according to an embodiment of the present invention.

第十四圖係本發明實施例截滴件之示意圖。 Figure 14 is a schematic view of a cut piece of the embodiment of the present invention.

第十五圖係本發明實施例除渣件之示意圖。 The fifteenth drawing is a schematic view of a slag removing member according to an embodiment of the present invention.

第十六圖係本發明實施例截滴件之繫固部位示意圖。 Figure 16 is a schematic view showing the securing portion of the cutting piece of the embodiment of the present invention.

第十七圖係本發明實施例沾錫製程之初始步驟示意圖。 Figure 17 is a schematic view showing the initial steps of the dip soldering process of the embodiment of the present invention.

第十八圖係本發明實施例沾錫製程之沾錫步驟示意圖。 The eighteenth drawing is a schematic diagram of the step of diluting tin in the dip soldering process of the embodiment of the present invention.

第十九圖係本發明實施例沾錫製程之截滴步驟示意圖。 The nineteenth drawing is a schematic diagram of the cutting step of the dip tin process of the embodiment of the present invention.

第二十圖係本發明實施例沾錫製程之刮液面步驟示意圖。 Figure 20 is a schematic view showing the steps of the scraping surface of the dip tin process of the embodiment of the present invention.

第二十一圖係本發明實施例沾錫製程之壓錫滴步驟示意圖。 The twenty-first drawing is a schematic view of the step of pressing tin in the dip tin process of the embodiment of the present invention.

第二十二圖係本發明實施例排料裝置示意圖。 The twenty-second figure is a schematic view of the discharge device of the embodiment of the present invention.

第二十三圖係本發明實施例排料製程承接座之部份示意圖。 The twenty-third figure is a partial schematic view of the discharge process receiving socket of the embodiment of the present invention.

第二十四圖係本發明實施例排料裝置承接座翻轉示意(一)。 The twenty-fourth embodiment is an indication of the flipping of the socket discharging device of the embodiment of the present invention (1).

第二十五圖係本發明實施例排料裝置承接座翻轉示意(二)。 The twenty-fifth drawing is a schematic diagram of the flipping of the socket discharging device of the embodiment of the present invention (2).

第二十六圖係本發明實施例清潔裝置之示意圖。 The twenty-sixth drawing is a schematic view of a cleaning device of an embodiment of the present invention.

第二十七圖係本發明實施例清潔裝置進行清潔之示意圖。 The twenty-seventh drawing is a schematic view of cleaning of the cleaning device of the embodiment of the present invention.

請參閱圖1、2,本發明實施例沾助銲劑方法及裝置可使用於如圖所示待沾錫元件之線圈1的沾助銲劑,該線圈1包括一芯材11,其具有位於兩端之第一凸緣111、第二凸緣112,以及位於其間的捲芯部113,該第一凸緣111上位於相隔適當間距之兩側各設有相互平行且凹設之線槽 114;該捲芯部113捲繞線材12,其形成一位於近第二凸緣112之由入線端構成之第一線端121以及近第一凸緣111之由出線端構成之第二線端122,第一線端121及第二線端122分別但同一方向地自第一凸緣111一側彎折並各覆靠於第一凸緣111二相互平行且凹設之線槽114約一半左右長度,其經沾錫製程而受類如錫液之導電物質13沾覆固定於第一凸緣111線槽114中而成完整線圈1。 Referring to Figures 1 and 2, the method and apparatus for fluxing the flux of the embodiment of the present invention can be used for the flux of the coil 1 of the component to be tinned as shown in the figure. The coil 1 comprises a core material 11 having two ends at both ends. a first flange 111, a second flange 112, and a core portion 113 therebetween, wherein the first flange 111 is provided with mutually parallel and recessed wire grooves on opposite sides of the proper spacing The winding core portion 113 winds the wire 12, and forms a first wire end 121 formed by the wire end of the near second flange 112 and a second wire formed by the wire end of the first flange 111. The end 122, the first wire end 121 and the second wire end 122 are respectively bent from the first flange 111 side in the same direction and each of the first flanges 111 are parallel to each other and are recessed about the wire groove 114. About half of the length, which is adhered to the first flange 111 of the first flange 111 by the conductive material 13 such as tin liquid by the soldering process to form the complete coil 1.

本發明實施例中線圈1自已完成繞線之第一圖半成品,經由本發明實施例所提供之製造方法及裝置而完成如第二圖所示之線圈1成品。 In the embodiment of the present invention, the coil 1 has completed the winding of the first figure and the finished product, and the finished product of the coil 1 as shown in the second figure is completed by the manufacturing method and apparatus provided by the embodiment of the present invention.

請參閱第二、三、四圖,本發明實施例係在一機台上以一搬送裝置2將線圈1以間歇性旋轉流路進行搬送於多個工作站21,該等工作站21執行以下製程,包括:一沾助銲劑製程,位於該間歇性旋轉流路之一工作站21上,使受搬送裝置2搬送之線圈1待沾錫部位受助銲劑所沾浸;一沾錫製程,位於該間歇性旋轉流路上之沾助銲劑製程後段工作站21,使受搬送之線圈1待沾錫部位受錫液所沾浸;一排料製程,用以將完成沾錫之線圈1自間歇性旋轉流路之搬送裝置2上取下,並予以收集。 Referring to the second, third and fourth figures, in the embodiment of the present invention, the coil 1 is transported to the plurality of workstations 21 by means of a transport device 2 by means of a transport device 2, and the workstations 21 perform the following processes. The method includes: a fluxing flux process, located on the workstation 21 of the intermittent rotating flow path, so that the tinned portion of the coil 1 to be conveyed by the conveying device 2 is immersed in the flux; the soldering process is located in the intermittent The station 21 on the rotating flow path is used to make the tinned portion of the coil 1 to be contaminated by the tin liquid; a discharge process is used to complete the coil 1 from the intermittent rotating flow path. The conveying device 2 is removed and collected.

該搬送裝置2略呈盤狀,每一工作站21各設有一取放機構A,並受驅動機構22驅動而以僅在原位的同一間歇旋轉流路進行搬送,以水平方式繞Z軸旋轉軸向間歇性轉動;每一取放機構A各包括:一取放座A1,其受複數立設導軌A11支撐而設於搬送裝置2上,導軌A11於搬送裝置2上表面23與取放座A1間設有彈性元件A12,導軌A11部份伸置於上表面23下方軸筒A13中; 一吸附機構A2,藉一連動件A3與取放座A1連動作上下位移,設有框體A211及底蓋A212組設之吸附座A21,吸附座21內部形成一中空氣腔A213,而底部則形成一吸附面A214,氣腔A213中設有磁性件A22以複數個列設方式嵌於一活動件A23,該活動件A23以二樞桿A231樞經吸附座A21,而於外部設一擋體A232,及在擋體A232與吸附座A21間套設有彈性元件A233;另設有感測元件A3伸入氣腔A213中可對活動件A23位移狀況進行感測;藉取放座A1受壓抵以連動吸附機構A2向下方之待吸附及搬送之線圈1移靠,並對氣腔A213中通入正壓氣體,使活動件A23受到下推驅力而使磁性件A22貼抵吸附面A214內側,使吸附面A214具磁性而吸附下方待吸附線圈1;在欲釋放吸附面A214吸附之線圈1時,則停止正壓氣體或改對氣腔A213中通入負壓氣體,使活動件A23受到向上吸力而連動磁性件A22脫離貼抵吸附面A214,使吸附面A214失去磁性而釋放下方線圈1。 The conveying device 2 is slightly disk-shaped, and each of the workstations 21 is provided with a pick-and-place mechanism A, and is driven by the driving mechanism 22 to carry the same intermittent rotating flow path only in the home position, and rotates the axis around the Z axis in a horizontal manner. Each of the pick-and-place mechanisms A includes: a pick-and-place A1 supported by the plurality of vertical rails A11 and disposed on the transport device 2, the rails A11 on the upper surface 23 of the transport device 2 and the pick-and-place A1 An elastic member A12 is disposed therebetween, and the guide rail A11 is partially disposed in the lower shaft A13 below the upper surface 23; An adsorption mechanism A2 is vertically displaced by a linkage A3 and a loading and unloading base A1, and a suction seat A21 is provided for the frame body A211 and the bottom cover A212, and a middle air chamber A213 is formed inside the adsorption seat 21, and the bottom portion is formed. An adsorption surface A214 is formed, and the magnetic member A22 is disposed in the air chamber A213 to be embedded in a movable member A23 in a plurality of manners. The movable member A23 is pivoted through the adsorption seat A21 by two pivots A231, and a stopper is disposed outside. A232, and an elastic member A233 is disposed between the blocking body A232 and the suction seat A21. The sensing element A3 is inserted into the air chamber A213 to sense the displacement condition of the movable member A23; The movable adsorption mechanism A2 is moved downward to the coil 1 to be adsorbed and transported, and a positive pressure gas is introduced into the air chamber A213, so that the movable member A23 is pushed down and the magnetic member A22 is pressed against the adsorption surface A214. On the inner side, the adsorption surface A214 is magnetically adsorbed to adsorb the coil 1 to be adsorbed; when the coil 1 to be adsorbed by the adsorption surface A214 is released, the positive pressure gas is stopped or the negative pressure gas is introduced into the air chamber A213, so that the movable member A23 The magnetic member A22 is detached from the adsorption surface A214 by the upward suction, so that the adsorption surface A 214 loses magnetism and releases the lower coil 1.

請參閱第五、六圖,該沾助銲劑製程可使用如圖所示之助銲劑裝置B,包括:一助銲劑槽B1,其內充填有例如松香之助銲劑,並設有進液管路B11及出液管路B12,使槽中助銲劑經由幫浦產生循環,以降低因助銲劑之揮發性特質,導致濃度改變過大,影響助銲劑之沾附品質;同時設有洩液管路B13可在停機或必要時將槽中助銲劑洩放至儲液筒(圖中未示),避免助銲劑揮發殆盡;一沾附機構B2,包括其上設有由海棉等具軟撓性材質構成之沾體B211的載座B21,載座B21受一昇降機構B22所連動可上昇使沾體B211移出助銲劑槽B1內助銲劑液面,或下降使沾體B211浸於助銲劑槽B1內助銲劑液面下;該昇降機構B22包括由馬達B221帶動繞轉之皮帶B222,以連 動跨設助銲劑槽B1兩側並位於助銲劑槽B1後方之框架B223作上下位移,使載座B21以一連動件B212固設於該框架B223上受其連動;一刮撥機構B3,包括一刮片狀刮體B31,其設於一受一驅動件B32作用而可作橫向往復於該沾體B211上方位移之載架B33上,該刮體B31並可移撥於沾體B211上表面刮除過多之助銲劑。 Please refer to the fifth and sixth figures. The fluxing process can use the flux device B as shown in the figure, including: a flux tank B1 filled with a flux such as rosin, and a liquid inlet pipe B11 And the liquid discharge pipe B12, so that the flux in the tank is passed through The pump generates circulation to reduce the volatility of the flux, causing the concentration to change too much, affecting the adhesion quality of the flux. At the same time, the drain line B13 can be used to discharge the flux in the tank to the shutdown or if necessary. The liquid storage cylinder (not shown) prevents the flux from being evaporated; the adhering mechanism B2 includes a carrier B21 having a body B211 made of a soft flexible material such as sponge, and a carrier B21 When the lifting mechanism B22 is linked, the body B211 can be moved out of the flux level in the flux tank B1, or the body B211 can be immersed in the flux level in the flux tank B1; the lifting mechanism B22 includes the motor B221 The revolving belt B222 is vertically displaced by the frame B223 which is disposed on both sides of the flux tank B1 and located behind the flux tank B1, so that the carrier B21 is fixed to the frame B223 by a linkage B212; A scraping mechanism B3 includes a blade-shaped scraping body B31 which is disposed on a carrier B33 which is displaced by a driving member B32 and is reciprocally reciprocated above the body B211. The scraping body B31 can be moved. Apply too much flux to the upper surface of the body B211.

請參閱第六至九圖,有關助銲劑裝置B中沾附機構B2及刮撥機構B3所進行的沾助銲劑製程,包括以下步驟:一初始步驟,請參閱第六圖,此時載座B21載置沾體B211浸潤於助銲劑槽B1中助銲劑液面下;一第一上昇步驟,請參閱第七圖,載座B21載置沾體B211受昇降機構B22作用上昇而使沾體B211上表面位於助銲劑槽B1中助銲劑液面上方;一刮撥步驟,請參閱第八圖,刮體B31被驅動件B32驅動載架B33而作對沾體B211上表面進行刮撥,使過多之助銲劑被刮落;一第二上昇步驟,請參閱第九圖,載座B21載置沾體B211受昇降機構B22作用再次上昇,而使沾體B211上表面抵觸吸附機構A2吸附面A214下方所吸附線圈1待沾錫面,完成沾潤助銲劑後,載座B21載置沾體B211受昇降機構B22作用回復原初始步驟。 Please refer to the sixth to ninth drawings. The fluxing process of the adhesion mechanism B2 and the scraping mechanism B3 in the flux device B includes the following steps: For an initial step, please refer to the sixth figure, at this time, the carrier B21 The deposited body B211 is immersed in the flux liquid level in the flux tank B1; in the first rising step, please refer to the seventh figure, the carrier B21 is placed on the body B211 and is lifted by the lifting mechanism B22 to make the body B211 The surface is located above the flux level in the flux bath B1; in the scraping step, please refer to the eighth figure, the scraper B31 is driven by the driving member B32 to drive the carrier B33 to scrape the upper surface of the body B211, so that the help is excessive The flux is scraped off; a second rising step, please refer to the ninth figure, the carrier B21 is placed on the body B211 by the lifting mechanism B22 to rise again, and the upper surface of the body B211 is adsorbed under the adsorption surface A214 of the adsorption mechanism A2. After the coil 1 is to be soldered to the tin surface, after the flux is wetted, the carrier B21 is placed on the body B211 to be returned to the original initial step by the lifting mechanism B22.

請參閱第十圖,該沾錫製程可使用如圖所示沾錫裝置C,配合一掣抵裝置D及一排氣裝置E;該掣抵裝置D位於沾錫裝置C前,藉一座架D1上掣抵驅動件D2驅動掣抵件D3下抵第三圖中吸附機構A2上連動件A3,使吸附機構A2下移以將其下方吸附之線圈1進行沾錫等作業;座架D1上設有一懸臂D4,其上設有可朝下方伸抵之缸桿D5的頂抵驅動件D6,其用以觸抵第三圖中吸附機構A2之氣壓開關,以使吸附機構A2作線 圈1釋放操作,其係下一排料製程之操控,容後詳述;排氣裝置E設在沾錫裝置C之錫爐C1上方,以吸排錫液揮發之有毒氣體。 Please refer to the tenth figure. The dip tin process can use the dip soldering device C as shown in the figure, and cooperate with a smashing device D and an exhaust device E; the smashing device D is located in front of the dipping device C, and borrows a frame D1. The upper abutting driving member D2 drives the yoke resisting member D3 to the lowering member A3 of the absorbing mechanism A2 in the third figure, so that the absorbing mechanism A2 is moved downward to perform the work of dipping the coil 1 adsorbed under the squeegee; the frame D1 is provided There is a cantilever D4, which is provided with a top abutting driving member D6 which can be extended downwardly, and is used for contacting the air pressure switch of the adsorption mechanism A2 in the third figure, so that the adsorption mechanism A2 is used as a line. The ring 1 release operation is controlled by the next discharge process, which is detailed later; the exhaust device E is disposed above the tin furnace C1 of the tin-plating device C to absorb the toxic gas volatilized by the tin liquid.

請參閱第十一圖,該沾錫裝置C如圖所示,包括:一錫爐C1,內部具有一可進行加熱的供容納錫液之錫槽C11,錫爐C1前後側各貼靠設有一錫渣槽C12、C13;一沾錫槽C2,請同時參閱第十二圖,其體積小於錫槽C11並浸置於其中,其受一載架C21所承載及受一載架驅動件C22所驅動,可上下位移於錫槽C11之錫液表面上方或下方;載架C21呈一ㄣ字形狀,使驅動件C22所驅動之上下位移路徑與沾錫槽C2之上下位移路徑平行,但相隔一適當間距;一刮液件C3,請同時參閱第十三圖,其設於一載座C31前端,該載座C31位於載架C21間並受一位於水平軌桿C32上之刮液驅動件C33所驅動,可連動刮液件C3前後位移於錫槽C11錫液上表面作錫液表面氧層刮除作業,並將錫渣推刮落於錫爐C1前後側錫渣槽C12、C13;載座C31上方靠刮液件C3處設有凸設之複數壓墊C34,各壓墊C34同設於載座C31之一固定座C35上,並在固定座C35中受有彈性元件(圖中未示)作用而具適當彈性;一截滴件C4,請同時參閱第十四圖,由一例如琴鋼線之線體所構成,其兩端各繫扣於一托架C41之兩端,截滴件C4位於該刮液件C3前方,該托架C41則位於所述載架C21間及所述載座C31外,並受一位於一組水平軌桿C42上之截滴驅動件C43所驅動,可連動截滴件C4前後位移於錫槽C11錫液表面上方;請同時配合參閱第十五圖,截滴件C4之線體處設有一除渣件C44,其底端以一扣槽C441扣觸截滴件C4之線徑,並於一可受除渣驅動件C45驅動上下位移之軌座C46上作橫向左右位移,以對截滴件 C4線徑上所沾附之錫渣予以刮除;請同時配合參閱第十六圖,截滴件C4,之琴鋼線線體兩端係伸穿經托架C41兩端之繫孔C411,並偏置塞入繫孔C411內徑一側之狹縫C412中定位,同時截滴件C4之琴鋼線線體末端繫繞於托架C41外側一滑座C413之第一螺固件C414受其螺固,滑座C413並於滑移調整截滴件C4線體適當張力緊度後,以第二螺固件C415螺固定位。 Referring to FIG. 11 , the soldering device C includes a tin furnace C1 having a tin bath C11 for accommodating tin liquid and a tin bath C1 on the front and rear sides of the tin furnace C1. Tin dross tanks C12, C13; a tin bath C2, please also refer to the twelfth figure, which is smaller than the tin tank C11 and is immersed therein, which is carried by a carrier C21 and subjected to a carrier drive member C22 The drive can be moved up and down on the surface of the tin bath of the tin bath C11 or above; the carrier C21 has a U shape, so that the upper and lower displacement paths driven by the driving member C22 are parallel to the upper displacement path of the tin bath C2, but separated by one. Appropriate spacing; a scraping member C3, please also refer to the thirteenth figure, which is disposed at the front end of a carrier C31, which is located between the carrier C21 and is subjected to a wiper driving member C33 located on the horizontal rail C32 Driven, the scraping member C3 can be moved forward and backward on the upper surface of the tin bath of the tin bath C11 as the oxygen layer scraping operation of the tin liquid surface, and the tin slag is scraped and scraped on the front and rear side slag tanks C12 and C13 of the tin furnace C1; A plurality of pressure pads C34 protruding from the scraping member C3 are arranged above the seat C31, and each pressure pad C34 is fixed on one of the carriers C31. C35, and in the fixed seat C35 by the elastic element (not shown) to have appropriate elasticity; a cut piece C4, please also refer to the fourteenth figure, consisting of a wire body such as a steel wire The two ends are fastened to the two ends of a bracket C41, and the cutting piece C4 is located in front of the scraping member C3, and the bracket C41 is located between the carrier C21 and the carrier C31, and is subjected to A truncated driving member C43 is arranged on a set of horizontal rails C42, and the truncating and dropping device C4 can be moved forward and backward on the surface of the tin bath of the tin bath C11; please also refer to the fifteenth figure, the line of the cut piece C4 A slag removing member C44 is disposed at the body, and the bottom end of the slag removing member C44 is buckled by a buckle groove C441, and is laterally displaced laterally on a rail seat C46 which can be driven up and down by the slag removing driving member C45. Pair of cut pieces The tin slag adhered to the C4 wire diameter is scraped off; please also refer to the sixteenth figure, the cut piece C4, and the two ends of the piano wire body extend through the hole C411 at both ends of the bracket C41. And is biased into the slit C412 which is inserted into the inner diameter side of the hole C411, and the end of the steel wire body of the cutting piece C4 is wound around the outer side of the bracket C41, and the first screw C414 of the sliding seat C413 is subjected to The screw is fixed, and the sliding seat C413 is screwed and fixed by the second screw C415 after adjusting the proper tension of the wire cutter C4.

請同時參閱第十七至二十一圖,有關沾錫裝置C中刮液件C3及截滴件C4所進行的沾錫製程,包括以下步驟:一初始步驟,請參閱第十七圖,吸附機構A2吸附線圈1並將其搬送至錫槽C11上方,沾錫槽C2此時浸置於錫槽C11中,刮液件C3及截滴件C4均位於錫槽C11一側定位;一沾錫步驟,請參閱第十八圖,吸附機構A2吸附線圈1並下降往錫槽C11錫液面靠近,沾錫槽C2由錫槽C11中上昇,使其盛載之錫液表面與線圈1待沾錫面適當接觸而沾附錫液於其上;一截滴步驟,請參閱第十九圖,吸附機構A2吸附線圈1在往上位移且沾錫槽C2擬往下降入錫槽C11中之際,線圈1待沾錫面與錫液表面正處於液滴拉延的狀態,此時截滴件C4被驅動移切該被拉延之錫液滴,使該拉延的部位被切斷而截取適當份量之錫液滴留置於線圈1待沾錫面;一刮液面步驟,請參閱第二十圖,吸附機構A2吸附線圈1上移且沾錫槽C2降入錫槽C11中後,載座C31及其上刮液件C3被驅動前移,而使刮液件C3於錫槽C11錫液上表面進行表面氧層之刮除作業,並在刮液件C3前移推至定位時,使載座C31上壓墊C34恰位於吸附機構A2吸附線圈1之正下方; 一壓錫滴步驟,請參閱第二十一圖,吸附機構A2吸附已沾有適當份量錫液滴留置於線圈1待沾錫面之線圈1再次下降,使該待沾錫面之錫液滴與壓墊C34對壓,將半凝固狀態之錫液滴壓扁至如第二圖線槽114中之平整狀態後,吸附機構A2吸附線圈1上移,刮液件C3及截滴件C4則回移至初始步驟狀態。 Please also refer to the seventeenth to twenty-first figures. The soldering process for the scraping device C3 and the cut-off device C4 in the soldering device C includes the following steps: For an initial step, please refer to the seventeenth figure. The mechanism A2 adsorbs the coil 1 and transports it to the top of the tin bath C11. The tin bath C2 is immersed in the tin bath C11 at this time, and the scraping member C3 and the cutting piece C4 are located on the side of the tin tank C11; Step, please refer to the eighteenth figure, the adsorption mechanism A2 adsorbs the coil 1 and descends to the tin bath surface of the tin bath C11, and the tin bath C2 rises from the tin bath C11, so that the surface of the tin liquid contained therein is to be adhered to the coil 1 The tin surface is properly contacted and the tin liquid is attached thereto; in the case of a cut-off step, please refer to the nineteenth figure, when the adsorption mechanism A2 is moved upward and the tin bath C2 is intended to descend into the tin bath C11 The surface of the coil 1 to be tinned and the surface of the tin liquid is in a state in which the droplet is drawn. At this time, the cutting piece C4 is driven to cut the drawn tin droplet, so that the drawn portion is cut and intercepted. The appropriate amount of tin droplets is left in the coil 1 to be tinned; a scraping surface step, please refer to the twentieth figure, the adsorption mechanism A2 adsorption coil 1 After the dip tank C2 is lowered into the tin bath C11, the carrier C31 and the upper scraping member C3 are driven forward, and the scraping member C3 is scraped off on the upper surface of the tin bath of the tin bath C11. Work, and when the scraping member C3 is moved forward to the positioning, the pressure pad C34 of the carrier C31 is located just below the adsorption coil 1 of the adsorption mechanism A2; For a step of pressing tin, please refer to the twenty-first figure. The adsorption mechanism A2 adsorbs the tin droplets which have been coated with the appropriate amount of tin and left on the coil 1 to be tinted. After pressing against the pressure pad C34, the semi-solidified tin droplets are flattened to a flat state as in the second drawing groove 114, the adsorption mechanism A2 is moved up by the adsorption coil A, and the scraping member C3 and the cutting piece C4 are Move back to the initial step state.

請參閱第二十二圖,該排料製程可使用如圖所示之排料裝置F,其用以將完成沾錫之線圈1自搬送裝置2間歇性旋轉流路之取放機構A予以承接,送至收集裝置G收集,其包括:一承接機構F1,包括設於一轉座F11上之承接座F12,該承接座F12受一昇降驅動件F13所驅動而可在轉座F11上作上下位移,而該轉座F11受一旋轉驅動件F14經一皮帶F141連動之驅動可作預設角度之旋轉,以帶動轉座F11上承接座F12由朝上翻轉為朝下;該承接座F12上設有列設之複數個凹設之載置區間F121,每一凹設之載置區間F121較預定承接之線圈1略大,並於各其中設有負壓吸孔F122;該承接座F12同時受一橫設於其側之錯動驅動件F15所驅動而可作橫向錯動;一輸送機構F2,由受驅動作循環繞動之輸送帶F21所構成,其輸送路徑上設有計測元件F22以及影像檢測裝置F23,藉由該影像檢測裝置F23檢測沾錫後線圈1成品之是否為良品,而計測元件F22則計測是否有空料或不良品於第幾個排序之線圈1位置出現,以反應給控制系統處理。 Referring to the twenty-second figure, the discharge device can use the discharge device F as shown in the figure, which is used for taking the pick-and-place mechanism A which completes the coiled wire 1 from the intermittent rotary flow path of the transfer device 2 And sent to the collecting device G for collecting, comprising: a receiving mechanism F1, comprising a receiving seat F12 disposed on a rotating seat F11, the receiving seat F12 is driven by a lifting driving member F13 and can be made up and down on the rotating seat F11 Displacement, and the rotary seat F11 is driven by a rotating drive F14 via a belt F141 to rotate at a preset angle to drive the socket F12 on the rotary seat F11 to be turned upwards downward; the receiving seat F12 a plurality of recessed mounting sections F121 are provided, each recessed mounting section F121 is slightly larger than the coil 1 that is intended to be received, and a negative pressure suction hole F122 is provided in each of the recesses; It can be laterally displaced by a shifting driving member F15 disposed on the side thereof; a conveying mechanism F2 is constituted by a conveying belt F21 driven to circulate, and a measuring component F22 is disposed on the conveying path. And the image detecting device F23, wherein the image detecting device F23 detects the tinned wire 1 whether the finished product yield, thereby measuring element F22 is measured whether the available material or a defective product in the first few sort of coil position appears to reflect to the process control system.

有關排料裝置F中之排料製程,包括以下步驟:一初始步驟,取放機構A吸附之各線圈1對應承接機構F1,承接座F12各凹設之載置區間F121,並下降(由第十圖中頂抵驅動件D6驅動之缸桿D5所操控)將各線圈1置於其中,置入時使線圈1偏靠載置區間F121之一側邊; 一吸附步驟,載置區間F121中負壓吸孔F122被通入負壓對載置區間F121中線圈進行吸附;一錯動步驟,請配合參閱第二十三圖,承接座F12受錯動驅動件F15所驅動而作橫向錯動,在線圈1偏靠載置區間F121側邊的情況下,錯動之產生使該側邊形成對線圈之扳撥作用,令線圈1可自取放機構A脫落而被落置於載置區間F121中受吸附;一翻轉步驟,請配合參閱第二十四、二十五圖,承接座F12吸附各線圈1並與昇降驅動件F13一起受轉座F11翻轉朝下,並停止負壓吸附作用而將線圈以沾錫面朝上方式置於輸送機構F2輸送帶F21上,以受輸送收集。 The discharge process in the discharge device F includes the following steps: an initial step, the respective coils 1 adsorbed by the pick-and-place mechanism A are corresponding to the receiving mechanism F1, and the mounting portions F121 of the recesses F12 are lowered and lowered (by the first In the ten figure, the cylinder rod D5 driven by the driving member D6 is driven to place the coil 1 therein, and the coil 1 is biased against one side of the mounting section F121 when being placed; In an adsorption step, the negative pressure suction hole F122 in the mounting section F121 is sucked into the negative pressure to adsorb the coil in the mounting section F121; in the case of a shifting step, please refer to the twenty-third figure, the socket F12 is driven by the displacement. The member F15 is driven to be laterally displaced. When the coil 1 is biased against the side of the mounting section F121, the displacement causes the side to form a pulling action on the coil, so that the coil 1 can be self-propelled and placed. It is detached and is placed in the loading section F121 to be adsorbed; in a flipping step, please refer to the 24th and 25th drawings, the receiving seat F12 adsorbs each coil 1 and is flipped by the rotating seat F11 together with the lifting and lowering drive F13 Downward, and stop the negative pressure adsorption, the coil is placed on the conveying mechanism F2 conveyor belt F21 with the tin-plated face facing up to be collected by the conveyance.

請參閱第二十六、二十七圖,本發明實施例之沾助銲劑方法中所使用的搬送手段,可以在完成線圈沾錫及釋放收集後,在搬送裝置間歇性旋轉流路之一個工作站執行對取放機構A之清潔製程,並採用如圖所示之清潔裝置H,包括:一清潔槽H1,內部容置清潔液;一清潔元件H2,由設於一移動座H21上之複數刷毛所構成,該清潔元件H2之刷毛可受清潔槽H1內部清潔液所浸潤,該移動座H21可受一設於清潔槽H1一側之清潔驅動件H22所驅動,而連動清潔元件H2作橫向往復位移;在清潔槽H1另一側設有可對應清潔元件H2方向進行吹氣之吹乾機構H23;當取放機構A之吸附機構A2被間接移送至清潔裝置H之清潔槽H1上方時,清潔元件H2將被驅動位移,執行對吸附機構A2吸附面的清潔步驟,完成後,吹乾機構H23將執行對吸附機構A2吸附面之吹乾步驟。 Referring to the twenty-sixth and twenty-seventh drawings, the conveying means used in the flux-welding method of the embodiment of the present invention can be used in a station of intermittently rotating the flow path of the conveying device after the coil is tinned and released. The cleaning process of the pick-and-place mechanism A is performed, and the cleaning device H as shown in the figure is used, comprising: a cleaning tank H1 for accommodating the cleaning liquid inside; a cleaning element H2, which is composed of a plurality of bristles disposed on a moving seat H21. The bristles of the cleaning element H2 can be infiltrated by the cleaning liquid inside the cleaning tank H1, and the moving seat H21 can be driven by the cleaning driving member H22 disposed on the side of the cleaning tank H1, and the cleaning element H2 is interlocked for lateral reciprocation. Displacement; on the other side of the cleaning tank H1, there is a drying mechanism H23 for blowing in the direction corresponding to the cleaning element H2; when the suction mechanism A2 of the pick-and-place mechanism A is indirectly transferred to the cleaning tank H1 of the cleaning device H, cleaning The element H2 is driven to be displaced, and the cleaning step of the adsorption surface of the adsorption mechanism A2 is performed. Upon completion, the drying mechanism H23 performs the drying step of the adsorption surface of the adsorption mechanism A2.

綜觀上述,本發明實施例所提供之沾助銲劑方法及裝置,由於可適用於搬送裝置2採旋轉流路進行線圈1之搬送,除使機構之動作流路較規律外,不同線圈1之沾錫液及沾助銲劑可同時進行,大幅提高整體製程效率;另外,搬送裝置2之旋轉流路並不干涉各工作站之作業空間,故各工件站可以對例如助銲劑浸潤程度進行控制、錫液滴進行截滴和壓扁、成品進行翻轉輸送及檢測---等,作有效之精細處理,因此使線圈沾錫之品質獲得有效的提升。 In view of the above, the soldering flux method and apparatus provided by the embodiments of the present invention can be applied to the conveying device 2 to take the rotating flow path for the coil 1 to be transported, except that the action flow path of the mechanism is relatively regular, and the different coils 1 are dip. The tin liquid and the flux can be simultaneously performed to greatly improve the overall process efficiency; in addition, the rotating flow path of the conveying device 2 does not interfere with the working space of each workstation, so each workpiece station can control, for example, the degree of flux infiltration, tin liquid The drop is cut and flattened, the finished product is inverted and conveyed, and the like, for effective fine treatment, so that the quality of the coil tin is effectively improved.

惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。 The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.

B‧‧‧助銲劑裝置 B‧‧‧weld device

B1‧‧‧助銲劑槽 B1‧‧‧flux tank

B11‧‧‧進液管路 B11‧‧‧Inlet line

B12‧‧‧出液管路 B12‧‧‧Drainage line

B13‧‧‧洩液管路 B13‧‧‧Drainage line

B2‧‧‧沾附機構 B2‧‧‧ Attachment

B21‧‧‧載座 B21‧‧‧ Carrier

B211‧‧‧沾體 B211‧‧‧ Body

B212‧‧‧連動件 B212‧‧‧ linkages

B22‧‧‧昇降機構 B22‧‧‧ Lifting mechanism

B221‧‧‧馬達 B221‧‧‧Motor

B222‧‧‧皮帶 B222‧‧‧Land

B223‧‧‧框架 B223‧‧‧Frame

B3‧‧‧刮撥機構 B3‧‧‧ scraping mechanism

B33‧‧‧載架 B33‧‧‧ Carrier

Claims (9)

一種沾助銲劑方法,包括以下步驟:一初始步驟,以一載座載置一沾體浸潤於一助銲劑槽中;一第一上昇步驟,載座載置該沾體上昇而使沾體上表面位於助銲劑槽中助銲劑液面上方;一刮撥步驟,使一刮體被驅動對沾體進行刮撥,使過多之助銲劑被刮落;一第二上昇步驟,載座載置沾體再次上昇,而使沾體抵觸待沾錫元件之待沾錫面,完成沾助銲劑之製程。 A flux-welding method comprising the following steps: an initial step of depositing a body with a body to be infiltrated into a flux bath; and a first ascending step, placing the body on the carrier to raise the upper surface of the body Located in the flux bath above the liquid level of the flux; a scraping step causes a scraper to be driven to scrape the body, causing excessive flux to be scraped off; and a second ascending step, the carrier is placed on the body Rising again, the adhering body is in contact with the tin surface to be tinned, and the fluxing process is completed. 如申請專利範圍第1項所述沾助銲劑裝置,其中,該待沾錫元件受一取放機構中可作吸附或釋放的一吸附座所吸附。 The fluxing device of claim 1, wherein the component to be tinted is adsorbed by a suction seat that can be adsorbed or released in a pick-and-place mechanism. 如申請專利範圍第2項所述沾助銲劑裝置,其中,該取放機構以水平方式而僅在原位繞Z軸旋轉軸向的間歇性旋轉流路進行待沾錫元件搬送。 The fluxing device according to the second aspect of the invention, wherein the pick-and-place mechanism performs the transfer of the member to be soldered in a horizontal manner only in an intermittent rotary flow path in the axial direction of the Z-axis. 一種沾助銲劑裝置,包括:一助銲劑槽,其內充填有助銲劑;一沾附機構,包括其上設有沾體的載座,載座受一昇降機構所連動可上昇使沾體移出助銲劑槽內助銲劑液面,或下降使沾體浸於助銲劑槽內助銲劑液面下;一刮撥機構,包括一刮片狀刮體,其設於受一驅動件作用而可作往復位移之載架上。 A flux-welding device comprising: a flux tank filled with a flux; an adhering mechanism comprising a carrier having a body on the body, the carrier being lifted by a lifting mechanism to raise the body The flux level in the flux tank is lowered, or the dip is immersed in the flux liquid level in the flux tank; a scraping mechanism includes a scraper-like scraping body, which is disposed to be reciprocated by a driving member Displacement on the carrier. 如申請專利範圍第4項所述沾助銲劑裝置,其中,該助銲劑槽設有進液管路及出液管路,使槽中助銲劑經由幫浦產生循環,同時設有洩液管路可在必要時將槽中助銲劑洩放至一儲液筒。 The fluxing device of claim 4, wherein the fluxing tank is provided with a liquid feeding line and a liquid discharging line, so that the flux in the tank is circulated through the pump, and the liquid discharging line is provided at the same time. The flux in the tank can be vented to a reservoir if necessary. 如申請專利範圍第4項所述沾助銲劑裝置,其中,該助銲劑槽設於以間歇性旋轉流路進行搬送的多個工作站其中之一。 The fluxing device of claim 4, wherein the fluxing tank is provided in one of a plurality of workstations that are transported in an intermittent rotating flow path. 如申請專利範圍第4項所述沾助銲劑裝置,其中,該沾體為由海棉等具軟撓性材質構成。 The fluxing device according to the fourth aspect of the invention, wherein the body is made of a soft flexible material such as sponge. 如申請專利範圍第4項所述沾助銲劑裝置,其中,該昇降機構包括由馬達帶動繞轉之皮帶,以連動跨設助銲劑槽兩側並位於助銲劑槽後方之框架作上下位移,使載座以一連動件固設於該框架上受其連動。 The fluxing device of claim 4, wherein the lifting mechanism comprises a belt driven by a motor to move up and down across the frame on both sides of the flux tank and behind the flux tank. The carrier is fixed to the frame by a linkage member and is interlocked. 一種沾助銲劑裝置,用以執行申請專利範圍第1至3項任一項沾助銲劑方法,包括:一助銲劑槽、一沾附機構、一刮撥機構。 A flux-welding device for performing the flux-welding method of any one of claims 1 to 3, comprising: a flux bath, an adhesion mechanism, and a scraping mechanism.
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Publication number Priority date Publication date Assignee Title
CN102315010B (en) * 2010-06-21 2013-05-01 日特机械工程株式会社 Non-circular coil manufacturing device and manufacturing method thereof

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102315010B (en) * 2010-06-21 2013-05-01 日特机械工程株式会社 Non-circular coil manufacturing device and manufacturing method thereof

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