TWI597745B - Pick and place institutions - Google Patents

Description

Pick and place mechanism

The invention relates to a pick-and-place mechanism, in particular to a pick-and-place mechanism which can be arranged in a conveying device to pick up and release the coil after the winding is completed, so that the coil wire end is dipped.

Press, the general coil production usually consists of two parts, one is the winding process, the other is the dip soldering process; in the winding process, the core part of the two flanges must be wound on a "work" type core material. Winding the wire, completing the wound core material and then performing the dip soldering process, so that the core material is placed in the vibrating feeder and sent to the tin bath to adhere the tin liquid to the second line end portion of the core material flange. Then discharge and collect.

The patent application No. 181713, "Welding Machine for Wirewound Inductors" proposes a soldering process for a coil, which proposes a step of first attaching a loose perfume flux to a coil before soldering, and immersing the coil in tin Prior art for sinking tin in a tank, including a guiding device, a detaching device, a wire straightening device, a finishing device, a conveying device, a transmission device, a rotating device, a control device, an infiltration device, a scraping device, a soldering device, and a belt The device and the like are configured to perform the steering, the transfer, the wetting, and the solder transfer operation of the left and right rotating devices to complete the tin plating of the copper wire at both ends of the wound inductor, and the wire is gradually separated from the solder bath to avoid the solder attached to the end of the wire. The surface is elongated into a needle shape, and then combined by a toothed chain conveyor, a cylinder action, a solenoid valve line control, and a lead screw to form a wire wound inductor soldering machine.

The prior art soldering process uses a left and right set of rotating devices located in the flux immersion The soldering device and the soldering device of the tin liquid are above, and the rotating axial direction is parallel with the wetting device and the soldering device, but the rotating conveying method is perpendicular to the direction of infiltrating the flux and the tin liquid, and the tin coil to be wetted by the flux is wetted. The device and the tin soldering device are transported back and forth between the device and the soldering device. In addition to the complexity and bulk of the mechanism, the tin and the flux can not be simultaneously performed to improve the overall process efficiency; and the left and right rotating devices are reciprocated to the flux infiltration device. Between the soldering device and the tin soldering device, the wetting device cannot be provided with a device for adjusting the degree of wetting, and the device for handling the suspension of tin droplets cannot be disposed above the soldering device, so that it is difficult to effectively improve the quality of the soldering tin.

Accordingly, an object of the present invention is to provide a pick-and-place mechanism that can be disposed on a transport device for transporting a coil to an intermittent rotary flow path of a transport device and picking up and dropping it on a plurality of workstations.

The pick-and-place mechanism according to the object of the present invention comprises: a pick-and-place holder disposed on a transport device that transports in an intermittent rotating flow path; and an adsorption mechanism that moves up and down by a linkage member and the pick-and-place base The adsorption mechanism is provided with an adsorption seat, a hollow air chamber is formed inside the adsorption seat, and an adsorption surface is formed at the bottom of the adsorption seat, and a magnetic member is disposed in the air chamber, and the magnetic member is disposed on a movable member. The positive or negative pressure gas is introduced into the air chamber, so that the movable member is linked to or away from the adsorption surface, so that the adsorption surface adsorbs or releases the lower to be adsorbed and transported. object.

According to the pick-and-place mechanism provided by the embodiment of the present invention, the coil is conveyed by the rotating conveying path by the conveying device, and the flow channel of the different coils and the flux can be simultaneously performed, which is greatly improved, except that the flow path of the mechanism is relatively regular. The overall process efficiency; in addition, the pick-and-place mechanism cooperates with the rotating flow path of the conveying device does not interfere with the working space of each workstation, so each workpiece station can control, for example, the degree of flux infiltration, the tin droplets are cut and flattened, and the finished product Inverted conveying and detection ---, etc., for effective fine processing, so that the quality of the coil tinned is effectively improved.

1‧‧‧ coil

11‧‧‧ core material

111‧‧‧First flange

112‧‧‧second flange

113‧‧‧core core

114‧‧‧ wire trough

12‧‧‧Wire

121‧‧‧First line end

122‧‧‧second line

13‧‧‧Conductive substances

2‧‧‧Transporting device

21‧‧‧Workstation

22‧‧‧ drive mechanism

23‧‧‧ upper surface

A‧‧‧ pick-and-place mechanism

A1‧‧‧Removable seat

A11‧‧‧rail

A12‧‧‧Flexible components

A13‧‧‧ shaft tube

A2‧‧‧Adsorption mechanism

A21‧‧‧ adsorption seat

A211‧‧‧ frame

A212‧‧‧ bottom cover

A213‧‧‧ air cavity

A214‧‧‧Adsorption surface

A22‧‧‧Magnetic parts

A23‧‧‧Activities

A231‧‧‧ pivot

A232‧‧ ‧ body

A233‧‧‧Flexible components

A3‧‧‧Sensor components

B‧‧‧weld device

B1‧‧‧flux tank

B11‧‧‧Inlet line

B12‧‧‧Drainage line

B13‧‧‧Drainage line

B2‧‧‧ Attachment

B21‧‧‧ Carrier

B211‧‧‧ Body

B212‧‧‧ linkages

B22‧‧‧ Lifting mechanism

B221‧‧‧Motor

B222‧‧‧Land

B223‧‧‧Frame

B3‧‧‧ scraping mechanism

B31‧‧‧Scratch

B32‧‧‧ drive parts

B33‧‧‧ Carrier

C‧‧‧Staining device

C1‧‧‧ Tin furnace

C11‧‧‧ tin bath

C12‧‧‧dew tank

C13‧‧‧dew tank

C2‧‧‧Dip tin bath

C21‧‧‧ carrier

C22‧‧‧carrier drive

C3‧‧‧ scraping parts

C31‧‧‧ Carrier

C32‧‧‧ rails

C33‧‧‧Scrape driver

C34‧‧‧ pressure pad

C35‧‧‧ fixed seat

C4‧‧‧ cut pieces

C41‧‧‧ bracket

C411‧‧‧ hole

C412‧‧‧Slit

C413‧‧‧ slide

C414‧‧‧First screw firmware

C415‧‧‧Second screw firmware

C42‧‧‧Horizontal rail

C43‧‧‧ cut-off drive

C44‧‧‧Slag removal parts

C45‧‧‧Slag removal drive

C46‧‧‧ rail seat

D‧‧‧掣抵装置

D1‧‧‧Rack

D2‧‧‧ drive parts

D3‧‧‧掣掣件

D4‧‧‧ cantilever

D5‧‧‧Cylinder rod

D6‧‧‧ drive parts

E‧‧‧Exhaust device

F‧‧‧Discharge device

F1‧‧‧Accommodating agency

F11‧‧‧Transposition

F12‧‧‧ socket

F121‧‧‧Loading interval

F122‧‧‧ Negative pressure suction hole

F13‧‧‧ Lifting drive

F14‧‧‧Rotary drive

F141‧‧‧Leather belt

F15‧‧‧Displacement drive

F2‧‧‧Transportation agency

F21‧‧‧ conveyor belt

F22‧‧‧Measurement components

F23‧‧‧Image inspection device

G‧‧‧Collection device

H‧‧‧ cleaning device

H1‧‧‧ cleaning tank

H2‧‧‧ cleaning components

H21‧‧‧Mobile seat

H22‧‧‧clean drive parts

H23‧‧‧Blowing mechanism

The first figure is a schematic perspective view of the winding of the core material of the embodiment of the present invention.

The second figure is a perspective view of the finished coil product of the embodiment of the present invention.

The third figure is a schematic perspective view of a conveying device according to an embodiment of the present invention.

The fourth figure is a schematic cross-sectional view of the adsorption mechanism of the pick-and-place mechanism of the embodiment of the present invention.

The fifth figure is a schematic perspective view of a flux device according to an embodiment of the present invention.

Figure 6 is a schematic view showing the initial steps of the flux-welding process of the embodiment of the present invention.

The seventh figure is a schematic diagram of the first rising step of the flux-welding process of the embodiment of the present invention.

The eighth figure is a schematic diagram of the scraping step of the flux-welding process of the embodiment of the present invention.

The ninth drawing is a schematic diagram of the second rising step of the flux-welding process of the embodiment of the present invention.

The tenth figure is a schematic view of a device for immersing tin, smashing, and exhausting according to an embodiment of the present invention.

The eleventh drawing is a schematic view of a dip soldering apparatus according to an embodiment of the present invention.

Twelfth is a schematic view of a dip tank according to an embodiment of the present invention.

Figure 13 is a schematic view of a wiper member according to an embodiment of the present invention.

Figure 14 is a schematic view of a cut piece of the embodiment of the present invention.

The fifteenth drawing is a schematic view of a slag removing member according to an embodiment of the present invention.

Figure 16 is a schematic view showing the securing portion of the cutting piece of the embodiment of the present invention.

Figure 17 is a schematic view showing the initial steps of the dip soldering process of the embodiment of the present invention.

The eighteenth drawing is a schematic diagram of the step of diluting tin in the dip soldering process of the embodiment of the present invention.

The nineteenth drawing is a schematic diagram of the cutting step of the dip tin process of the embodiment of the present invention.

Figure 20 is a schematic view showing the steps of the scraping surface of the dip tin process of the embodiment of the present invention.

The twenty-first drawing is a schematic view of the step of pressing tin in the dip tin process of the embodiment of the present invention.

The twenty-second figure is a schematic view of the discharge device of the embodiment of the present invention.

The twenty-third figure is a partial schematic view of the discharge process receiving socket of the embodiment of the present invention.

The twenty-fourth embodiment is an indication of the flipping of the socket discharging device of the embodiment of the present invention (1).

The twenty-fifth drawing is a schematic diagram of the flipping of the socket discharging device of the embodiment of the present invention (2).

The twenty-sixth drawing is a schematic view of a cleaning device of an embodiment of the present invention.

The twenty-seventh drawing is a schematic view of cleaning of the cleaning device of the embodiment of the present invention.

Referring to Figures 1 and 2, the pick-and-place mechanism of the embodiment of the present invention can be used for the manufacture of the coil 1 shown in Figs. 1 and 2, the coil 1 comprising a core material 11 having a first flange 111 at both ends. a second flange 112, and a core portion 113 located therebetween, wherein the first flange 111 is provided with mutually parallel and recessed wire grooves 114 on opposite sides of the proper spacing; the winding core portion 113 is wound a wire 12 forming a first wire end 121 formed by the wire end of the second flange 112 and a second wire end 122 formed by the wire end of the first flange 111, the first wire end 121 and The second wire ends 122 are respectively bent from the first flange 111 side in the same direction and each of the first flanges 111 are parallel to each other and the recessed groove 114 is about half of the length. The conductive material 13 such as tin liquid is adhered and fixed to the first flange 111 of the first groove 111 to form a complete coil 1.

In the embodiment of the present invention, the coil 1 has completed the winding of the first figure and the finished product, and the finished product of the coil 1 as shown in the second figure is completed by the manufacturing method and apparatus provided by the embodiment of the present invention.

Referring to the second, third and fourth figures, in the embodiment of the present invention, the coil 1 is transported to the plurality of workstations 21 by means of a transport device 2 by means of a transport device 2, and the workstations 21 perform the following processes. The method includes: a fluxing flux process, located on the workstation 21 of the intermittent rotating flow path, so that the tinned portion of the coil 1 to be conveyed by the conveying device 2 is contaminated by the flux; a dip tin process, located in the intermittent rotating flow path of the flux processing post stage workstation 21, so that the tinned portion of the coil 1 to be transferred is contaminated by the tin liquid; a discharge process for completing the dip tin The coil 1 is removed from the transfer device 2 of the intermittent rotary flow path and collected.

The conveying device 2 is slightly disk-shaped, and each of the workstations 21 is provided with a pick-and-place mechanism A, and is driven by the driving mechanism 22 to carry the same intermittent rotating flow path only in the home position, and rotates the axis around the Z axis in a horizontal manner. Each of the pick-and-place mechanisms A includes: a pick-and-place A1 supported by the plurality of vertical rails A11 and disposed on the transport device 2, the rails A11 on the upper surface 23 of the transport device 2 and the pick-and-place A1 The elastic member A12 is disposed, and the guide rail A11 is partially disposed in the lower shaft A13 of the upper surface 23; an adsorption mechanism A2 is vertically displaced by the linkage A3 and the loading and unloading seat A1, and the frame body A211 and the bottom are provided. The adsorption seat A21 of the cover A212 is formed, a middle air chamber A213 is formed inside the adsorption seat 21, and an adsorption surface A214 is formed at the bottom, and the magnetic member A22 is arranged in the air chamber A213 to be embedded in a movable member A23 in a plurality of arrangement manners. The movable member A23 is pivoted through the adsorption seat A21 by two pivots A231, and a stopper body A232 is disposed outside, and an elastic member A233 is disposed between the stopper body A232 and the adsorption seat A21; and the sensing component A3 is further provided. The displacement condition of the movable member A23 can be sensed in the air inlet chamber A213; the borrowing seat A1 is pressed against The interlocking adsorption mechanism A2 is moved downward to the coil 1 to be adsorbed and transported, and a positive pressure gas is introduced into the air chamber A213, so that the movable member A23 is subjected to the push driving force so that the magnetic member A22 is pressed against the inner side of the adsorption surface A214. The adsorption surface A214 is magnetically adsorbed to adsorb the coil 1 to be adsorbed; when the coil 1 adsorbed by the adsorption surface A214 is to be released, the positive pressure gas is stopped or the negative pressure gas is introduced into the air chamber A213, so that the movable member A23 is subjected to When the suction force is upward, the magnetic member A22 is detached from the adsorption surface A214, and the adsorption surface A214 is demagnetized to release the lower coil 1.

Please refer to the fifth and sixth figures. The fluxing process can use the flux device B as shown in the figure, including: a flux tank B1 filled with a flux such as rosin, and a liquid inlet pipe B11 And the liquid discharge pipe B12, so that the flux in the tank is circulated through the state, to reduce the volatility of the flux, causing the concentration to change too much, affecting the adhesion quality of the flux; at the same time, the liquid discharge pipe B13 can be provided. Flush the flux in the tank to the liquid storage tank (not shown) during shutdown or if necessary to avoid flux evaporation; a bonding mechanism B2, including a soft flexible material such as sponge The carrier B21 of the body B211 is formed, and the carrier B21 is moved by a lifting mechanism B22 to move the body B211 out of the flux level in the flux tank B1, or to drop the body B211 into the flux tank B1. The lifting mechanism B22 includes a belt B222 driven by the motor B221 to interlock the frame B223 which is located on both sides of the flux tank B1 and located behind the flux tank B1 for up-and-down displacement, so that the carrier B21 is interlocked. The piece B212 is fixed on the frame B223 and is linked by the same; The structure B3 includes a blade-shaped scraping body B31 which is disposed on a carrier B33 which is displaced by a driving member B32 and is reciprocally reciprocated above the body B211. The blade body B31 can be moved to the body. Excessive flux is scraped off the upper surface of body B211.

Please refer to the sixth to ninth drawings. The fluxing process of the adhesion mechanism B2 and the scraping mechanism B3 in the flux device B includes the following steps: For an initial step, please refer to the sixth figure, at this time, the carrier B21 The deposited body B211 is immersed in the flux liquid level in the flux tank B1; in the first rising step, please refer to the seventh figure, the carrier B21 is placed on the body B211 and is lifted by the lifting mechanism B22 to make the body B211 The surface is located above the flux level in the flux bath B1; A scraping step, please refer to the eighth figure, the scraper B31 is driven by the driving member B32 to drive the carrier B33 to scrape the upper surface of the body B211, so that too much flux is scraped off; a second rising step, please refer to In the ninth figure, the carrier B21 is placed on the body B211 to be raised again by the lifting mechanism B22, so that the upper surface of the body B211 is in contact with the suction surface of the adsorption unit A2 under the adsorption surface A214 to be tinned, and after the flux is finished The carrier B21 is placed on the body B211 to be returned to the original initial step by the lifting mechanism B22.

Please refer to the tenth figure. The dip tin process can use the dip soldering device C as shown in the figure, and cooperate with a smashing device D and an exhaust device E; the smashing device D is located in front of the dipping device C, and borrows a frame D1. The upper abutting driving member D2 drives the yoke resisting member D3 to the lowering member A3 of the absorbing mechanism A2 in the third figure, so that the absorbing mechanism A2 is moved downward to perform the work of dipping the coil 1 adsorbed under the squeegee; the frame D1 is provided There is a cantilever D4, which is provided with a top abutting driving member D6 which can be extended downwardly, and is used for contacting the air pressure switch of the adsorption mechanism A2 in the third figure, so that the adsorption mechanism A2 is released as the coil 1. It is the control of the next discharge process, detailed later; the exhaust device E is placed above the tin furnace C1 of the tin-plating device C to absorb the toxic gas volatilized by the tin liquid.

Referring to FIG. 11 , the soldering device C includes a tin furnace C1 having a tin bath C11 for accommodating tin liquid and a tin bath C1 on the front and rear sides of the tin furnace C1. Tin dross tanks C12, C13; a tin bath C2, please also refer to the twelfth figure, which is smaller than the tin tank C11 and is immersed therein, which is carried by a carrier C21 and subjected to a carrier drive member C22 The drive can be moved up and down on the surface of the tin bath of the tin bath C11 or above; the carrier C21 has a U shape, so that the upper and lower displacement paths driven by the driving member C22 are parallel to the upper displacement path of the tin bath C2, but separated by one. Appropriate spacing; a scraping member C3, please also refer to the thirteenth figure, which is disposed at the front end of a carrier C31, which is located between the carrier C21 and is subjected to a wiper driving member C33 located on the horizontal rail C32 Driven, The scraping liquid scraping member C3 can be displaced forward and backward on the upper surface of the tin bath of the tin bath C11 as the oxygen layer scraping operation of the tin liquid surface, and the tin slag can be scraped and scraped on the front and rear side slag tanks C12 and C13 of the tin furnace C1; above the carrier C31 A plurality of pressure pads C34 are provided at the scraping member C3, and the pressure pads C34 are disposed on the fixing base C35 of the carrier C31, and are subjected to elastic members (not shown) in the fixing base C35. With appropriate flexibility; a piece of cut piece C4, please also refer to the fourteenth figure, consisting of a wire body such as a steel wire, the two ends of which are fastened to the ends of a bracket C41, the cutting piece C4 Located in front of the scraping member C3, the bracket C41 is located between the carrier C21 and the carrier C31, and is driven by a truncated driving member C43 located on a group of horizontal rails C42. The cutting piece C4 is displaced forward and backward on the surface of the tin bath of the tin bath C11; please also refer to the fifteenth figure, the slag removing part C44 is provided at the line body of the cut piece C4, and the bottom end is buckled by a buckle groove C441 The wire diameter of the drop piece C4 is laterally displaced to the left and right on a rail seat C46 which can be driven up and down by the slag driving member C45, so as to adhere the tin to the wire diameter of the cut piece C4. Scrape; please also refer to the sixteenth figure, the cut piece C4, the two ends of the piano wire body extend through the hole C411 at both ends of the bracket C41, and biased into the inner diameter of the hole C411 The slit C412 of one side is positioned, and the end of the wire body of the cut piece C4 is wound around the outer side of the bracket C41. The first screw C414 of the slide C413 is screwed, and the slide C413 is slipped. After adjusting the proper tension of the C4 wire body of the cut piece, the second screw C415 is screwed into place.

Please also refer to the seventeenth to twenty-first figures. The soldering process for the scraping device C3 and the cut-off device C4 in the soldering device C includes the following steps: For an initial step, please refer to the seventeenth figure. The mechanism A2 adsorbs the coil 1 and transports it to the top of the tin bath C11. The tin bath C2 is immersed in the tin bath C11 at this time, and the scraping member C3 and the cutting piece C4 are located on the side of the tin tank C11; Step, please refer to the eighteenth figure, the adsorption mechanism A2 adsorbs the coil 1 and descends to the tin The tank C11 tin liquid surface is close, and the tin bath C2 is raised from the tin bath C11, so that the surface of the tin liquid contained therein is properly contacted with the tinned surface of the coil 1 and the tin liquid is adhered thereto; a truncation step, please Referring to the nineteenth figure, when the adsorption mechanism A2 is displaced upward and the tin bath C2 is intended to descend into the tin bath C11, the surface of the coil 1 to be tinned and the surface of the tin liquid is in a state of droplet drawing. At this time, the cutting piece C4 is driven to cut the drawn tin droplets, so that the drawn portion is cut and a proper amount of tin droplets are intercepted and left in the coil 1 to be tinned; a scraping surface Step, please refer to the twentieth figure. After the adsorption mechanism A2 moves up the coil 1 and the tin bath C2 falls into the tin bath C11, the carrier C31 and the upper scraping member C3 are driven to move forward, so that the scraping member C3 performs the scraping operation of the surface oxygen layer on the upper surface of the tin bath of the tin bath C11, and when the scraping member C3 is moved forward to the positioning, the pressure pad C34 of the carrier C31 is located just below the adsorption coil 1 of the adsorption mechanism A2. For a step of pressing tin, please refer to the twenty-first figure. The adsorption mechanism A2 adsorbs the coil which has been coated with the appropriate amount of tin and remains on the coil 1 to be tinned. Decreasing, the tin droplets of the tin surface to be pressed are pressed against the pressure pad C34, and the tin droplets in the semi-solidified state are flattened to a flat state as in the second image line groove 114, and the adsorption mechanism A2 is adsorbed on the coil 1 The scraping member C3 and the cutting piece C4 are moved back to the initial step state.

Referring to the twenty-second figure, the discharge device can use the discharge device F as shown in the figure, which is used for taking the pick-and-place mechanism A which completes the coiled wire 1 from the intermittent rotary flow path of the transfer device 2 And sent to the collecting device G for collecting, comprising: a receiving mechanism F1, comprising a receiving seat F12 disposed on a rotating seat F11, the receiving seat F12 is driven by a lifting driving member F13 and can be made up and down on the rotating seat F11 Displacement, and the rotary seat F11 is driven by a rotating drive F14 via a belt F141 to rotate at a preset angle to drive the socket F12 on the rotary seat F11 to be turned upwards downward; the receiving seat F12 There are a plurality of recessed mounting sections F121 arranged, and each recessed mounting section F121 is more predetermined than the predetermined one. The coil 1 is slightly larger, and each of them is provided with a negative pressure suction hole F122; the receiving seat F12 is simultaneously driven by a shifting driving member F15 disposed on the side thereof to be laterally displaced; a conveying mechanism F2, The conveyor belt F21 is driven by the circulation, and the measuring device F22 and the image detecting device F23 are disposed on the conveying path, and the image detecting device F23 detects whether the finished coil 1 is good after the tinning, and the measuring component F22 measures whether there are empty materials or defective products appearing in the first sorted coil 1 position to react to the control system.

The discharge process in the discharge device F includes the following steps: an initial step, the respective coils 1 adsorbed by the pick-and-place mechanism A are corresponding to the receiving mechanism F1, and the mounting portions F121 of the recesses F12 are lowered and lowered (by the first In the ten figure, the cylinder rod D5 driven by the driving member D6 is driven to place the coil 1 therein, and the coil 1 is biased against one side of the mounting section F121 when being placed; and an adsorption step is carried in the section F121. The negative pressure suction hole F122 is sucked into the negative pressure to adsorb the coil in the mounting section F121; in the case of a shifting step, please refer to the twenty-third figure, the bearing seat F12 is driven by the shifting driving member F15 to be laterally displaced. When the coil 1 is biased to the side of the mounting section F121, the displacement causes the side to form a pulling action on the coil, so that the coil 1 can be separated from the pick-and-place mechanism A and placed in the mounting section. F121 is adsorbed; in the flipping step, please refer to the 24th and 25th drawings. The receiving seat F12 adsorbs the coils 1 and is turned upside down by the rotating seat F11 together with the lifting and lowering drive F13, and stops the negative pressure adsorption. And placing the coil on the conveyor belt F21 of the conveying mechanism F2 with the tin-facing side facing up, By transport collection.

Referring to the twenty-sixth and twenty-seventh drawings, the conveying means used in the embodiment of the present invention can intermittently rotate the flow path in the conveying device after the coil is tinned and released and collected. A cleaning station performs a cleaning process for the pick-and-place mechanism A, and adopts a cleaning device H as shown in the drawing, comprising: a cleaning tank H1 for accommodating the cleaning liquid therein; and a cleaning element H2 disposed on a moving seat H21. The bristles of the cleaning element H2 can be infiltrated by the cleaning liquid inside the cleaning tank H1, and the moving seat H21 can be driven by the cleaning driving member H22 disposed on the side of the cleaning tank H1, and the cleaning component H2 is interlocked Lateral reciprocating displacement; on the other side of the cleaning tank H1, there is a drying mechanism H23 capable of blowing in the direction corresponding to the cleaning element H2; when the suction mechanism A2 of the pick-and-place mechanism A is indirectly transferred to the cleaning tank H1 of the cleaning device H The cleaning element H2 is driven to be displaced, and the cleaning step of the adsorption surface of the adsorption mechanism A2 is performed. After completion, the drying mechanism H23 performs the drying step of the adsorption surface of the adsorption mechanism A2.

In view of the above, in the pick-and-place mechanism provided by the embodiment of the present invention, since the pick-and-place mechanism A cooperates with the transporting device 2 to take the rotating flow path for the coil 1 to be transported, in addition to making the action flow path of the mechanism more regular, the different coils 1 are dipped in tin. The liquid and the flux can be simultaneously performed to greatly improve the overall process efficiency; in addition, the pick-and-place mechanism A cooperates with the rotating flow path of the conveying device 2 without interfering with the working space of each workstation, so that each workpiece station can perform, for example, flux infiltration degree. The control, the tin droplets are cut and flattened, the finished product is turned over and conveyed, and the like, for effective fine processing, so that the quality of the coil tin is effectively improved.

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.

1‧‧‧ coil

A21‧‧‧ adsorption seat

A211‧‧‧ frame

A212‧‧‧ bottom cover

A213‧‧‧ air cavity

A214‧‧‧Adsorption surface

A22‧‧‧Magnetic parts

A23‧‧‧Activities

A231‧‧‧ pivot

A232‧‧ ‧ body

A233‧‧‧Flexible components

A3‧‧‧Sensor components

Claims (7)

The pick-and-place mechanism comprises: a pick-and-placed seat, which is disposed on a conveying device that carries the intermittent rotating flow path; and an adsorption mechanism that is moved up and down by a linkage member and the pick-and-place joint, the adsorption mechanism a suction seat is formed, a hollow air chamber is formed inside the adsorption seat, and an adsorption surface is formed at the bottom of the adsorption seat, and a magnetic member is disposed in the air chamber, and the magnetic member is disposed on a movable member; A positive pressure or a negative pressure gas is introduced into the air chamber to cause the movable member to interlock with or away from the adsorption surface, so that the adsorption surface adsorbs or releases the object to be adsorbed and transported. The pick-and-place mechanism according to the first aspect of the invention, wherein the pick-and-place mount is supported by the plurality of vertical rails and is disposed on the transport device, wherein the guide rail is provided with an elastic component between the upper surface of the transport device and the pick-and-place The rail portion extends into the barrel below the upper surface. The pick-and-place mechanism of claim 1, wherein the suction seat of the adsorption mechanism is assembled by a frame and a bottom cover. The pick-and-place mechanism of claim 1, wherein the magnetic member of the suction chamber is embedded in the movable member in a plurality of manners, and the movable member is pivoted through the adsorption seat by two pivots. And a blocking body is arranged outside, and an elastic element is sleeved between the blocking body and the adsorption seat. The pick-and-place mechanism according to claim 1, wherein the adsorption seat is provided with a sensing element extending into the air chamber to sense the displacement condition of the movable member. The pick-and-place mechanism according to claim 1, wherein the transporting device transports the coil to the plurality of workstations in an intermittent rotating flow path, and the pick-and-place mechanism is provided in the workstation. The pick-and-place mechanism according to claim 1, wherein the transporting device is slightly disk-shaped, and the transporting device is driven by the driving mechanism to be transported in the same intermittent rotating flow path only in the home position, and is horizontally wound around the Z. The shaft rotates axially intermittently.