TWI596375B - Automated microscopic imaging system and method - Google Patents

Description

Automated microscopic image capturing device and method

The present invention relates to a system for inspecting conductive particles of an anisotropic conductive paste on a substrate, and more particularly to an automated microscopic image taking device for image taking in the system.

The use of anisotropic conductive film (ACF) to assemble a flexible circuit board or wafer onto a liquid crystal panel or printed circuit board has been widely used in the manufacture of liquid crystal panels and printed circuit boards. For example, a tape carrier package (TCP), a chip on film (COF), a chip on glass (COG) that directly assembles a driver wafer to a glass substrate, and directly directs the wafer The board on board (COB) assembled on the printed circuit board, and the chip directly bonded to the chip on glass (COG) are mostly made of an anisotropic conductive paste.

The anisotropic conductive adhesive is composed of conductive particles and insulating rubber material, and has the characteristics of vertical conduction and left and right insulation. However, when the hot pressing process is performed, if the pressure of the anisotropic conductive adhesive is uneven or insufficient, The number of deformable conductive particles that cause conduction is insufficient, resulting in poor conductivity. In addition, when the density distribution of the conductive particles is uneven, the conductivity is also poor. Therefore, in the case of using an anisotropic conductive paste, it is usually necessary to check the state, number and distribution of the conductive particle indentation to determine the conductivity. The Taiwan Patent No. 583403 shows the use for such inspection. An automatic detection system for conductive particle compression.

The system adopts an image inspection technology, which uses an image capturing module with an optical microscope to capture a digital image of a wafer pin that has been pressed, and transmits the digital image to an image processing module for processing. The processing result is used for analysis to determine whether the conductive state of the conductive particles is good. Similar technology can also be found in Taiwan’s public Case No. 200910484.

Since the above-mentioned conductive particles are very small, if the lens of the optical microscope is slightly deviated and the area to be imaged on the substrate is not positive, or the vertical distance between the lens and the image capturing area is slightly insufficient or slightly too large, it will result in taking It is not clear enough to increase the difficulty of subsequent image processing and the correctness of analysis. Therefore, it is imperative to provide a new type of microscopic image capturing device that can ensure the image resolution is within an acceptable range.

The present invention provides an automated microscopic image taking device for taking image of at least one image capturing area of a substrate. The device includes a preliminary guiding mechanism, a carrying device, a rotary guiding module and a linear scanning and capturing device. The preliminary guiding mechanism is used to perform preliminary guiding of the substrate. The transport device is configured to transfer the substrate from the preliminary guiding mechanism to the rotary guiding module. After the preliminary guided substrate is transferred to the rotary guiding module by the carrying device, the alignment line of the substrate can fall within a detection range of the detecting device. The rotary guiding module is configured to rotate the substrate to an image capturing starting position. The linear scanning image capturing device is configured to perform linear scanning image capturing when the substrate is guided to the image capturing start position to capture an image of the image capturing area of the substrate.

Preferably, the rotary guiding module comprises a detecting device and a rotating mechanism. The detecting device is configured to detect an angular difference of an alignment line of the substrate with respect to a reference line; and the rotating mechanism is connected to the detecting device and corresponding to the rotation angle according to the detected angle difference, so that The substrate is guided to the image capturing start position.

The invention further provides an automated microscopic image capturing method for taking image of at least one image capturing area of a substrate, the method comprising the steps of: (a) guiding the substrate to a first position in advance, Decreasing the degree of skew of the substrate such that an alignment line of the substrate can fall within a detectable range; (b) transferring the substrate from the first position to a second position, causing the alignment line of the substrate to fall Detecting the detectable range of the device; (c) detecting the alignment line of the substrate by the detecting device to determine the degree of skew of the substrate; (d) rotating the detecting result according to step (c) Substrate to turn the substrate to a third position for linear scanning imaging; and (e) linear scanning of the substrate after the rotation to capture an image of the imaging area of the substrate.

100‧‧‧Microscopic image capturing equipment

1‧‧‧ preliminary guiding mechanism

10‧‧‧Vacuum adsorption platform

11‧‧‧y-axis side device

111‧‧‧Drive unit

112‧‧‧y stage

113‧‧‧Pushing column

12‧‧‧x axle edge device

121‧‧‧Drive unit

122‧‧‧x stage

123‧‧‧Two pushes to the column

13‧‧‧Base

131‧‧‧Leather slide

2‧‧‧Transportation device

20‧‧‧ Arm

21‧‧‧Slide rails

3‧‧‧Rotary guide module

31‧‧‧Detection device

32‧‧‧Rotating mechanism

321‧‧‧Adsorption platform

300‧‧‧x track

4‧‧‧Linear scanning image capture device

41‧‧‧x-axis transfer device

410‧‧‧ long strip

411‧‧‧x-axis track

412‧‧‧x axle carrier

413‧‧‧x-axis drive unit

413a‧‧‧stator

413b‧‧‧ mover

42‧‧‧y-axis transfer device

420‧‧‧ seat board

421‧‧‧y-axis

422‧‧‧y axle carrier

423‧‧‧y-axis drive unit

423a‧‧‧stator

423b‧‧‧ mover

43‧‧‧z-axis transfer device

430‧‧‧z axis orbit

431‧‧‧z axle carrier

432‧‧‧z axis drive unit

432a‧‧‧Servo motor

44‧‧‧Laser tracking module

440‧‧‧Laser Displacement Detection Module

45‧‧‧Microscope image group

450‧‧‧ lens

6‧‧‧Substrate

60‧‧‧ wafer

601‧‧‧ first half

602‧‧‧The latter half

61‧‧‧ first side

62‧‧‧ second side

The first figure is a schematic view of the three-dimensional structure of the automated microscopic image capturing apparatus of the present invention.

The second figure is a schematic perspective view of the substrate guiding mechanism of the automated microscopic image capturing apparatus of the present invention.

The third figure is a perspective exploded view of the substrate guiding mechanism of the second figure.

The fourth A to fourth C drawings show the guiding process of the substrate guiding mechanism of the second figure.

The fifth drawing is a schematic perspective view of a handling device of the automated microscopic image taking device of the present invention.

The sixth figure is a schematic perspective view of the rotary guide module of the automated microscopic image capturing apparatus of the present invention.

The seventh figure is a schematic perspective view of a linear scanning module of the automated microscopic image capturing apparatus of the present invention.

The eighth figure is a perspective exploded view of the linear scanning module of the seventh figure.

The ninth drawing is a three-dimensional structural diagram of the combined structure of the rotary guiding module and the linear scanning module of the automated microscopic image capturing apparatus of the present invention, which is shown to be applied to the glass flip chip packaging of the glass substrate.

The tenth drawing, similar to the ninth drawing, shows the application of the present invention to the imaging of a flip chip package of a printed circuit board.

The eleventh drawing is a side view of the combined structure of the ninth drawing.

The twelfth figure is a front view of the combined structure of the ninth figure.

The thirteenth diagram shows a schematic diagram showing the scanning route of the linear scanning module of the present invention.

Figure 14 is a schematic flow chart of the automated microscopic image capturing method of the present invention.

The first figure shows a preferred embodiment of the automated microscopy imaging apparatus 100 of the present invention, which generally includes a preliminary guiding mechanism 1, a handling device 2, and a rotary guiding module 3. And a linear scanning image capturing device 4. The rotary guiding module 3 further includes a detecting device 31 and a rotating mechanism 32. The linear scanning image capturing device 4 includes a laser focusing module 44 and a micro-mirror group 45, whereby the substrate 6 shown in FIG. 9 is subjected to precise microscopic image capturing. The substrate 6 refers to a liquid crystal panel, an organic light emitting diode panel, a printed circuit board, a packaging pad or other plate material, and may also generally refer to an object having a substantially square or rectangular shape.

The preliminary guiding mechanism 1 (shown in an enlarged view of the second figure) is used to first conduct a preliminary guiding of the substrate 6 to reduce the skew of the substrate 6. The handling device 2 (shown in the enlarged view of the fifth figure) moves the substrate 6 from a first position of the preliminary guiding mechanism 1 to the rotating guiding module 3 by a suction cup underneath (such as A second position, shown in the enlarged view of the sixth figure, for more precise skew guidance. More specifically, after the preliminary guided substrate 6 is transferred to the rotary guiding module 3 by the carrying device 2, the alignment line of the substrate 6 can be detected in the rotating guiding module 3 Within a detection range of device 31. The rotating mechanism 32 of the rotary guiding module 3 continues to rotate an appropriate angle according to the angle difference detected by the detecting device 31 to guide the substrate 6 to an image capturing starting position. In short, the rotary guiding module 3 is configured to rotate the substrate 6 to the image capturing start position, so that the linear scanning image capturing device 4 (shown in an enlarged view of the seventh figure) performs linearity. The image is scanned to capture an image of the image capturing area of the substrate 6.

In detail, referring to the second and third figures, the preliminary guiding mechanism 1 generally includes a base 13, a y-axis abutment device 11 disposed above the base 13, and an x stacked above the y-axis abutment device 11. A shaft edge device 12 and a vacuum suction platform 10. The substrate 6 is laid flat on one surface of the vacuum adsorption platform 10 (i.e., the X-Y plane) for guiding operation. Generally, the substrate 6 has a first side 61 and a second side 62 that are perpendicular to each other. The y-axis edge-receiving device 11 is disposed adjacent to one side of the vacuum adsorption platform 10, corresponding to the first side 61 of the substrate, the y-axis edge-receiving device 11 includes a driving unit 111, a y-stage 112, and At least two of the y-stages 112 are pushed against the post 113. The driving unit 111 is configured to drive the y stage 112 to move, so that the two of the y stages 112 are pushed against the column 113 from the original position of the substrate 6 on the vacuum adsorption platform 10 (as shown in FIG. 4A). The lateral direction is shifted to a first position (as shown in FIG. 4B) such that the first side 61 of the substrate 6 is aligned with an x-axis X. Similarly, the x-axis edge-receiving device 12 is disposed adjacent to the other side of the vacuum adsorption platform 10, corresponding to the second side 62 of the substrate 6. The x-axis edge-receiving device 12 includes a driving unit 121 and an x-stage 122. And at least two pushing posts 123 disposed on the x stage 122. The driving unit 121 is configured to drive the x stage 122 to move to make the x stage 122 The upper two push-up columns 123 longitudinally move the substrate 6 on the vacuum adsorption stage 10 to a second position (as shown in FIG. 4C) such that the second side 62 of the substrate 6 is aligned with a y-axis Y. .

It should be noted that the vacuum adsorption platform 10 is controlled to provide a suction force to allow the substrate 6 to be pushed and pushed by the pushing columns 113, 123 to prevent the substrate 6 from slipping away when pushed. Some pushes against the columns 113, 123. Thus, when the substrate 6 is pushed, the substrate 6 does not slip off the push-push columns 113, 123 due to its own inertia. In short, how many distances the push columns 113, 123 move forward, the substrate 6 substantially moves the same distance.

In this way, after a piece of the skewed substrate 6 is sequentially placed on the vacuum adsorption platform 10, each of the substrates 6 is moved by the x and y-axis edge-receiving devices 12 and 11 to a target area T. The target area T is an area defined by the y-axis and the x-axis, as shown in FIG. 4C. Thus, the originally skewed substrate 6 is guided so that it does not become skewed or skewed to a reduced extent. Accepted within the scope. After the substrate 6 is initially guided, the substrate 6 can be directly transported along the belt slide 131 on the base 13 to the next position facing the handling device. After the arm 20 of the transport device 2 sucks the substrate 6 by the suction cup, the substrate 6 can be transported along the slide rail 21 to the next workstation, that is, the position of the rotary guide module 3 is rotated.

It should be noted that when the substrate 6 that is guided by the preliminary guiding mechanism 1 is moved to the rotating guiding module 3 by the conveying device 2, the alignment line of the substrate 6 (for example, the substrate 6 of the thirteenth figure) The connection lines of the two cross-shaped alignment symbols on the left and right corners can fall within a detection range of the detecting device 31 of the rotary guiding module 3. The detecting device 31 is configured to detect an angular difference between the alignment line of the substrate 6 and a reference line, thereby determining the deflection amplitude thereof. In the preferred embodiment, the present invention provides two sets of detecting devices 31 and two sets of rotating mechanisms 32. Each detecting device 31, such as a CCD image sensor, can be moved back and forth along an x-track 300 to capture two cross-shaped alignment symbols of the substrate 6 lying on the corresponding rotating mechanism 32. The deflection amplitude of the substrate 6 is determined. The rotating mechanism 32 is connected to the detecting device 31, and can rotate the appropriate angle according to the detected angle difference, so that the substrate 6 is guided to the image capturing starting position, as shown in FIG. point.

Referring to FIGS. 7 and 8, the linear scanning image capturing device 4 includes an x-axis transfer device 41, a z-axis transfer device 43 that is driven by the x-axis transfer device 41 and can move left and right along the x-axis. And a y-axis transfer device 42 driven by the z-axis transfer device 43 and movable up and down along the z-axis, a laser tracking module 44 disposed on the x-axis transfer device 41, and the y A microscopic image taking group 45 on the axis transfer device 42. The laser tracking module 44 has a laser displacement detecting module 440 for directly facing the image capturing area of the substrate 6. The microscopy lens set 45 has a lens 450 for the imaging area of the substrate 6. In this way, the laser tracking module 44 can be moved along the x-axis by the x-axis transfer device 41, and the image capturing area of the substrate 6 and the lens of the micro-mirror group 45 are detected while moving. The vertical distance between the 450 changes, and the micro-mirror group 45 can move along the x-axis together with the laser-tracking module 44, and can detect the detection result of the module 41 according to the laser displacement. And the laser displacement detecting module 41 together fine-tune the height position along the z-axis to ensure that the lens is focused on the image capturing area of the substrate at any time.

As shown in FIG. 9 , in this example, the substrate 6 is a liquid crystal panel placed on an adsorption stage 321 of the rotating mechanism 32 , and the liquid crystal panel is held by the adsorption stage 321 and is fixed, and Adjacent one long side and one short side are protruded from the outside of the adsorption stage 321, as shown in FIG. As shown in FIG. 13, the liquid crystal panel has a plurality of wafers 60, which are formed by chip on glass (COG), that is, anisotropic conductive film. And ACF) is hot pressed onto a plurality of conductive metal pads (not shown) formed on a top surface of the liquid crystal panel, wherein a wafer 60 is adjacent to and parallel to the short side of the liquid crystal panel, and the remaining wafers 60 The long sides of the liquid crystal panel are adjacent to each other and arranged in a line parallel to the long sides. It should be noted that the number of wafers 60 corresponding to each side is not limited to the foregoing.

A bottom surface of the substrate 6 further has a plurality of image capturing regions. In this example, each of the image capturing regions is located just below the respective wafers 60, and each of the image capturing regions is substantially the same size as the corresponding wafer. The area of the bottom surface of 60. Since the wafers 60 occupy the transparent portion of the liquid crystal panel, the image capturing regions can be imaged by the lens 450 of the microscopic lens group 45. The obtained image data can show the indentation caused by the conductive particles of the anisotropic conductive paste on the conductive metal pad. The image data is then transmitted to an image analysis judging unit (not shown) for image processing and analysis, and the quality of the conductive connection between each wafer 60 and the corresponding conductive metal pad is determined based on the analysis result. The type and quantity of the items referred to by the substrate 6 are not limited to the liquid crystal panel. For example, one or more pieces of the hard and soft circuit board 6a (as shown in FIG. 10) or other kinds of items may be placed in one or A plurality of adsorption stages 321 are provided.

As shown in the eleventh and twelfth drawings, the laser focusing module 44 and the microscopic lens assembly 45 are manually adjusted by the adjustment mechanism to a position where the substrate 6 can be clearly imaged (clear) Taking the image means that the image sharpness captured is within an acceptable range, and the substrate 6 has been rotated by the rotation of the rotating mechanism 32 such that its long side is indeed parallel to the microscopic lens group. 45 mobile route. The laser tracking module 44 is movable along the x-axis and detects a change in the vertical distance between the image capturing area of the substrate 6 and the lens 450 while moving. The microscope lens assembly 45 can be moved along the x-axis along with the laser tracking module 44, and can detect the detection result of the laser displacement detecting module 440 according to the laser tracking module 44. And adjusting the height position along the z-axis together with the laser tracking module 44, so that the lens 450 of the micro-mirror group 45 and the laser displacement detecting module 440 are always maintained along the x-axis. At a position where the substrate 6 can be clearly imaged, it is ensured that the sharpness of the captured image meets the requirements. Thus, even if the image capturing area of the substrate 6 has irregularities such that the vertical distance (focal length) between the lens 450 and the image capturing area is slightly insufficient or slightly too large, the laser displacement detecting module can be used. The 440 detects the height position of the laser tracking module 44 and the micro-mirror group 45 according to the detection result, so that the vertical distance (focal length) between the lens 450 and the image capturing area is maintained. At a predetermined value, it is ensured that the laser displacement detecting module 440 and the lens 450 can still clearly image the substrate 6 there.

Referring to Figures 12 and 13, when the lens 450 in an original position moves from the point A to the end point B as the microscope lens set 45 moves, the microscope lens set 45 passes. The lens 450 acquires image data of each of the image capturing areas (i.e., the bottom surface of each of the wafers 60) adjacent to the long sides of the substrate 6 in a line scan and transmits them to the image analysis judging unit. In this example, since the image capturing range of the lens 450 is small, the obtained image data is only the image of the front half 601 of the image capturing area, and therefore, the microscopic lens group 45 also has a movement along the y axis. The ability of the microscope lens assembly 45 to move forward slightly relative to the laser tracking module 44 (ie, toward the adsorption stage 321) when the lens 450 reaches the end point B, so that the lens The 450 is moved forward along the y-axis to enable the image capture range to encompass the second half 602 of the image capture zones. Next, the micro-mirror group 45 is moved in the opposite direction along the x-axis, so that the lens 450 is moved from the end point B to the starting point A. During the movement, the micro-mirror group 45 passes through the lens 450. The scanning method acquires image data of the rear half 602 of each of the image capturing areas on the long sides of the adjacent substrate 6, and transmits them to the image analysis judging unit, thereby expanding the image capturing range of the lens 450. When the lens 450 returns to the starting point A, the microscopic image capturing mirror set 45 is opposite to the laser focusing module 44. The ground is moved slightly back to move the lens 450 back in the y-axis back to the original position.

In addition, in order to save the working time, when the laser tracking module 44 and the micro-mirror group 45 move along the x-axis to take an image of the image capturing area, it may be slowly moved as needed, and when the laser When the chasing module and the micro-mirror group are located in the transition zone between the two image capturing areas, the forward or backward movement can be accelerated to avoid unnecessary time waste.

Up to this point, the linear scanning image capturing device 4 completes the microscopic image capturing operation of the image capturing area on the long side of the adjacent substrate 6. In this example, after the lens 450 returns to the original position, the rotating mechanism 32 is rotated by 90 degrees so that the image capturing area of the short side of the adjacent substrate 6 is located directly above the laser displacement detecting module 440 and the lens 450. Then, the linear scanning image capturing device 4 performs a microscopic image capturing operation on the image capturing area on the short side of the adjacent substrate 6, which is substantially the same as the foregoing, and will not be described again.

As can be seen from the above description, the laser focusing module 44 and the micro-mirror group 45 have the ability to move along the x-axis and move along the z-axis together, and the micro-mirror group 45 also has a separate The ability to move along the y axis. The laser tracking module 44 and the micro-mirror lens group 45 move along the x-axis together for the lens 450 to acquire the image data of the image capturing area of the substrate 6 in a scanning manner according to a predetermined route. The micro-mirror lens group 45 itself moves along the y-axis in order to change the area covered by the image capturing range of the lens 450, which is a function required when the image capturing range of the lens 450 is small, and is not necessary. As for the laser tracking module 44 and the micro-mirror group 45 moving along the z-axis, the height position of the two is adjusted at any time so that the lens 450 can remain on the substrate 6 during the moving process. Clearly capture the location. The preferred embodiment of the laser tracking module 44 and the microscopic lens assembly 45 can be realized in the following, but is not limited thereto.

The x-axis transfer device 41 can be selected from the configuration shown in the eighth figure, and includes an elongated base 410, a set of x-axis rails 411 disposed on the elongated base 410 and extending along the x-axis for a length, and slidable. An x-axis carrier 412 is disposed on the x-axis rail 411, and an x-axis driving unit 413 is disposed on the elongated base 410 and connected to the x-axis carrier 412. Preferably, the x-axis driving unit 413 can select an existing linear motor. The stator 413a of the linear motor is shown in the eighth figure, and the mover 413b slid in the stator 413a is connected to the x-axis carrier 412. In this manner, the x-axis driving unit 413 can drive the x-axis carrier 412 to move left and right along the x-axis track 411.

The z-axis transfer device 43 can be selected from the configuration shown in the eighth figure, and includes a set of z-axis rails 430 disposed on the x-axis carrier 412 and extending along the z-axis for a length, slidably disposed on the z-axis. a z-axis carrier 431 on the shaft track 430, and a z on the x-axis carrier 412 Axis drive unit 432. Preferably, the z-axis drive unit 432 can be selected from existing products, such as a conventional servo drive module including a servo motor 432a and a set of precision lead screw mechanisms (not shown). In this manner, the z-axis driving unit 432 can drive the z-axis carrier 431 to move up and down along the z-axis rail 430.

The laser focusing module 44 and the micro-mirror group 45 are disposed on the z-axis carrier 431. The z-axis carrier 431 is slidably disposed on the x-axis carrier 412. Therefore, in the x Under the driving of the shaft driving unit 413, the laser focusing module 44, the micro-mirror group 45 and the z-axis carrier 431 can move along the x-axis together, as shown in the twelfth figure, Under the driving of the z-axis driving unit 432, the laser focusing module 44 and the micro-mirror group 45 can move up and down along the z-axis, as shown in FIG.

The micro-mirror lens set 45 can optionally be directly coupled to the z-axis carrier 431, preferably to the z-axis carrier 431 by a y-axis transfer device 42. The y-axis transfer device 42 can be selected from the configuration shown in FIG. 8 and includes a board 420 disposed on the z-axis carrier 431, and a set of lengths extending along the y-axis. The y-axis rail 421, a y-axis carrier 422 slidably disposed on the y-axis rail 41, and a y-axis driving unit 423 are disposed on the seat plate 420 and connected to the y-axis carrier 422. Preferably, the y-axis driving unit 423 can select an existing linear motor, and the eighth embodiment shows that the stator 423a of the linear motor is fixed on the seat plate 420 and extends along the y-axis for a length, and the mover that slides in the stator 423a The 423b is connected to the y-axis carrier 422. In this manner, the y-axis driving unit 423 can drive the y-axis carrier 422 to move back and forth along the y-axis track 421, so that the micro-mirror group 45 disposed on the y-axis carrier 422 moves back and forth. In turn, the lens 450 can be moved back and forth along the y axis with respect to the laser displacement detecting module 440.

Figure 14 is a view showing an automated microscopic image capturing method of the present invention for taking image of at least one image capturing area of the substrate 6, the method comprising the steps of:

First, in step 901, the substrate 6 is guided to a first position by using the preliminary guiding mechanism 1 (second drawing) as described above, and as shown in the fourth C, an alignment of the substrate 6 is performed. The line can fall within a detectable range after being carried. Preferably, the preliminary guiding operation uses the y-axis abutment device 11 and the x-axis abutment device 12 to push the sides of the substrate 6 from the y direction and the x direction, respectively, so that the adjacent sides of the substrate 6 are The first position is respectively aligned with a Y axis and an X axis.

Next, in step 902, the substrate 6 is transported from the first position to a second position by the transport device 2 (fifth diagram), so that the alignment line of the substrate 6 just falls on the rotary guiding module 3 The detectable range of the detecting device 31 (sixth figure). Next, in step 903, the detecting device 31 can detect the alignment line of the substrate 6 to determine the degree of skew of the substrate 6. Then, in step 904, the rotating mechanism 32 of the rotary guiding module 3 can rotate the substrate 6 according to the detection result of the detecting device 31 to rotate the substrate 6 to a third position. It is to take the image start position for linear scan acquisition.

Finally, in step 905, the linear scanning image capturing device 4 can perform linear scanning and image capturing on the substrate 6 after the rotation to capture the image of the image capturing area of the substrate 6. Preferably, when the linear scanning image capturing is performed, the image capturing area of the substrate 6 is captured by the microscopic image capturing lens group 45 of the linear scanning image capturing device 4, and the linear scanning image capturing device is utilized. The laser tracking module 44 of 4 detects the change of the vertical distance between the image capturing area of the substrate 6 and the microscopic lens group 45, and adjusts the microscopic lens group according to the detected vertical distance variation. 45, to ensure that the micro-mirror lens set 45 is focused on the image capturing area of the substrate 6 at any time.

In any event, anyone can obtain sufficient teaching from the description of the above examples, and it is understood that the present invention is indeed different from the prior art, and is industrially usable and progressive. It is the invention that has indeed met the patent requirements and has filed an application in accordance with the law.

100‧‧‧Microscopic image capturing equipment

1‧‧‧ preliminary guiding mechanism

2‧‧‧Transportation device

21‧‧‧Slide rails

3‧‧‧Rotary guide module

31‧‧‧Detection device

32‧‧‧Rotating mechanism

4‧‧‧Linear scanning image capture device

Claims (5)

An automated microscopic image capturing device for taking image of at least one image capturing area of a substrate, the image capturing area being adjacent to one side of the substrate, the substrate further having two alignments that can be connected to form an alignment line The device includes a preliminary guiding mechanism, a handling mechanism, a rotating mechanism, a detecting device and a linear scanning image capturing device, wherein: the preliminary guiding mechanism performs preliminary guiding on the substrate to reduce the The degree of skew of the substrate; the transport mechanism transports the substrate that is initially guided by the preliminary guiding mechanism to the rotating mechanism; the detecting device picks up the two of the substrate located on the rotating mechanism Aligning a symbol to determine a skew width of the substrate; the rotating mechanism guides the substrate according to a deflection amplitude of the substrate determined by the detecting device; and the linear scanning image capturing device is configured to guide the rotating mechanism The rear substrate performs a linear scan image capture to capture an image of the image capture area of the substrate. The automatic microscopic image capturing apparatus of claim 1, wherein the preliminary guiding mechanism comprises: a vacuum adsorption platform for carrying the substrate; and a y-axis abutting device disposed on one side of the vacuum adsorption platform An edge for urging the substrate to be displaced to a first position along the y direction such that the first side of the substrate is aligned with a Y axis; An x-axis edge-receiving device is disposed on another adjacent side of the vacuum adsorption platform for pushing the substrate to be displaced to a second position along the y direction such that the second side of the substrate is aligned with an X-axis; The vacuum adsorption platform is controlled to provide a suction force to allow the substrate to be moved by the y-axis abutment device and the x-axis abutment device to prevent the substrate from being slid away from the y-axis abutment device when being pushed by the substrate And the x-axis edge device. The automatic microscopic image capturing apparatus of claim 1, wherein the linear scanning image capturing device comprises: a laser tracking module having a laser displacement detecting module for positively facing the substrate The image capturing area; and a microscopic image capturing lens group having a lens for directly facing the image capturing area of the substrate; wherein the laser focusing module is movable along the x axis and moving Simultaneously detecting a change in the vertical distance between the image capturing area of the substrate and the lens; and the microscopic image capturing group can move along the x axis together with the laser focusing module, and according to the The detection result of the displacement detecting module is finely adjusted along the z-axis along with the laser displacement detecting module to ensure that the lens is focused on the image capturing area of the substrate at any time. The automated microscopic image capturing apparatus of claim 3, wherein the microscopic image taking lens group is movable along the y axis to expand the image capturing range of the lens. The automated microscopic image capturing apparatus of claim 3, wherein the laser tracking module and the microscopic lens assembly are arranged to move along the x-axis When the image capturing area is imaged, the moving speed is slow, and when the laser tracking module and the microscopic image capturing group move in the transition area between the two image capturing areas, the speed is faster.