TWI592673B - Disposer, and parts inspection device - Google Patents

Disposer, and parts inspection device Download PDF

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Publication number
TWI592673B
TWI592673B TW103145832A TW103145832A TWI592673B TW I592673 B TWI592673 B TW I592673B TW 103145832 A TW103145832 A TW 103145832A TW 103145832 A TW103145832 A TW 103145832A TW I592673 B TWI592673 B TW I592673B
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pressing
motor
unit
pressure receiving
electronic component
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TW103145832A
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Chinese (zh)
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TW201512065A (en
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Toshioki Shimojima
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Seiko Epson Corp
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/286External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867Handlers or transport devices, e.g. loaders, carriers, trays
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/2601Apparatus or methods therefor

Description

處置器、及零件檢查裝置 Disposer and part inspection device

本發明係關於一種對搬送對象進行搬送之處置器(handler),尤其係關於一種將搬送對象搬送至按壓區域並於該按壓區域進行按壓之處置器及包含該處置器之零件檢查裝置。 The present invention relates to a handler for transporting a transport target, and more particularly to a handler for transporting a transport target to a pressing region and pressing the pressing region, and a component inspection device including the same.

自先前以來,已知有例如專利文獻1中記載般之檢查電子零件之電特性之零件檢查裝置。於此種零件檢查裝置中使用有如下之處置器,該處置器將作為搬送對象之電子零件搬送至成為按壓區域之檢查用插座(socket)為止,並將電子零件嵌入該檢查用插座。 A component inspection device for inspecting the electrical characteristics of an electronic component as described in Patent Document 1 has been known. In the component inspection device, the processor is used to transport the electronic component to be transported to the inspection socket to be the pressing region, and the electronic component is embedded in the inspection socket.

於上述處置器中,搭載有用以吸附電子零件之吸附部、及用以將吸附於該吸附部之電子零件嵌入檢查用插座之按壓用之馬達。而且,於將檢查前之電子零件利用檢查用插座進行檢查時,於電子零件吸附於吸附部之狀態下驅動上述馬達,將電子零件之端子嵌入檢查用插座之端子。此時,為了將電子零件之端子與檢查用插座之端子電性連接,需要對電子零件施加特定之按壓力,上述之按壓力係由上述馬達施加。 In the above-described handler, an adsorption unit for adsorbing electronic components and a motor for pressing the electronic component adsorbed to the adsorption unit into the inspection socket are mounted. Further, when the electronic component before inspection is inspected by the inspection socket, the motor is driven while the electronic component is adsorbed to the adsorption portion, and the terminal of the electronic component is inserted into the terminal of the inspection socket. At this time, in order to electrically connect the terminal of the electronic component to the terminal of the inspection socket, it is necessary to apply a specific pressing force to the electronic component, and the pressing force is applied by the motor.

另一方面,近年來,有嵌入於檢查用插座之電子零件之個數增加之傾向,因此將無法利用上述馬達之輸出,對複數個電子零件之各者施加足以連接上述端子間之按壓力。因此,於上述之處置器中搭載有按壓用之氣壓缸(pneumatic cylinder),並且大於上述馬達之按壓力係自該氣壓缸施加至電子零件。根據利用如上所述之氣壓缸之電子零件 之按壓,由於將上述端子間確實連接,故可高精度地進行電子零件之檢查。 On the other hand, in recent years, the number of electronic components embedded in the inspection socket tends to increase, so that the output of the motor cannot be used, and a pressing force sufficient to connect the terminals can be applied to each of the plurality of electronic components. Therefore, a pneumatic cylinder for pressing is mounted on the above-described handler, and a pressing force larger than the above-described motor is applied from the pneumatic cylinder to the electronic component. According to the electronic parts using the pneumatic cylinder as described above In the pressing, since the terminals are reliably connected, the inspection of the electronic components can be performed with high precision.

[先前技術文獻] [Previous Technical Literature]

[特許文獻] [license literature]

[專利文獻1]日本專利特開2010-101776號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2010-101776

然而,如上所述,為了形成於電子零件之各端子之連接而需要特定之按壓力,因此若電子零件之端子數或電子零件之個數增加,則上述氣壓缸所期望之按壓力亦變大。另一方面,若如此氣壓缸之按壓力變大,則來自檢查用插座之反作用力亦自動變大。而且,對於支撐上述氣壓缸之構件或用以使氣壓缸移動之軌道,需要具有不因上述反作用力而變形之程度之剛性。然而,為了提高上述構件及軌道之剛性,無法避免包含該構件及軌道之搬送部之大型化或重量化。 However, as described above, in order to form a connection between the terminals of the electronic component, a specific pressing force is required. Therefore, if the number of terminals or the number of electronic components of the electronic component increases, the pressing force of the pneumatic cylinder becomes larger. . On the other hand, if the pressing force of the pneumatic cylinder is increased, the reaction force from the inspection socket is automatically increased. Further, it is necessary to have rigidity to the extent that the member for supporting the pneumatic cylinder or the rail for moving the pneumatic cylinder is deformed by the reaction force. However, in order to increase the rigidity of the above-described member and the rail, it is unavoidable to increase the size or weight of the conveying portion including the member and the rail.

再者,上述問題並不限定於如上述般使用馬達與氣壓缸按壓電子零件之處置器,而為使用設置於搬送部之1個以上之按壓部來按壓搬送對象之處置器所共通之問題。 In addition, the above-described problem is not limited to the case where the motor and the pneumatic cylinder are used to press the electronic component as described above, and the problem is common to the processor that presses the transport target by using one or more pressing portions provided in the transport unit.

本發明係鑒於上述實際情況而完成者,其目的在於提供一種於藉由對搬送對象進行搬送之搬送部按壓搬送對象之處置器中,可抑制搬送部之大型化或重量化之處置器、及包含該處置器之零件檢查裝置。 The present invention has been made in view of the above-described actual circumstances, and an object of the present invention is to provide a processor capable of suppressing an increase in size or weight of a transport unit in a handler for transporting a transport target by a transport unit that transports a transport target, and A part inspection device including the handler.

本發明之態樣之一為,處置器包含基台、對搬送對象進行搬送之搬送部、及連結於上述基台之受壓部,於上述搬送部設有將上述搬送對象朝向上述基台按壓之按壓部,於上述受壓部設有與上述按壓部之一部分卡合之卡合部。 In one aspect of the present invention, the processor includes a base, a transport unit that transports the transport target, and a pressure receiving unit that is coupled to the base, and the transport unit is configured to press the transport object toward the base The pressing portion is provided with an engaging portion that is engaged with one of the pressing portions in the pressure receiving portion.

於按壓部之按壓力作用於搬送對象時,抵抗該按壓力之反作用力 將作用於搬送部。根據上述態樣,按壓力之反作用力中之一部分作用於搬送部,而其剩餘部分經由設置於受壓部之卡合部而作用於基台。即,並非按壓力之反作用力之全部作用於搬送部,而該反作用力之一部分將向基台分散。藉此,以所期望之按壓力而搬送對象被按壓,而搬送部所要求之剛性為可耐受按壓力之反作用力之一部分者即可。因此,可抑制搬送部之大型化或重量化。 The reaction force against the pressing force when the pressing force of the pressing portion acts on the object to be transported Will act on the transport unit. According to the above aspect, one of the reaction forces of the pressing force acts on the conveying portion, and the remaining portion acts on the base via the engaging portion provided in the pressure receiving portion. That is, not all of the reaction force of the pressing force acts on the conveying portion, and a part of the reaction force is dispersed to the base. Thereby, the object to be conveyed is pressed by the desired pressing force, and the rigidity required for the conveying portion is one of the reaction forces capable of withstanding the pressing force. Therefore, it is possible to suppress an increase in size or weight of the conveying unit.

本發明之態樣之一較佳為,上述按壓部包含將上述搬送對象朝向上述基台按壓之第1按壓部、及將上述第1按壓部朝向上述基台按壓之第2按壓部,上述受壓部之上述卡合部以與設置於上述第2按壓部之一部分之突出部卡合之方式可動。 In one aspect of the present invention, the pressing portion includes a first pressing portion that presses the conveying target toward the base, and a second pressing portion that presses the first pressing portion toward the base. The engaging portion of the pressing portion is movable so as to be engaged with a protruding portion provided at a portion of the second pressing portion.

根據上述構成,構成按壓部之第1按壓部與第2按壓部中受壓部之卡合部係以與設置於第2按壓部之一部分之突出部卡合之方式可動。因此,藉由上述卡合可抑制第2按壓部因第1按壓部之按壓力而退回。而且,施加至搬送對象之按壓力因受壓部與第2按壓部之機械性之卡合而固定,故亦可抑制該按壓力發生變動。 According to the above configuration, the engagement portion between the first pressing portion that constitutes the pressing portion and the pressure receiving portion of the second pressing portion is movable so as to be engaged with the protruding portion provided in one of the second pressing portions. Therefore, by the engagement described above, it is possible to suppress the second pressing portion from being retracted by the pressing force of the first pressing portion. Further, since the pressing force applied to the object to be conveyed is fixed by the mechanical engagement between the pressure receiving portion and the second pressing portion, the pressing force can be suppressed from fluctuating.

本發明之態樣之一較佳為,上述按壓部包含將上述搬送對象朝向上述基台按壓之第1按壓部、及將上述第1按壓部朝向上述基台按壓之第2按壓部,上述受壓部之上述卡合部以解除與設置於上述第2按壓部之一部分之突出部之卡合之方式可動。 In one aspect of the present invention, the pressing portion includes a first pressing portion that presses the conveying target toward the base, and a second pressing portion that presses the first pressing portion toward the base. The engaging portion of the pressing portion is movable so as to release the engagement with the protruding portion provided in one of the second pressing portions.

根據上述構成,構成按壓部之第1按壓部與第2按壓部中受壓部之卡合部係以解除與設置於第2按壓部之一部分之突出部之卡合之方式可動。因此,藉由上述卡合可抑制第2按壓部因第1按壓部之按壓力而退回,又,藉由該卡合之解除,按壓部之移動將不易受突出部影響。而且,施加至搬送對象之按壓力因受壓部與第2按壓部之機械性之卡合而固定,故亦可抑制該按壓力發生變動。 According to the above configuration, the engagement portion between the first pressing portion that constitutes the pressing portion and the pressure receiving portion of the second pressing portion is movable so as to release the engagement with the protruding portion provided in one of the second pressing portions. Therefore, the engagement of the second pressing portion can be suppressed by the pressing force of the first pressing portion, and the movement of the pressing portion is less likely to be affected by the protruding portion by the release of the engagement. Further, since the pressing force applied to the object to be conveyed is fixed by the mechanical engagement between the pressure receiving portion and the second pressing portion, the pressing force can be suppressed from fluctuating.

本發明之態樣之一較佳為,上述第1按壓部為按壓缸,上述第2按 壓部包含使上述按壓缸上升及下降之馬達,上述第1按壓部之按壓力大於上述第2按壓部之按壓力。 In one aspect of the invention, preferably, the first pressing portion is a pressing cylinder, and the second pressing portion The pressing portion includes a motor that raises and lowers the pressing cylinder, and a pressing force of the first pressing portion is larger than a pressing force of the second pressing portion.

由按壓缸施加之按壓力通常藉由使按壓缸之作動壓增大,例如提高供給至按壓缸之壓縮空氣之壓力而變大。於上述態樣中,需要相對較大之按壓力之第1按壓部包含此種按壓缸。因此,與藉由馬達之驅動而施加相對較大之按壓力之構成相比,可簡化搬送部之構成,進而可簡化處置器之構成。又,與第1按壓部包含馬達之情形相比,亦更容易使施加至搬送對象之按壓力增大。 The pressing force applied by the pressing cylinder is generally increased by increasing the dynamic pressure of the pressing cylinder, for example, increasing the pressure of the compressed air supplied to the pressing cylinder. In the above aspect, the first pressing portion that requires a relatively large pressing force includes such a pressing cylinder. Therefore, the configuration of the conveying portion can be simplified as compared with the configuration in which a relatively large pressing force is applied by the driving of the motor, and the configuration of the treating device can be simplified. Moreover, it is easier to increase the pressing force applied to the object to be conveyed than in the case where the first pressing portion includes the motor.

本發明之態樣之一較佳為,包含控制上述馬達之驅動之馬達控制部,上述馬達控制部於上述按壓缸按壓上述搬送對象之狀態下,藉由轉矩控制驅動上述馬達。 One of the aspects of the present invention preferably includes a motor control unit that controls driving of the motor, and the motor control unit drives the motor by torque control in a state where the pressing cylinder presses the transfer target.

使用馬達之搬送對象之按壓可藉由馬達之位置控制及轉矩控制之至少一個而進行。再者,所謂位置控制,係指以按壓缸之位置成為特定之位置之方式,控制馬達之旋轉位置。另一方面,所謂轉矩控制,係指以對搬送對象施加特定之按壓力之方式,控制馬達之產生轉矩。 The pressing of the transport target using the motor can be performed by at least one of position control and torque control of the motor. In addition, the position control means controlling the rotational position of the motor so that the position of the pressing cylinder becomes a specific position. On the other hand, the torque control means that the torque generated by the motor is controlled such that a specific pressing force is applied to the object to be transported.

此處,上述按壓缸之按壓力越大,則對於該按壓缸之支撐側之反作用力、即對於上述馬達之負載越大。此時,若藉由上述之位置控制而驅動馬達,則只要馬達之輸出不超過上述反作用力,則馬達之旋轉位置不會到達目標之旋轉位置。而且,馬達之驅動電流會持續增大,對馬達之內部施加過量之負載。 Here, the larger the pressing force of the pressing cylinder, the larger the reaction force on the supporting side of the pressing cylinder, that is, the load on the motor. At this time, if the motor is driven by the position control described above, the rotational position of the motor does not reach the target rotational position as long as the output of the motor does not exceed the reaction force. Moreover, the drive current of the motor continues to increase, and an excessive load is applied to the inside of the motor.

就該方面而言,於上述態樣中,於按壓缸之按壓力施加至搬送對象之狀態下,藉由轉矩控制而驅動馬達。因此,即便因按壓缸之伸長而該按壓缸之支撐側退回,馬達亦輸出特定之轉矩,既然如此便不會對該馬達施加過量之負載。 In this respect, in the above aspect, the motor is driven by the torque control in a state where the pressing force of the pressing cylinder is applied to the conveying target. Therefore, even if the support side of the pressing cylinder is retracted due to the extension of the pressing cylinder, the motor outputs a specific torque, and thus the excessive load is not applied to the motor.

本發明之態樣之一較佳為,包含控制上述馬達之驅動之馬達控制部,上述馬達控制部於上述按壓缸按壓上述搬送對象之前,藉由轉矩 控制而驅動上述馬達。 Preferably, one aspect of the present invention includes a motor control unit that controls driving of the motor, wherein the motor control unit uses torque before the pressing cylinder presses the transfer target Control the drive of the above motor.

根據上述態樣,於按壓缸對搬送對象施加按壓力時,藉由轉矩控制而驅動馬達。因此,不會對馬達施加過量之負載,而且施加至搬送對象之按壓力亦變得穩定。 According to the above aspect, when the pressing cylinder applies a pressing force to the conveying target, the motor is driven by the torque control. Therefore, an excessive load is not applied to the motor, and the pressing force applied to the object to be conveyed also becomes stable.

本發明之態樣之一較佳為,上述卡合部為相互對向之一對可動臂,上述一對可動臂變位至與上述突出部卡合之位置、及自上述突出部離開之位置。 In one aspect of the invention, preferably, the engaging portion is a pair of movable arms that face each other, and the pair of movable arms are displaced to a position where the protruding portion is engaged with the protruding portion and a position away from the protruding portion. .

根據上述態樣,相互對向之一對可動臂與設置於按壓部之突出部卡合,來自按壓部之按壓力之反作用力作用於相互對向之一對可動臂之各者。因此,與來自按壓部之按壓力之反作用力作用於一個部位之態樣相比,可擴大該反作用力分散之範圍,進而可抑制受壓部或基台所要求之剛性。 According to the above aspect, one of the pair of movable arms is engaged with the protruding portion provided on the pressing portion, and the reaction force of the pressing force from the pressing portion acts on each of the pair of movable arms facing each other. Therefore, compared with the state in which the reaction force of the pressing force from the pressing portion acts on one portion, the range in which the reaction force is dispersed can be expanded, and the rigidity required for the pressure receiving portion or the base can be suppressed.

本發明之態樣之一較佳為,上述搬送部具有吸附複數個上述搬送對象之狀態,上述按壓部具有按壓複數個上述搬送對象之狀態。 In one aspect of the invention, it is preferable that the conveying unit has a state in which a plurality of the objects to be conveyed are adsorbed, and the pressing unit has a state in which a plurality of the objects to be conveyed are pressed.

於具有按壓複數個搬送對象之狀態之態樣中,具有隨著搬送對象之個數變大,施加至複數個搬送對象之整體之按壓力亦自動變大之狀態。此時,具有相應於施加至連接對象之整體之按壓力,而該按壓力之反作用力亦自動變大之狀態。就該點而言,根據上述態樣,如上述般變大之反作用力之一部分將向基台分散。因此,抑制搬送部之大型化或重量化之效果變得更加顯著。 In the state in which the plurality of transport targets are pressed, the pressing force applied to the entire plurality of transport targets is automatically increased as the number of transport targets increases. At this time, there is a state in which the pressing force corresponding to the entirety of the connection object is applied, and the reaction force of the pressing force is automatically increased. In this regard, according to the above aspect, a part of the reaction force which becomes larger as described above will be dispersed toward the base. Therefore, the effect of suppressing an increase in size or weight of the conveying unit becomes more remarkable.

本發明之態樣之一為,零件檢查裝置包含基台、搬送電子零件之搬送部、連結於上述基台之受壓部、及設置於上述基台之檢查用插座,於上述搬送部設置有將上述電子零件朝向上述檢查用插座按壓之按壓部,於上述受壓部設置有與上述按壓部之一部分卡合之卡合部。 In one aspect of the present invention, the component inspection device includes a base, a transfer portion for transporting electronic components, a pressure receiving portion coupled to the base, and an inspection socket provided on the base, and the transport portion is provided in the transport portion The pressing portion that presses the electronic component toward the inspection socket is provided with an engaging portion that is engaged with one of the pressing portions in the pressure receiving portion.

於按壓部之按壓力作用於電子零件時,抵抗該按壓力之反作用力作用於搬送部。根據上述態樣,按壓力之反作用力中之一部分作用於 搬送部,而其剩餘部分經由設置於受壓部之卡合部而作用於基台。即,並非按壓力之反作用力之全部作用於搬送部,而該反作用力之一部分將向基台分散。藉此,以所期望之按壓力而搬送對象被按壓,然而搬送部所要求之剛性為可耐受按壓力之反作用力之一部分者即可。因此,可抑制搬送部之大型化或重量化。 When the pressing force of the pressing portion acts on the electronic component, the reaction force against the pressing force acts on the conveying portion. According to the above aspect, one of the reaction forces of the pressing force acts on The conveyance unit has a remaining portion that acts on the base via an engagement portion provided in the pressure receiving portion. That is, not all of the reaction force of the pressing force acts on the conveying portion, and a part of the reaction force is dispersed to the base. Thereby, the object to be conveyed is pressed by the desired pressing force, but the rigidity required for the conveying portion may be one of the reaction forces capable of withstanding the pressing force. Therefore, it is possible to suppress an increase in size or weight of the conveying unit.

10‧‧‧處置器 10‧‧‧Processor

11‧‧‧基台 11‧‧‧Abutment

11a‧‧‧搭載面 11a‧‧‧Jacketing surface

12‧‧‧蓋構件 12‧‧‧Caps

20‧‧‧供給機械手 20‧‧‧Supply manipulator

21‧‧‧供給側固定導件 21‧‧‧Supply side fixed guide

22‧‧‧供給側可動導件 22‧‧‧Supply side movable guide

23‧‧‧供給用手單元 23‧‧‧Supply unit

31‧‧‧搬送導件 31‧‧‧Transport guides

32‧‧‧第1梭子 32‧‧‧1st shuttle

32a‧‧‧供給用梭盤 32a‧‧‧Supply shuttle

37a‧‧‧供給用梭盤 37a‧‧‧Supply shuttle

32b‧‧‧回收用梭盤 32b‧‧‧Recycling shuttle

37b‧‧‧回收用梭盤 37b‧‧·Recycling shuttle

32c‧‧‧第1導梭板 32c‧‧‧1st guide

33‧‧‧檢查用插座 33‧‧‧Check socket

33a‧‧‧檢查用凹穴 33a‧‧‧Checking pockets

34‧‧‧第1搬送單元 34‧‧‧1st transport unit

35‧‧‧受壓臂機構 35‧‧‧pressure arm mechanism

36‧‧‧受壓臂機構 36‧‧‧pressure arm mechanism

35a‧‧‧支撐體 35a‧‧‧Support

36a‧‧‧支撐體 36a‧‧‧Support

35b‧‧‧受壓臂 35b‧‧‧pressure arm

36b‧‧‧受壓臂 36b‧‧‧pressure arm

35s‧‧‧臂缸 35s‧‧‧ arm cylinder

36s‧‧‧臂缸 36s‧‧‧ arm cylinder

37‧‧‧第2梭子 37‧‧‧2nd shuttle

37c‧‧‧第1導梭板 37c‧‧‧1st guide

38‧‧‧第2搬送單元 38‧‧‧2nd transport unit

40‧‧‧回收機械手 40‧‧‧Recycling robot

41‧‧‧回收側固定導件 41‧‧‧Recovery side fixed guide

42‧‧‧回收側可動導件 42‧‧‧Recovery side movable guide

43‧‧‧回收用手單元 43‧‧‧Recycling hand unit

51‧‧‧水平移動臂 51‧‧‧ horizontal moving arm

51M‧‧‧按壓馬達 51M‧‧‧ Pressing motor

52‧‧‧垂直移動臂 52‧‧‧Vertical moving arm

52a‧‧‧被受壓片 52a‧‧‧Subjected tablets

53‧‧‧按壓缸 53‧‧‧Pressing cylinder

54‧‧‧吸附部 54‧‧‧Adsorption Department

60‧‧‧控制裝置 60‧‧‧Control device

61‧‧‧輸送機驅動部 61‧‧‧Conveyor drive department

62‧‧‧導件驅動部 62‧‧‧guide drive department

63‧‧‧梭子驅動部 63‧‧‧ Shuttle Drive Department

64‧‧‧手單元驅動部 64‧‧‧Hand unit drive department

64a‧‧‧手馬達驅動部 64a‧‧‧Hand motor drive department

64b‧‧‧抽吸閥驅動部 64b‧‧‧Suction valve drive

65‧‧‧搬送單元驅動部 65‧‧‧Transport unit drive unit

65a‧‧‧搬送馬達驅動部 65a‧‧‧Transport motor drive unit

65b‧‧‧按壓馬達驅動部 65b‧‧‧ Press motor drive

65c‧‧‧按壓缸驅動部 65c‧‧‧Pushing cylinder drive

65d‧‧‧抽吸閥驅動部 65d‧‧‧Suction valve drive

66‧‧‧受壓臂驅動部 66‧‧‧Accepting arm drive

C1‧‧‧輸送機 C1‧‧‧Conveyor

C2‧‧‧輸送機 C2‧‧‧Conveyor

C3‧‧‧輸送機 C3‧‧‧Conveyor

C4‧‧‧輸送機 C4‧‧‧Conveyor

C1a‧‧‧輸送機托盤 C1a‧‧‧Conveyor tray

C2a‧‧‧輸送機托盤 C2a‧‧‧Conveyor tray

C3a‧‧‧輸送機托盤 C3a‧‧‧Conveyor tray

C4a‧‧‧輸送機托盤 C4a‧‧‧Conveyor tray

E51M‧‧‧編碼器 E51M‧‧‧Encoder

EMC‧‧‧編碼器 EMC‧‧‧Encoder

EMS‧‧‧編碼器 EMS‧‧‧Encoder

EMX‧‧‧編碼器 EMX‧‧‧Encoder

EMY‧‧‧編碼器 EMY‧‧ Encoder

EMZ‧‧‧編碼器 EMZ‧‧‧Encoder

ESV1‧‧‧抽吸感測器 ESV1‧‧‧sucking sensor

ESV2‧‧‧抽吸感測器 ESV2‧‧‧Suction Sensor

MC‧‧‧輸送機馬達 MC‧‧‧Conveyor motor

MS‧‧‧梭子馬達 MS‧‧‧ shuttle motor

MX‧‧‧導件馬達 MX‧‧‧guide motor

MY‧‧‧搬送馬達 MY‧‧‧Transport motor

MZ‧‧‧手馬達 MZ‧‧‧Hand motor

SV1‧‧‧抽吸閥 SV1‧‧‧ suction valve

SV2‧‧‧抽吸閥 SV2‧‧‧ suction valve

T‧‧‧電子零件 T‧‧‧Electronic parts

圖1係表示本發明中之零件檢查裝置之一實施形態之整體構成之概略俯視圖。 Fig. 1 is a schematic plan view showing an overall configuration of an embodiment of a component inspection device according to the present invention.

圖2係該零件檢查裝置所包含之處置器中之第1搬送單元及受壓臂機構之側面構造之側視圖。 Fig. 2 is a side view showing the side structure of the first conveying unit and the pressure receiving arm mechanism in the handler included in the component inspection device.

圖3係表示該處置器之電性構成之方塊圖。 Fig. 3 is a block diagram showing the electrical configuration of the handler.

圖4係表示該處置器所包含之各種馬達之驅動態樣之時序圖。 Fig. 4 is a timing chart showing driving states of various motors included in the handler.

圖5係表示第1搬送單元與受壓臂機構之作動態樣之圖,且係使(a)第1搬送單元及受壓臂機構之平面構造與(b)端面構造相對應而表示之圖。 Fig. 5 is a view showing a dynamic example of the first conveying unit and the pressure receiving arm mechanism, and showing the plane structure of the (a) first conveying unit and the pressure receiving arm mechanism in correspondence with the (b) end surface structure. .

圖6係表示第1搬送單元與受壓臂機構之作動態樣之圖,且係使(a)第1搬送單元及受壓臂機構之平面構造與(b)端面構造相對應而表示之圖。 Fig. 6 is a view showing a dynamic example of the first conveying unit and the pressure receiving arm mechanism, and showing the plane structure of the (a) first conveying unit and the pressure receiving arm mechanism in correspondence with the (b) end surface structure. .

圖7係表示第1搬送單元與受壓臂機構之作動態樣之圖,且係使(a)第1搬送單元及受壓臂機構之平面構造與(b)端面構造相對應而表示之圖。 Fig. 7 is a view showing a dynamic example of the first conveying unit and the pressure receiving arm mechanism, and showing the plane structure of the (a) first conveying unit and the pressure receiving arm mechanism in correspondence with the (b) end surface structure. .

圖8係表示第1搬送單元與受壓臂機構之作動態樣之圖,且係使(a)第1搬送單元及受壓臂機構之平面構造與(b)端面構造相對應而表示之圖。 Fig. 8 is a view showing a dynamic example of the first conveying unit and the pressure receiving arm mechanism, and showing the plane structure of the first conveying unit and the pressure receiving arm mechanism in accordance with (b) the end surface structure. .

圖9係表示第1搬送單元與受壓臂機構之作動態樣之圖,且係使(a)第1搬送單元及受壓臂機構之平面構造與(b)端面構造相對應而表示 之圖。 FIG. 9 is a view showing a dynamic example of the first conveying unit and the pressure receiving arm mechanism, and showing the planar structure of the (a) first conveying unit and the pressure receiving arm mechanism in association with the (b) end surface structure. Picture.

圖10係表示第1搬送單元與受壓臂機構之作動態樣之圖,且係使(a)第1搬送單元及受壓臂機構之平面構造與(b)端面構造相對應而表示之圖。 Fig. 10 is a view showing a dynamic example of the first conveying unit and the pressure receiving arm mechanism, and showing the plane structure of the (a) first conveying unit and the pressure receiving arm mechanism in correspondence with the (b) end surface structure. .

圖11係表示第1搬送單元與受壓臂機構之作動態樣之圖,且係使(a)第1搬送單元及受壓臂機構之平面構造與(b)端面構造相對應而表示之圖。 Fig. 11 is a view showing a dynamic example of the first conveying unit and the pressure receiving arm mechanism, and showing the plane structure of the (a) first conveying unit and the pressure receiving arm mechanism in correspondence with the (b) end surface structure. .

圖12係表示第1搬送單元與受壓臂機構之作動態樣之圖,且係使(a)第1搬送單元及受壓臂機構之平面構造與(b)端面構造相對應而表示之圖。 Fig. 12 is a view showing a dynamic example of the first conveying unit and the pressure receiving arm mechanism, and showing the plane structure of the (a) first conveying unit and the pressure receiving arm mechanism in correspondence with the (b) end surface structure. .

以下,參照圖1~圖12對使本發明之處置器及零件檢查裝置具體化之一實施形態進行說明。首先,參照圖1對零件檢查裝置之構成進行說明。 Hereinafter, an embodiment in which the treatment device and the component inspection device of the present invention are embodied will be described with reference to Figs. 1 to 12 . First, the configuration of the component inspection device will be described with reference to Fig. 1 .

[零件檢查裝置之構成] [Composition of parts inspection device]

如圖1所示,於零件檢查裝置所包含之處置器10之基台11,搭載有各種機械手之搭載面11a係作為上表面而設置,該搭載面11a之大部分由蓋構件12覆蓋。由該等蓋構件12與搭載面11a所包圍之空間即搬送空間藉由自零件檢查裝置之外部供給之乾空氣而將濕度與溫度維持為特定值。 As shown in Fig. 1, the mounting surface 11a on which the various robots are mounted is mounted on the base 11 of the handler 10 included in the component inspection device as an upper surface, and most of the mounting surface 11a is covered by the cover member 12. The transport space, which is the space surrounded by the cover member 12 and the mounting surface 11a, maintains the humidity and the temperature at a specific value by the dry air supplied from the outside of the component inspection device.

於基台11之搭載面11a,沿一個方向延伸之4個輸送機排列於與該輸送機之搬送方向正交之方向上。4個輸送機中,於作為輸送機之排列方向之X方向之一側,敷設有2個供給用輸送機C1、C2,另一方面,於X方向之另一側,敷設有2個回收用輸送機C3、C4。而且,於供給用輸送機C1、C2中,供給用輸送機托盤C1a、C2a自蓋構件12之外側朝向內側搬運。又,於回收用輸送機C3、C4中,回收用輸送機 托盤C3a、C4a自蓋構件12之內側朝向外側搬運。再者,於供給用輸送機托盤C1a、C2a,收容有作為搬送對象之檢查前之複數個電子零件T,又,於回收用輸送機托盤C3a、C4a,收容有檢查後之複數個電子零件T。 On the mounting surface 11a of the base 11, four conveyors extending in one direction are arranged in a direction orthogonal to the conveying direction of the conveyor. In the four conveyors, two supply conveyors C1 and C2 are placed on one side of the X direction as the arrangement direction of the conveyor, and two collections are disposed on the other side in the X direction. Conveyor C3, C4. Further, in the supply conveyors C1 and C2, the supply conveyor trays C1a and C2a are conveyed from the outer side of the cover member 12 toward the inside. Moreover, in the conveyors C3 and C4 for recycling, the conveyor for recycling The trays C3a and C4a are conveyed from the inner side of the lid member 12 toward the outside. Further, in the supply conveyor trays C1a and C2a, a plurality of electronic components T before the inspection as the transport target are accommodated, and the plurality of electronic components T after the inspection are stored in the collection conveyor trays C3a and C4a. .

於上述基台11之搭載面11a上,搭載有於X方向上相互對向之供給機械手20與回收機械手40。供給機械手20配置於供給用輸送機C1、C2之Y方向上,又,回收機械手40配置於回收用輸送機C3、C4之Y方向上。 The robot 20 and the recovery robot 40 are mounted on the mounting surface 11a of the base 11 so as to face each other in the X direction. The supply robot 20 is disposed in the Y direction of the supply conveyors C1 and C2, and the recovery robot 40 is disposed in the Y direction of the collection conveyors C3 and C4.

供給機械手20包含作為沿Y方向延伸之固定軸之供給側固定導件21、作為連結於供給側固定導件21之可動軸之供給側可動導件22、及連結於供給側可動導件22且沿著供給側可動導件22移動之供給用手單元23。 The supply robot 20 includes a supply-side fixed guide 21 as a fixed shaft extending in the Y direction, a supply-side movable guide 22 as a movable shaft coupled to the supply-side fixed guide 21, and a supply-side movable guide 22 And the hand unit 23 is moved along the supply side movable guide 22.

供給側可動導件22為自供給側固定導件21向回收機械手40側延伸之可動軸,其相對於供給側固定導件21,可沿Y方向進行往返移動地連結。供給用手單元23為配置於供給側可動導件22之搭載面11a側之末端效應器,其相對於供給側可動導件22,可沿X方向進行往返移動地連結。又,供給用手單元23可自供給側可動導件22朝向搭載面11a之下降且可自搭載面11a側朝向供給側可動導件22之上升地連結於供給側可動導件22。 The supply-side movable guide 22 is a movable shaft that extends from the supply-side fixed guide 21 toward the recovery robot 40, and is fixed to the supply-side fixed guide 21 so as to be reciprocally movable in the Y direction. The supply hand unit 23 is an end effector disposed on the mounting surface 11a side of the supply side movable guide 22, and is coupled to the supply side movable guide 22 so as to be reciprocally movable in the X direction. Further, the supply hand unit 23 can be connected to the supply side movable guide 22 from the supply side surface 11a side toward the supply side movable guide 22 so as to be lowered from the supply side movable guide 22 toward the mounting surface 11a.

而且,供給側可動導件22沿著供給側固定導件21向供給用輸送機C1、C2側移動,並且供給用手單元23沿著供給側可動導件22移動至供給用輸送機托盤C1a、C2a之正上方為止。藉此,載置於供給用輸送機托盤C1a、C2a之電子零件T吸附於供給用手單元23,然後自供給用輸送機托盤C1a、C2a提昇。又,自該狀態起,供給側可動導件22沿著供給側固定導件21自供給用輸送機C1、C2上離開,藉此將吸附於供給用手單元23之電子零件T向上述搬送空間內之特定之位置供 給。 Further, the supply-side movable guide 22 moves toward the supply conveyors C1 and C2 along the supply-side fixed guide 21, and the supply manual unit 23 moves along the supply-side movable guide 22 to the supply conveyor tray C1a, Just above C2a. Thereby, the electronic component T placed on the supply conveyor trays C1a and C2a is sucked by the supply hand unit 23, and then lifted from the supply conveyor trays C1a and C2a. Further, from this state, the supply-side movable guide 22 is separated from the supply conveyors C1 and C2 along the supply-side fixed guide 21, whereby the electronic component T adsorbed to the supply unit 23 is moved to the above-mentioned conveyance space. Specific location within give.

回收機械手40係與供給機械手20同樣地,包含作為沿Y方向延伸之固定軸之回收側固定導件41、作為連結於回收側固定導件41之可動軸之回收側可動導件42、及連結於回收側可動導件42且沿著回收側可動導件42於X方向上移動之回收用手單元43。 Similarly to the supply robot 20, the collection robot 40 includes a collection-side fixed guide 41 as a fixed shaft extending in the Y direction, and a recovery-side movable guide 42 as a movable shaft coupled to the recovery-side fixed guide 41, And a recycling hand unit 43 coupled to the recovery-side movable guide 42 and moving along the recovery-side movable guide 42 in the X direction.

回收側可動導件42為自回收側固定導件41向供給機械手20側延伸之可動軸,其相對於回收側固定導件41,可沿Y方向進行往返移動地連結。回收用手單元43為配置於回收側可動導件42之搭載面11a側之末端效應器,其相對於回收側可動導件42,可沿X方向進行往返移動地連結。又,回收用手單元43可自回收側可動導件42朝向搭載面11a之下降且可自搭載面11a側朝向回收側可動導件42之上升地連結於回收側可動導件42。 The recovery-side movable guide 42 is a movable shaft that extends from the recovery-side fixed guide 41 toward the supply robot 20 side, and is reciprocally coupled to the recovery-side fixed guide 41 in the Y direction. The collection hand unit 43 is an end effector disposed on the side of the mounting surface 11a of the recovery-side movable guide 42 and is reciprocally coupled to the recovery-side movable guide 42 in the X direction. In addition, the recovery hand unit 43 can be lowered from the recovery side movable guide 42 toward the mounting surface 11a, and can be connected to the recovery side movable guide 42 from the mounting surface 11a side toward the recovery side movable guide 42.

而且,回收側可動導件42沿著回收側固定導件41向回收用輸送機C3、C4側移動,並且回收用手單元43沿著回收側可動導件42,移動至回收用輸送機托盤C3a、C4a之正上方為止。藉此,將吸附於回收用手單元43之電子零件T載置於回收用輸送機托盤C3a、C4a。 Further, the recovery-side movable guide 42 moves along the recovery-side fixed guide 41 toward the recovery conveyors C3 and C4, and the recovery hand unit 43 moves along the recovery-side movable guide 42 to the recovery conveyor tray C3a. Just above C4a. Thereby, the electronic component T adsorbed to the collection hand unit 43 is placed on the collection conveyor trays C3a and C4a.

於蓋構件12之內側面,沿Y方向延伸之搬送導件31固定於該內側面中之X方向之大致中央。於該搬送導件31中之兩端部之下方,配設有沿X方向延伸之第1梭子32與同樣地沿X方向延伸之第2梭子37。 On the inner side surface of the cover member 12, a conveyance guide 31 extending in the Y direction is fixed to substantially the center of the inner side in the X direction. Below the both end portions of the conveyance guide 31, a first shuttle 32 extending in the X direction and a second shuttle 37 extending in the X direction in the same manner are disposed.

第1梭子32連結於固定設置於搭載面11a之沿X方向延伸之第1導梭板32c,以於X方向上,與供給側可動導件22及回收側可動導件42之任一者重疊之方式,沿X方向滑動。於第1梭子32中之上述供給機械手20側,固定有供給用梭盤32a,又,於第1梭子32中之上述回收機械手40側,固定有回收用梭盤32b。於供給用梭盤32a,收容有作為搬送對象之檢查前之複數個電子零件T,又,於回收用梭盤32b,收容有檢查後之複數個電子零件T。 The first shuttle 32 is coupled to the first shuttle plate 32c that is fixed to the mounting surface 11a and extends in the X direction, and overlaps with either the supply-side movable guide 22 and the recovery-side movable guide 42 in the X direction. In the same way, slide in the X direction. The supply bobbin 32a is fixed to the supply robot 20 side of the first shuttle 32, and the recovery bobbin 32b is fixed to the recovery robot 40 side of the first shuttle 32. The supply shuttle 32a accommodates a plurality of electronic components T before the inspection as a transport target, and the collection shuttle 32b stores a plurality of electronic components T after inspection.

第2梭子37亦連結於固定設置於搭載面11a之沿X方向延伸之第2導梭板37c,以於X方向上,與供給側可動導件22及回收側可動導件42之任一者重疊之方式,沿X方向滑動。於第2梭子37中之上述供給機械手20側,固定有供給用梭盤37a,又,於第2梭子37中之上述回收機械手40側,固定有回收用梭盤37b。於供給用梭盤37a,收容有作為搬送對象之檢查前之複數個電子零件T,又,於回收用梭盤37b,收容有檢查後之複數個電子零件T。 The second shuttle 37 is also connected to the second shuttle plate 37c that is fixed to the mounting surface 11a and extends in the X direction, and is in the X direction, and either the supply side movable guide 22 and the recovery side movable guide 42. In the overlapping manner, slide in the X direction. A supply shuttle 37a is fixed to the supply robot 20 side of the second shuttle 37, and a recovery shuttle 37b is fixed to the recovery robot 40 side of the second shuttle 37. In the supply tray 37a, a plurality of electronic components T before the inspection as the object to be transported are accommodated, and a plurality of electronic components T after inspection are accommodated in the recovery tray 37b.

搭載面11a中,於搬送空間之大致中央,設置有貫通搭載面11a之矩形開口,並且,作為同時進行複數個電子零件T之檢查之連接對象之檢查用插座33係埋設於該矩形開口中。檢查用插座33為嵌入電子零件T之插座,其連結於用以檢查該電子零件T之未圖示之檢查單元。檢查單元係與收容於基台11之內部之處置器不同之裝置,與處置器一併構成零件檢查裝置。 In the mounting surface 11a, a rectangular opening penetrating the mounting surface 11a is provided in the center of the transport space, and an inspection socket 33, which is a connection target for simultaneously inspecting a plurality of electronic components T, is embedded in the rectangular opening. The inspection socket 33 is a socket in which the electronic component T is embedded, and is connected to an inspection unit (not shown) for inspecting the electronic component T. The inspection unit is a device different from the handler housed inside the base 11, and constitutes a component inspection device together with the handler.

於檢查用插座33之上表面,凹設有可同時收容複數個電子零件T之檢查用凹穴33a,又,於檢查用凹穴33a之底面,凹設有可與電子零件T之凸端子嵌合之複數個凹端子。而且,藉由將電子零件T所包含之凸端子嵌入檢查用凹穴33a之凹端子,可檢查該電子零件T之電特性。再者,檢查用凹穴33a包含之端子係連接於作為搭載於基台11內之不同體之檢查單元,電子零件T包含之端子係經由檢查用凹穴33a包含之端子而連接於檢查單元內之檢查電路。而且,利用檢查用插座33進行之檢查之結果自該檢查單元輸出至處置器10。 On the upper surface of the inspection socket 33, a check recess 33a for accommodating a plurality of electronic components T is recessed, and a bottom surface of the inspection recess 33a is recessed to be embedded with a convex terminal of the electronic component T. A plurality of concave terminals are combined. Further, the electrical characteristics of the electronic component T can be inspected by fitting the male terminal included in the electronic component T into the female terminal of the inspection recess 33a. Further, the terminal included in the inspection recess 33a is connected to an inspection unit which is a different body mounted in the base 11, and the terminal included in the electronic component T is connected to the inspection unit via a terminal included in the inspection recess 33a. Check the circuit. Moreover, the result of the inspection by the inspection socket 33 is output from the inspection unit to the handler 10.

於上述搬送導件31,構成搬送部之第1搬送單元34與第2搬送單元38於Y方向上並排連結。 In the conveyance guide 31, the first conveyance unit 34 and the second conveyance unit 38 that constitute the conveyance unit are connected in parallel in the Y direction.

第1搬送單元34於第1梭子32與檢查用插座33之間,沿著Y方向進行往返移動。第1搬送單元34之下端部於搬送導件31與搭載面11a之間,沿著Z方向下降及上升。而且,第1搬送單元34利用該第1搬送單 元34之下端部保持收容於供給用梭盤32a之電子零件T,將所保持之電子零件T搬送至檢查用插座33為止,將該電子零件T嵌入檢查用插座33。又,第1搬送單元34利用該第1搬送單元34之下端部取出嵌入於檢查用插座33之電子零件T,將所取出之電子零件T載置於回收用梭盤32b。 The first transport unit 34 reciprocates in the Y direction between the first shuttle 32 and the inspection socket 33. The lower end portion of the first transport unit 34 is lowered and raised in the Z direction between the transport guide 31 and the mounting surface 11a. Further, the first transport unit 34 uses the first transport order The electronic component T accommodated in the supply tray 32a is held at the lower end of the unit 34, and the held electronic component T is transported to the inspection socket 33, and the electronic component T is fitted into the inspection socket 33. Further, the first transport unit 34 takes out the electronic component T embedded in the inspection socket 33 by the lower end portion of the first transport unit 34, and mounts the taken electronic component T on the recovery shuttle 32b.

第2搬送單元38於第2梭子37與檢查用插座33之間,沿著Y方向進行往返移動。第2搬送單元38之下端部於搬送導件31與搭載面11a之間,沿著Z方向下降及上升。而且,第2搬送單元38利用該第2搬送單元38之下端部保持載置於供給用梭盤37a之電子零件T,將所保持之電子零件T搬送至檢查用插座33為止,將該電子零件T嵌入檢查用插座33。又,第2搬送單元38利用該第2搬送單元38之下端部取出嵌入於檢查用插座33之電子零件T,將所取出之電子零件T載置於回收用梭盤37b。 The second transport unit 38 reciprocates in the Y direction between the second shuttle 37 and the inspection socket 33. The lower end portion of the second transfer unit 38 is lowered and raised in the Z direction between the conveyance guide 31 and the mounting surface 11a. In addition, the second transport unit 38 holds the electronic component T placed on the supply shuttle 37a by the lower end portion of the second transport unit 38, and transports the held electronic component T to the inspection socket 33 to the electronic component. T is embedded in the inspection socket 33. Further, the second transport unit 38 takes out the electronic component T embedded in the inspection socket 33 by the lower end portion of the second transport unit 38, and mounts the taken electronic component T on the recovery shuttle 37b.

又,搭載面11a中,於檢查用插座33之X方向上之兩側,固定設置有構成受壓部之一對受壓臂機構35、36。 Further, in the mounting surface 11a, one of the pressure receiving portions 35 and 36 constituting the pressure receiving portion is fixedly provided on both sides of the inspection socket 33 in the X direction.

[零件檢查裝置之作用] [The role of the parts inspection device]

於上述處置器10中,首先,檢查前之電子零件T自外部裝置移載至供給用輸送機托盤C1a、C2a。繼而,藉由驅動供給用輸送機C1、C2,將檢查前之電子零件T搬運至搬送空間內為止。繼而,當檢查前之電子零件T搬運至搬送空間內為止時,則供給側可動導件22沿著供給側固定導件21移動至供給用輸送機C1、C2上為止。繼而,當供給用手單元23移動至供給用輸送機托盤C1a、C2a之正上方為止而保持電子零件T時,供給側可動導件22沿著供給側固定導件21移動至第1梭子32上為止。 In the above-described handler 10, first, the electronic component T before inspection is transferred from the external device to the supply conveyor trays C1a and C2a. Then, the electronic components T before inspection are transported into the transport space by driving the supply conveyors C1 and C2. Then, when the electronic component T before inspection is transported into the transport space, the supply-side movable guide 22 moves along the supply-side fixed guide 21 to the supply conveyors C1 and C2. Then, when the supply unit 23 is moved right above the supply conveyor trays C1a and C2a to hold the electronic component T, the supply-side movable guide 22 moves along the supply-side fixed guide 21 to the first shuttle 32. until.

繼而,當供給側可動導件22到達第1梭子32上時,供給用手單元23移動至第1梭子32上為止,並且第1梭子32亦以供給用手單元23位於 供給用梭盤32a之正上方之方式滑動。繼而,將供給用手單元23保持之檢查前之電子零件T自供給用手單元23移載至供給用梭盤32a。 Then, when the supply-side movable guide 22 reaches the first shuttle 32, the supply hand unit 23 moves to the first shuttle 32, and the first shuttle 32 is also positioned by the supply hand unit 23. The supply slides in a manner directly above the shuttle 32a. Then, the electronic component T before inspection which is held by the supply hand unit 23 is transferred from the supply hand unit 23 to the supply shuttle 32a.

當將檢查前之電子零件T移載至供給用梭盤32a時,則第1搬送單元34移動至第1梭子32上為止,並且第1梭子32亦以第1搬送單元34之下端部位於供給用梭盤32a之正上方之方式滑動。繼而,第1搬送單元34之下端部朝向供給用梭盤32a下降,將移載至供給用梭盤32a之檢查前之電子零件T保持於第1搬送單元34之下端部。繼而,第1搬送單元34移動至檢查用插座33上為止,將檢查前之電子零件T搬送至檢查用插座33之正上方為止。繼而,藉由檢查前之電子零件T與第1搬送單元34之下端部一併下降,對檢查用凹穴33a內之凹端子,嵌入電子零件T之凸端子。 When the electronic component T before inspection is transferred to the supply shuttle 32a, the first transport unit 34 moves to the first shuttle 32, and the first shuttle 32 is also positioned at the lower end of the first transport unit 34. Slide with the shuttle 32a directly above. Then, the lower end portion of the first transport unit 34 is lowered toward the supply shuttle 32a, and the electronic component T before the inspection to be transferred to the supply shuttle 32a is held by the lower end portion of the first transport unit 34. Then, the first transport unit 34 is moved to the inspection socket 33, and the electronic component T before the inspection is transported directly above the inspection socket 33. Then, the electronic component T before the inspection is lowered together with the lower end portion of the first transport unit 34, and the male terminal of the electronic component T is inserted into the female terminal in the inspection recess 33a.

若如此般將檢查前之電子零件T嵌入檢查用插座33,則用以開始電子零件T之檢查之檢查開始信號自處置器10輸出至檢查單元,藉此,利用檢查單元開始電子零件T之檢查。 When the electronic component T before inspection is embedded in the inspection socket 33, the inspection start signal for starting the inspection of the electronic component T is output from the processor 10 to the inspection unit, whereby the inspection of the electronic component T is started by the inspection unit. .

然後,當表示電子零件T之檢查結束之檢查結束信號自檢查單元輸出至處置器10時,於檢查後之電子零件T由第1搬送單元34保持之狀態下,第1搬送單元34之下端部上升,藉此自檢查用插座33取出檢查後之電子零件T。繼而,第1搬送單元34自檢查用插座33上移動至第1梭子32上為止,並且第1梭子32以第1搬送單元34位於回收用梭盤32b之正上方之方式滑動。繼而,當第1搬送單元34之下端部下降而解除電子零件T之保持時,自第1搬送單元34將檢查後之電子零件T移載至回收用梭盤32b。 When the inspection completion signal indicating the completion of the inspection of the electronic component T is output from the inspection unit to the handler 10, the lower end portion of the first conveyance unit 34 is in a state where the electronic component T after inspection is held by the first conveyance unit 34. Ascending, the electronic component T after inspection is taken out from the inspection socket 33. Then, the first transport unit 34 moves from the inspection socket 33 to the first shuttle 32, and the first shuttle 32 slides so that the first transport unit 34 is positioned directly above the recovery shuttle 32b. Then, when the lower end portion of the first transport unit 34 is lowered to release the electronic component T, the electronic component T after the inspection is transferred from the first transport unit 34 to the recovery shuttle 32b.

當將檢查後之電子零件T移載至回收用梭盤32b時,回收側可動導件42沿著回收側固定導件41移動至第1梭子32上為止。進而,當回收側可動導件42移動至第1梭子32上時,回收用手單元43移動至第1梭子32上為止,並且第1梭子32亦以回收用手單元43位於回收用梭盤32b之 正上方之方式滑動。繼而,將移載至回收用梭盤32b之檢查後之電子零件T保持於回收用手單元43。 When the inspected electronic component T is transferred to the recovery shuttle 32b, the recovery-side movable guide 42 moves along the recovery-side fixed guide 41 to the first shuttle 32. Further, when the recovery-side movable guide 42 moves to the first shuttle 32, the recovery hand unit 43 moves to the first shuttle 32, and the first shuttle 32 is also located at the recovery shuttle 32b with the recovery hand unit 43. It Sliding in the way above. Then, the electronic component T that has been transferred to the recovery shuttle 32b is held by the recovery hand unit 43.

當將檢查後之電子零件T保持於回收用手單元43時,回收側可動導件42係自第1梭子32上移動至回收用輸送機C3、C4上為止。繼而,回收用手單元43移動至回收用輸送機托盤C3a、C4a之正上方為止,檢查後之電子零件T係於針對每一檢查結果而分類之狀態下,移載至回收用輸送機托盤C3a、C4a。 When the electronic component T after inspection is held in the recovery hand unit 43, the recovery-side movable guide 42 is moved from the first shuttle 32 to the collection conveyors C3 and C4. Then, the recovery hand unit 43 moves to the front side of the collection conveyor trays C3a and C4a, and the electronic parts T after inspection are transferred to the collection conveyor tray C3a in a state classified for each inspection result. , C4a.

再者,與上述供給機械手20與第1梭子32之間同樣地,亦於供給機械手20與第2梭子37之間移載檢查前之電子零件T。又,與上述第1梭子32與第1搬送單元34之間同樣地,亦於第2梭子37與第2搬送單元38之間,移載檢查前之電子零件T及檢查後之電子零件T。進而,與上述第1梭子32與回收機械手40之間同樣地,亦於第2梭子37與回收機械手40之間,移載檢查後之電子零件T。 Further, similarly to the above-described supply robot 20 and the first shuttle 32, the electronic component T before inspection is also transferred between the supply robot 20 and the second shuttle 37. Further, similarly to the first shuttle 32 and the first transport unit 34, the electronic component T before the inspection and the electronic component T after the inspection are transferred between the second shuttle 37 and the second transport unit 38. Further, similarly to the first shuttle 32 and the recovery robot 40, the electronic component T after inspection is transferred between the second shuttle 37 and the recovery robot 40.

[處置器之詳細構成] [Detailed composition of the processor]

繼而,參照圖2對處置器10所包含之第1搬送單元34及第2搬送單元38之構成進行詳細說明。再者,關於第1搬送單元34與第2搬送單元38,雖然與搬送導件31之連結位置或成為移動目標之梭子互不相同,但用以按壓電子零件T之構成相同,因此以下,對第1搬送單元34進行說明,而省略關於第2搬送單元38之說明。又,圖2係自輸送機側觀察第1搬送單元34之周邊構造所得之端視圖,表示第1搬送單元34配置於檢查用插座33之正上方之狀態。 Next, the configuration of the first transport unit 34 and the second transport unit 38 included in the handler 10 will be described in detail with reference to FIG. 2 . In addition, the first transport unit 34 and the second transport unit 38 are different from each other in the connection position with the transport guide 31 or the shuttle target, but the configuration for pressing the electronic component T is the same. The first transport unit 34 will be described, and the description of the second transport unit 38 will be omitted. In addition, FIG. 2 is an end view which shows the structure of the surroundings of the 1st conveyance unit 34 from the conveyor side, and shows the state in which the 1st conveyance unit 34 was arrange|positioned on the right side of the inspection-s

於上述搬送導件31,連結有用以搬送檢查前之電子零件T之第1搬送單元34。構成第1搬送單元34之水平移動臂51係以可沿著搬送導件31進行往返移動之方式連結。於水平移動臂51之下端部,垂直移動臂52以可相對於水平移動臂51上升及下降之方式連結。垂直移動臂52藉由搭載於水平移動臂51內之按壓馬達51M進行旋轉,而相對於水平移 動臂51上升及下降。又,於垂直移動臂52之下端部,遍及Y方向之整個寬度而固定設置有作為於X方向上突出之突出部之被受壓片52a,又,於垂直移動臂52之下端部,朝向搭載面11a而連結有藉由氣壓而作動之按壓缸53。此處,按壓缸53構成第1按壓部,按壓馬達51M、垂直移動臂52及被受壓片52a構成第2按壓部。而且,第1按壓部與第2按壓部構成按壓部。 The first transport unit 34 for transporting the electronic component T before the inspection is connected to the transport guide 31. The horizontal moving arm 51 constituting the first conveying unit 34 is coupled so as to be reciprocable along the conveying guide 31. At the lower end of the horizontal moving arm 51, the vertical moving arm 52 is coupled so as to be movable up and down with respect to the horizontal moving arm 51. The vertical moving arm 52 is rotated by the pressing motor 51M mounted in the horizontal moving arm 51 with respect to the horizontal shift The boom 51 rises and falls. Further, at the lower end portion of the vertical movement arm 52, a pressure receiving piece 52a as a protruding portion protruding in the X direction is fixedly provided over the entire width of the Y direction, and the lower end portion of the vertical movement arm 52 is mounted toward the lower end portion. A pressing cylinder 53 that is actuated by air pressure is connected to the surface 11a. Here, the pressing cylinder 53 constitutes a first pressing portion, and the pressing motor 51M, the vertical moving arm 52, and the pressure receiving piece 52a constitute a second pressing portion. Further, the first pressing portion and the second pressing portion constitute a pressing portion.

於按壓缸53連接有未圖示之壓縮空氣供給部。壓縮空氣供給部包含例如設置有零件檢查裝置之設施所包含之氣體供給系統、及控制該氣體供給系統之壓縮空氣之供給之閥等者。氣體供給系統供給以大氣壓為基準壓力時之相對壓力為例如0.5MPa之壓縮空氣。而且,按壓缸53係藉由自壓縮空氣供給部供給壓縮空氣而於Z方向上伸長,藉由將該供給之壓縮空氣排出而於Z方向上收縮。 A compressed air supply unit (not shown) is connected to the pressing cylinder 53. The compressed air supply unit includes, for example, a gas supply system included in a facility in which the component inspection device is installed, and a valve that controls supply of compressed air to the gas supply system. The gas supply system supplies a compressed air having a relative pressure of, for example, 0.5 MPa when the atmospheric pressure is used as a reference pressure. Further, the pressing cylinder 53 is extended in the Z direction by supplying compressed air from the compressed air supply unit, and is contracted in the Z direction by discharging the supplied compressed air.

於按壓缸53之下端部,連結有可藉由例如真空吸附而吸附電子零件T之末端效應器即複數個吸附部54。吸附部54包含例如吸附用之噴嘴與連接於該噴嘴之真空泵等。 At the lower end portion of the pressing cylinder 53, a plurality of adsorption portions 54 which are end effectors capable of adsorbing the electronic component T by vacuum suction, for example, are connected. The adsorption unit 54 includes, for example, a nozzle for adsorption, a vacuum pump connected to the nozzle, and the like.

於上述搭載面11a中之檢查用插座33之X方向兩側,以夾住檢查用插座33之方式配設有相互對向之受壓臂機構35、36。受壓臂機構35、36包含:支撐體35a、36a,其固定設置於搭載面11a;及受壓臂35b、36b,其以於該支撐體35a、36a之上表面可沿X方向進行往返移動之方式連結。受壓臂35b、36b係與按壓部之一部分即被受壓片52a卡合之卡合部。 The pressure receiving arm mechanisms 35 and 36 that face each other are disposed on both sides of the inspection socket 33 in the X direction on the mounting surface 11a so as to sandwich the inspection socket 33. The pressure receiving arm mechanisms 35 and 36 include support bodies 35a and 36a fixed to the mounting surface 11a, and pressure receiving arms 35b and 36b for reciprocating in the X direction on the upper surfaces of the supporting bodies 35a and 36a. The way to connect. The pressure receiving arms 35b and 36b are engaging portions that are engaged with the pressure receiving piece 52a, which is one of the pressing portions.

於受壓臂35b、36b上,連結有連接於未圖示之壓縮空氣供給部之臂缸。壓縮空氣供給部例如為與連接於上述按壓缸53之壓縮空氣供給部相同之構成。而且,於檢查用插座33之正上方配置有第1搬送單元34,且當將壓縮空氣供給至受壓臂35b、36b之臂缸時,受壓臂35b、36b於X方向上相互靠近,該受壓臂35b、35b變位至可卡合於被受壓 片52a之卡合位置。又,若自該狀態起,將臂缸內之壓縮空氣排出,則受壓臂35b、36b於X方向上相互分離,該受壓臂35b、36b變位至自被受壓片52a離開之離開位置。如此般,藉由受壓臂35b、36b可動之構造,可進行受壓臂35b、36b與被受壓片52a之卡合或可將該卡合解除。 An arm cylinder connected to a compressed air supply unit (not shown) is connected to the pressure receiving arms 35b and 36b. The compressed air supply unit has the same configuration as the compressed air supply unit connected to the pressing cylinder 53, for example. Further, the first transport unit 34 is disposed directly above the inspection socket 33, and when compressed air is supplied to the arm cylinders of the pressure receiving arms 35b and 36b, the pressure receiving arms 35b and 36b approach each other in the X direction. The pressure receiving arms 35b, 35b are displaced until they are engageable under pressure The engagement position of the piece 52a. Further, when the compressed air in the arm cylinder is discharged from this state, the pressure receiving arms 35b and 36b are separated from each other in the X direction, and the pressure receiving arms 35b and 36b are displaced to be separated from the pressed piece 52a. position. In this manner, by the movable structure of the pressure receiving arms 35b and 36b, the pressure receiving arms 35b and 36b can be engaged with the pressure receiving piece 52a or the engagement can be released.

[處置器之電性構成] [Electrical composition of the processor]

參照圖3對上述處置器10之電性構成進行說明。上述處置器10所具備之控制裝置60係以包含中央處理裝置(CPU,Central Processing Unit,中央處理單元)、非揮發性記憶體(ROM,Read Only Memory,唯讀記憶體)及揮發性記憶體(RAM,Random Access Memory,隨機存取記憶體)之微電腦為中心而構成。控制裝置60根據儲存於上述ROM及RAM中之各種資料及程式,進行與處置器10之動作相關之各種控制。 The electrical configuration of the above-described handler 10 will be described with reference to Fig. 3 . The control device 60 included in the processor 10 includes a central processing unit (CPU, Central Processing Unit), non-volatile memory (ROM, Read Only Memory), and volatile memory. The microcomputer (RAM, Random Access Memory, random access memory) is mainly composed of a microcomputer. The control device 60 performs various controls related to the operation of the processor 10 based on various data and programs stored in the ROM and the RAM.

於控制裝置60,連接有使輸送機馬達MC旋轉驅動之輸送機驅動部61。於輸送機驅動部61,連接有檢測輸送機馬達MC之旋轉位置之編碼器EMC。輸送機驅動部61根據自控制裝置60輸入之位置指令與自編碼器EMC輸入之輸送機馬達MC之旋轉位置,生成輸送機馬達MC之驅動電流,並且將該驅動電流輸出至輸送機馬達MC。輸送機馬達MC藉由進行與上述驅動電流相對應之旋轉,而驅動上述輸送機C1~C4。再者,上述輸送機驅動部61及輸送機馬達MC係針對每一輸送機C1~C4而設置,又,編碼器EMC係相對於各輸送機馬達MC而設置。 A conveyor drive unit 61 that rotationally drives the conveyor motor MC is connected to the control device 60. An encoder EMC that detects the rotational position of the conveyor motor MC is connected to the conveyor drive unit 61. The conveyor drive unit 61 generates a drive current of the conveyor motor MC based on the position command input from the control unit 60 and the rotational position of the conveyor motor MC input from the encoder EMC, and outputs the drive current to the conveyor motor MC. The conveyor motor MC drives the conveyors C1 to C4 by performing rotation corresponding to the above-described drive current. Further, the conveyor drive unit 61 and the conveyor motor MC are provided for each of the conveyors C1 to C4, and the encoder EMC is provided for each conveyor motor MC.

於控制裝置60連接有使導件馬達MX旋轉驅動之可動導件驅動部62。於可動導件驅動部62,連接有檢測導件馬達MX之旋轉位置之編碼器EMX。可動導件驅動部62根據自控制裝置60輸入之位置指令與自編碼器EMX輸入之旋轉位置,生成導件馬達MX之驅動電流,並且將該驅動電流輸出至導件馬達MX。導件馬達MX藉由進行與所輸入之 上述驅動電流相對應之旋轉,使上述可動導件22、42沿著固定導件21、41進行往返移動。再者,上述可動導件驅動部62及導件馬達MX相對於供給側可動導件22及回收側可動導件42之各者而設置,又,編碼器EMX相對於各導件馬達MX而設置。 A movable guide driving portion 62 that rotationally drives the guide motor MX is connected to the control device 60. An encoder EMX that detects the rotational position of the guide motor MX is connected to the movable guide drive unit 62. The movable guide drive unit 62 generates a drive current of the guide motor MX based on the position command input from the control device 60 and the rotational position input from the encoder EMX, and outputs the drive current to the guide motor MX. Guide motor MX by performing and inputting The drive currents are rotated correspondingly to move the movable guides 22, 42 back and forth along the fixed guides 21, 41. Further, the movable guide driving unit 62 and the guide motor MX are provided for each of the supply-side movable guide 22 and the recovery-side movable guide 42, and the encoder EMX is provided for each of the guide motors MX. .

於控制裝置60,連接有使梭子馬達MS旋轉驅動之梭子驅動部63。於梭子驅動部63,連接有檢測梭子馬達MS之旋轉位置之編碼器EMS。梭子驅動部63根據自控制裝置60輸入之位置指令與自編碼器EMS輸入之旋轉位置,生成梭子馬達MS之驅動電流,並且將該驅動電流輸出至梭子馬達MS。梭子馬達MS藉由進行與所輸入之上述驅動電流相對應之旋轉,而使梭子32、37沿著上述導件32c、37c滑動。再者,上述梭子驅動部63及梭子馬達MS相對於第1梭子32及第2梭子37之各者而設置,又,編碼器EMS相對於各梭子馬達MS而設置。 A shuttle drive unit 63 for rotationally driving the shuttle motor MS is connected to the control unit 60. An encoder EMS that detects the rotational position of the shuttle motor MS is connected to the shuttle drive unit 63. The shuttle drive unit 63 generates a drive current of the shuttle motor MS based on the position command input from the control unit 60 and the rotational position input from the encoder EMS, and outputs the drive current to the shuttle motor MS. The shuttle motor MS slides the shuttles 32, 37 along the guides 32c, 37c by performing rotation corresponding to the input drive current. Further, the shuttle drive unit 63 and the shuttle motor MS are provided for each of the first shuttle 32 and the second shuttle 37, and the encoder EMS is provided for each shuttle motor MS.

於控制裝置60,連接有包含手馬達驅動部64a與抽吸閥驅動部64b之手單元驅動部64。其中,於手馬達驅動部64a,連接有檢測手馬達MZ之旋轉位置之編碼器EMZ。手馬達驅動部64a根據自控制裝置60輸入之位置指令與自編碼器EMZ輸入之旋轉位置,生成手馬達MZ之驅動電流,並且將該驅動電流輸出至手馬達MZ。手馬達MZ係藉由進行與所輸入之上述驅動電流相對應之旋轉,使上述手單元23、43上升及下降。 A hand unit drive unit 64 including a hand motor drive unit 64a and a suction valve drive unit 64b is connected to the control device 60. The encoder motor EMZ that detects the rotational position of the hand motor MZ is connected to the hand motor driving unit 64a. The hand motor drive unit 64a generates a drive current of the hand motor MZ based on the position command input from the control unit 60 and the rotational position input from the encoder EMZ, and outputs the drive current to the hand motor MZ. The hand motor MZ raises and lowers the hand units 23 and 43 by performing rotation corresponding to the input drive current.

於抽吸閥驅動部64b,連接有檢測設置於手單元23、43之前端之抽吸閥SV1之開放量之抽吸感測器ESV1。抽吸閥驅動部64b根據自控制裝置60輸入之閥行程指令與自抽吸感測器ESV1輸入之開放量,生成抽吸閥SV1之驅動信號,並且將該驅動信號輸出至抽吸閥SV]。抽吸閥SV1藉由進行與所輸入之上述驅動信號相對應之開閉,利用與上述開放量相對應之抽吸力抽吸上述電子零件T。再者,上述手單元驅動部64、手馬達MZ及抽吸閥SV1相對於供給用手單元23及回收用手 單元43之各者而設置,又,編碼器EMZ、抽吸感測器ESV1相對於手馬達MZ及抽吸閥SV1之各者而設置。 A suction sensor ESV1 that detects an opening amount of the suction valve SV1 provided at the front end of the hand units 23, 43 is connected to the suction valve driving portion 64b. The suction valve drive unit 64b generates a drive signal of the suction valve SV1 based on the valve stroke command input from the control device 60 and the opening amount input from the suction sensor ESV1, and outputs the drive signal to the suction valve SV] . The suction valve SV1 suctions the electronic component T by a suction force corresponding to the opening amount by performing opening and closing corresponding to the input drive signal. Furthermore, the hand unit driving unit 64, the hand motor MZ, and the suction valve SV1 are opposite to the supply hand unit 23 and the recycling hand. Each of the units 43 is provided, and the encoder EMZ and the suction sensor ESV1 are provided for each of the hand motor MZ and the suction valve SV1.

於控制裝置60,連接有包含搬送馬達驅動部65a、構成馬達控制部之按壓馬達驅動部65b、構成缸控制部之按壓缸驅動部65c及抽吸閥驅動部65d之搬送單元驅動部65。 The control device 60 is connected to a transport motor drive unit 65a, a push motor drive unit 65b that constitutes a motor control unit, a push cylinder drive unit 65c that constitutes a cylinder control unit, and a transport unit drive unit 65 that forms a suction valve drive unit 65d.

於搬送馬達驅動部65a,連接有檢測搬送馬達MY之旋轉位置之編碼器EMY。搬送馬達驅動部65a根據自控制裝置60輸入之位置指令與自編碼器EMY輸入之旋轉位置,生成搬送馬達MY之驅動電流,並且將該驅動電流輸出至搬送馬達MY。搬送馬達MY藉由進行與所輸入之上述驅動電流相對應之旋轉,而使上述搬送單元34、38沿著上述搬送導件31進行往返移動。再者,上述搬送馬達驅動部65a相對於第1搬送單元34及第2搬送單元38之各者而設置,又,編碼器EMY亦相對於第1搬送單元34及第2搬送單元38之各者而設置。 An encoder EMY that detects the rotational position of the transport motor MY is connected to the transport motor drive unit 65a. The conveyance motor drive unit 65a generates a drive current of the transport motor MY based on the position command input from the control device 60 and the rotational position input from the encoder EMY, and outputs the drive current to the transport motor MY. The conveyance motor MY reciprocates the conveyance units 34 and 38 along the conveyance guide 31 by performing rotation corresponding to the input drive current. Further, the transport motor drive unit 65a is provided for each of the first transport unit 34 and the second transport unit 38, and the encoder EMY is also associated with each of the first transport unit 34 and the second transport unit 38. And set.

於按壓馬達驅動部65b,連接有檢測按壓馬達51M之旋轉位置之編碼器E51M。按壓馬達驅動部65b根據自控制裝置60輸入之位置指令與自編碼器E51M輸入之旋轉位置,生成按壓馬達51M之驅動電流,並且將該驅動電流輸出至按壓馬達51M。按壓馬達51M藉由進行與所輸入之上述驅動電流相對應之旋轉,使垂直移動臂52上升及下降。 An encoder E51M that detects the rotational position of the pressing motor 51M is connected to the pressing motor driving unit 65b. The pressing motor driving unit 65b generates a driving current for pressing the motor 51M based on the position command input from the control device 60 and the rotational position input from the encoder E51M, and outputs the driving current to the pressing motor 51M. The pressing motor 51M raises and lowers the vertical moving arm 52 by performing rotation corresponding to the input driving current.

又,於按壓馬達驅動部65b,連接有計測按壓馬達51M中之驅動電流之實際值之電流計測部I51M。按壓馬達驅動部65b根據自控制裝置60輸入之轉矩指令與自電流計測部I51M輸入之計測值,生成按壓馬達51M之驅動電流,並且將該驅動電流輸出至按壓馬達51M。按壓馬達51M藉由進行與所輸入之上述驅動電流相對應之旋轉,而使垂直移動臂52上升及下降。 Further, a current measuring unit I51M that measures the actual value of the driving current in the pressing motor 51M is connected to the pressing motor driving unit 65b. The pressing motor driving unit 65b generates a driving current of the pressing motor 51M based on the torque command input from the control device 60 and the measured value input from the current measuring unit I51M, and outputs the driving current to the pressing motor 51M. The pressing motor 51M raises and lowers the vertical moving arm 52 by performing rotation corresponding to the input driving current.

附帶說,控制裝置60選擇位置控制模式與轉矩控制模式作為按壓馬達51M之驅動控制之方法。其中,所謂位置控制模式,係指以連結 於上述搬送單元34、38之端部之吸附部54成為特定之位置之方式,根據上述位置指令控制按壓馬達51M之驅動之方法。另一方面,所謂轉矩控制模式,係指以將藉由按壓馬達51M之旋轉而產生之轉矩維持於特定之大小之方式,根據上述轉矩指令控制按壓馬達51M之驅動之方法。再者,上述按壓馬達驅動部65b相對於第1搬送單元34及第2搬送單元38之各者而設置,又,電流計測部I51M亦相對於第1搬送單元34及第2搬送單元38之各者而設置。 Incidentally, the control device 60 selects the position control mode and the torque control mode as a method of driving control of the pressing motor 51M. Among them, the so-called position control mode refers to the link The method of controlling the driving of the pressing motor 51M based on the position command is such that the suction portion 54 at the end of the conveying units 34 and 38 is at a specific position. On the other hand, the torque control mode is a method of controlling the driving of the pressing motor 51M based on the torque command so that the torque generated by the rotation of the pressing motor 51M is maintained at a specific magnitude. Further, the pressing motor driving unit 65b is provided for each of the first conveying unit 34 and the second conveying unit 38, and the current measuring unit I51M is also provided for each of the first conveying unit 34 and the second conveying unit 38. Set up.

按壓缸驅動部65c根據自控制裝置60輸入之驅動指令,生成用以將作動壓供給至按壓缸53之驅動信號,並且將該各驅動信號輸出至按壓缸53。而且,按壓缸53係根據用以使其伸長之驅動信號而伸長,藉此對電子零件T施加按壓力,並且根據用以使其收縮之驅動信號而收縮,藉此解除對電子零件T之按壓力。再者,上述按壓缸驅動部65c相對於第1搬送單元34及第2搬送單元38之各者而設置。 The pressing cylinder drive unit 65c generates a drive signal for supplying the actuation pressure to the pressing cylinder 53 based on the drive command input from the control device 60, and outputs the drive signals to the pressing cylinder 53. Further, the pressing cylinder 53 is extended in accordance with a driving signal for extending it, thereby applying a pressing force to the electronic component T, and contracting according to a driving signal for contracting thereof, thereby releasing the pressing of the electronic component T. pressure. Further, the pressing cylinder drive unit 65c is provided for each of the first transport unit 34 and the second transport unit 38.

於抽吸閥驅動部65d,連接有檢測抽吸閥SV2之開放量之抽吸感測器ESV2。抽吸閥驅動部65d根據自控制裝置60輸入之閥行程指令與自抽吸感測器ESV2輸入之開放量,生成抽吸閥SV2之驅動信號,並且將該驅動信號輸出至抽吸閥SV2。而且,抽吸閥SV2利用與上述開放量相對應之抽吸力抽吸上述電子零件T。再者,抽吸閥驅動部65d相對於第1搬送單元34及第2搬送單元38之各者而設置。又,抽吸感測器ESV2相對於抽吸閥SV2之各者而設置。 A suction sensor ESV2 that detects an opening amount of the suction valve SV2 is connected to the suction valve driving portion 65d. The suction valve drive unit 65d generates a drive signal of the suction valve SV2 based on the valve stroke command input from the control device 60 and the opening amount input from the suction sensor ESV2, and outputs the drive signal to the suction valve SV2. Further, the suction valve SV2 suctions the electronic component T by a suction force corresponding to the above-described opening amount. Further, the suction valve drive unit 65d is provided for each of the first transfer unit 34 and the second transfer unit 38. Further, the suction sensor ESV2 is provided for each of the suction valves SV2.

於控制裝置60,連接有使上述受壓臂35b、36b變位之受壓臂驅動部66。受壓臂驅動部66根據自控制裝置60輸入之驅動指令,生成用以將作動壓供給至受壓臂35b、36b之臂缸35s、36s之驅動信號,並且將該驅動信號輸出至臂缸35s、36s。而且,臂缸35s、36s根據用以使受壓臂35b、36b變位之驅動信號而伸長,藉此使受壓臂35b、36b變位至上述卡合位置。另一方面,臂缸35s、36s根據用以使其收縮之驅動信 號而收縮,藉此使受壓臂35b、36b變位至上述離開位置。 A pressure receiving arm drive unit 66 that displaces the pressure receiving arms 35b and 36b is connected to the control device 60. The pressure receiving arm drive unit 66 generates a drive signal for supplying the actuation pressure to the arm cylinders 35s and 36s of the pressure receiving arms 35b and 36b based on the drive command input from the control device 60, and outputs the drive signal to the arm cylinder 35s. , 36s. Further, the arm cylinders 35s and 36s are extended in accordance with a drive signal for displacing the pressure receiving arms 35b and 36b, thereby displacing the pressure receiving arms 35b and 36b to the engagement position. On the other hand, the arm cylinders 35s, 36s are driven by a drive letter for contracting The contraction is performed, whereby the pressure receiving arms 35b, 36b are displaced to the above-mentioned leaving position.

[處置器之作用] [The role of the processor]

繼而,根據上述構成,參照圖4~圖12對將由搬送單元保持之電子零件T嵌入檢查用插座33時之各種馬達之驅動態樣與各種缸之驅動態樣進行說明。再者,關於利用第1搬送單元34之嵌入態樣與利用第2搬送單元38之嵌入態樣,雖然電子零件T之供給源或電子零件T之搬送方向互不相同,但除此以外為相互相同之態樣,因此以下,僅例示第1搬送單元34中之上述態樣。 According to the above configuration, the driving state of each of the motors and the driving modes of the various cylinders when the electronic component T held by the transport unit is inserted into the inspection socket 33 will be described with reference to FIGS. 4 to 12 . In addition, the embedding pattern by the first transport unit 34 and the embedding pattern by the second transport unit 38 are different from each other in the direction in which the supply source of the electronic component T or the electronic component T is different from each other. In the same manner, the above-described aspects of the first transport unit 34 will be exemplified below.

再者,於圖4中,方便地表示對於搬送馬達MY之位置指令與第1搬送單元34之動作,又,方便地表示對於按壓馬達51M之位置指令或轉矩指令與垂直移動臂52之動作及控制模式。又,於圖5~圖12中,圖4所示之各時序T0~T10時之第1搬送單元34之驅動態樣及受壓臂機構35、36之驅動態樣係於使其等之平面構造與端面構造相互對應之狀態下而表示。 In addition, in FIG. 4, the position command of the conveyance motor MY and the operation of the first conveyance unit 34 are conveniently shown, and the position command or the torque command for the pressing motor 51M and the movement of the vertical movement arm 52 are conveniently displayed. And control mode. Further, in FIGS. 5 to 12, the driving state of the first transport unit 34 and the driving state of the pressure receiving arm mechanisms 35 and 36 at the respective timings T0 to T10 shown in FIG. 4 are attached to the plane of the first transport unit 35 and 36. The structure is shown in a state in which the end face structure corresponds to each other.

[搬送單元設置期間:T0-T1] [Transport unit setting period: T0-T1]

首先,如圖4所示,控制裝置60對搬送馬達驅動部65a輸出位置指令。此時,控制裝置60輸出之位置指令係用以使第1搬送單元34之吸附部54自供給用梭盤32a之正上方移動至檢查用插座33之正上方為止者。繼而,搬送馬達驅動部65a根據搬送馬達MY之旋轉位置與上述位置指令生成驅動電流,並將該驅動電流輸出至搬送馬達MY。藉此,搬送馬達MY自時序T0起開始朝向特定方向之旋轉,第1搬送單元34朝向檢查用插座33進行去向移動直至第1搬送單元34之吸附部54在保持電子零件T之狀態下到達檢查用插座33之正上方為止(參照圖5(a))。 First, as shown in FIG. 4, the control device 60 outputs a position command to the transport motor drive unit 65a. At this time, the position command output from the control device 60 is for moving the suction unit 54 of the first transport unit 34 from directly above the supply shuttle 32a to directly above the inspection socket 33. Then, the transport motor drive unit 65a generates a drive current based on the rotational position of the transport motor MY and the position command, and outputs the drive current to the transport motor MY. As a result, the conveyance motor MY starts to rotate in a specific direction from the time series T0, and the first conveyance unit 34 moves to the inspection socket 33 until the suction unit 54 of the first conveyance unit 34 reaches the inspection while holding the electronic component T. The socket 33 is directly above (see Fig. 5(a)).

再者,於上述搬送單元設置期間,為了使垂直移動臂52之下端部維持最高位置,而控制裝置60對按壓馬達驅動部65b輸出位置指令。繼而,按壓馬達驅動部65b根據按壓馬達51M之旋轉位置與上述位置 指令生成驅動電流,並將該驅動電流輸出至按壓馬達51M。藉此,按壓馬達驅動部65b抑制按壓馬達51M之旋轉。 Further, during the installation of the transport unit, the control device 60 outputs a position command to the push motor drive unit 65b in order to maintain the lower end portion of the vertical movement arm 52 at the highest position. Then, the pressing motor driving portion 65b is in accordance with the rotational position of the pressing motor 51M and the above position. The drive current is commanded and output to the push motor 51M. Thereby, the pressing motor driving unit 65b suppresses the rotation of the pressing motor 51M.

又,於上述搬送單元設置期間,為了不對按壓缸53供給作動壓,而控制裝置60對按壓缸驅動部65c輸出按壓解除指令。藉此,按壓缸驅動部65c根據按壓解除指令生成驅動信號,藉此,藉由不對按壓缸53供給作動壓,而將按壓缸53之伸長量維持於最小值(參照圖5(b))。 Further, in the period in which the transport unit is installed, the control device 60 outputs a press release command to the push cylinder drive unit 65c so as not to supply the actuation pressure to the press cylinder 53. Thereby, the pressing cylinder drive unit 65c generates a drive signal based on the press release command, thereby maintaining the amount of elongation of the pressing cylinder 53 to a minimum by not supplying the operating pressure to the pressing cylinder 53 (see FIG. 5(b)).

繼而,如上所述,將垂直移動臂52之下端部維持於最高位置,且將按壓缸53之伸長量維持於最小值,藉此將吸附部54配置於其之最高位置。再者,所謂吸附部54之最高位置,係指當水平移動臂51沿著搬送導件31移動時,吸附部54與其他構件不發生碰撞之位置。 Then, as described above, the lower end portion of the vertical moving arm 52 is maintained at the highest position, and the amount of elongation of the pressing cylinder 53 is maintained at the minimum value, whereby the adsorption portion 54 is disposed at the highest position thereof. The highest position of the adsorption unit 54 is a position at which the adsorption unit 54 does not collide with other members when the horizontal movement arm 51 moves along the conveyance guide 31.

[下降、按壓期間:T1-T3] [Descent, pressing period: T1-T3]

當吸附部54到達檢查用插座33之正上方時,為了將吸附於吸附部54之電子零件T收容於檢查用插座33,而控制裝置60如圖4所示,於時序T1對按壓馬達驅動部65b輸出位置指令。此時,控制裝置60輸出上述位置控制模式中之位置指令。繼而,按壓馬達驅動部65b根據按壓馬達51M之旋轉位置與上述位置指令生成驅動電流,並將該驅動電流輸出至按壓馬達51M。藉此,按壓馬達51M自時序T1起開始朝向特定方向之旋轉,垂直移動臂52進行下降直至將電子零件T收容於檢查用插座33為止。 When the adsorption unit 54 reaches the inspection socket 33, the control unit 60 presses the motor drive unit at the timing T1, as shown in FIG. 4, in order to accommodate the electronic component T adsorbed to the adsorption unit 54 in the inspection socket 33. 65b output position command. At this time, the control device 60 outputs the position command in the above position control mode. Then, the pressing motor driving unit 65b generates a driving current based on the rotational position of the pressing motor 51M and the position command, and outputs the driving current to the pressing motor 51M. Thereby, the pressing motor 51M starts to rotate in a specific direction from the timing T1, and the vertical moving arm 52 descends until the electronic component T is housed in the inspection socket 33.

繼而,當於時序T2,將電子零件T收容於檢查用插座33時,繼續進行按壓馬達51M之位置控制,吸附部54以吸附部54之位置成為特定位置之方式進一步下降。藉此,將來自按壓馬達51M之按壓力施加至電子零件T(參照圖6(a)(b))。 Then, when the electronic component T is housed in the inspection socket 33 at the timing T2, the position control of the pressing motor 51M is continued, and the adsorption portion 54 is further lowered such that the position of the adsorption portion 54 becomes a specific position. Thereby, the pressing force from the pressing motor 51M is applied to the electronic component T (see FIG. 6(a) and (b)).

再者,於上述下降、按壓期間,為了維持第1搬送單元34中之Y方向之位置,而控制裝置60對搬送馬達驅動部65a輸出位置指令。繼而,搬送馬達驅動部65a根據搬送馬達MY之旋轉位置與上述位置指令 生成驅動電流,並將該驅動電流輸出至搬送馬達MY而抑制該搬送馬達MY之旋轉。 In the above-described falling and pressing period, the control device 60 outputs a position command to the transport motor drive unit 65a in order to maintain the position in the Y direction of the first transport unit 34. Then, the transport motor drive unit 65a is in accordance with the rotational position of the transport motor MY and the position command. A drive current is generated, and the drive current is output to the transfer motor MY to suppress the rotation of the transfer motor MY.

[受壓臂驅動期間:T3-T4] [Loading arm period: T3-T4]

當電子零件T定位於檢查用插座33時,為了受壓臂機構35、36之受壓臂35b、36b變位至上述卡合位置,而控制裝置60如圖4所示,於時序T3,對受壓臂驅動部66輸出卡合指令。 When the electronic component T is positioned at the inspection socket 33, the pressure receiving arms 35b, 36b of the pressure receiving arm mechanisms 35, 36 are displaced to the above-mentioned engagement positions, and the control device 60 is shown in Fig. 4 at timing T3. The pressure receiving arm drive unit 66 outputs an engagement command.

繼而,受壓臂驅動部66根據上述卡合指令生成驅動信號,並將該驅動信號輸出至臂缸35s、36s。藉此,臂缸35s、36s伸長而受壓臂35b、36b變位至卡合位置(參照圖7(a)(b))。 Then, the pressure receiving arm drive unit 66 generates a drive signal based on the engagement command, and outputs the drive signal to the arm cylinders 35s and 36s. Thereby, the arm cylinders 35s and 36s are extended, and the pressure receiving arms 35b and 36b are displaced to the engagement position (refer FIG. 7 (a) (b)).

再者,於上述受壓臂驅動期間,為了維持第1搬送單元34中之Y方向之位置,而控制裝置60對搬送馬達驅動部65a輸出位置指令。繼而,搬送馬達驅動部65a根據搬送馬達MY之旋轉位置與上述位置指令生成驅動電流,並將該驅動電流輸出至搬送馬達MY而抑制搬送馬達MY之旋轉。 In the drive arm driving period, the control device 60 outputs a position command to the transport motor drive unit 65a in order to maintain the position in the Y direction of the first transport unit 34. Then, the conveyance motor drive unit 65a generates a drive current based on the rotational position of the transport motor MY and the position command, and outputs the drive current to the transport motor MY to suppress the rotation of the transport motor MY.

又,於上述受壓臂驅動期間,為了對電子零件T施加來自按壓馬達51M之按壓力Fbase,而控制裝置60對按壓馬達驅動部65b輸出位置指令。繼而,按壓馬達驅動部65b根據按壓馬達51M之旋轉位置與上述位置指令生成驅動電流,並將該驅動電流輸出至按壓馬達51M而使吸附部54之位置下降至特定位置為止。再者,所謂上述之按壓力Fbase,係指藉由試驗等而預先設定者,按壓力Fbase係足夠用以將電子零件T定位於檢查用凹穴33a之力,且為電子零件T或檢查用插座33不因該按壓力Fbase而發生變形之程度者。 Further, during the driving of the pressure receiving arm, in order to apply the pressing force Fbase from the pressing motor 51M to the electronic component T, the control device 60 outputs a position command to the pressing motor driving unit 65b. Then, the pressing motor driving unit 65b generates a driving current based on the rotational position of the pressing motor 51M and the position command, and outputs the driving current to the pressing motor 51M to lower the position of the adsorption unit 54 to a specific position. In addition, the above-mentioned pressing force Fbase is a preset by a test or the like, and the pressing force Fbase is sufficient for positioning the electronic component T in the inspection recess 33a, and is used for the electronic component T or the inspection. The socket 33 is not deformed by the pressing force Fbase.

[轉矩控制期間:T4-T5] [Torque Control Period: T4-T5]

當受壓臂35b、35b變位至卡合位置時,控制裝置60如圖4所示,於時序T4,對按壓馬達驅動部65b輸出轉矩控制模式中之轉矩指令。此時,為了對電子零件T施加大於上述按壓力Fbase之按壓力Fcon,而 控制裝置60輸出轉矩指令。繼而,按壓馬達驅動部65b根據電流計測部I51M之計測值與轉矩指令生成驅動電流,並將該驅動電流輸出至按壓馬達51M。 When the pressure receiving arms 35b and 35b are displaced to the engagement position, the control device 60 outputs a torque command in the torque control mode to the pressing motor driving unit 65b at timing T4 as shown in FIG. At this time, in order to apply a pressing force Fcon greater than the above-described pressing force Fbase to the electronic component T, Control device 60 outputs a torque command. Then, the pressing motor driving unit 65b generates a driving current based on the measured value of the current measuring unit I51M and the torque command, and outputs the driving current to the pressing motor 51M.

藉此,按壓馬達51M自時序T4起持續進行朝向特定方向之旋轉,按壓馬達51M輸出特定之轉矩並對電子零件T施加上述按壓力Fcon,相對於檢查用插座33而將電子零件T定位(參照圖8(a))。 As a result, the pressing motor 51M continues to rotate in a specific direction from the timing T4, and the pressing motor 51M outputs a specific torque and applies the pressing force Fcon to the electronic component T to position the electronic component T with respect to the inspection socket 33 ( Refer to Figure 8(a)).

再者,於上述轉矩控制期間,為了維持第1搬送單元34中之Y方向之位置,而控制裝置60對搬送馬達驅動部65a輸出位置指令。又,為了維持臂缸35s、36s之伸長,而控制裝置60對受壓臂驅動部66輸出卡合指令。 In the torque control period, the control device 60 outputs a position command to the transport motor drive unit 65a in order to maintain the position in the Y direction of the first transport unit 34. Further, in order to maintain the elongation of the arm cylinders 35s and 36s, the control device 60 outputs an engagement command to the pressure receiving arm drive unit 66.

繼而,搬送馬達驅動部65a抑制搬送馬達MY之旋轉,並且受壓臂驅動部66維持臂缸35s、36s之伸長。繼而,按壓馬達驅動部65b持續以按壓力Fcon按壓電子零件T(參照圖8(b))。 Then, the conveyance motor drive unit 65a suppresses the rotation of the conveyance motor MY, and the pressure receiving arm drive unit 66 maintains the extension of the arm cylinders 35s and 36s. Then, the pressing motor driving portion 65b continues to press the electronic component T with the pressing force Fcon (see FIG. 8(b)).

[缸按壓期間:T5-T6] [Cylinder pressing period: T5-T6]

當以按壓力Fcon按壓電子零件T時,為了將作動壓供給至按壓缸53,控制裝置60如圖4所示,於時序T5對按壓缸驅動部65c輸出按壓指令。繼而,按壓缸驅動部65c根據按壓指令生成驅動信號,並將該驅動信號輸出至壓縮空氣供給系統。藉此,按壓缸驅動部65c將作動壓供給至按壓缸53,並且對電子零件T進一步施加按壓力Fhigh。 When the electronic component T is pressed by the pressing force Fcon, the control device 60 outputs a pressing command to the pressing cylinder driving unit 65c at the timing T5 as shown in FIG. 4 in order to supply the operating pressure to the pressing cylinder 53. Then, the pressing cylinder drive unit 65c generates a drive signal based on the pressing command, and outputs the drive signal to the compressed air supply system. Thereby, the pressing cylinder drive unit 65c supplies the actuation pressure to the pressing cylinder 53, and further applies a pressing force Fhigh to the electronic component T.

所謂該按壓力Fhigh係指大於上述按壓力Fbase之力,且為電子零件T或檢查用插座33不會因該按壓力Fhigh之按壓而發生變形之程度者。而藉由將如上所述之按壓力Fhigh施加至電子零件T,可確實地進行電子零件T之凸端子與檢查用插座33之凹端子之電性連接。 The pressing force Fhigh means a force greater than the pressing force Fbase, and the electronic component T or the inspection socket 33 is not deformed by the pressing of the pressing force Fhigh. By applying the pressing force Fhigh as described above to the electronic component T, the electrical connection between the male terminal of the electronic component T and the female terminal of the inspection socket 33 can be reliably performed.

繼而,當將作動壓供給至按壓缸53時,控制裝置60對檢查單元輸出用以開始檢查之檢查開始信號。 Then, when the operating pressure is supplied to the pressing cylinder 53, the control device 60 outputs an inspection start signal for starting the inspection to the inspection unit.

此時,對第1搬送單元34中之支撐側即垂直移動臂52施加抵抗按 壓力Fhigh之反作用力。藉此,藉由使垂直移動臂52退回至搬送導件31側,該被受壓片52a與受壓臂35b、36b卡合(參照圖9(a)(b))。 At this time, a resistance is applied to the vertical moving arm 52 on the support side of the first transport unit 34. The reaction of the pressure Fhigh. As a result, the vertically movable arm 52 is retracted to the side of the conveyance guide 31, and the pressure receiving piece 52a is engaged with the pressure receiving arms 35b and 36b (see FIGS. 9(a) and 9(b)).

因此,按壓缸53之按壓力之反作用力之一部分作用於第1搬送單元34,而其餘部分會經由受壓臂機構35、36而作用於基台11。即,雖然垂直移動臂52因按壓缸53之伸長而被推回,但與按壓缸53之伸長被受壓臂機構35、36抑制相應地,垂直移動臂52之退回程度亦受到不小之抑制。因此,雖然將大於垂直移動臂52之按壓力Fcon之按壓力施加至電子零件T,但並非電子零件T受到之按壓力之反作用力全部作用於第1搬送單元34,該反作用力之一部分會向基台11分散。藉此,雖然以所期望之按壓力按壓電子零件T,但對於第1搬送單元34所要求之剛性為可耐受該按壓力之反作用力之一部分者即已足夠。因此,可抑制第1搬送單元34之大型化或重量化。 Therefore, one of the reaction forces of the pressing force of the pressing cylinder 53 acts on the first conveying unit 34, and the remaining portion acts on the base 11 via the pressure receiving arm mechanisms 35 and 36. That is, although the vertical moving arm 52 is pushed back by the extension of the pressing cylinder 53, the degree of retraction of the vertical moving arm 52 is suppressed notably because the extension of the pressing cylinder 53 is suppressed by the pressure receiving arm mechanisms 35, 36. . Therefore, although the pressing force of the pressing force Fcon larger than the vertical moving arm 52 is applied to the electronic component T, the reaction force against the pressing force of the electronic component T is not applied to the first conveying unit 34, and one part of the reaction force is directed to The base 11 is dispersed. Thereby, although the electronic component T is pressed with a desired pressing force, it is sufficient that the rigidity required for the first conveying unit 34 is one of the reaction forces capable of withstanding the pressing force. Therefore, it is possible to suppress an increase in size or weight of the first transport unit 34.

附帶說明,於按壓缸53之伸長量未由受壓臂機構35、36強制地規定之態樣下,根據按壓馬達51M之驅動之態樣,按壓缸53之伸長量亦有所變化。而且,雖然按壓馬達51M之驅動為轉矩控制模式,但若與在被受壓片52a與受壓臂35b、36b之機械性之卡合下使按壓力固定之態樣相比,對於電子零件T之按壓力亦會有所變動。就該點而言,若為上述態樣,由於按壓缸53之伸長量在被受壓片52a與受壓臂35b、36b之卡合下固定為特定值,故對於電子零件T之按壓力亦變得穩定。 Incidentally, in the case where the amount of elongation of the pressing cylinder 53 is not forcibly defined by the pressure receiving arm mechanisms 35 and 36, the amount of elongation of the pressing cylinder 53 also changes depending on the driving state of the pressing motor 51M. Further, although the driving of the pressing motor 51M is in the torque control mode, the electronic component is compared with the state in which the pressing force is fixed under the mechanical engagement of the pressure receiving piece 52a and the pressure receiving arms 35b and 36b. The pressing pressure of T will also change. In this regard, in the above-described manner, since the amount of elongation of the pressing cylinder 53 is fixed to a specific value by the engagement of the pressure receiving piece 52a and the pressure receiving arms 35b and 36b, the pressing force for the electronic component T is also Become stable.

再者,於上述缸按壓期間,與之前之轉矩控制期間同樣地,為了維持第1搬送單元34之Y方向之位置,控制裝置60對搬送馬達驅動部65a輸出位置指令。又,為了維持臂缸35s、36s之伸長,控制裝置60對受壓臂驅動部66輸出卡合指令。進而,如上所述,為了按壓馬達51M能夠以按壓力Fcon對按壓缸53進行按壓,而控制裝置60對按壓馬達驅動部65b輸出轉矩指令。 In the same manner as the previous torque control period, the control device 60 outputs a position command to the transport motor drive unit 65a in order to maintain the position of the first transport unit 34 in the Y direction. Further, in order to maintain the elongation of the arm cylinders 35s and 36s, the control device 60 outputs an engagement command to the pressure receiving arm drive unit 66. Further, as described above, the pressing device 51 can press the pressing cylinder 53 with the pressing force Fcon, and the control device 60 outputs a torque command to the pressing motor driving unit 65b.

繼而,搬送馬達驅動部65a抑制搬送馬達MY之旋轉,並且受壓臂 驅動部66維持臂缸35s、36s之伸長。繼而,按壓馬達驅動部65b持續以按壓力Fcon按壓按壓缸53。 Then, the transport motor drive unit 65a suppresses the rotation of the transport motor MY, and the pressure arm The drive unit 66 maintains the elongation of the arm cylinders 35s and 36s. Then, the pressing motor driving portion 65b continues to press the pressing cylinder 53 with the pressing force Fcon.

附帶說,使用按壓馬達51M之電子零件T之按壓可藉由按壓馬達51M之位置控制及轉矩控制之至少一個而進行。此處,按壓缸53之按壓力越大,則對於該按壓缸53之支撐側之反作用力即對於按壓馬達51M之負載亦越大。此時,當藉由上述位置控制模式驅動按壓馬達51M時,只要按壓馬達51M之輸出不超過上述反作用力,按壓馬達51M之旋轉位置便不會到達目標之旋轉位置。而且,按壓馬達51M之驅動電流持續增大,對按壓馬達51M之內部施加過量之負載。 Incidentally, the pressing of the electronic component T using the pressing motor 51M can be performed by at least one of the position control and the torque control of the pressing motor 51M. Here, the larger the pressing force of the pressing cylinder 53, the larger the reaction force with respect to the supporting side of the pressing cylinder 53, that is, the load on the pressing motor 51M. At this time, when the pressing motor 51M is driven by the above-described position control mode, as long as the output of the pressing motor 51M does not exceed the reaction force, the rotational position of the pressing motor 51M does not reach the target rotational position. Further, the drive current of the pressing motor 51M continues to increase, and an excessive load is applied to the inside of the pressing motor 51M.

就該點而言,於上述缸按壓期間,在按壓缸53之按壓力施加至電子零件T之狀態下,藉由轉矩控制模式驅動按壓馬達51M。因此,即便因按壓缸53之伸長而垂直移動臂52退回,按壓馬達51M亦輸出特定之轉矩,既然如此便不會對該按壓馬達51M施加過量在負載。 At this point, during the cylinder pressing period, the pressing motor 51M is driven by the torque control mode in a state where the pressing force of the pressing cylinder 53 is applied to the electronic component T. Therefore, even if the vertical moving arm 52 is retracted due to the extension of the pressing cylinder 53, the pressing motor 51M outputs a specific torque, and thus the excessive pressing force is not applied to the pressing motor 51M.

[缸按壓解除期間:T6-T7] [Cylinder press release period: T6-T7]

當於檢查單元中電子零件T之檢查結束時,將用以開始電子零件T之回收之檢查結束信號自檢查單元輸出至控制裝置60。繼而,為了按壓缸53進行收縮,控制裝置60如圖4所示,於時序T6,對按壓缸驅動部65c輸出按壓解除指令。藉此,按壓缸驅動部65c藉由根據按壓解除指令生成驅動信號,而將因按壓缸53之伸長所致之按壓力解除。藉此,對於第1搬送單元34之反作用力變小,因此亦將垂直移動臂52之被受壓片52a與受壓臂35b、36b之卡合解除(參照圖10(a)(b))。 When the inspection of the electronic component T in the inspection unit is completed, the inspection end signal for starting the recovery of the electronic component T is output from the inspection unit to the control device 60. Then, in order to contract the pressing cylinder 53, the control device 60 outputs a pressing release command to the pressing cylinder driving unit 65c at timing T6 as shown in Fig. 4 . Thereby, the pressing cylinder drive unit 65c cancels the pressing force due to the elongation of the pressing cylinder 53 by generating a driving signal in accordance with the pressing release command. As a result, the reaction force with respect to the first transport unit 34 is reduced, so that the engagement between the pressed piece 52a of the vertical moving arm 52 and the pressure receiving arms 35b and 36b is also released (see FIG. 10(a)(b)). .

再者,於上述缸按壓解除期間,為了維持第1搬送單元34中之Y方向之位置,而控制裝置60對搬送馬達驅動部65a輸出位置指令。又,為了維持臂缸35s、36s之伸長,控制裝置60對受壓臂驅動部66輸出卡合指令。進而,如上所述,為了按壓馬達51M能夠以按壓力Fcon按壓電子零件T,而控制裝置60對按壓馬達驅動部65b輸出轉矩指令。 In the cylinder press release period, the control device 60 outputs a position command to the transport motor drive unit 65a in order to maintain the position in the Y direction of the first transport unit 34. Further, in order to maintain the elongation of the arm cylinders 35s and 36s, the control device 60 outputs an engagement command to the pressure receiving arm drive unit 66. Further, as described above, in order to press the motor 51M, the electronic component T can be pressed by the pressing force Fcon, and the control device 60 outputs a torque command to the pressing motor driving unit 65b.

繼而,搬送馬達驅動部65a抑制搬送馬達MY之旋轉,並且受壓臂驅動部66維持臂缸35s、36s之伸長。繼而,按壓馬達驅動部65b持續以按壓力Fcon按壓電子零件T。 Then, the conveyance motor drive unit 65a suppresses the rotation of the conveyance motor MY, and the pressure receiving arm drive unit 66 maintains the extension of the arm cylinders 35s and 36s. Then, the pressing motor driving portion 65b continues to press the electronic component T with the pressing force Fcon.

[位置控制期間:T7-T8] [Location Control Period: T7-T8]

當將按壓缸53之按壓解除時,控制裝置60如圖4所示,於時序T7,對按壓馬達驅動部65b輸出位置指令。繼而,按壓馬達驅動部65b根據按壓馬達51M之旋轉位置與上述位置指令生成驅動電流,並將該驅動電流輸出至按壓馬達51M。藉此,按壓馬達51M藉由開始朝向特定方向之旋轉,而開始以按壓力Fbase按壓電子零件T(參照圖11(a)(b))。 When the pressing of the pressing cylinder 53 is released, the control device 60 outputs a position command to the pressing motor driving unit 65b at timing T7 as shown in Fig. 4 . Then, the pressing motor driving unit 65b generates a driving current based on the rotational position of the pressing motor 51M and the position command, and outputs the driving current to the pressing motor 51M. Thereby, the pressing motor 51M starts to press the electronic component T with the pressing force Fbase by starting the rotation in a specific direction (see FIG. 11(a) and (b)).

再者,於上述位置控制期間,為了維持第1搬送單元34中之Y方向之位置,而控制裝置60對搬送馬達驅動部65a輸出位置指令。又,為了維持臂缸35s、36s之伸長,而控制裝置60對受壓臂驅動部66輸出卡合指令。 In the position control period, the control device 60 outputs a position command to the transport motor drive unit 65a in order to maintain the position in the Y direction of the first transport unit 34. Further, in order to maintain the elongation of the arm cylinders 35s and 36s, the control device 60 outputs an engagement command to the pressure receiving arm drive unit 66.

繼而,搬送馬達驅動部65a抑制搬送馬達MY之旋轉,並且受壓臂驅動部66維持臂缸35s、36s之伸長。 Then, the conveyance motor drive unit 65a suppresses the rotation of the conveyance motor MY, and the pressure receiving arm drive unit 66 maintains the extension of the arm cylinders 35s and 36s.

[受壓臂解除期間:T8-T9] [Responsive arm release period: T8-T9]

當藉由位置控制驅動按壓馬達51M時,為了使受壓臂35b、36b返回至離開位置為止,而控制裝置60如圖4所示,於時序T8,對受壓臂驅動部66輸出卡合解除指令。繼而,受壓臂驅動部66根據卡合解除指令生成驅動信號並輸出,臂缸35s、36s進行收縮,而受壓臂35b、36b返回至離開位置(參照圖12(a)(b))。 When the pressing motor 51M is driven by the position control, in order to return the pressure receiving arms 35b and 36b to the separated position, the control device 60 outputs the engagement release to the pressure receiving arm driving unit 66 at the timing T8 as shown in FIG. instruction. Then, the pressure receiving arm drive unit 66 generates and outputs a drive signal based on the engagement release command, and the arm cylinders 35s and 36s contract, and the pressure receiving arms 35b and 36b return to the separated position (see FIGS. 12(a) and (b)).

再者,於上述受壓臂機構解除期間,為了維持第1搬送單元34中之Y方向之位置,而控制裝置60對搬送馬達驅動部65a輸出位置指令。又,為了以按壓力Fbase按壓電子零件T,而控制裝置60對按壓馬達驅動部65b輸出位置指令。 In addition, during the release of the pressure receiving arm mechanism, the control device 60 outputs a position command to the transport motor drive unit 65a in order to maintain the position in the Y direction of the first transport unit 34. Further, in order to press the electronic component T with the pressing force Fbase, the control device 60 outputs a position command to the pressing motor driving unit 65b.

繼而,搬送馬達驅動部65a抑制搬送馬達MY之旋轉,並且按壓馬達驅動部65b抑制按壓馬達51M之旋轉。 Then, the conveyance motor drive unit 65a suppresses the rotation of the conveyance motor MY, and the pressing motor drive unit 65b suppresses the rotation of the pressing motor 51M.

[上升期間:T9-T10] [Rise period: T9-T10]

當受壓臂35b、36b返回至離開位置為止時,為了使垂直移動臂52之下端部返回至最高位置為止,而控制裝置60如圖4所示,於時序T9,對按壓馬達驅動部65b輸出位置指令。繼而,按壓馬達驅動部65b根據按壓馬達51M之旋轉位置與上述位置指令生成驅動電流,並將該驅動電流輸出至按壓馬達51M。藉此,按壓馬達51M向與時序T9以前相反之方向旋轉而使垂直移動臂52返回至最高位置為止。 When the pressure receiving arms 35b and 36b are returned to the separated position, the control device 60 outputs the lower end portion of the vertical moving arm 52 to the highest position, and the control device 60 outputs the pressing motor driving portion 65b at timing T9 as shown in FIG. Position command. Then, the pressing motor driving unit 65b generates a driving current based on the rotational position of the pressing motor 51M and the position command, and outputs the driving current to the pressing motor 51M. Thereby, the pressing motor 51M rotates in the opposite direction to the time T9 before the vertical moving arm 52 returns to the highest position.

繼而,當垂直移動臂52之下端部到達最高位置時,為了使第1搬送單元34之吸附部54配置於回收用梭盤32b之正上方,而控制裝置60如圖4所示,於時序T10,對搬送馬達驅動部65a輸出位置指令。繼而,搬送馬達驅動部65a根據搬送馬達MY之旋轉位置與上述位置指令生成驅動電流,並將該驅動電流輸出至搬送馬達MY。藉此,搬送馬達MY自時序T10起開始朝向特定方向之旋轉,第1搬送單元34朝向第1梭子進行回向移動直至吸附於吸附部54之電子零件T到達回收用梭盤32b之正上方為止。 Then, when the lower end portion of the vertical moving arm 52 reaches the highest position, in order to arrange the adsorption portion 54 of the first conveying unit 34 directly above the collecting shuttle 32b, the control device 60 is as shown in FIG. The position command is output to the transport motor drive unit 65a. Then, the transport motor drive unit 65a generates a drive current based on the rotational position of the transport motor MY and the position command, and outputs the drive current to the transport motor MY. As a result, the transport motor MY starts to rotate in a specific direction from the timing T10, and the first transport unit 34 moves back toward the first shuttle until the electronic component T adsorbed to the adsorption unit 54 reaches the top of the recovery shuttle 32b. .

如以上說明所述,根據上述實施形態,可獲得以下列舉之效果。 As described above, according to the above embodiment, the effects listed below can be obtained.

(1)按壓缸53之按壓力之反作用力之一部分作用於搬送單元34、38或搬送導件31,然而其剩餘部分經由受壓臂機構35、36而作用於基台11。即,並非按壓力之反作用力之全部作用於搬送單元34、38,而該反作用力之一部分將向基台11分散。藉此,雖然以所期望之按壓力按壓電子零件T,但搬送單元34、38所要求之剛性為可耐受按壓力之反作用力之一部分者即可。因此,可抑制搬送單元34、38之大型化或重量化。 (1) One of the reaction forces of the pressing force of the pressing cylinder 53 acts on the conveying units 34, 38 or the conveying guide 31, but the remaining portion acts on the base 11 via the pressure receiving arm mechanisms 35, 36. That is, not all of the reaction force of the pressing force acts on the conveying units 34, 38, and a part of the reaction force is dispersed to the base 11. Thereby, although the electronic component T is pressed with a desired pressing force, the rigidity required for the conveying units 34 and 38 may be one of the reaction forces capable of withstanding the pressing force. Therefore, it is possible to suppress an increase in size or weight of the transport units 34 and 38.

(2)按壓電子零件T之垂直移動臂52與按壓缸53中,受壓臂機構 35、36僅與設置於垂直移動臂52之被受壓片52a卡合。因此,可抑制垂直移動臂52因按壓缸53之按壓力而退回。而且,亦可抑制施加至電子零件T之按壓力發生變動。 (2) pressing the vertical moving arm 52 of the electronic component T and the pressing cylinder 53, the pressure arm mechanism 35, 36 are only engaged with the pressed piece 52a provided on the vertical moving arm 52. Therefore, it is possible to suppress the vertical movement arm 52 from being retracted by the pressing force of the pressing cylinder 53. Further, it is also possible to suppress a change in the pressing force applied to the electronic component T.

(3)由於搬送單元34、38包含以相對較大之按壓力按壓電子零件T之按壓缸53,故而與藉由馬達之驅動施加相對較大之按壓力之構成相比,可使搬送單元34、38之構成簡單,進而可使處置器10之構成簡單。又,與代替按壓缸53而包含馬達之構成相比,增大施加至電子零件T之按壓力亦變得容易。 (3) Since the conveying units 34 and 38 include the pressing cylinder 53 that presses the electronic component T with a relatively large pressing force, the conveying unit 34 can be made larger than the configuration in which a relatively large pressing force is applied by the driving of the motor. The configuration of 38 is simple, and the configuration of the handler 10 can be simplified. Moreover, it is easier to increase the pressing force applied to the electronic component T than the configuration including the motor instead of the pressing cylinder 53.

(4)於按壓缸53之按壓力施加至電子零件T之狀態下,藉由轉矩控制驅動按壓馬達51M。因此,即便垂直移動臂52因按壓缸53之伸長而退回,按壓馬達51M亦輸出特定之轉矩,既然如此便不會對該馬達施加過量之負載。 (4) The pressing motor 51M is driven by the torque control in a state where the pressing force of the pressing cylinder 53 is applied to the electronic component T. Therefore, even if the vertical moving arm 52 is retracted by the extension of the pressing cylinder 53, the pressing motor 51M outputs a specific torque, and thus the excessive load is not applied to the motor.

(5)於按壓缸53對電子零件T施加按壓力時,藉由轉矩控制驅動按壓馬達51M。因此,不會對按壓馬達51M施加過量之負載,此外施加至電子零件T之按壓力亦變得穩定。 (5) When the pressing force is applied to the electronic component T by the pressing cylinder 53, the pressing motor 51M is driven by the torque control. Therefore, an excessive load is not applied to the pressing motor 51M, and the pressing force applied to the electronic component T also becomes stable.

(6)來自按壓缸53之按壓力之反作用力作用於相互對向之一對受壓臂35b、36b之各者。因此,與抵抗來自按壓缸53之按壓力之反作用力作用於搭載面11a之一個部位之態樣相比,可擴大該反作用力分散之範圍,進而可抑制受壓臂機構35、36或基台11所要求之剛性。 (6) The reaction force from the pressing force of the pressing cylinder 53 acts on each of the pair of pressure receiving arms 35b, 36b facing each other. Therefore, compared with the aspect in which the reaction force against the pressing force from the pressing cylinder 53 acts on one portion of the mounting surface 11a, the range in which the reaction force is dispersed can be expanded, and the pressure receiving arm mechanism 35, 36 or the base can be suppressed. 11 required rigidity.

(7)若為同時按壓複數個電子零件T之上述態樣,則施加至檢查用插座33之整體之按壓力自動變大,因此與此相應,該按壓力之反作用力亦自動變大。因此,可抑制搬送單元34、38之大型化或重量化之效果變得更顯著。 (7) If the above-described aspect of the plurality of electronic components T is pressed at the same time, the pressing force applied to the entire inspection socket 33 is automatically increased, and accordingly, the reaction force of the pressing force is automatically increased. Therefore, the effect of suppressing the enlargement or weight of the conveyance units 34 and 38 becomes more remarkable.

再者,上述實施形態可以如下之方式進行適當變更而實施。 Further, the above embodiment can be implemented by appropriately changing the following aspects.

●搬送對象除上述電子零件T以外,亦可為光學零件或精密機器零件等各種零件,總之,為被搬送及按壓者即可。即便為上述之搬送 對象,亦可獲得依據上述(1)~(7)所得之效果。 ● In addition to the electronic component T described above, the object to be transported may be various components such as optical components or precision machine components. In short, it may be transported and pressed. Even for the above The object can also obtain the effects obtained according to the above (1) to (7).

●保持部保持搬送對象之態樣並不限定於如上述般吸附搬送對象之態樣,亦可為例如握持搬送對象之態樣,總之,為可保持載置於上述各種托盤之搬送對象,並且可利用檢查用插座33按壓所保持之搬送對象之態樣即可。即便為如上所述之保持之態樣,亦可獲得依據上述(1)~(7)所得之效果。 The aspect in which the holding unit holds the object to be transported is not limited to the case of adsorbing the object to be transported as described above, and may be, for example, a state in which the object to be transported is held, and in the end, it is possible to hold the object to be transported on the various trays. Further, the inspection socket 33 can be pressed by the inspection target 33 to hold the object to be conveyed. Even in the case of maintaining as described above, the effects obtained in accordance with the above (1) to (7) can be obtained.

●處置器10亦可不為必定同時搬送且同時按壓複數個電子零件T之構成。總之,至少具有同時搬送複數個電子零件T之狀態及同時按壓複數個電子零件T之狀態即可。根據上述構成,由於具有施加至檢查用插座33之整體之按壓力變大之狀態,故而與此相應,具有該按壓力之反作用力亦變大之狀態。因此,可抑制搬送單元34、38之大型化或重量化之效果變得更顯著。 The processor 10 may not be configured to simultaneously transport a plurality of electronic components T at the same time. In short, it is sufficient to have at least a state in which a plurality of electronic components T are simultaneously conveyed and a state in which a plurality of electronic components T are simultaneously pressed. According to the above configuration, since the pressing force applied to the entire inspection socket 33 is increased, the reaction force of the pressing force is also increased. Therefore, the effect of suppressing the enlargement or weight of the conveyance units 34 and 38 becomes more remarkable.

●一個搬送單元搬送之搬送對象之個數亦可為一個。即便為如上所述之構成,亦可獲得依據上述(1)~(6)所得之效果。 ● The number of transport objects to be transported by one transport unit may be one. Even in the configuration as described above, the effects obtained in accordance with the above (1) to (6) can be obtained.

●亦可為被受壓片52a與一個受壓臂機構卡合之構成,即便為如上所述之構成,亦可獲得依據上述(1)~(5)、(7)所得之效果,又,受壓臂機構之數量較少,相應地可將處置器10之構成設為簡單者。 - It can also be configured such that the pressure receiving piece 52a is engaged with one of the pressure receiving arm mechanisms, and even if it is configured as described above, the effects obtained by the above (1) to (5) and (7) can be obtained, and The number of the pressure-receiving arm mechanisms is small, and accordingly, the configuration of the handler 10 can be simplified.

●亦可為如下之構成:於作為第1按壓部之按壓缸53對電子零件T施加按壓力時,與該按壓力之施加同時地,以轉矩控制模式驅動構成第2按壓部之按壓馬達51M。即便為如上所述之構成,亦可獲得依據上述(1)~(4)、(6)、(7)所得之效果,而且亦可利用共通之控制信號使驅動按壓缸53之時序與以轉矩控制模式驅動按壓馬達51M之時序同步。因此,驅動按壓缸53之時序與以轉矩控制模式驅動按壓馬達51M之時序之匹配亦變得容易。 In the case where the pressing force is applied to the electronic component T by the pressing cylinder 53 as the first pressing portion, the pressing motor constituting the second pressing portion is driven in the torque control mode simultaneously with the application of the pressing force. 51M. Even in the configuration described above, the effects obtained by the above (1) to (4), (6), and (7) can be obtained, and the timing of driving the pressing cylinder 53 can be made by using a common control signal. The moment control mode drives the timing synchronization of the pressing motor 51M. Therefore, the matching between the timing of driving the pressing cylinder 53 and the timing of driving the pressing motor 51M in the torque control mode is also facilitated.

●亦可為於按壓缸53對電子零件T施加按壓力時,藉由位置控制驅動按壓馬達51M之態樣。即便為如上所述之構成,亦可獲得依據上 述(1)~(3)、(5)~(7)所得之效果,並且亦可省略用以計測按壓馬達51M之驅動電流之電流計測部I51M。 The state in which the pressing motor 51M is driven by the position control when the pressing force is applied to the electronic component T by the pressing cylinder 53 is also possible. Even if it is configured as described above, it can be obtained on the basis of The effects obtained by (1) to (3), (5) to (7) are described, and the current measuring unit I51M for measuring the driving current of the pressing motor 51M may be omitted.

●按壓缸並不限定於經由閥而供給特定壓力之壓縮空氣之構成,亦可為供給藉由電氣調節器而壓縮為特定壓力之空氣之構成。又,按壓缸並不限定於藉由壓縮空氣而給予作動壓之缸,亦可為藉由油壓而給予作動壓之缸。 The pressing cylinder is not limited to a configuration in which compressed air of a specific pressure is supplied through a valve, and may be configured to supply air compressed to a specific pressure by an electric regulator. Further, the pressing cylinder is not limited to a cylinder that is actuated by compressed air, and may be a cylinder that is actuated by hydraulic pressure.

●亦可為搬送單元34、38代替按壓缸53而包含與按壓馬達51M不同之按壓用之馬達之構成,即便為如上所述之構成,亦可獲得依據上述(1)、(2)、(6)、(7)所得之效果。 The transport unit 34 and 38 may be configured to include a motor for pressing that is different from the push motor 51M in place of the push cylinder 53. Even in the above configuration, the above (1), (2), 6), (7) The effect obtained.

●亦可為搬送單元34、38僅藉由按壓缸53按壓搬送對象之構成。即便為如上所述之構成,亦可獲得依據上述(1)、(2)、(6)、(7)所得之效果。 The configuration may be such that the transporting units 34 and 38 press the transport target only by the pressing cylinder 53. Even in the configuration as described above, the effects obtained by the above (1), (2), (6), and (7) can be obtained.

●亦可為搬送單元34、38不包含按壓缸53之構成,且僅藉由按壓馬達51M進行搬送對象之按壓之構成。即便為如上所述之構成,亦可獲得依據上述(1)、(2)、(6)、(7)所得之效果,而且亦可使搬送單元之構成簡單。 The configuration in which the transfer units 34 and 38 do not include the pressing cylinder 53 and the pressing of the transport target by the pressing motor 51M may be employed. Even in the configuration described above, the effects obtained by the above (1), (2), (6), and (7) can be obtained, and the configuration of the transport unit can be simplified.

●與受壓臂35b、36b卡合之被受壓片52a並不限定於垂直移動臂52之下端,亦可相較垂直移動臂52之下端而設置於水平移動臂51側。 The pressed piece 52a that is engaged with the pressure receiving arms 35b and 36b is not limited to the lower end of the vertical moving arm 52, and may be provided on the horizontal moving arm 51 side than the lower end of the vertical moving arm 52.

●亦可為對垂直移動臂與按壓缸設置被受壓片,並且受壓臂機構35、36與該等被受壓片之兩者卡合之構成。即便為如上所述之構成,亦可獲得依據上述(1)、(3)~(7)所得之效果,與被受壓片之數量多相應地,按壓馬達51M與按壓缸53之按壓力之反作用力更確實地由受壓臂機構35、36所受壓。 Further, the vertically movable arm and the pressing cylinder may be provided with a pressure receiving piece, and the pressure receiving arm mechanisms 35 and 36 are engaged with the pressure receiving pieces. Even in the configuration as described above, the effects obtained by the above (1), (3) to (7) can be obtained, and the pressing force of the pressing motor 51M and the pressing cylinder 53 can be made corresponding to the number of the pressed sheets. The reaction force is more reliably pressed by the pressure receiving arm mechanisms 35,36.

●亦可為按壓缸包含缸本體與連結於吸附部之柱塞,且於缸本體設置被受壓片之構成。即便為上述之構成,亦可獲得依據上述(1)、(3)~(7)所得之效果。 The pressing cylinder may include a cylinder body and a plunger connected to the adsorption portion, and the cylinder body may be provided with a pressure receiving piece. Even in the above configuration, the effects obtained by the above (1), (3) to (7) can be obtained.

●受壓臂35b、36b亦可為藉由臂缸35s、36s以外之機構例如由馬達驅動之機構等其他機構而驅動者。 The pressure receiving arms 35b and 36b may be driven by other mechanisms such as a mechanism driven by a motor other than the arm cylinders 35s and 36s.

●亦可為如下之構成:受壓臂35b、36b於其卡合位置固定於支撐體35a、36a,於受壓臂35b、36b與檢查用插座33之間,設置有被受壓片52a可沿Y方向移動之間隙。若為如上所述之構成,則於所固定之受壓臂35b、36b之下方,進行電子零件T相對於檢查用插座33之搬入及搬出,並且因按壓力之反作用力而退回之被受壓片52a與受壓臂35b、36b卡合。又,由於可省略受壓臂35b、36b之可動所需之機構,故而亦可簡化受壓臂35b、36b之構成。 The configuration may be such that the pressure receiving arms 35b and 36b are fixed to the support bodies 35a and 36a at the engagement positions thereof, and the pressure receiving pieces 52a are provided between the pressure receiving arms 35b and 36b and the inspection socket 33. The gap that moves in the Y direction. According to the configuration described above, the electronic component T is carried in and out of the inspection socket 33 below the fixed pressure receiving arms 35b and 36b, and is retracted by the reaction force of the pressing force. The piece 52a is engaged with the pressure receiving arms 35b and 36b. Further, since the mechanism required for the movable of the pressure receiving arms 35b and 36b can be omitted, the configuration of the pressure receiving arms 35b and 36b can be simplified.

●受壓臂35b、36b與被受壓片52a亦可為以如下之方式進行動作之構成。即,於位於卡合位置之受壓臂35b、36b與檢查用插座33之間隙中,被受壓片52a自Y方向移動。繼而,於被受壓片52a與受壓臂35b、36b卡合之後,受壓臂35b、36b變位至離開位置。而且,被受壓片52a沿Z方向移動。 The pressure receiving arms 35b and 36b and the pressure receiving piece 52a may be configured to operate as follows. In other words, the pressure receiving piece 52a moves from the Y direction in the gap between the pressure receiving arms 35b and 36b at the engagement position and the inspection socket 33. Then, after the pressed piece 52a is engaged with the pressure receiving arms 35b and 36b, the pressure receiving arms 35b and 36b are displaced to the separated position. Further, the pressed piece 52a moves in the Z direction.

根據上述動作,於利用第1搬送單元34進行電子零件T之按壓時,可省略使位於離開位置之受壓臂35b、36b向卡合位置移動之期間、即自上述時序T3直至時序T4為止之期間。再者,已變位至離開位置之受壓臂35b、36b於任意時序變位至卡合位置即可。 According to the above operation, when the electronic component T is pressed by the first transport unit 34, the period in which the pressure receiving arms 35b and 36b located at the separation position are moved to the engagement position, that is, from the timing T3 to the timing T4, can be omitted. period. Further, the pressure receiving arms 35b and 36b that have been displaced to the leaving position may be displaced to the engaging position at any timing.

●受壓臂35b、36b與被受壓片52a亦可為以如下之方式進行動作之構成。即,於位於離開位置之受壓臂35b、36b間,被受壓片52a自Z方向移動,繼而,受壓臂35b、36b移動至卡合位置。繼而,於被受壓片52a與受壓臂35b、36b卡合之後,被受壓片52a自受壓臂35b、36b與檢查用插座33之間隙沿Y方向移動,藉此解除與受壓臂35b、36b之卡合。 The pressure receiving arms 35b and 36b and the pressure receiving piece 52a may be configured to operate as follows. That is, between the pressure receiving arms 35b and 36b located at the separation position, the pressure receiving piece 52a moves from the Z direction, and then the pressure receiving arms 35b and 36b move to the engagement position. Then, after the pressure receiving piece 52a is engaged with the pressure receiving arms 35b and 36b, the pressure receiving piece 52a is moved in the Y direction from the gap between the pressure receiving arms 35b and 36b and the inspection socket 33, thereby releasing the pressure receiving arm. The engagement of 35b and 36b.

根據上述動作,於利用第1搬送單元34進行電子零件T之按壓時,可省略使已變位至卡合位置之受壓臂35b、36b向離開位置移動之期 間、即自上述時序T8直至時序T9為止之期間。再者,已變位至卡合位置之受壓臂35b、36b於被受壓片52a之解除後之任意時序變位至離開位置即可。 According to the above operation, when the electronic component T is pressed by the first transport unit 34, the period in which the pressure receiving arms 35b and 36b that have been displaced to the engagement position are moved to the separated position can be omitted. The period from the above timing T8 to the timing T9. Further, the pressure-receiving arms 35b and 36b that have been displaced to the engagement position may be displaced to the exit position at any timing after the release of the pressure receiving piece 52a.

●亦可為按壓部之一部分以與所固定之受壓部之卡合部卡合之方式可動之構成,又,亦可為按壓部之一部分以解除與卡合部之卡合之方式可動之構成。 ● It may be configured such that one of the pressing portions is configured to be engaged with the engaging portion of the fixed pressure receiving portion, or one of the pressing portions may be movable to release the engagement with the engaging portion. Composition.

●受壓部亦可作為藉由因與按壓部之接觸而產生之摩擦,而抑制按壓部向按壓方向之相反側移動之構成而實現。而且,受壓部與按壓部之接觸部位亦可為按壓部之下端。於此情形時,亦可為於按壓部設置有凹部,並且於受壓部設置有凸部之構成或於按壓部設置有凸部,並且於受壓部設置有凹部之構成。藉由於該等凹部與凸部之間產生之摩擦,可很大地抑制按壓部之移動。總之,受壓部為可阻止按壓部因按壓搬送對象時產生之反作用力而退回之構成即可。 The pressure receiving portion can be realized by suppressing the friction generated by the contact with the pressing portion and suppressing the movement of the pressing portion to the opposite side of the pressing direction. Further, the contact portion between the pressure receiving portion and the pressing portion may be the lower end of the pressing portion. In this case, a concave portion may be provided in the pressing portion, and a convex portion may be provided in the pressure receiving portion or a convex portion may be provided in the pressing portion, and a concave portion may be provided in the pressure receiving portion. The movement of the pressing portion can be greatly suppressed by the friction generated between the concave portion and the convex portion. In short, the pressure receiving portion may be configured to prevent the pressing portion from being retracted by the reaction force generated when the object to be conveyed is pressed.

●設為按壓缸53之按壓力大於按壓馬達51M之按壓力之構成,但亦可為按壓馬達51M之按壓力大於按壓缸53之按壓力之構成,或按壓馬達51M之按壓力與按壓缸53之按壓力相等之構成。 The pressing force of the pressing cylinder 53 is larger than the pressing force of the pressing motor 51M, but the pressing force of the pressing motor 51M may be larger than the pressing force of the pressing cylinder 53, or the pressing force of the pressing motor 51M and the pressing cylinder 53 may be employed. The composition of the pressing force is equal.

●使得處置器10包含受到第1搬送單元34將電子零件T嵌入檢查用插座33時之反作用力之受壓臂機構35、36。並不限定於此,亦可使得處置器10包含受到第1搬送單元34利用供給用梭盤32a、回收用梭盤37b或輸送機托盤C1a、C2a、C3a、C4a等按壓電子零件T時之反作用力之受壓臂機構。 The treatment device 10 includes the pressure receiving arm mechanisms 35 and 36 that are subjected to the reaction force when the first transfer unit 34 inserts the electronic component T into the inspection socket 33. The present invention is not limited thereto, and the reaction device 10 may include a reaction when the first transport unit 34 presses the electronic component T by the supply shuttle 32a, the recovery shuttle 37b, or the conveyor trays C1a, C2a, C3a, C4a, and the like. Forced arm mechanism.

●亦可為按壓馬達51M之按壓力大於按壓缸53之按壓力之構成或按壓馬達51M之按壓力與按壓缸53之按壓力相等之構成。 The pressing force of the pressing motor 51M may be larger than the pressing force of the pressing cylinder 53 or the pressing force of the pressing motor 51M may be equal to the pressing force of the pressing cylinder 53.

●使得供給側可動導件22相對於所固定之供給側固定導件21相對移動,並且回收側可動導件42相對於所固定之回收側固定導件41相對移動,但亦可為設置有2個可相對於所固定之單一之固定導件相對移 動之可動導件之構成。於此情形時,固定導件較佳為於上述蓋構件12內,與基台11之上表面中之沿X方向延伸之一邊平行,且遍及基台11之X方向之大致整個範圍而形成。又,2個可動導件較佳為於蓋構件12內且隔著上述搬送導件31而設置於相反側。 ● the supply side movable guide 22 is relatively moved with respect to the fixed supply side fixed guide 21, and the recovery side movable guide 42 is relatively moved with respect to the fixed recovery side fixed guide 41, but may be provided with 2 Relatively movable relative to a fixed single fixed guide The composition of the movable guide. In this case, the fixed guide member is preferably formed in the cover member 12 so as to be parallel to one side of the upper surface of the base 11 extending in the X direction and formed over substantially the entire X direction of the base 11. Further, the two movable guides are preferably provided on the opposite side of the cover member 12 via the conveyance guide 31.

●處置器10包含之搬送單元之台數並不限定於2台,亦可為1台或3台。 The number of the transport units included in the handler 10 is not limited to two, and may be one or three.

●亦可為如下之態樣:收容於供給用梭盤32a之電子零件T由第1搬送單元34搬送至檢查用插座33為止,且收容於檢查用插座33之電子零件T由第2搬送單元38按壓。總之,為對搬送對象進行搬送,且按壓該搬送對象之態樣即可。 The electronic component T accommodated in the supply tray 32a is transported to the inspection socket 33 by the first transport unit 34, and the electronic component T accommodated in the inspection socket 33 is provided by the second transport unit. 38 pressed. In short, it is sufficient to transport the object to be transported and press the object to be transported.

●處置器並不限定於檢查搬送對象之零件檢查裝置,為用於進行搬送對象之搬送與按壓之裝置者即可。 The processor is not limited to the component inspection device for inspecting the transfer target, and may be a device for transporting and pressing the transport target.

11‧‧‧基台 11‧‧‧Abutment

11a‧‧‧搭載面 11a‧‧‧Jacketing surface

31‧‧‧搬送導件 31‧‧‧Transport guides

33‧‧‧檢查用插座 33‧‧‧Check socket

33a‧‧‧檢查用凹穴 33a‧‧‧Checking pockets

34‧‧‧第1搬送單元 34‧‧‧1st transport unit

35‧‧‧受壓臂機構 35‧‧‧pressure arm mechanism

35a‧‧‧支撐體 35a‧‧‧Support

35b‧‧‧受壓臂 35b‧‧‧pressure arm

36‧‧‧受壓臂機構 36‧‧‧pressure arm mechanism

36a‧‧‧支撐體 36a‧‧‧Support

36b‧‧‧受壓臂 36b‧‧‧pressure arm

51‧‧‧水平移動臂 51‧‧‧ horizontal moving arm

51M‧‧‧按壓馬達 51M‧‧‧ Pressing motor

52‧‧‧垂直移動臂 52‧‧‧Vertical moving arm

52a‧‧‧被受壓片 52a‧‧‧Subjected tablets

53‧‧‧按壓缸 53‧‧‧Pressing cylinder

54‧‧‧吸附部 54‧‧‧Adsorption Department

T‧‧‧電子零件 T‧‧‧Electronic parts

X‧‧‧方向 X‧‧‧ direction

Y‧‧‧方向 Y‧‧‧ direction

Z‧‧‧方向 Z‧‧‧ direction

Claims (9)

一種處置器,其特徵在於包含:基台;搬送部,其對搬送對象進行搬送;及受壓部,其由上述基台所具備;且於上述搬送部設有將上述搬送對象朝向上述基台按壓之按壓部;上述受壓部係藉由與上述按壓部之接觸,抑制上述按壓部朝按壓方向之相反側移動。 A processor comprising: a base; a conveying unit that conveys a conveying target; and a pressure receiving unit that is provided by the base; and the conveying unit that presses the conveying target toward the base The pressing portion is configured to prevent the pressing portion from moving toward the opposite side of the pressing direction by contact with the pressing portion. 如請求項1之處置器,其中上述按壓部包含:第1按壓部,其將上述搬送對象朝向上述基台按壓;及第2按壓部,其將上述第1按壓部朝向上述基台按壓;且上述受壓部之與上述按壓部接觸之部分係可朝與設置於上述第2按壓部之突出部接觸之方向移動。 The treatment unit of claim 1, wherein the pressing portion includes: a first pressing portion that presses the transfer target toward the base; and a second pressing portion that presses the first pressing portion toward the base; The portion of the pressure receiving portion that is in contact with the pressing portion is movable in a direction in contact with the protruding portion provided in the second pressing portion. 如請求項2之處置器,其中:上述受壓部之與上述按壓部接觸之部分係可朝離開設置於上述第2按壓部之突出部之方向移動。 The processor according to claim 2, wherein the portion of the pressure receiving portion that is in contact with the pressing portion is movable away from a protruding portion provided in the second pressing portion. 如請求項3之處置器,其中上述第1按壓部為按壓缸;上述第2按壓部包含使上述按壓缸上升及下降之馬達;上述第1按壓部之按壓力大於上述第2按壓部之按壓力。 The processor according to claim 3, wherein the first pressing portion is a pressing cylinder, the second pressing portion includes a motor that raises and lowers the pressing cylinder, and a pressing force of the first pressing portion is larger than a pressing of the second pressing portion pressure. 如請求項4之處置器,其中包含控制上述馬達之驅動之馬達控制部;上述馬達控制部於上述按壓缸按壓上述搬送對象之狀態下,藉由轉矩控制而驅動上述馬達。 The processor of claim 4 includes a motor control unit that controls driving of the motor, and the motor control unit drives the motor by torque control in a state where the pressing cylinder presses the transfer target. 如請求項4或5之處置器,其中包含控制上述馬達之驅動之馬達控 制部;上述馬達控制部於上述按壓缸按壓上述搬送對象之前,藉由轉矩控制而驅動上述馬達。 The processor of claim 4 or 5, comprising a motor control for controlling the driving of the motor The motor control unit drives the motor by torque control before the pressing cylinder presses the transfer target. 如請求項2至5中任一項之處置器,其中與上述按壓部接觸之部分為相互對向之一對可動臂;上述一對可動臂係變位至與上述突出部接觸之位置、及自上述突出部離開之位置。 The processor according to any one of claims 2 to 5, wherein the portion in contact with the pressing portion is a pair of movable arms facing each other; the pair of movable arms are displaced to a position in contact with the protruding portion, and From the position where the above-mentioned protrusions are separated. 如請求項1至5中任一項之處置器,其中上述搬送部具有吸附複數個上述搬送對象之狀態;上述按壓部具有按壓複數個上述搬送對象之狀態。 The processor according to any one of claims 1 to 5, wherein the conveying unit has a state in which a plurality of the objects to be conveyed are adsorbed, and the pressing unit has a state in which a plurality of the objects to be conveyed are pressed. 一種零件檢查裝置,其特徵在於包含:基台;搬送部,其搬送電子零件;受壓部,其由上述基台所具備;及檢查用插座,其設置於上述基台;且於上述搬送部設置將上述電子零件朝向上述基台之上述檢查用插座按壓之按壓部;上述受壓部係藉由與上述按壓部之接觸,抑制上述按壓部向按壓方向之相反側移動。 A component inspection device comprising: a base; a conveying unit that conveys an electronic component; a pressure receiving portion provided by the base; and an inspection socket provided on the base; and the conveying unit is provided in the conveying unit The pressing portion that presses the electronic component toward the inspection socket of the base; and the pressure receiving portion prevents the pressing portion from moving to the opposite side of the pressing direction by contact with the pressing portion.
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