TWI589856B - Testing device and testing method - Google Patents

Description

Test device and test method

The invention relates to a testing device and a testing method, in particular to a testing device with a probe and a testing method.

In recent years, with the advancement of technology, the process of LED wafers has been continuously improved. At the same time, in order to effectively improve the quality control rate of wafer products, the industry often transmits the current accurately to the crystal by the spot measuring device in the latter stage process. The LED die on the circle, and by detecting the characteristics of the light emitted by the LED die on the wafer, to judge the merits of each die on the wafer.

At present, the conventional wafer inspection method is to drive the carrying device with the LED wafer to move to the spot measuring device via the driving mechanism at the bottom, and when the top surface of the LED wafer is pressed against the probe of the measuring device, the probe can The LED die of the LED wafer contacts and causes the LED die to illuminate. In this way, the manufacturer can determine the quality of each die on the LED wafer by detecting the characteristics of the light emitted by the LED dies on the LED wafer.

However, since the weight of the carrier device is heavy and the moving speed is slow, the efficiency of the above wafer detecting method is difficult to increase. In addition, the probes of the conventional spot measuring device are fixed, that is, the distance between the probes is constant, but the probes are not necessarily fixed because the distances of the positions to be tested on the wafer are not fixed. Accurately falling on the detected position, resulting in some probes unintentionally contacting the non-detection area of the wafer reduces the detection efficiency.

The probe should originally be in contact with the detection area of the wafer, but the fixed probe is not intended to be offset to the non-detection area of the wafer, which increases the probability of scratching the surface of the wafer and thus reduces Wafer inspection quality. Therefore, how to improve the detection efficiency and quality of wafer inspection is one of the problems that developers should solve.

The invention provides a testing device and a testing method for improving the detection efficiency and the detection quality of the wafer inspection.

The test device disclosed in one embodiment of the present invention is suitable for testing a test object. The test device includes a loading platform, a test module and a driving module. The stage is adapted to carry the object to be tested. The test module includes at least one first probe and at least one second probe. The first probe and the second probe are movably located above the stage. The drive module is connected to the test module. The driving module is configured to drive the first probe and the second probe to move and swing relative to the stage to test the object to be tested. The first probe tests the first position to be tested of the object to be tested, and the driving module drives the second probe to move to a second position to be tested of the object to be tested. Wherein, at a second time later than the first time, the second probe tests the second position to be tested of the object to be tested, and the driving module drives the first probe to move from the first position to be tested to the object to be tested. A third position to be tested.

A test method for testing a test object according to another embodiment of the present invention includes. In a first time, a first probe is contacted with a first position to be tested of the test object, and a second probe is moved to a second position to be tested of the object to be tested. The second probe is contacted to test the second position to be tested at a second time later than the first time, and moves the first probe from the first position to be tested to a third position to be tested of the object to be tested.

According to the test apparatus and the test method of the above embodiment, since the two probes move relative to the stage, when the detection is performed, only the probe or the probe can be moved together with the stage to increase the detection efficiency of the test apparatus.

Furthermore, the probe is movable, and the distance between the two probes can be adjusted according to the position to be tested of the object to be tested, so as to avoid the idle condition of the probe, and to prevent the idle probe from being contacted when not detecting. Measuring object. In this way, in addition to improving the detection efficiency of the test device, the probability of the probe scratching the test object can be reduced.

The above description of the present invention and the following description of the embodiments are intended to illustrate and explain the principles of the invention, and to provide a further explanation of the scope of the invention.

Please refer to Figure 1 to Figure 2. 1 is a side elevational view of a test object placed in a test apparatus according to a first embodiment of the present invention. Figure 2 is a top plan view of Figure 1.

The testing device 10 of the embodiment is adapted to test a sample to be tested 20. The object to be tested 20 is, for example, a wafer having a plurality of light emitting diode dies. The object to be tested 20 has a plurality of positions to be tested, and each of the objects to be tested 20 has a light-emitting diode die to be detected.

The test device 10 includes a stage 100, a test module 200, a drive module 300, and an optical detection module 400. The stage 100 is adapted to carry the object to be tested 20. Furthermore, the stage 100 of the present embodiment is movable, and the stage 100 can be translated, for example, in two axial directions (e.g., X-axis and Y-axis) that are parallel to the ground and orthogonal to each other.

The test module 200 includes a first probe 210 and a second probe 220. The first probe 210 and the second probe 220 are movably located above the stage 100. In detail, the first probe 210 is movable on one side of the stage 100 in an axial direction (such as an X-axis direction), and the second probe 210 is movable in an axial direction (such as an X-axis direction). The opposite side of the stage 100. In addition, the first probes 210 can swing together relative to the stage 100 to be relatively close to or away from the stage 100. Similarly, the second probe 220 can also swing relative to the stage 100 to be relatively close to or away from the stage 100. In addition, the first probe 210 has, for example, two pins 211, which respectively supply positive and negative power sources to the same light emitting diode die to excite the light emitting diode crystal light. Similarly, the second probe 220 has, for example, two pins 221.

The driving module 300 includes two first driving elements 310a and 310b and a second driving element 320. The second first driving elements 310a, 310b and the second driving element 320 are, for example, motor driving components or oil and pneumatic driving components. The first driving component 310a is connected to the first probe 210 of the test module 200 to drive the first probe 210 to move and swing relative to the stage 100. The first driving component 310b is coupled to the second probe 220 of the test module 200 to drive the first probe 220 to move and swing relative to the stage 100. The second drive element 320 is coupled to the stage 100 to drive the stage 100 to move relative to the ground.

The optical detecting module 400 is, for example, an integrating sphere or a mono-crystalline silicon solar cell. The optical detection module 400 has a detection range 410.

Next, the test apparatus 10 described above is used to test the test method of the object to be tested 20. Please refer to FIG. 3A to FIG. 3F. 3A to 3F are test procedures for testing a test object by a test device. 3A to 3F are partial enlarged views of FIG. 2 in order to clearly present the screen of the test flow.

First, as shown in FIG. 3A, in a first time, the first driving component 310a of the driving module 300 drives the two pins 211 of the first probe 210 to be located at the first to-be-tested position A1 of the object to be tested 20, and The two pins 211 of one probe 210 detect the light emitting diode dies at the first position A1 to be tested of the object to be tested 20. The light-emitting diode die located at the first position A1 to be tested is energized by the two-pin 211 to emit light (not shown), and the light (not shown) passes through the detection range 410 of the optical detection module 400. The quality of the light-emitting diode crystal grains is detected by the optical detecting module 400.

In addition, when the first probe 210 is detected, the first driving component 310b will drive the two pins 211 of the second probe 220 and the object to be tested 20 to be separated, and move to the direction to be tested in the direction indicated by the arrow a1. A second position A2 to be measured 20 is used to increase the detection efficiency of the test device 10. It should be noted that, in this embodiment, the first probe 210 is moved along with the stage 100 in the direction indicated by the arrow b1 to ensure that the light energy excited by the power is projected on the optical detection module 400. Within the detection range 410.

Next, as shown in FIG. 3B, at a second time later than the first time, the two pins 221 of the second probe 220 test the light emitting diode crystal grains of the object to be tested 20 at the second position A2 to be tested. .

In addition, when the second probe 220 is detected, the first driving component 310a will drive the two pins 211 of the first probe 210 to separate from the object to be tested 20, and move to the direction to be tested in the direction indicated by the arrow a2. A third position A3 to be measured 20 of the object 20. It should be noted that, in this embodiment, the second probe 220 is moved along with the stage 100 in the direction indicated by the arrow b2 to ensure that the light energy excited by the power is projected on the optical detection module 400. Within the detection range 410.

In addition, the moving distance D2 of the third to-be-measured position A3 to the second to-be-measured position A2 is about the width of one light-emitting diode die, and the moving distance D1 of the first to-be-measured position A1 to the third to-be-tested position A3 It is twice the moving distance D2 of the third to-be-measured position A3 to the second to-be-tested position A2. That is to say, the moving distance of each probe is the width of two light-emitting diode crystal grains.

Next, as shown in FIG. 3C, at a third time later than the second time, the two pins 211 of the first probe 210 will illuminate the LED dies at the third position A3 to be tested 20 Test.

In addition, when the first probe 210 is detected, the first driving component 310b will drive the two pins 221 of the second probe 220 and the object 20 to be separated, and move to the direction to be tested in the direction indicated by the arrow a3. A first waiting position B1 of the object 20, the first waiting position B1 has no LED die to be detected, and the first waiting position B1 is adjacent to the next position to be tested to facilitate the next detection. It should be noted that, in this embodiment, the first probe 210 is moved along with the stage 100 in the direction indicated by the arrow b3 to ensure that the light energy excited by the power is projected on the optical detection module 400. Within the detection range 410.

Then, as shown in FIG. 3D, at a fourth time later than the third time, the first driving component 310a will drive the two pins 211 of the first probe 210 and the object to be tested 20 to be separated, and along the arrow a4. The indicated direction is moved to a second waiting position B2 of the object to be tested 20, and the second waiting position B2 is adjacent to the next position to be tested to facilitate the next detection.

Next, as shown in FIG. 3E, at a fifth time later than the fourth time, the second driving component 320 will collectively drive the stage 100 to move in the direction indicated by the arrow c, so that the first probe 210 and the second probe 210 The probes 220 are moved from the first waiting position B1 and the second waiting position B2 to the fourth to-be-tested position A4 and the fifth to-be-tested position A5, respectively.

Next, as shown in FIG. 3F, at a sixth time later than the fifth time, the two pins 221 of the second probe 220 test the light emitting diode crystal grains of the object to be tested 20 at the fifth position A5 to be tested. .

In addition, when the second probe 220 is detected, the first driving component 310a will drive the two pins 211 of the first probe 210 and the object to be tested 20 to be separated, and move to the direction to be tested in the direction indicated by the arrow b5. A sixth position A6 to be measured 20 of the object 20. It should be noted that, in this embodiment, the second probe 220 is moved along with the stage 100 in the direction indicated by the arrow a5 to ensure that the light energy excited after the power is applied to the optical detection module 400. Within the detection range 410.

The third position A3 to be tested is between the first position A1 to be measured and the second position A2 to be measured, but the order of the position to be tested is not limited thereto. In other embodiments, the second position to be tested is A2 may also be between the third position to be tested A3 and the first position to be tested A1. Please refer to FIG. 4A and FIG. 4B. 4A to 4B are another test flow of the test device for testing the test object.

As shown in FIG. 4A, in a first time, the first driving component 310a of the driving module 300 drives the two pins 211 of the first probe 210 to be at the first position A1 to be tested 20, and makes the first probe The two pins 211 of the needle 210 detect the light emitting diode dies at the first position A1 to be tested of the object to be tested 20.

In addition, when the first probe 210 is detected, the first driving component 310b will drive the two pins 221 of the second probe 220 and the object to be tested 20 to be separated, and move to the direction to be tested in the direction indicated by the arrow a6. A second position A2 to be measured 20 of the object 20. It should be noted that, in this embodiment, the first probe 210 is moved along with the stage 100 in the direction indicated by the arrow b6 to ensure that the light energy excited by the power is projected on the optical detection module 400. Within the detection range 410.

Next, as shown in FIG. 4B, at a second time later than the first time, the two pins 221 of the second probe 220 test the light emitting diode crystal grains of the object to be tested 20 at the second position A2 to be tested. .

In addition, when the second probe 220 is detected, the first driving component 310a drives the two pins 211 of the first probe 210 and the object to be tested 20 to be separated, and moves to the direction to be tested in the direction indicated by the arrow a7. A third position A3 to be measured 20 of the object 20. It should be noted that, in this embodiment, the second probe 220 is moved along with the stage 100 in the direction indicated by the arrow b7 to ensure that the light energy excited by the power is projected on the optical detection module 400. Within the detection range 410.

The first probe 210 and the second probe 220 described above detect the same row of positions to be tested, but can also detect different rows to be tested. Please refer to FIG. 5A to FIG. 5C. 5A to 5C are another test flow of the test device for testing the test object.

As shown in FIG. 5A, the first probe 210 and the second probe 220 are respectively located at the first to-be-tested position E1 and the second to-be-tested position F1. In addition, the two pins 211 of the first probe 210 detect the LED dies located at the first to-be-tested position E1 of the object to be tested 20.

Next, as shown in FIG. 5B, at a first time, the two pins 221 of the second probe 220 test the light emitting diode dies at the second position F1 to be tested.

In addition, when the second probe 220 is detected, the first driving component 310a will drive the two pins 211 of the first probe 210 and the object to be tested 20 to be separated, and move to the direction to be tested in the direction indicated by the arrow e1. A third position to be measured E2 of the object 20. It should be noted that, in this embodiment, the second probe 220 is moved along with the stage 100 in the direction indicated by the arrow f1 to ensure that the light energy excited by the power is projected on the optical detection module 400. Within the detection range 410.

Next, as shown in FIG. 5C, at a second time later than the first time, the two pins 211 of the first probe 210 perform the illuminating diode dies on the third to-be-measured position E2 of the object to be tested 20. Detection.

In addition, when the first probe 210 is detected, the first driving component 310b will drive the two pins 221 of the second probe 220 and the object to be tested 20 to be separated, and move to the direction to be tested in the direction indicated by the arrow e2. A fourth position to be measured F2 of the object 20. It should be noted that, in this embodiment, the first probe 210 is moved along with the stage 100 in the direction indicated by the arrow f2 to ensure that the light energy excited by the power is projected on the optical detection module 400. Within the detection range 410.

According to the test apparatus and the test method of the above embodiment, since the two probes move relative to the stage, when the detection is performed, only the probe or the probe can be moved together with the stage to increase the detection efficiency of the test apparatus.

Furthermore, the probe is movable, and the distance between the two probes can be adjusted according to the position to be tested of the object to be tested, so as to avoid the idle condition of the probe, and to prevent the idle probe from being contacted when not detecting. Measuring object. In this way, in addition to improving the detection efficiency of the test device, the probability of the probe scratching the test object can be reduced.

While the present invention has been described above in terms of the preferred embodiments thereof, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The patent protection scope of the invention is subject to the definition of the scope of the patent application attached to the specification.

10‧‧‧Testing device
20‧‧‧Test object
100‧‧‧stage
200‧‧‧Test Module
210‧‧‧First probe
211‧‧‧ stitches
220‧‧‧Second probe
221‧‧‧ stitches
300‧‧‧Drive Module
310a, 310b‧‧‧ first drive element
320‧‧‧Second drive element
400‧‧‧Optical Inspection Module
410‧‧‧Detection range
A1~a7, b1~b3, b5~b7, c, e1, e2, f1, f2‧‧‧ direction
A1~A6, E1, E2, F1, F2‧‧‧ position to be tested
B1, B2‧‧‧ waiting position
D1, D2‧‧‧ distance

1 is a side elevational view of a test object placed in a test apparatus according to a first embodiment of the present invention. Figure 2 is a top plan view of Figure 1. 3A to 3F are test procedures for testing a test object by a test device. 4A to 4B are another test flow of the test device for testing the test object. 5A to 5C are another test flow of the test device for testing the test object.

10‧‧‧Testing device

20‧‧‧Test object

100‧‧‧stage

210‧‧‧First probe

211‧‧‧ stitches

220‧‧‧Second probe

221‧‧‧ stitches

300‧‧‧Drive Module

310a, 310b‧‧‧ first drive element

320‧‧‧Second drive element

400‧‧‧Optical Inspection Module

410‧‧‧Detection range

Claims (10)

A test device is adapted to test a test object, the test device comprising: a carrier adapted to carry the object to be tested; a test module comprising at least a first probe and at least a second probe The first probe and the second probe are movably disposed above the stage; and a driving module is coupled to the test module, the driving module is configured to drive the first probe and the second Testing the object to be tested by moving and swinging the probe relative to the stage; wherein, at a first time, the first probe tests the first position to be tested of the object to be tested, and the driving module drives the object The second probe is moved to a second position to be tested of the object to be tested; wherein, at a second time later than the first time, the second probe tests the second position to be tested of the object to be tested, And the driving module drives the first probe to move from the first position to be tested to a third position to be tested of the object to be tested. The test device of claim 1, wherein the second probe is separated from the object to be tested during the first time; and the first probe and the test are to be tested during the second time The phases are separated. The test device of claim 1, wherein the stage is coupled to the drive module, and the drive module is configured to move the stage relative to the test module. The test device of claim 3, wherein the first probe and the second probe are separated from the object to be tested in a third time, and the driving module drives the stage The first probe and the second probe are respectively located at a fourth to-be-tested position and a fifth to-be-tested position of the object to be tested. The test device of claim 3, further comprising an optical detecting module disposed above the stage, wherein the first position to be tested is located in the optical detecting module during the first time Within the detection range, the driving module moves the stage and the first probe in a direction opposite to a moving direction of the second probe. The test device of claim 1, wherein the moving distance from the first to-be-measured position to the third to-be-measured position is twice the moving distance from the third to-be-measured position to the second to-be-measured position. . The test device of claim 1, wherein the first probe and the second probe are respectively disposed on opposite sides of the stage. A test method for testing a test object, comprising: contacting a first probe to test a first test position of the test object in a first time, and moving a second probe to the test object to be tested a second position to be measured; and a second time later than the first time, contacting the second probe to test the second position to be tested, and moving the first probe from the first The position to be tested is to a third position to be tested of the object to be tested. The test method of claim 8, wherein: after the second probe is separated from the object to be tested, the second probe is moved to the second position to be tested. And after the first probe is separated from the object to be tested in the second time, the first probe is moved to the third position to be tested. The test method of claim 8, further comprising: moving the stage and the first probe in a direction opposite to a moving direction of the second probe during the first time; Two times, the stage and the second probe are moved in the opposite direction of the moving direction of the first probe.