TWI589394B - 化學機械研磨基板的方法及研磨系統 - Google Patents

化學機械研磨基板的方法及研磨系統 Download PDF

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Publication number
TWI589394B
TWI589394B TW102138706A TW102138706A TWI589394B TW I589394 B TWI589394 B TW I589394B TW 102138706 A TW102138706 A TW 102138706A TW 102138706 A TW102138706 A TW 102138706A TW I589394 B TWI589394 B TW I589394B
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TW
Taiwan
Prior art keywords
angle
substrate
signal
monitoring system
grinding
Prior art date
Application number
TW102138706A
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English (en)
Chinese (zh)
Other versions
TW201422369A (zh
Inventor
許昆
沈世豪
劉子宇
卡爾森伊格馬
依拉維尼寒森Ｇ
史威克柏格斯勞Ａ
涂文強
班尼特杜里Ｅ
Original Assignee
應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 應用材料股份有限公司 filed Critical 應用材料股份有限公司
Publication of TW201422369A publication Critical patent/TW201422369A/zh
Application granted granted Critical
Publication of TWI589394B publication Critical patent/TWI589394B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/048—Lapping machines or devices; Accessories designed for working plane surfaces of sliders and magnetic heads of hard disc drives or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW102138706A 2012-11-08 2013-10-25 化學機械研磨基板的方法及研磨系統 TWI589394B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261724218P 2012-11-08 2012-11-08
US13/791,694 US9205527B2 (en) 2012-11-08 2013-03-08 In-situ monitoring system with monitoring of elongated region

Publications (2)

Publication Number Publication Date
TW201422369A TW201422369A (zh) 2014-06-16
TWI589394B true TWI589394B (zh) 2017-07-01

Family

ID=50622777

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102138706A TWI589394B (zh) 2012-11-08 2013-10-25 化學機械研磨基板的方法及研磨系統

Country Status (4)

Country Link
US (1) US9205527B2 (https=)
JP (1) JP6297301B2 (https=)
KR (1) KR102147784B1 (https=)
TW (1) TWI589394B (https=)

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JP6399873B2 (ja) * 2014-09-17 2018-10-03 株式会社荏原製作所 膜厚信号処理装置、研磨装置、膜厚信号処理方法、及び、研磨方法
KR102412776B1 (ko) * 2015-10-27 2022-06-24 주식회사 케이씨텍 웨이퍼 가장자리에서의 연마층 두께 검출 정확성이 향상된 화학 기계적 연마 장치
JP6779633B2 (ja) * 2016-02-23 2020-11-04 株式会社荏原製作所 研磨装置
JP6795337B2 (ja) * 2016-06-29 2020-12-02 株式会社荏原製作所 膜厚信号処理装置、研磨装置、膜厚信号処理方法、及び、研磨方法
WO2018045039A1 (en) * 2016-08-31 2018-03-08 Applied Materials, Inc. Polishing system with annular platen or polishing pad
TW201822953A (zh) 2016-09-16 2018-07-01 美商應用材料股份有限公司 基於溝槽深度的電磁感應監控進行的過拋光
US10427272B2 (en) 2016-09-21 2019-10-01 Applied Materials, Inc. Endpoint detection with compensation for filtering
KR102547156B1 (ko) * 2016-10-21 2023-06-26 어플라이드 머티어리얼스, 인코포레이티드 인-시튜 전자기 유도 모니터링 시스템을 위한 코어 구성
TWI816620B (zh) * 2017-04-21 2023-09-21 美商應用材料股份有限公司 使用神經網路來監測的拋光裝置
US10898986B2 (en) * 2017-09-15 2021-01-26 Applied Materials, Inc. Chattering correction for accurate sensor position determination on wafer
TWI825075B (zh) 2018-04-03 2023-12-11 美商應用材料股份有限公司 針對墊子厚度使用機器學習及補償的拋光裝置、拋光系統、方法及電腦儲存媒體
CN108789157A (zh) * 2018-06-13 2018-11-13 苏州市蓄动源自动化科技有限公司 自动化打磨装置
CN118943037A (zh) 2018-09-26 2024-11-12 应用材料公司 针对原位电磁感应监测的边缘重建中的基板掺杂的补偿
JP7447284B2 (ja) 2020-06-24 2024-03-11 アプライド マテリアルズ インコーポレイテッド 研磨パッドの摩耗補償による基板層の厚さの決定
JP7629295B2 (ja) * 2020-11-25 2025-02-13 株式会社荏原製作所 渦電流センサ
CN116652813A (zh) * 2022-02-17 2023-08-29 中国科学院微电子研究所 一种化学机械平坦化设备、终点检测方法、装置及系统
WO2023234974A1 (en) * 2022-06-03 2023-12-07 Applied Materials, Inc. Determining substrate orientation with acoustic signals
US20240308019A1 (en) * 2023-03-17 2024-09-19 Applied Materials, Inc. Method for detection of wafer slippage
CN117885031A (zh) * 2024-01-17 2024-04-16 华虹半导体(无锡)有限公司 监控化学机械平坦化研磨端点检测异常的装置及方法

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Also Published As

Publication number Publication date
JP2014096585A (ja) 2014-05-22
KR102147784B1 (ko) 2020-08-25
KR20140059741A (ko) 2014-05-16
US9205527B2 (en) 2015-12-08
JP6297301B2 (ja) 2018-03-20
US20140127971A1 (en) 2014-05-08
TW201422369A (zh) 2014-06-16

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