KR102147784B1 - 가늘고 긴 영역을 모니터링하는 인-시튜 모니터링 시스템 - Google Patents

가늘고 긴 영역을 모니터링하는 인-시튜 모니터링 시스템 Download PDF

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KR102147784B1
KR102147784B1 KR1020130134924A KR20130134924A KR102147784B1 KR 102147784 B1 KR102147784 B1 KR 102147784B1 KR 1020130134924 A KR1020130134924 A KR 1020130134924A KR 20130134924 A KR20130134924 A KR 20130134924A KR 102147784 B1 KR102147784 B1 KR 102147784B1
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South Korea
Prior art keywords
polishing
substrate
angle
monitoring system
signal
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KR1020130134924A
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Korean (ko)
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KR20140059741A (ko
Inventor
쿤 슈
시흐-하우르 셴
츠-유 리우
잉에마르 칼슨
하산 지. 이라바니
보그슬로우 에이. 스웨덱
웬-치앙 투
도일 이. 베넷
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어플라이드 머티어리얼스, 인코포레이티드
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/048—Lapping machines or devices; Accessories designed for working plane surfaces of sliders and magnetic heads of hard disc drives or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020130134924A 2012-11-08 2013-11-07 가늘고 긴 영역을 모니터링하는 인-시튜 모니터링 시스템 Active KR102147784B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201261724218P 2012-11-08 2012-11-08
US61/724,218 2012-11-08
US13/791,694 2013-03-08
US13/791,694 US9205527B2 (en) 2012-11-08 2013-03-08 In-situ monitoring system with monitoring of elongated region

Publications (2)

Publication Number Publication Date
KR20140059741A KR20140059741A (ko) 2014-05-16
KR102147784B1 true KR102147784B1 (ko) 2020-08-25

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Application Number Title Priority Date Filing Date
KR1020130134924A Active KR102147784B1 (ko) 2012-11-08 2013-11-07 가늘고 긴 영역을 모니터링하는 인-시튜 모니터링 시스템

Country Status (4)

Country Link
US (1) US9205527B2 (https=)
JP (1) JP6297301B2 (https=)
KR (1) KR102147784B1 (https=)
TW (1) TWI589394B (https=)

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US9754846B2 (en) * 2014-06-23 2017-09-05 Applied Materials, Inc. Inductive monitoring of conductive trench depth
JP6399873B2 (ja) * 2014-09-17 2018-10-03 株式会社荏原製作所 膜厚信号処理装置、研磨装置、膜厚信号処理方法、及び、研磨方法
KR102412776B1 (ko) * 2015-10-27 2022-06-24 주식회사 케이씨텍 웨이퍼 가장자리에서의 연마층 두께 검출 정확성이 향상된 화학 기계적 연마 장치
JP6779633B2 (ja) * 2016-02-23 2020-11-04 株式会社荏原製作所 研磨装置
JP6795337B2 (ja) * 2016-06-29 2020-12-02 株式会社荏原製作所 膜厚信号処理装置、研磨装置、膜厚信号処理方法、及び、研磨方法
WO2018045039A1 (en) * 2016-08-31 2018-03-08 Applied Materials, Inc. Polishing system with annular platen or polishing pad
TW201822953A (zh) 2016-09-16 2018-07-01 美商應用材料股份有限公司 基於溝槽深度的電磁感應監控進行的過拋光
US10427272B2 (en) 2016-09-21 2019-10-01 Applied Materials, Inc. Endpoint detection with compensation for filtering
KR102547156B1 (ko) * 2016-10-21 2023-06-26 어플라이드 머티어리얼스, 인코포레이티드 인-시튜 전자기 유도 모니터링 시스템을 위한 코어 구성
TWI816620B (zh) * 2017-04-21 2023-09-21 美商應用材料股份有限公司 使用神經網路來監測的拋光裝置
US10898986B2 (en) * 2017-09-15 2021-01-26 Applied Materials, Inc. Chattering correction for accurate sensor position determination on wafer
TWI825075B (zh) 2018-04-03 2023-12-11 美商應用材料股份有限公司 針對墊子厚度使用機器學習及補償的拋光裝置、拋光系統、方法及電腦儲存媒體
CN108789157A (zh) * 2018-06-13 2018-11-13 苏州市蓄动源自动化科技有限公司 自动化打磨装置
CN118943037A (zh) 2018-09-26 2024-11-12 应用材料公司 针对原位电磁感应监测的边缘重建中的基板掺杂的补偿
JP7447284B2 (ja) 2020-06-24 2024-03-11 アプライド マテリアルズ インコーポレイテッド 研磨パッドの摩耗補償による基板層の厚さの決定
JP7629295B2 (ja) * 2020-11-25 2025-02-13 株式会社荏原製作所 渦電流センサ
CN116652813A (zh) * 2022-02-17 2023-08-29 中国科学院微电子研究所 一种化学机械平坦化设备、终点检测方法、装置及系统
WO2023234974A1 (en) * 2022-06-03 2023-12-07 Applied Materials, Inc. Determining substrate orientation with acoustic signals
US20240308019A1 (en) * 2023-03-17 2024-09-19 Applied Materials, Inc. Method for detection of wafer slippage
CN117885031A (zh) * 2024-01-17 2024-04-16 华虹半导体(无锡)有限公司 监控化学机械平坦化研磨端点检测异常的装置及方法

Citations (4)

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JP2007501509A (ja) 2003-07-31 2007-01-25 アプライド　マテリアルズ　インコーポレイテッド イン・シトゥー・プロファイル計測のための渦電流システム
JP2007334934A (ja) 2006-06-12 2007-12-27 Shinka Jitsugyo Kk 積層体の研磨量検出素子、ウエファー、および積層体の研磨方法
JP2011023579A (ja) 2009-07-16 2011-02-03 Ebara Corp 研磨方法および装置
JP2012508983A (ja) 2008-11-14 2012-04-12 アプライド マテリアルズ インコーポレイテッド 縁部分解能強化渦電流センサ

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US6399501B2 (en) 1999-12-13 2002-06-04 Applied Materials, Inc. Method and apparatus for detecting polishing endpoint with optical monitoring
US6924641B1 (en) 2000-05-19 2005-08-02 Applied Materials, Inc. Method and apparatus for monitoring a metal layer during chemical mechanical polishing
DE60116757T4 (de) * 2000-05-19 2007-01-18 Applied Materials, Inc., Santa Clara Verfahren und vorrichtung zur "in-situ" überwachung der dicke während des chemisch-mechanischen planiervorganges
TWI273947B (en) * 2002-02-06 2007-02-21 Applied Materials Inc Method and apparatus of eddy current monitoring for chemical mechanical polishing
JP2003347259A (ja) * 2002-05-23 2003-12-05 Ebara Corp ポリッシングの終点検知方法
SG125108A1 (en) * 2003-03-11 2006-09-29 Asml Netherlands Bv Assembly comprising a sensor for determining at least one of tilt and height of a substrate, a method therefor and a lithographic projection apparatus
US7008296B2 (en) 2003-06-18 2006-03-07 Applied Materials, Inc. Data processing for monitoring chemical mechanical polishing
TW201201957A (en) 2010-01-29 2012-01-16 Applied Materials Inc High sensitivity real time profile control eddy current monitoring system
US9023667B2 (en) * 2011-04-27 2015-05-05 Applied Materials, Inc. High sensitivity eddy current monitoring system
US20120276817A1 (en) * 2011-04-27 2012-11-01 Iravani Hassan G Eddy current monitoring of metal residue or metal pillars

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
JP2007501509A (ja) 2003-07-31 2007-01-25 アプライド　マテリアルズ　インコーポレイテッド イン・シトゥー・プロファイル計測のための渦電流システム
JP2007334934A (ja) 2006-06-12 2007-12-27 Shinka Jitsugyo Kk 積層体の研磨量検出素子、ウエファー、および積層体の研磨方法
JP2012508983A (ja) 2008-11-14 2012-04-12 アプライド マテリアルズ インコーポレイテッド 縁部分解能強化渦電流センサ
JP2011023579A (ja) 2009-07-16 2011-02-03 Ebara Corp 研磨方法および装置

Also Published As

Publication number Publication date
JP2014096585A (ja) 2014-05-22
KR20140059741A (ko) 2014-05-16
TWI589394B (zh) 2017-07-01
US9205527B2 (en) 2015-12-08
JP6297301B2 (ja) 2018-03-20
US20140127971A1 (en) 2014-05-08
TW201422369A (zh) 2014-06-16

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