TWI585143B - 圖案形成方法、感光化射線性樹脂組成物、感放射線性樹脂組成物、抗蝕劑膜及電子元件的製造方法 - Google Patents

圖案形成方法、感光化射線性樹脂組成物、感放射線性樹脂組成物、抗蝕劑膜及電子元件的製造方法 Download PDF

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Publication number
TWI585143B
TWI585143B TW103100882A TW103100882A TWI585143B TW I585143 B TWI585143 B TW I585143B TW 103100882 A TW103100882 A TW 103100882A TW 103100882 A TW103100882 A TW 103100882A TW I585143 B TWI585143 B TW I585143B
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Taiwan
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group
formula
hydrocarbon group
resin composition
solvent
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TW103100882A
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English (en)
Chinese (zh)
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TW201431940A (zh
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岩戸薫
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富士軟片股份有限公司
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G03F7/325—Non-aqueous compositions

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
TW103100882A 2013-02-08 2014-01-10 圖案形成方法、感光化射線性樹脂組成物、感放射線性樹脂組成物、抗蝕劑膜及電子元件的製造方法 TWI585143B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013023550 2013-02-08
JP2013075278A JP6140508B2 (ja) 2013-02-08 2013-03-29 パターン形成方法、及び電子デバイスの製造方法

Publications (2)

Publication Number Publication Date
TW201431940A TW201431940A (zh) 2014-08-16
TWI585143B true TWI585143B (zh) 2017-06-01

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TW103100882A TWI585143B (zh) 2013-02-08 2014-01-10 圖案形成方法、感光化射線性樹脂組成物、感放射線性樹脂組成物、抗蝕劑膜及電子元件的製造方法

Country Status (5)

Country Link
US (1) US20150301451A1 (ja)
JP (1) JP6140508B2 (ja)
KR (1) KR101962666B1 (ja)
TW (1) TWI585143B (ja)
WO (1) WO2014122852A1 (ja)

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JPWO2016035497A1 (ja) * 2014-09-02 2017-04-27 富士フイルム株式会社 パターン形成方法、電子デバイスの製造方法及び電子デバイス
JP6706892B2 (ja) * 2014-09-16 2020-06-10 住友化学株式会社 レジスト組成物及びレジストパターンの製造方法
KR102095314B1 (ko) * 2015-09-30 2020-03-31 후지필름 가부시키가이샤 패턴 형성 방법, 전자 디바이스의 제조 방법, 및 적층체
JP6561937B2 (ja) * 2016-08-05 2019-08-21 信越化学工業株式会社 ネガ型レジスト組成物及びレジストパターン形成方法
US10416558B2 (en) * 2016-08-05 2019-09-17 Shin-Etsu Chemical Co., Ltd. Positive resist composition, resist pattern forming process, and photomask blank
KR102296567B1 (ko) 2017-03-13 2021-09-01 후지필름 가부시키가이샤 감활성광선성 또는 감방사선성 수지 조성물, 레지스트막, 패턴 형성 방법, 전자 디바이스의 제조 방법
JP6950357B2 (ja) * 2017-08-24 2021-10-13 信越化学工業株式会社 スルホニウム化合物、レジスト組成物及びパターン形成方法
KR102669089B1 (ko) * 2017-09-29 2024-05-23 니폰 제온 가부시키가이샤 포지티브형 감방사선성 수지 조성물
CN109928904A (zh) * 2017-11-30 2019-06-25 罗门哈斯电子材料有限责任公司 两性离子化合物和包括其的光致抗蚀剂
KR102442808B1 (ko) * 2018-03-01 2022-09-14 후지필름 가부시키가이샤 감활성광선성 또는 감방사선성 수지 조성물, 레지스트막, 패턴 형성 방법, 전자 디바이스의 제조 방법

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JP6246480B2 (ja) * 2012-04-09 2017-12-13 住友化学株式会社 レジスト組成物及びレジストパターンの製造方法
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Also Published As

Publication number Publication date
JP2014170205A (ja) 2014-09-18
KR101962666B1 (ko) 2019-03-27
TW201431940A (zh) 2014-08-16
WO2014122852A1 (ja) 2014-08-14
JP6140508B2 (ja) 2017-05-31
KR20150093777A (ko) 2015-08-18
US20150301451A1 (en) 2015-10-22

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