TWI584391B - Measuring apparatus, substrate processing system and measuring method - Google Patents

Description

Measuring device, substrate processing system, and measuring method

The disclosed embodiments relate to a measuring device, a substrate processing system, and a measuring method.

In recent years, in the manufacture of FPD (Flat Panel Display), patterning on a substrate is performed by photolithography. In the above-described photolithography project, after a predetermined film is formed on a substrate to be processed such as a glass substrate, a photoresist is applied, and the photoresist film formed on the substrate is exposed to a predetermined pattern shape using a mask. Then, the exposed substrate is immersed in a developing liquid to perform a development process, whereby a pattern is formed on the substrate.

However, for the pattern of the substrate formed as described above, a device for measuring the line width of the pattern has been proposed. For example, Patent Document 1 discloses a technique in which a suction plate for adsorbing a substrate is placed on a stone board, and a line width of a pattern of the substrate is measured in a state where the substrate is placed and fixed on the adsorption plate.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2008-140816

However, in the above-mentioned conventional technique, since the stone board is made of marble or the like, the weight of the entire line width measuring device is increased, and the device becomes expensive.

In one aspect of the embodiment, it is intended to reduce the weight and provide a low-cost measuring device, a substrate processing system, and a measuring method.

A measuring device according to an aspect of the embodiment includes a conveying unit, an imaging unit, and a measuring unit. The transport unit transports the substrate on which the pattern is formed. The imaging unit is disposed above the transport unit and captures a pattern of the substrate placed on the transport unit. The measurement unit measures the shape of the pattern based on image information of the pattern captured by the imaging unit.

According to one aspect of the embodiment, weight reduction can be achieved in the measuring device, and it can be made at a lower price.

1‧‧‧Substrate processing system

11‧‧‧Photoresist coating device

12‧‧‧Decompression drying device

13‧‧‧Pre-bake device

14‧‧‧Cooling device

15‧‧‧Exposure device

16‧‧‧Partial exposure device

17‧‧‧Developing device

18‧‧‧Line width measuring device

20‧‧‧Transportation Department

30‧‧‧Photography Department

40‧‧‧Mobile Department

50‧‧‧Measurement control device

51‧‧‧Determination Department

52‧‧‧Memory Department

53‧‧‧Feedback

C1~C9‧‧‧ area

D, Da, Db‧‧‧ measuring points

G‧‧‧Substrate

Fig. 1 is a schematic explanatory view showing a configuration of a substrate processing system according to a first embodiment.

Fig. 2 is a schematic perspective view showing the configuration of the line width measuring device shown in Fig. 1.

Fig. 3 is a block diagram showing the line width measuring device shown in Fig. 1.

Fig. 4 is a schematic enlarged view of a substrate.

Fig. 5 is a flow chart showing the processing procedure of the line width measuring process.

Fig. 6A is a schematic plan view of a substrate.

6B] Fig. 6B is an enlarged schematic plan view showing a portion of the substrate shown in Fig. 6A in an enlarged manner.

Fig. 7 is a graph showing vibration of a substrate.

FIG. 8 is a schematic explanatory view showing a modification of the measurement points measured on the substrate and the second substrate. FIG.

[ Fig. 9] Fig. 9 is a schematic perspective view showing a configuration of a line width measuring device according to a second embodiment.

Fig. 10 is a flow chart showing the processing procedure of the line width measurement processing of the third embodiment.

Fig. 11 is a flow chart showing the processing procedure of the line width measurement processing of the fourth embodiment.

Hereinafter, embodiments of the measuring apparatus, the substrate processing system, and the measuring method disclosed in the present application will be described in detail with reference to the accompanying drawings. Further, the invention is not limited to the embodiments described below.

(First embodiment)

<1. Substrate processing system>

First, the configuration of a substrate processing system according to the first embodiment will be described with reference to Fig. 1 . Fig. 1 is a schematic explanatory view showing a configuration of a substrate processing system according to a first embodiment.

The substrate processing system 1 of the first embodiment shown in FIG. 1 is formed by patterning a substrate G to be processed (hereinafter referred to as "substrate plate G", not shown in FIG. 1) by photolithography. The unit of processing.

The substrate processing system 1 includes a photoresist coating device 11, a vacuum drying device 12, a prebaking device 13, a cooling device 14, an exposure device 15, a partial exposure device 16, a developing device 17, and a line width measuring device 18. . Each of the above-described devices 11 to 18 is integrally connected in this order in the positive X-axis direction. Further, the above-described line width measuring device 18 corresponds to an example of a measuring device.

Further, the arrangement position of the partial exposure device 16 is not limited to the latter stage of the exposure device 15 described above. That is, for example, the partial exposure device 16 may be disposed in the rear portion of the prebaking device 13 or the rear portion of the cooling device 14.

Each of the above devices 11 to 18 transports the substrate G to The conveying mechanism (not shown in Fig. 1) in the positive X-axis direction is connected. Therefore, the substrate G is formed into a pattern by passing through the respective devices 11 to 18 while being transported by the transport mechanism. As a result, in the substrate processing system 1, each of the devices 11 to 18 is linearized to perform photolithography. Further, in the substrate processing system 1, the substrate G is transported by the transport mechanism in sequence at predetermined intervals or at predetermined intervals.

In the photoresist coating apparatus 11 of the substrate processing system 1, a photoresist having photosensitivity is applied to the substrate G. Further, the above-mentioned photoresist can be applied to any of a positive photoresist and a negative photoresist.

In the vacuum drying apparatus 12, the substrate G is placed in a chamber that has been depressurized, and the photoresist film formed on the substrate G is dried. The prebaking device 13 heats the substrate G to evaporate the solvent of the photoresist film to fix the photoresist film to the substrate G. The cooling device 14 cools the substrate G heated by the prebaking device 13 to a predetermined temperature.

The exposure device 15 exposes the photoresist film formed on the substrate G to a predetermined pattern shape using a mask. The partial exposure device 16 performs local exposure of the photoresist film in order to suppress variations in the pattern formed on the substrate G, for example. That is, for example, assuming that the line width of the pattern formed on the substrate G is different from the desired line width, in the partial exposure device 16, the line width of the pattern is corrected in such a manner that local exposure is performed on different portions thereof.

The developing device 17 immerses the substrate G exposed by the exposure device 15 and the partial exposure device 16 into a developing liquid to perform development processing. Thereby, a pattern is formed on the substrate G. The line width measuring device 18 measures the line width of the pattern formed on the substrate G by the developing process in the developing device 17.

Further, in the above description, the measurement target is set to the line width of the pattern, but the illustration is not limited thereto. In other words, the measurement target may be any pattern as long as it is about the shape of the pattern. Specifically, for example, the shape, the curvature, the wiring, and the defect or deformation of the pattern, such as the length or the thickness of the pattern, may be measured.

However, as a device for measuring the line width of the pattern of the substrate, a conventional technique is known in which, for example, a suction plate is placed on a stone board, and the substrate is placed in a state where the substrate is placed and fixed on the adsorption plate. The line width of the pattern. However, in the case of such a conventional technique, since the stone board is made of marble or the like, the weight of the entire line width measuring device is increased, and the device becomes expensive.

Therefore, in the line width measuring device 18 of the first embodiment, the imaging unit is disposed above the transport unit of the transport substrate G, and the pattern of the substrate G placed on the transport unit is imaged. Then, the line width of the pattern is measured based on the image information of the pattern captured by the imaging unit. Thereby, the line width measuring device 18 can be made lighter than the apparatus having a stone board or the like, and the line width measuring device 18 can be manufactured at low cost.

Further, in the conventional technique, the line width of the pattern is measured while suppressing the vibration of the substrate by using a stone plate or a damping mechanism or the like on the portion where the substrate is placed. In this regard, the line width measurement in the first embodiment In the device 18, since the substrate G is placed on the transport portion, the vibration of the transport portion is transmitted, and the substrate G is also vibrated.

Therefore, in the present embodiment, the edge intensity of the pattern is calculated based on the image information of the pattern captured by the imaging unit. Moreover, when the calculated edge intensity is equal to or greater than a predetermined edge intensity, that is, when the focus of the image captured by the imaging unit is coincident, the line width of the pattern can be determined according to the captured image information. . Thereby, even when the substrate G is placed on the transport portion and vibrates, the line width of the pattern can be measured.

<2. Composition of line width measuring device>

Hereinafter, the configuration of the line width measuring device 18 and the line width measuring process using the pattern of the substrate G by the line width measuring device 18 will be described in detail. FIG. 2 is a schematic perspective view showing the configuration of the line width measuring device 18. In the following description, as shown in FIG. 2, the Y-axis direction and the Z-axis direction orthogonal to the X-axis direction described above are defined, and the Z-axis positive direction is defined as the vertical upward direction.

As shown in FIG. 2, the line width measuring device 18 includes a transport unit 20, an imaging unit 30, a moving unit 40, and a measurement control device 50. The conveyance unit 20 is, for example, a roller conveyor, and the substrate G placed on the drum 21 is conveyed to the horizontal direction, specifically, the positive direction of the X-axis, by rotating the plurality of rollers 21 . In addition, in Fig. 2, the drum 21 is shown in perspective.

The transport unit 20 is a part of the transport mechanism of the substrate processing system 1 described above. Therefore, the transport unit 20 is in the substrate processing system 1 The substrate G carried out from the developing device 17 is transported, and the developing device 17 is disposed in the front stage of the line width measuring device 18.

Further, the operation of the transport unit 20, in detail, the rotation of the drum 21 is controlled by the measurement control device 50. Here, although the conveyance unit 20 is provided as a roller conveyor, the present invention is not limited thereto, and may be another conveyance mechanism such as a belt conveyor or a chain conveyor.

Further, in the transport unit 20, a plurality of (for example, four) substrate position detecting portions 22 indicated by broken lines are disposed in the vicinity of the transport surface of the transport substrate G. The substrate position detecting unit 22 outputs a detection signal to the measurement control device 50 when the substrate G is positioned above. As the substrate position detecting portion 22, for example, an optical load sensor can be used.

In the measurement control device 50, the measurement control device 50 determines whether or not the substrate G is placed at a predetermined position based on the detection signal of the substrate position detecting unit 22. Therefore, the substrate position detecting unit 22 is disposed on the load. Placed below the substrate G at the predetermined position. In the above, although the number of the substrate position detecting units 22 is set to four, this is exemplified, and may be three or less or five or more.

The imaging unit 30 is disposed above the Z-axis direction of the transport unit 20 and images the pattern of the substrate G placed on the transport unit 20 from above. As the imaging unit 30, for example, a CCD (Charge Coupled Device) camera can be used. The image data captured by the imaging unit 30 is input to the measurement control device 50.

In the vicinity of the imaging unit 30, a camera height measurement is provided. Fixed part 31. The camera height measuring unit 31 is a measuring unit that measures the height in the Z-axis direction from the lens of the imaging unit 30 to the pattern surface (upper surface) Ga of the substrate G. The measurement result of the camera height measuring unit 31 is input to the measurement control device 50, and is used to adjust the height of the imaging unit 30. Further, as the camera height measuring unit 31, for example, a laser displacement meter can be used.

The moving unit 40 moves the imaging unit 30 in the horizontal direction (X-Y axis direction) or the vertical direction (Z direction) with respect to the pattern surface Ga of the substrate G. Specifically, the moving unit 40 includes a guide rail portion 41 , a sliding portion 42 , and a connecting portion 43 .

The guide rail portions 41 are disposed on both end sides of the transport unit 20 in the Y-axis direction, and are provided to extend in the X-axis direction. The sliding portion 42 is slidably (slidably) coupled to each of the guide rail portions 41 so as to be linearly movable in the X-axis direction along the guide rail portion 41.

The connecting portion 43 connects the sliding portions 42 to each other and is disposed to be placed above the substrate G. Both the imaging unit 30 and the camera height measuring unit 31 are movably connected to the Y-axis and Z-axis directions via the mounting plate 44 at the connecting portion 43.

Although not shown in the drawings, the moving unit 40 includes a drive source for moving the slide portion 42 in the X-axis direction with respect to the guide rail portion 41, and the imaging unit 30 and the like in the Y-axis direction with respect to the connection portion 43 and A drive source that moves in the Z-axis direction. As the above-described driving source, for example, an electric motor can be used. With this configuration, for example, the measurement control device 50 controls the driving source of the moving unit 40, so that the imaging unit 30 can face X with respect to the substrate G. Move in the 3 direction of the Y and Z axis directions.

The measurement control device 50 is a device for controlling the operation of the line width measuring device 18. 3 is a block diagram of a line width measuring device 18.

As shown in FIG. 3, the measurement control device 50 includes a computer including a measurement unit 51, a storage unit 52, and a feedback unit 53. Further, the measurement control device 50 is communicably connected to the above-described partial exposure device 16, the transport unit 20, the substrate position detecting unit 22, the imaging unit 30, the camera height measuring unit 31, the moving unit 40, and the like.

In the storage unit 52, a program for controlling the line width measurement processing is stored. The measuring unit 51 controls the operation of the line width measuring device by reading and executing the program stored in the memory unit 52.

Further, the program is recorded by a computer on a readable recording medium, and may be installed in the memory unit 52 of the measurement control device 50 by the recording medium. As the recording medium readable by a computer, there are, for example, a hard disk (HD), a floppy disk (FD), a compact disk (CD), a magneto-optical disk (MO), a memory card, and the like.

The memory unit 52 further stores the pattern shape of the substrate G (hereinafter referred to as "memory pattern shape") and the position information of the pattern to be measured on the substrate G. Fig. 4 is a schematic enlarged view of a substrate G for explaining the shape and position information of the memory pattern. Here, a case where the line width of the pattern P shown in the symbol A of FIG. 4 is to be measured in a plurality of patterns formed on the substrate G will be described as an example. Moreover, in FIG. 4, it is easy to understand, and the pattern is attached with diagonal lines.

As shown in FIG. 4, in the vicinity of the pattern P to be measured, As indicated by a broken line, there is a pattern B which can be a shape of a mark with respect to the pattern P. In the memory unit 52, the shape of the pattern B is previously stored as "memory pattern shape B". The memory pattern shape B is used to estimate whether or not the image information captured by the imaging unit 30 in the line width measurement process includes the pattern P to be measured, but this will be described later.

Further, the memory pattern shape B is set and stored in the memory unit 52 in accordance with each measurement point described later. However, for example, when the memory pattern shape B has the same shape at two or more measurement points, the memory pattern shape B may be shared by two or more measurement points.

Further, the position information described above is, for example, image coordinate information indicating a relative position of a measurement point of a pattern matching the memory pattern shape B in the captured image. Specifically, in the memory pattern shape B, the origin O as shown in FIG. 4 is set, and in the image coordinate information, the start position XY1 and the end position XY2 of the measurement point with respect to the origin O are included. News.

Specifically, as the start position XY1, the lower end position of one of the patterns P to be measured (the pattern P on the upper side in FIG. 4) is set, and the other end of the pattern P to be measured is set as the end position XY2 (at The upper end position of the pattern P) on the lower side in FIG. Further, the distance between the above-described starting position XY1 and the end position XY2 is measured as "line width A". The measurement of the line width A will be described next. Further, the information of the start position XY1 and the end position XY2 described above is represented by, for example, the X and Y coordinates of the pixels when the image is composed of pixels of 4000×2000.

Returning to the description of FIG. 3, the feedback unit 53 feeds back the data indicating the line width of the pattern measured by the line width measurement process to the partial exposure device 16 (send). In the partial exposure device 16, the line width of the measured pattern is compared with the desired line width, and if there is a deviation, the amount of deviation is calculated, and the illuminance of the exposure is corrected based on the calculated amount of deviation or A position where the exposure is partially performed on the substrate G, and the like. Thereby, the corrected illuminance or the position of the substrate G can be locally exposed to the substrate G conveyed to the partial exposure device 16 after the correction, so that the line width of the pattern of the substrate G can be corrected to a desired level. Line width.

<3. Processing of line width measuring device>

Next, the specific content of the line width measurement processing by the line width measuring device 18 will be described with reference to FIG. Fig. 5 is a flow chart showing the processing procedure of the line width measuring process. Further, in the line width measuring device 18, the respective processing steps shown in FIG. 5 are executed in accordance with the control of the measuring unit 51 of the measurement control device 50.

The measuring unit 51 controls the operation of the transport unit 20 and transports the substrate G that has been subjected to the development process (step S1). Next, the measurement unit 51 determines whether or not the substrate G is placed at a predetermined position based on the detection signal output from the substrate position detecting unit 22 (step S2). Here, the predetermined position refers to the position of the substrate G that can be imaged by the imaging unit 30.

When the measurement unit 51 determines that the substrate G is not placed at the predetermined position (step S2, No), the measurement unit 51 directly ends the processing. On the other hand, when the measurement unit 51 determines that the substrate G is placed at the predetermined position (step S2, Yes), the operation of the transport unit 20 is stopped and the substrate G is stopped (step S3).

Next, the measuring unit 51 determines the position of the measurement point of the pattern of the substrate G, and specifically determines the position of the pattern to be measured (hereinafter also referred to as "measurement point") (step S4). Here, the measurement points regarding the substrate G will be described. Fig. 6A is a schematic plan view of a substrate G; Fig. 6B is an enlarged schematic plan view showing a portion of the substrate G shown in Fig. 6A. In addition, in FIGS. 6A and 6B, the measurement points are schematically indicated by x-print for easy understanding.

As shown in FIG. 6A, in the pattern surface Ga of the substrate G, there are a plurality of measurement points D. However, when the line width of the pattern is measured for all of the measurement points D, there is a tendency that the time required for the measurement becomes long.

Therefore, in the present embodiment, the pattern surface Ga of the substrate G is divided into a plurality of regions, and the line width is measured in a predetermined region of the region to be regiond. Specifically, as shown by the broken line in FIG. 6A, the pattern surface Ga of the substrate G can be divided into a plurality of (for example, nine) regions C1 to C9 in advance, and the regions C1 to C9 are identified in the measurement unit 51. Further, the measuring unit 51 measures the line width in one of the regions C1 to C9 (for example, the region C1).

Fig. 6B is an enlarged view showing a region C1 belonging to one of the regions C1 to C9. As shown in FIG. 6B, in the area C1, a plurality of (for example, nine) measurement points D are set. In the above-described step S4, the process of determining the position of the measurement point D to be measured in the plurality of measurement points D in the region C1 is specifically determined, and specifically, the position of the measurement point D in the X-axis direction, Y is determined. Processing of the position in the axial direction.

Continuing with the description of the measurement point D, the measurement unit 51 sequentially measures the measurement point D in the region C1, and ends the measurement process of the substrate G at the time point after the measurement of the nine measurement points D is completed.

In the line width measuring device 18, the substrate G that has been measured is carried out, and then the measured second substrate G2 is carried in. In this case, the measuring unit 51 moves the imaging unit 30 to the region corresponding to the predetermined region (here, the region C1 of the substrate G) in the second substrate G2 via the moving portion 40, that is, moves to and The other region (for example, the region C2 of the second substrate G2) in which the region C1 of the second substrate G2 is different is measured in the other region C2.

In addition, in FIG. 6A, in order to facilitate understanding, the substrate G and the second substrate G2 are shown as the same substrate, but the second substrate G2 is transferred to the substrate of the line width measuring device 18 after being carried out. Therefore, the substrate G and the second substrate G2 are separate substrates.

As described above, the measurement unit 51 changes the area to be measured from C1 to C2 and from C2 to C3. Therefore, in the example in which the area is divided into nine, as shown in FIG. 6A, when the nine substrates are transported, the entire measurement substrate is formed, and the lines in the measurement points D of the measurement areas C1 to C9 are in detail. width. Thereby, a plurality of measurement points D located on the substrate can be measured efficiently and efficiently. Further, since the measurement is performed on one substrate, since it is one region, the time required for measurement does not become long.

Further, in the above description, the substrate G is divided into a plurality of regions C1 to C9 and measured one by one, but the present invention is not limited thereto. The line width of all the measurement points D can also be measured as long as it is the time at which the measurement can be tolerated. Further, the number of the above-described regions C1 to C9 or the measurement point D is exemplified and is not limited.

Returning to the description of FIG. 5, the measuring unit 51 controls the operation of the moving unit 40 so that the imaging unit 30 moves above the measurement point D determined in step S4 (step S5). Next, the measuring unit 51 adjusts the height in the Z-axis direction of the imaging unit 30 (step S6). Specifically, in step S6, the moving portion is controlled so that the distance from the lens of the imaging unit 30 to the pattern surface Ga of the substrate G becomes the working distance of the imaging unit 30, based on the measurement result of the camera height measuring unit 31. 40 action.

More specifically, the measuring unit 51 measures the height in the Z-axis direction from the imaging unit 30 to the substrate G by using the camera height measuring unit 31. In addition, the measurement unit 51 calculates the amplitude of the vibrating substrate G based on the obtained measurement result, and the distance from the lens of the imaging unit 30 to the pattern surface Ga of the substrate G is set in accordance with the calculated central value of the amplitude. The operation of the moving unit 40 is controlled in such a manner that the working distance of the imaging unit 30 is set.

Thereby, even when the substrate G is vibrated, it is possible to easily image an image having the same focus in the processing to be described later. Further, in the above, although the central value of the amplitude is used, the present invention is not limited thereto, and may be, for example, an arithmetic mean or a mode.

Next, the measuring unit 51 determines whether or not the number of times of photographing by the imaging unit 30 is equal to or greater than a predetermined number of times (step S7). in The predetermined number of times is set to an integer of, for example, 2 or more.

When it is determined that the number of times of photographing is less than the predetermined number of times (step S7, No), the measuring unit 51 operates the imaging unit 30 and images the pattern of the substrate G (step S8). Next, the measurement unit 51 performs a pattern search process (step S9).

In the pattern search processing, the correlation value of the pattern shape (hereinafter referred to as "image pattern shape") included in the image information captured by the imaging unit 30 and the memory pattern shape B stored in the storage unit 52 is calculated. . In addition, the correlation value here is a value which shows the similarity of the image pattern shape and the memory pattern shape B.

Next, the measurement unit 51 determines whether or not the calculated correlation value is equal to or greater than a predetermined correlation value (step S10). Here, the processing of step S10 will be described. When the correlation value is less than the predetermined correlation value and is relatively low, the image information captured by the imaging unit 30 does not include the pattern corresponding to the memory pattern shape B. As a result, it is presumed that the pattern P to be measured is not included. On the other hand, when the correlation value is higher than or equal to the predetermined correlation value, the image information captured by the imaging unit 30 includes a pattern matching the memory pattern shape B, and therefore it is presumed that the image information is also included. The pattern is close to the pattern P to be determined.

In other words, step S10 is a process of determining whether or not the position of the imaging unit 30 is not deviated with respect to the pattern P (measurement point D) to be measured. Therefore, when the correlation value is less than the predetermined correlation value (No in step S10), the measurement unit 51 does not include the pattern P to be measured, and the imaging unit 30 is estimated to be different from the measurement point D. Location, due to The position of the imaging unit 30 is adjusted (step S11).

In the process of step S11, for example, the imaging unit 30 is moved to a predetermined direction (for example, the X-axis direction) set in advance by a predetermined distance, and position adjustment is performed. When the measurement unit 51 adjusts the position of the imaging unit 30, the measurement unit 51 returns to step S8 and performs imaging again.

Further, in the above description, the image pickup unit 30 is moved only in a predetermined direction by a predetermined distance, but the position is not limited thereto. That is, for example, the magnification of the lens of the imaging unit 30 can be lowered, the field of view of the camera can be enlarged, and the camera 30 can be moved to the measurement point D and adjusted based on the image information from the enlarged camera field of view.

In this way, when the correlation value is less than the predetermined correlation value, the imaging unit 30 can perform the imaging of the pattern of the substrate G again, thereby preventing erroneous measurement of the line width other than the line width A of the pattern P to be measured. The situation.

On the other hand, when the correlation value is equal to or greater than a predetermined correlation value (Yes in step S10), the measurement unit 51 calculates the edge intensity of the pattern based on the image information of the pattern captured by the imaging unit 30, and determines the Whether the calculated edge strength is equal to or greater than the predetermined edge strength (step S12).

The edge intensity here means the degree of change in the degree of shading of the boundary (contour) of the photographed pattern. As the edge intensity becomes higher, the shading is more clear, that is, the meaning of the focus of the image is the same.

When the edge intensity is less than the predetermined edge intensity and is relatively low (step S12, No), the measurement unit 51 does not match the focus of the image captured by the imaging unit 30, and therefore returns to step S7. And if shooting When the number of times is less than the predetermined number of times, in other words, when the number of times of photographing has not reached the predetermined number of times, the photographing of the pattern of the substrate G is performed again in step S8, and the processing from step S9 onward is performed again.

On the other hand, when the edge intensity is equal to or higher than the predetermined edge intensity and relatively high (step S12, Yes), the focus of the captured image is the same, and therefore, the image is used to calculate the measurement. The start position XY1 and the end position XY2 of the point D (step S13).

Specifically, the measurement unit 51 calculates the start position of the measurement point D from the position of the pattern having a relatively high correlation value and matching the memory pattern shape B with respect to the memory pattern shape B in the image having the same focus. XY1 and end position XY2.

In detail, in the memory pattern shape B, the origin O is set as described above (see FIG. 4). The measurement unit 51 sets a position corresponding to the origin O as a "reference point" in the image corresponding to the memory pattern shape B in the captured image. The measurement unit 51 calculates the start position XY1 and the end position XY2 based on the reference point and the image coordinate information which is the position information of the memory unit 52.

Further, the measuring unit 51 measures the distance between the start position XY1 and the end position XY2 calculated in the step S13 as the line width A of the pattern P of the measurement point D (step S14).

As described above, in the present embodiment, the position of the measurement point D is calculated from the positional information indicating the relative position of the measurement point D with respect to the pattern D in the captured image. Start position XY1 and end position XY2, and measure the line width of the pattern P A. Thereby, for example, even when the pattern matching the memory pattern shape B is projected at any position within the captured image, the start position XY1 and the end position XY2 can be calculated, and the line width of the pattern P can be determined. A.

Further, as described above, the measurement unit 51 calculates the edge intensity of the pattern based on the image information of the pattern captured by the imaging unit 30, and when the calculated edge intensity is equal to or greater than the predetermined edge intensity, according to the pattern The image information is determined by the line width A of the pattern P.

Thereby, even when the substrate G vibrates, an image having a relatively high edge intensity, that is, an image having the same focus can be selected, so that the line width A of the pattern P of the measurement point D can be accurately measured.

Referring to Fig. 7, the processing of the line width measurement based on the edge strength (steps S12 to S14 and S8) will be described again. Fig. 7 is a graph showing the vibration of the substrate G. In addition, the symbols T1 to T4 in FIG. 7 indicate the timing at which the imaging unit 51 performs imaging, that is, the time at which imaging is performed.

Since the substrate G of the present embodiment is placed on the transport unit 20, it is affected by interference such as vibration of the transport unit 20 or air conditioner, and vibrates in the Z-axis direction as shown in Fig. 7 . On the other hand, in the imaging unit 30, when the position of the pattern surface Ga of the substrate G does not fall within the range E of the depth of field of the imaging unit 30, an image in which the focus is uniform cannot be captured. Further, when the pattern surface Ga of the substrate G falls within the range E of the depth of field, the edge strength becomes high, and when the range E of the depth of field is deviated, the edge strength becomes low.

In the example shown in FIG. 7, from the first imaging time T1 to the third imaging time T3, imaging is performed in a state where the position of the pattern surface Ga of the substrate G does not fall within the range E of the depth of field. Thus, in At the shooting times T1, T2, and T3, the edge intensity becomes less than the predetermined edge strength, and the processing of step S8 is repeated, and the shooting is resumed.

In the fourth imaging time T4, when the position of the pattern surface Ga of the substrate G falls within the range E of the depth of field, the edge intensity is equal to or greater than the predetermined edge strength. In the present embodiment, since the line width can be measured based on the image in which the focus intensity is high, that is, the image in which the focus is high, at the imaging time T4, even when the substrate G is placed on the transport unit 20 and vibrated, The line width of the pattern can be reliably determined.

Further, in this manner, when the edge intensity is less than the predetermined edge strength, the imaging unit 30 can perform the imaging of the pattern of the substrate G again, and thus the line width can be measured based on the image in which the focus is surely matched.

Returning to the description of FIG. 5, the measuring unit 51 determines whether or not the measurement of the predetermined measurement point D in the predetermined region C1 has been completed. In the example shown in FIG. 6B, it is determined whether or not the measurement of the nine measurement points D has been determined. The process ends (step S15). When it is determined that the measurement of the predetermined measurement point D has not been completed (step S15, No), the measurement unit 51 returns to step S4, determines the position of the other measurement point D in the predetermined region C1, and performs the above-described steps S5 to S14. Line width measurement.

In addition, when the number of times of photographing is equal to or greater than the predetermined number of times (Yes in step S7), the measurement unit 51 skips the processing of steps S8 to S14 and performs the processing of step S15. Specifically, when the edge intensity is less than the predetermined edge intensity in step S12, that is, when the focus of the captured image does not match, the measurement unit 51 returns to step S7 until the number of times of shooting reaches a predetermined number of times. Repeated shooting.

However, even if the shooting is repeated, there is a case where an image having the same focus cannot be obtained due to the timing of the shooting or the vibration state of the substrate G or the like. Therefore, when the number of times of imaging is equal to or greater than the predetermined number of times (Yes in step S7), the measurement unit 51 of the present embodiment determines that the measurement point D to be measured is not capable of capturing an image with the same focus, and skips S8~ Processing of S14 (stop shooting).

Further, in step S15, the measurement unit 51 determines whether or not the measurement of the nine measurement points D has been completed, and moves to the measurement point D as long as there is a measurement point D that has not been measured, except for the measured measurement point D. The measurement is made (return to step S4).

In this way, by setting the upper limit value (predetermined number of times) for the number of shots, it is possible to avoid, for example, one measurement point D, continue the photographing process until the image in which the focus has been matched is photographed, thereby causing disadvantages such as a long processing time. The situation.

In addition, in the measurement point D (see FIG. 6B) where the measurement is performed, for example, when there is only one measurement point D that cannot be measured, the measurement result of the measurement point D from the remaining eight of the completed measurement may be obtained. Then, the line width A of the measurement point D that cannot be measured is obtained by interpolation.

When it is determined that the measurement of the predetermined measurement point D has been completed (Yes in step S15), the measurement unit 51 ends the process of FIG. 5, and then, for example, the transport unit 20 is operated, and the line width measuring device 18 is operated. The substrate G is carried out.

Further, the measurement control device 50 feeds back the data indicating the line width of the pattern measured by the line width measurement process to the partial exposure as described above. In the partial exposure device 16, the optical device 16 corrects the illuminance of the exposure and the like, and corrects the line width of the pattern.

As described above, the line width measuring device 18 of the first embodiment includes the transport unit 20, the imaging unit 30, and the measuring unit 51. The conveyance unit 20 conveys the substrate G on which the pattern is formed to the horizontal direction. The imaging unit 30 is disposed above the transport unit 20 and images the pattern of the substrate G placed on the transport unit 20 . The measuring unit 51 measures the shape (for example, the line width) of the pattern based on the image information of the pattern captured by the imaging unit 30. Therefore, the line width measuring device 18 according to the first embodiment can be made lighter and can be manufactured at a lower price.

However, in the above description, the substrate G to be measured this time and the second substrate G2 to be measured next are changed from the region C1 to the region C2, and all the measurement points D are changed, but they are not Limited to this. In other words, the measurement point shown by the symbol Da in FIG. 6A may be measured on the substrate G or the second substrate G2.

In other words, the measurement unit 51 includes a plurality of measurement points D on which the second substrate G2 is formed, and includes measurement points Da at positions corresponding to the measurement points Da measured by the substrate G. In addition, the measurement point Da can be measured in the same manner for the subsequent substrate that is measured after the second substrate G2.

In this way, by continuously measuring the line width of the pattern of the common (repeated) measurement point Da, it is possible to make the measured line width data continuous, and it is also possible to easily detect, for example, the measured line width. Variety.

In addition, in the above, all the bases for measuring the line width are used. The measurement point Da is measured in common for the plate. However, the measurement point is not limited thereto. For example, the measurement point may be common to only the substrate that is continuously measured.

FIG. 8 is a schematic explanatory view showing measurement points measured on the substrate G and the second substrate G2. In FIG. 8, the measurement point measured by the substrate G is surrounded by the broken line F1, and the measurement point measured by the second substrate G2 is surrounded by the two-dot chain line F2.

As shown in FIG. 8, in the plurality of measurement points D measured by the substrate G and the second substrate G2, a part of the measurement points Db become the same measurement point, and correctly, a measurement point corresponding to a part of the measurement point is obtained. . Even in the case of the configuration as described above, the data of the measured line width can be made continuous, and the fine variation of the measured line width can be easily detected, for example.

(Second embodiment)

Fig. 9 is a schematic perspective view similar to Fig. 2, showing a configuration of the line width measuring device 18 of the second embodiment. In the following, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

In the line width measuring device 18 of the second embodiment, the second imaging unit 130 and the second camera height measuring unit 131 are provided. Since the second imaging unit 130 and the second camera height measuring unit 131 have substantially the same configuration as the imaging unit 30 and the camera height measuring unit 31, the substrate G can be moved to the X direction in the X, Y, and Z directions. . In addition, in FIG. 9, the movable range of the imaging unit 30 in the Y-axis direction is represented by "Y1", and "Y2" is shown. The movable range of the second imaging unit 130 in the Y-axis direction is indicated.

Further, the measurement unit 51 measures the line width based on the image information from the second imaging unit 130. Thereby, the number of measurement points D in one of the substrates G can be increased by only the component of the measurement point D measured by the image information of the second imaging unit 130, whereby the measurement line can be added to one of the substrates G. The number of wide patterns.

In addition, when the imaging unit 30 and the second imaging unit 130 share the imaging of the plurality of measurement points D, it is possible to shorten the time required for the imaging processing and the line width measurement processing.

Moreover, as shown in FIG. 9, the movable range Y1 of the imaging unit 30 and the movable range Y2 of the second imaging unit 130 are set so as to overlap by a predetermined amount. Thereby, in the substrate G, it is possible to eliminate the area that cannot be imaged by the imaging unit 30 or the second imaging unit 130, that is, a so-called dead zone, whereby the imaging unit 30 and the second imaging unit 130 can be used. The line width of the pattern of the substrate G was measured.

Further, in the mounting plate 144 of the second imaging unit 130, a guard portion 145 is attached to a surface facing the mounting plate 44 of the imaging unit 30. The guard portion 145 is a plate-shaped member made of, for example, a material having elasticity. By the guard unit 145, for example, when the imaging unit 30 is in contact with the second imaging unit 130, the impact force acting on the imaging unit 30 and the second imaging unit 130 can be alleviated.

Further, in the above, the guard portion 145 is attached to the second imaging unit 130 side, but may be attached to the imaging unit 30, or may be attached to both the imaging unit 30 side and the second imaging unit 130 side. . another In addition, since the remaining configuration and effects are the same as those of the first embodiment, the description thereof is omitted.

(Third embodiment)

Fig. 10 is a flowchart showing the processing procedure of the line width measurement processing of the line width measuring device 18 of the third embodiment. In addition, since the processing of steps S101 to S106 shown in FIG. 10 is the same as the processing of steps S1 to S6 shown in FIG. 5, description thereof will be omitted.

In the third embodiment, it is determined whether or not there is a pattern matching the memory pattern shape B and the presence or absence of the measurement point D in the captured image information, and in the case where there is no pattern or measurement point D that matches the memory pattern shape B, The position adjustment of the imaging unit 30 is performed.

Specifically, as shown in FIG. 10, after the height of the imaging unit 30 in the Z-axis direction is adjusted in step S106, the imaging unit 30 is operated to capture the pattern of the substrate G (step S107). Next, the measurement unit 51 performs a pattern search process and calculates a correlation value (step S108).

Next, the measurement unit 51 determines whether or not the calculated correlation value is not 0 (step S109). Since the correlation value is a value indicating the similarity between the image pattern shape and the memory pattern shape B as described above, when the correlation value is 0, the memory pattern shape B is not present because the similarity is low. The meaning of the image information.

The measurement unit 51 adjusts the position of the imaging unit 30 when the correlation value is 0 (step S109, No) (step S110). At step S110 For example, the imaging unit 30 is moved, for example, by shifting the camera field of the imaging unit 30 by half. When the measurement unit 51 adjusts the position of the imaging unit 30, the measurement unit 51 returns to step S107 and performs imaging again.

In this manner, the image information including the pattern matching the memory pattern shape B can be easily obtained in advance so that the position of the imaging unit 30 can be adjusted. Further, in the above description, the imaging unit 30 is moved so as to shift the field of view of the camera by half when the position is adjusted. However, the present invention is not limited thereto, and is mainly capable of shifting the field of view of the camera. The imaging unit 30 may be moved.

In addition, the memory pattern shape B does not exist in the image information captured after the position adjustment, and when the processing of step S110 is performed again, the coordinates of the imaging unit 30 taken at the beginning are centered around In the outer peripheral mode, it is preferable to perform position adjustment again while moving the imaging unit 30. Thereby, image information including a pattern matching the memory pattern shape B can be easily obtained with a relatively small number of shots.

When the determination unit 51 determines that the correlation value is not 0 (Yes in step S109), that is, when the captured image information includes a pattern matching the memory pattern shape B, it is determined whether or not the measurement point D exists. Within the image information (step S111).

Here, the information (the positional information of the pattern) indicating the relative position of the measurement point D with respect to the memory pattern shape B is previously stored in the memory unit 52. Therefore, in step S111, it is determined whether or not the measurement point D exists in the captured image information based on the position information of the pattern matching the memory pattern shape B and the information indicating the relative position.

When the measurement unit 51 determines that the measurement point D does not exist in the captured image information (step S111, No), the measurement unit 51 adjusts the position of the imaging unit 30 (step S112). In the process of step S112, for example, the offset amount of the position of the memory pattern shape B and the position of the pattern matching the memory pattern shape B is calculated, and the imaging unit is made such that the calculated offset amount becomes zero. 30 moves.

When the measurement unit 51 adjusts the position of the imaging unit 30, the measurement unit 51 returns to step S107 and performs imaging again. Thereby, the image information including the measurement point D can be obtained in advance.

On the other hand, when it is determined that the measurement point D exists in the captured image information (Yes in step S111), the measurement unit 51 determines whether or not the number of times of capturing the pattern of the imaging unit 30 is equal to or greater than a predetermined number of times (step S113). The processing of this step S113 is the same as that of step S7 shown in FIG. 5, and thus the description thereof is omitted.

When it is determined that the number of times of photographing is less than the predetermined number of times (No in step S113), the measuring unit 51 determines whether or not the correlation value is equal to or greater than a predetermined correlation value (step S114). The processing of step S114 is the same as that of step S10 shown in FIG. 5, and thus the description thereof is omitted.

Further, when the correlation value is less than the predetermined correlation value (No in step S114), the measurement unit 51 returns to step S107 and performs imaging again. On the other hand, when the correlation value is equal to or greater than the predetermined correlation value (Yes in step S114), the measurement unit 51 determines whether or not the edge intensity is equal to or greater than the predetermined edge intensity (step S115). Steps S115 to S118 are the same as steps S12 to S15 shown in FIG. 5, and thus the description thereof is omitted.

As described above, in the third embodiment, it is determined in steps S109 and S111 whether or not the pattern matching the memory pattern shape B and the presence or absence of the measurement point D are determined in the captured image information.

Further, when there is no pattern matching the memory pattern shape B, the image is taken again after the position of the imaging unit 30 is adjusted. Thereby, it is possible to easily obtain image information including a pattern matching the memory pattern shape B in advance.

Further, when there is no measurement point D in the captured image information, the imaging unit 30 is positionally adjusted based on the information indicating the relative position of the measurement point D stored in the storage unit 52, and then the imaging is performed again. Thereby, the image information including the measurement point D can be obtained in advance. In addition, since the remaining configuration and effects are the same as those of the first embodiment, the description thereof is omitted.

(Fourth embodiment)

Fig. 11 is a flow chart showing the processing procedure of the line width measurement processing of the line width measuring device 18 of the fourth embodiment. In addition, since the processing of steps S201 to S212 shown in FIG. 11 is the same as the processing of steps S101 to S112 shown in FIG. 10, description thereof will be omitted.

In the above-described embodiment, an example has been described in which the image information to be captured is judged for the presence or absence of the measurement point D, but the image may be captured in a plurality of times. The plurality of image information is used to determine whether or not the measurement point D is determined or the line width is measured.

With such a configuration, for example, while the imaging unit 30 is moving to the next measurement point D, the line width can be measured based on the plurality of image information that has been captured, so that the line width measurement processing for each of the substrates G can be further shortened. time needed.

As described in detail in FIG. 11, the measurement unit 51 determines that the measurement point D exists in the image information captured in step S207 (Yes in step S211), and performs imaging on the substrate G N times. The plurality of captured image information are stored in the storage unit 52 (step S213).

Here, the above N is set to an integer of 2 or more. Specifically, the number of times of photographing is preferably several to several tens of times, for example. In addition, the shooting timing (shooting period) when N shots are taken may be fixed or variable.

Here, in the case where the imaging timing is set to be variable, for example, it is preferable to change in accordance with the vibration of the substrate G. That is, the amplitude or frequency of the vibration of the substrate G is analyzed, for example, and the imaging timing is shifted from the vibration of the substrate G based on the analysis result. Thereby, it is possible to prevent the imaging timing from being synchronized with the vibration of the substrate G, and as a result, it is possible to easily capture an image having the same focus.

Next, the measurement unit 51 determines whether or not the image information (hereinafter referred to as "unmeasured image") for which the correlation value calculation or the line width measurement has not been performed is located in the storage unit 52 (step S214). When it is determined that there is an unmeasured image (Yes in step S214), the measurement unit 51 reads the unmeasured image from the storage unit 52, and performs pattern search processing to calculate a correlation value (step S215).

Next, the measurement unit 51 determines whether or not the correlation value is equal to or greater than a predetermined correlation value (step S216), and when it is equal to or greater than the predetermined correlation value (step S216, Yes), determines whether the edge intensity is equal to or greater than a predetermined edge intensity (step S217). ).

When the edge intensity is equal to or greater than the predetermined edge intensity (step S217, Yes), the measurement unit 51 calculates the start position XY1 and the end position XY2 of the measurement point D (step S218). In addition, since steps S218 to S220 are the same as the processes of steps S13 to S15 shown in FIG. 5, description thereof will be omitted.

Moreover, when the correlation value is less than the predetermined correlation value (No in step S216), or when the edge intensity is less than the predetermined edge intensity (step S217, No), the measurement unit 51 returns to the process of S214.

On the other hand, when the measurement unit 51 determines that there is no unmeasured image (step S214, No), that is, when the correlation calculation or the line width measurement is performed on all the image information stored in the storage unit 52, Steps S215 to S219 are skipped.

As described above, in the fourth embodiment, the shape (for example, the line width) of the pattern is measured based on the image information of the plurality of patterns obtained by the imaging unit 30 capturing the pattern of the substrate G a plurality of times (N times).

Thereby, for example, while the imaging unit 30 is moving to the next measurement point D, the line width can be measured based on the plurality of image information that has been captured, so that the time required for the line width measurement process of each of the substrate G can be further shortened. . In addition, since the remaining configuration and effects are the same as those of the above-described embodiment, the description thereof is omitted.

Further, in the above-described embodiment, for example, an aperture may be provided in the lens of the imaging unit 30. By setting the aperture to enlarge the range E of the depth of field shown in FIG. 7, it is possible to easily capture an image having a high edge intensity and a uniform focus in the imaging unit 30.

Further, in the example shown in FIG. 7, although the imaging unit 30 is imaged at the same cycle, the present invention is not limited thereto, and imaging may be performed in different cycles. Further, it is also possible to analyze, for example, the period or frequency of the vibration of the substrate G, and to perform imaging based on the analysis result, at a timing at which the position of the pattern surface Ga of the substrate G falls within the range of the depth of field. Thereby, in the imaging unit 30, it is also possible to easily capture an image having a high edge intensity and a uniform focus.

Further, before the imaging unit 30 captures the substrate G, the inclination of the imaging axis of the imaging unit 30 to the pattern surface Ga of the substrate G may be detected, and the position of the imaging unit 30 may be corrected based on the detected inclination. In other words, for example, the mark for tilt detection is provided on the pattern surface Ga, and on the other hand, the mark is previously stored in the memory unit 52. Further, the imaging unit 30 or another imaging unit captures the mark on the pattern surface Ga, compares the captured mark with the recorded mark, and detects the inclination of the imaging axis of the imaging unit 30 to the pattern surface Ga of the substrate G. Next, the position of the imaging unit 30 may be corrected such that the imaging axis of the imaging unit 30 is orthogonal to the pattern surface Ga based on the detected tilt. Thereby, the imaging unit 30 can accurately capture the pattern of the substrate G, and the measurement unit 51 can accurately recognize the shape of the pattern of the substrate G from the captured image.

Further, in the above, although the interval between the adjacent patterns P is measured The line width A of the pattern P is not limited thereto, and the interval between the non-adjacent patterns may be measured as the line width, and the pattern width or the like may be measured.

Additional effects or modifications can be readily derived by those of ordinary skill in the art of the invention. Therefore, the invention in its broader aspects is not limited to the specific details and representative embodiments described herein. Accordingly, various modifications may be made without departing from the spirit and scope of the inventions.

18‧‧‧Line width measuring device

20‧‧‧Transportation Department

21‧‧‧Roller

22‧‧‧Substrate position detection department

30‧‧‧Photography Department

31‧‧‧Camera Height Measurement Department

40‧‧‧Mobile Department

41‧‧‧ Guide rail

42‧‧‧Sliding section

43‧‧‧Connecting Department

44‧‧‧Installation board

50‧‧‧Measurement control device

G‧‧‧Substrate

Ga‧‧‧ patterned surface

Claims (12)

A measuring apparatus comprising: a conveying unit that conveys a substrate on which a pattern is formed; and an imaging unit that is disposed above the conveying unit and that images a pattern of the substrate placed on the conveying unit; and a measuring unit And measuring a shape of the pattern based on image information of the pattern captured by the imaging unit; and moving the portion to move the pattern surface on the substrate on the substrate in a horizontal direction; and measuring a height of the camera The measurement is performed by measuring the height of the pattern from the lens of the imaging unit to the pattern surface of the substrate, and measuring the height from the imaging unit to the Z-axis direction of the substrate by using the camera height measuring unit. As a result, the amplitude of the substrate that is vibrated is calculated, and the movement is controlled such that the distance from the lens of the imaging unit to the pattern surface of the substrate becomes the working distance of the imaging unit in response to the calculated central value of the amplitude. The action of the ministry. The measuring device according to claim 1, wherein the measuring unit calculates an edge intensity of the pattern based on image information of the pattern captured by the imaging unit, and the calculated edge intensity is When the predetermined edge strength is equal to or greater than above, the shape of the pattern is measured based on the image information of the pattern. The measuring device of claim 2, wherein In the measurement unit, when the edge intensity is less than the predetermined edge strength, the imaging unit performs imaging of the pattern of the substrate again. The measuring device according to the first, second or third aspect of the invention, further comprising: a memory unit having a pattern shape in which the substrate is previously stored; wherein the measuring unit calculates image information of the pattern captured by the imaging unit The shape of the pattern is measured based on the image information of the pattern when the calculated correlation value is equal to or greater than a predetermined correlation value from the correlation value of the pattern shape memorized by the memory unit. The measuring device according to claim 4, wherein the measuring unit causes the imaging unit to perform imaging of the pattern of the substrate again when the correlation value is less than the predetermined correlation value. The measuring device according to the fourth aspect of the invention, wherein the measuring unit adjusts the position of the imaging unit after the correlation value is 0, and causes the imaging unit to perform imaging of the pattern of the substrate again. The measuring device according to any one of claims 1 to 3, wherein the measuring unit divides a pattern surface of the substrate into a plurality of regions and is in a predetermined region of one of the plurality of regions. Measuring the aforementioned pattern After the measurement in the predetermined region is completed, when the second substrate to be measured is transported by the transport unit, the image pickup unit is moved to correspond to the second substrate via the moving portion. The other regions of the predetermined region are different in the region, and the shape of the pattern is measured in the other regions. The measuring device according to the seventh aspect of the invention, wherein the measuring unit performs the measurement of the shape of the pattern on the plurality of measurement points in the second substrate, and the plurality of measurement points of the second substrate include There is a measurement point corresponding to the position of the measurement point measured on the substrate. The measuring device according to any one of claims 1 to 3, wherein the plurality of imaging units are plural, and the measuring unit measures the patterns based on image information captured by a plurality of the imaging units. shape. The measuring device according to any one of the first to third aspects of the present invention, wherein the measuring unit determines the image information of the plurality of patterns obtained by causing the image capturing unit to capture the pattern of the substrate a plurality of times. The shape of the aforementioned pattern. A substrate processing system characterized by comprising: a photoresist coating device, a photoresist coated on the substrate; an exposure device, and a photoresist formed by the photoresist coating device a film exposed to a predetermined pattern shape; a partial exposure device for performing local exposure on the photoresist film formed by the photoresist coating device; a developing device for the exposure device and the partial exposure device The substrate after exposure is developed to form a pattern, and the measuring device measures the shape of the pattern formed on the substrate. The measuring device includes a transfer unit that transports the substrate on which the pattern is formed, and an imaging unit. Arranging on the upper side of the transport unit and photographing a pattern of the substrate placed on the transport unit; the measurement unit measures the shape of the pattern based on image information of the pattern captured by the imaging unit; The image pickup unit moves the pattern surface on which the pattern is formed on the substrate in the horizontal direction, and the camera height measurement unit measures the height from the lens of the image pickup unit to the pattern surface of the pattern formed on the substrate. A measurement method comprising: a transporting project, wherein the substrate is transported by transporting a transport unit that forms a patterned substrate; and the imaging project is placed above the transport unit and placed on the transport unit An imaging unit that captures a pattern of the substrate of the transport unit, captures a pattern of the substrate, and measures a shape of the pattern based on image information of the pattern captured by the imaging project; In the moving project, the imaging unit moves the moving unit that moves in the horizontal direction on the pattern surface of the substrate, and the measurement unit moves the lens from the imaging unit to the pattern. The height of the pattern surface formed on the substrate.