TW202100949A - Measurement device, circuit board processing system, and measurement method - Google Patents

Abstract

To provide a technique for accurately capturing images of pattern shapes. A measurement device according to an embodiment includes a conveyor unit, an image capturing unit, and a measurement unit. The conveyor unit conveys a circuit board having a pattern formed thereon. The image capturing unit starts capturing an image of the circuit board when the distance to the circuit board therefrom is within a predetermined focusing range. The measurement unit measures a shape of the pattern based on the captured image information.

Description

Measuring device, substrate processing system and measuring method

This disclosure relates to measuring devices, substrate processing systems, and measuring methods.

Patent Document 1 discloses that a patterned substrate is photographed by a photographing device, and the shape of the pattern is measured based on the image information of the pattern obtained by photographing. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] JP 2015-72257 A

[The problem to be solved by the invention]

This disclosure provides a technique for accurately measuring the shape of a pattern. [Means to solve the problem]

The measurement device according to one aspect of the present disclosure includes a transport unit, an imaging unit, and a measurement unit. The conveying part conveys the patterned substrate. When the distance between the imaging unit and the substrate is within a specific focus range, the substrate is photographed. The measuring unit measures the shape of the pattern based on the image information obtained by photography. [Effects of Invention]

According to this disclosure, the shape of the pattern can be measured accurately.

Hereinafter, with reference to the attached drawings, the implementation of the measuring device, substrate processing system and measuring method disclosed in this case will be described in detail. In addition, the measurement device, substrate processing system, and measurement method disclosed in the embodiments shown below are not limited.

(First implementation type) [Substrate Processing System] First, the configuration of the substrate processing system 1 according to the first embodiment will be described with reference to FIG. 1. FIG. 1 is a schematic explanatory diagram showing the structure of a substrate processing system 1 according to the first embodiment.

The substrate processing system 1 according to the first embodiment shown in FIG. 1 performs, for example, a photolithography process on a substrate G to be processed (hereinafter referred to as "substrate G", not shown in FIG. 1) And the processing unit that forms the pattern. In addition, the substrate processing system 1 may form patterns by processes other than the photolithography process.

The substrate processing system 1 includes a photoresist coating device 11, a reduced-pressure drying device 12, a pre-baking device 13, a cooling device 14, an exposure device 15, a partial exposure device 16, a developing device 17, and a line width measuring device 18 (measurement device ). The aforementioned devices 11-18 are integrally connected in the order of the devices 11-18 in the positive direction of the X axis, for example. In addition, the arrangement of the devices 11 to 18 is not limited to this. The devices 11 to 18 may be arranged in plural rows, for example, two rows parallel to the X axis.

Each of the above-mentioned devices 11 to 18 conveys the substrate G in the positive X-axis direction by a conveying mechanism. The conveying mechanism is a conveying mechanism such as a roller conveyor, a belt conveyor, or a chain conveyor. In addition, the transport mechanism may be a floating transport mechanism. The suspension type transport mechanism supports, for example, the end of the substrate G from below, and moves the substrate G while blowing compressed air toward the substrate G from below to hold the substrate G horizontally.

The substrate G is conveyed by the conveying mechanism while passing through each of the devices 11 to 18 to form a pattern. In this way, in the substrate processing system 1, the devices 11 to 18 are connected in series to perform the photolithography process. Furthermore, in the substrate processing system 1, the substrate G is sequentially flowed by the conveying mechanism every specific time or at specific intervals.

The photoresist coating device 11 applies a photosensitive photoresist to the substrate G. That is, the photoresist coating device 11 forms a photoresist film on the substrate G. In addition, as the photoresist, even if it is either a positive photoresist or a negative photoresist, it can be applied.

The reduced-pressure drying device 12 arranges the substrate G in the chamber under reduced pressure, and dries the photoresist film formed on the substrate G. The pre-baking device 13 heats the substrate G to evaporate the solvent of the photoresist film, and fix the photoresist film on the substrate G. The cooling device 14 cools the substrate G heated by the pre-baking device 13 until it reaches a specific temperature.

The exposure device 15 uses a mask to expose the photoresist film formed on the substrate G into a specific pattern shape. The partial exposure device 16 locally exposes the photoresist film in order to suppress the deviation of the pattern formed on the substrate G, for example. That is, for example, assuming that the line width of the pattern formed on the substrate G is different from the expected line width, the partial exposure device 16 locally exposes the part where the line width of the pattern is different from the expected line width to correct the pattern The line width.

In the developing device 17, the substrate G exposed by the exposure device 15 and the partial exposure device 16 is immersed in a developing solution to perform development processing, and a pattern is formed on the substrate G. The line width measuring device 18 measures the line width of the pattern formed on the substrate G by the development process in the developing device 17.

In addition, in the above, although the pattern that is the object of measurement is the line width of the pattern, this is an example and is not limited. That is, if the pattern is related to the shape of the pattern, it may be anything. Specifically, the object of measurement, that is, if the pattern is the size, curvature, and layout of the pattern, such as the length or thickness of the pattern, as well as the defect or deformation of the pattern, which is related to the shape of the pattern.

[Constitution of line width measuring device] Next, the line width measuring device 18 will be described with reference to FIGS. 2 and 3. Fig. 2 is a schematic side view showing the configuration of the line width measuring device 18 according to the first embodiment. Fig. 3 is a schematic perspective view showing the configuration of the line width measuring device 18 according to the first embodiment. In addition, in the following, as shown in FIGS. 2 and 3, the Y-axis direction and the Z-axis direction orthogonal to the above-mentioned X-axis direction are defined, and the positive direction of the Z-axis is defined as a vertical upward direction. In addition, let the direction including the X axis and the Y axis be a horizontal direction.

The line width measuring device 18 includes a conveying unit 20, an imaging unit 30, a moving unit 40, an FFU (Fan Filter Unit) 60, and a measurement control device 50.

The conveyance part 20 is a part of the conveyance mechanism of the said substrate processing system 1, for example, a roller conveyor. The conveyance part 20 conveys the substrate G placed on the roller 21 in the horizontal direction, specifically, the positive direction of the X axis by rotating the plurality of rollers 21. In addition, in FIG. 3, the drum 21 is shown in perspective.

The conveying unit 20 conveys the substrate G that has been conveyed from the developing device 17 arranged before the line width measuring device 18 in the substrate processing system 1. The operation of the transport unit 20, specifically, the rotation of the drum 21 is controlled by the measurement control device 50.

Furthermore, in the conveyance section 20, a plurality (for example, four) of the substrate position detection sections 22 shown by the broken line in FIG. 3 are arranged near the conveyance surface where the substrate G is conveyed. The substrate position detection unit 22 outputs a detection signal to the measurement control device 50 when the substrate G is located above. As the substrate position detecting section 22, for example, an optical inventory sensor is used.

The substrate position detection unit 22 is arranged to be located below the substrate G when the substrate G is placed at a specific position. The specific position is a position where the pattern of the substrate G can be photographed by the photographing unit 30. In addition, the number of substrate position detection units 22 may be three or less, and may be five or more.

The photographing unit 30 is arranged above the conveying unit 20 in the Z-axis direction, and photographs the pattern of the substrate G placed on the conveying unit 20 from above. As the imaging unit 30, for example, a CCD (Charge Coupled Device) camera can be used. Information (hereinafter referred to as “image information”) of the image obtained by the photographing by the photographing unit 30 is input to the measurement control device 50. The photographing unit 30 starts photographing and performs photographing based on the signal output from the measurement control device 50.

In the vicinity of the imaging unit 30, a camera height measuring unit 31 is provided. The camera height measuring unit 31 measures the height in the Z axis direction from the lens of the imaging unit 30 to the pattern surface (upper surface) Ga on which the pattern is formed on the substrate G. The measurement result by the camera measurement unit 31 is input to the measurement control device 50 and used to adjust the height of the imaging unit 30. In addition, as the camera height measuring unit 31, a laser displacement meter is used.

The moving part 40 moves the imaging part 30 with respect to the pattern surface Ga of the substrate G in the horizontal direction (X-Y axis direction) or the vertical direction (Z direction). Specifically, the moving part 40 includes a rail part 41, a sliding part 42, and a connecting part 43.

The rail portions 41 are respectively arranged on both end sides in the Y-axis direction of the conveying portion 20 and extend along the X-axis direction. The sliding portion 42 is connected to each rail portion 41 in a slidable (slidable) manner. That is, the sliding portion 42 linearly moves along the rail portion 41 in the X-axis direction.

The connecting portion 43 is spanned above the substrate G and connects the sliding portions 42 to each other. The photographing section 30 and the camera height measuring section 31 are connected to the connecting section 43 so as to be movable in the Y-axis and Z-axis directions via the mounting plate 44.

Although not shown, the moving unit 40 includes a drive source that moves the sliding portion 42 in the X-axis direction with respect to the guide rail 41, and a drive source that moves the imaging unit 30 and the like in the Y-axis direction and the Z-axis direction with respect to the connecting portion 43. As the above-mentioned drive source, for example, an electric motor is used. Accordingly, by, for example, the measurement control device 50 can control the drive source of the moving unit 40 to move the imaging unit 30 relative to the substrate G in three directions of the X, Y, and Z axis directions.

The FFU 60 is an air supply unit that is installed on the top surface 18b of the chamber 18a containing the transport unit 20 and the like, and supplies clean air to the substrate G.

Next, the measurement control device 50 will be described with reference to FIG. 4. FIG. 4 is a block diagram of the measurement control device 50 according to the first embodiment.

The measurement control device 50 is a computer equipped with a measurement unit 51 and a storage unit 52. In addition, the measurement control device 50 is connected to each of the conveying unit 22, the substrate position detecting unit 22, the imaging unit 30, the camera height measuring unit 31, the moving unit 40, and the like in a communicable manner.

A program for controlling the line width measurement processing is stored in the storage unit 52. The measuring unit 51 controls the operation of the line width measuring device 18 by reading the program stored in the memory unit 52.

In addition, such a program is recorded in a storage medium readable by a computer, even if it is installed in the storage section 52 of the measurement control device 50 from the storage medium. As a storage medium that can be read by a computer, for example, there are hard disk (HD), compact disk (CD), magneto-optical disk (MO), flash memory, memory card, etc.

In the memory portion 52, the pattern shape of the substrate G (hereinafter referred to as the "memory pattern shape" and the position information of the pattern to be measured on the substrate G) is further memorized in advance. For example, the pattern shape of the substrate G is measured at plural places. Fig. 5 It is a schematic enlarged view of the substrate G for explaining the shape and position information of the memory pattern. In addition, here, in order to measure the multiple patterns formed on the substrate G, the line of the pattern P indicated by the symbol A in FIG. 5 The broad case is explained as an example. Furthermore, in Fig. 5, for easy understanding, diagonal lines are indicated in the pattern.

In the vicinity of the pattern P to be measured, as indicated by a dotted line, there is a pattern B that becomes a shape of a mark with respect to the pattern P. The memory part 52 memorizes the shape of the pattern B in advance as the "memory pattern shape B". The memory pattern shape B is in the line width measurement processing, and the image information is used to determine whether the pattern P to be measured is included, but this will be described later.

In addition, the memory pattern shape B is set at the position (also referred to as "measurement point") of each pattern to be measured and is stored in the memory unit 52. However, for example, when the memory pattern shape B has the same shape at 2 or more measurement points, the memory pattern B may be shared even at 2 or more measurement points.

Furthermore, the above-mentioned position information is, for example, pixel coordinate information indicating the relative position of the measurement point to the pattern corresponding to the memory pattern shape B in the captured image. In detail, in the memory pattern shape B, the origin O as shown in FIG. 5 is set, and the pixel coordinates include the information of the start position XY1 and the end position XY2 of the measurement point to the origin O.

Specifically, as the starting point position XY1, set the lower end position of one of the patterns P to be measured (in Figure 5, the upper pattern P), and set the end position XY2 to set the other side of the pattern P to be measured (in Figure 5 The upper end position of the pattern P) on the middle and lower side. In addition, the distance between the starting point position XY1 and the ending point position XY2 is measured as "line width A". The measurement of the line width A will be described later. In addition, the information of the starting point position XY1 and the ending point position XY2 is represented by the X and Y coordinates in the pixels of the photographed image.

In addition, the measurement control device 50 feeds back data on the line width of the pattern measured by the line width measurement process. In the partial exposure device 16, the line width of the measured pattern is compared with the expected line width. In the case of deviation, the deviation is calculated. Based on the calculated deviation, the illuminance of the exposure or the local The location of the exposure, etc. In this way, the corrected illuminance or the position of the substrate G can be partially exposed to the substrate G transported to the partial exposure device 16 after correction, and the line width of the pattern of the substrate G can be corrected to the expected line width. .

[Processing of line width measuring device] Next, the specific content of the line width measurement process performed by the line width measurement device 18 will be described with reference to FIG. 6. FIG. 6 is a flowchart showing the processing procedure of the line width measurement processing according to the first embodiment. In addition, in the line width measuring device 18, each processing sequence shown in FIG. 6 is executed under the control of the measuring section 51 of the measuring control device 50.

The measurement unit 51 controls the operation of the transport unit 20 to transport the substrate G subjected to the development process (step S1). The measurement unit 51 determines whether the substrate G is placed at a specific position based on the detection signal output from the substrate position detection unit 22 (step S2).

When the measuring unit 51 determines that the substrate G is not placed in a specific position (step S2, NO), the processing ends as it is. In addition, when the measuring unit 51 determines that the substrate G is placed at a specific position (step S2, Yes), the operation of the conveying unit 20 is stopped to stop the substrate G (step S3).

The measurement part 51 determines the position of the measurement point of the pattern in the board|substrate G, specifically, the measurement point of this measurement (step S4).

The measurement unit 51 controls the operation of the moving unit 40 such that the imaging unit 30 moves above the determined measurement point (step S5). Specifically, the measurement unit 51 moves the imaging unit 30 in the horizontal direction, and moves the imaging unit 30 above the measurement point.

In addition, even if the measuring unit 51 measures the distance between the imaging unit 30 and the substrate G, it moves the imaging unit 30 in the Z direction while moving the imaging unit 30 in the horizontal direction so that the measured distance falls within a predetermined range. It can be moved. In other words, even if the measurement unit 51 follows the deflection of the substrate, the imaging unit 30 may be moved in the Z direction while moving the imaging unit 30 above the measurement point.

The measuring unit 51 adjusts the height in the Z-axis direction of the imaging unit 30 (step S6). Specifically, the measuring unit 51 controls the movement of the moving unit 40 based on the measurement result of the camera measuring unit 31 after a certain time has elapsed after the imaging unit 30 has moved above the measuring point. That is, the measuring section 51 adjusts the height of the substrate G in the Z-axis direction after a certain waiting time has elapsed after the substrate G has moved to the substrate imaging position in the horizontal direction.

The specific waiting time is a time set in advance, and the time for the horizontal vibration of the imaging unit 30 to converge. The measuring unit 51 controls the movement of the moving unit 40 so that the distance from the lens of the imaging unit 30 to the pattern surface Ga of the substrate G becomes the accurate focusing distance of the imaging unit 30. The accurate focusing distance is the distance that minimizes the shaking in the image photographed by the photographing section 30.

More specifically, the measuring unit 51 uses the camera height measuring unit 31 to measure the height in the Z-axis direction from the imaging unit 30 to the substrate G multiple times. Furthermore, the measurement unit 51 calculates the amplitude of the vibrating substrate G based on the obtained measurement result. In addition, the measuring unit 51 controls the movement of the moving unit 40 so that the distance from the lens of the imaging unit 30 to the pattern surface Ga of the substrate G becomes the accurate focusing distance of the imaging unit 30 in accordance with the calculated median value of the amplitude.

According to this, even when the substrate G vibrates, an in-focus image can be easily photographed in the photographing process described later. In addition, in the above, although the median value of the amplitude is used, it is not limited to this, and may be, for example, an arithmetic mean or mode.

The measurement unit 51 determines whether or not the number of times of imaging of the pattern by the imaging unit 30 is a specific number or more (step S7). The specific number of times is set to, for example, an integer of 2 or more.

It is determined by the measuring unit 51 that the number of times of shooting is less than the specified number of times (step S7, No), and the shooting process is performed (step S8). The photographic processing will be described later.

The measurement unit 51 performs a pattern search process after performing the imaging process (step S9). In the pattern search process, for example, the correlation value between the pattern shape included in the image information (hereinafter referred to as the "image pattern shape") and the memory pattern shape B stored in the memory unit 52 is calculated. In addition, the correlation value is a value indicating the similarity between the image pattern shape and the memory pattern shape B.

Next, the measuring unit 51 determines whether or not the calculated correlation value is equal to or greater than the specific correlation value (step S10). When the correlation value is less than the specific correlation value, the measurement unit 51 determines that the pattern P to be measured does not contain the pattern that matches the pattern shape B in the image information. Furthermore, when the correlation value is greater than or equal to the specific correlation value, the measurement unit 51 determines that the image information includes a pattern matching the memory pattern shape B. As a result, it is determined that the pattern P to be measured is included.

That is, the pattern search process is a process of determining whether the position of the imaging unit 30 is shifted from the pattern P (measurement point) to be measured. Therefore, when the correlation value is less than the specific correlation value (step S10, No), the measurement unit 51 determines that the image information does not include the pattern P to be measured, and determines that it is located at a position different from the measurement point of the imaging unit 30, and adjusts the imaging unit 30 Position (step S11).

The measurement unit 51 moves, for example, the imaging unit 30 in the horizontal direction. In addition, even if the measuring unit 51 reduces the magnification of the lens of the imaging unit 30 to enlarge the camera field of view, the imaging unit 30 may be moved to the measurement point based on the image information from the enlarged camera field of view.

After adjusting the position of the imaging unit 30, the measurement unit 51 executes the imaging process again (step S8).

In this way, when the correlation value is less than the specific correlation value, by making the photographing section 30 perform photographing of the pattern of the substrate G again, the measuring section 51 can prevent erroneous measurement of line widths other than the line width A of the pattern P to be measured. situation.

When the correlation value is greater than or equal to the specific correlation value (step S10, Yes), the measurement unit 51 calculates the edge strength of the pattern based on the image information, and determines whether the calculated edge strength is greater than or equal to the specific edge strength (step S12).

Edge intensity refers to the degree of change in the intensity of the boundary (contour) in the pattern being photographed. As the edge intensity increases, the intensity becomes clearer and the so-called image is focused.

When the edge strength is less than the specified edge strength (step S12, No), the measuring unit 51 returns to step S7 to perform the above processing because the image captured by the imaging unit 30 is out of focus. Moreover, if the number of times of photography has not reached the specified number of times, in other words, when the number of times of photography has not reached the specified number of times, the measuring unit 51 performs the photography of the pattern of the substrate G again in step S8, and performs the processing after step S9 again.

When the edge strength is greater than or equal to the specific edge strength (step S12, Yes), the measurement unit 51 uses the image to be captured to calculate the start position XY1 and the end position of the measurement point because the image is in focus. XY2 (step S13).

Specifically, the measurement unit 51 calculates the start position XY1 and the end position XY2 of the measurement point from the position of the pattern that has a high correlation value with respect to the memory pattern shape B in the in-focus image and matches the memory pattern shape B.

In detail, the origin O is set in the memory pattern shape B as described above (refer to FIG. 5). The measurement unit 51 sets the position corresponding to the origin O in the pattern corresponding to the memory pattern shape B in the captured image as the "reference point". In addition, the measurement unit 51 calculates the start position XY1 and the end position XY2 based on the reference point and the pixel coordinate information as the position information of the storage unit 52.

The measuring unit 51 measures the distance between the start point position XY1 and the end point position XY2 calculated in step S13 as the line width A of the pattern P at the measurement point (step S14). That is, the measuring unit 51 measures the pattern shape of the substrate G based on the image information obtained by the imaging unit 30.

The measurement unit 51 determines whether the measurement of a plurality of measurement points is completed (step S15). When it is determined that the measurement of a plurality of measurement points is not completed (step S15, No), the measurement unit 51 returns to step S4, determines the position of another measurement point, and performs the line width measurement of steps S5 to S14 described above. In addition, when the measurement of the plural measurement points is completed by the measurement unit 51 (step S15, Yes), the processing this time is ended. That is, the line width measurement processing for the substrate G is ended.

[Photographic processing] Next, the specific content of the photographing process will be described with reference to FIG. 7. Fig. 7 is a flowchart showing the processing procedure of the photographing process according to the first embodiment.

The measuring part 51 measures the distance from the camera of the imaging part 30 to the pattern surface Ga of the board|substrate G by the camera height measuring part 31 (step S20).

The measurement part 51 determines whether the distance from the camera of the imaging part 30 to the pattern surface Ga of the board|substrate G becomes short (step S21). Specifically, the measurement unit 51 determines whether the distance measured in the current process is shorter than the distance measured in the previous process.

When the distance from the camera of the imaging unit 30 to the pattern surface Ga of the substrate G does not decrease (step S21, No), the measurement unit 51 returns to step S20 and repeats the above-mentioned processing.

The measuring unit 51 determines whether the distance from the camera of the imaging unit 30 to the pattern surface Ga of the substrate G becomes shorter (step S21, Yes) The shooting start distance (step S22). The shooting start distance is set within a specific focus range including accurate focus. The specific focus range is the range of the line width of the pattern P can be accurately measured due to the small shake in the image captured by the imaging unit 30.

Specifically, the shooting start distance is the upper limit shooting start distance that is longer than the accurate focusing distance. The upper limit imaging start distance is set so that the distance from the camera of the imaging unit 30 to the pattern surface Ga of the substrate G within the specific focus range during the imaging time from the start of the imaging to the end of the imaging. The upper limit of the shooting start distance is set according to the performance of the shooting section 30, specifically, according to the shooting time. The upper limit of the shooting start distance is the shorter the shooting time, the closer to the exact focus distance.

When the distance from the camera of the imaging unit 30 to the pattern surface Ga of the substrate G becomes the imaging start distance (step S22, Yes), the measurement unit 51 starts imaging and performs imaging (step S23).

When the distance from the camera of the imaging unit 30 to the pattern surface Ga of the substrate G becomes the imaging start distance (step S22, No), the measurement unit 51 returns to step S20 and repeats the above-mentioned processing.

In this way, the distance from the camera of the imaging unit 30 to the pattern surface Ga of the substrate G is shortened in the measuring unit 51, and the distance from the camera of the imaging unit 30 to the pattern surface Ga of the substrate G becomes the upper limit of the imaging start distance Photography is performed at a specific timing.

The measuring section 51 adjusts the height of the photographing section 30 in the Z-axis direction before the photographing process so that the distance from the lens of the photographing section 30 to the pattern surface Ga of the substrate G becomes the accurate focusing distance of the photographing section 30 (Figure Step 6 of 6). However, the distance from the lens of the imaging section 30 to the pattern surface Ga of the substrate G is changed by the vibration of the imaging section 30 or the substrate G in the Z-axis direction.

Then, the measuring unit 51 first determines whether the distance from the camera of the imaging unit 30 to the pattern surface Ga of the substrate G is shortened by the vibration in the Z-axis direction of the imaging unit 30 or the substrate G. That is, the measurement unit 51 determines whether the camera is close to the substrate G or the camera is far away from the substrate G by the vibration of the imaging unit 30 or the substrate G in the Z axis direction. Furthermore, the measuring unit 51 is a case where the distance from the camera of the imaging unit 30 to the pattern surface Ga of the substrate G becomes shorter, and the distance from the camera of the imaging unit 30 to the pattern surface Ga of the substrate G becomes the imaging start distance. Start photography.

Accordingly, the imaging unit 30 performs imaging at a specific timing based on the distance from the camera of the imaging unit 30 to the pattern surface Ga of the substrate G. That is, even if the imaging unit 30 performs imaging at different measurement points or different substrates G, it can perform imaging at a specific timing based on the distance from the camera of the imaging unit 30 to the pattern surface Ga of the substrate G.

For example, the distance from the camera of the imaging unit 30 to the pattern surface Ga of the substrate G changes as shown by the solid line or the broken line in FIG. 8. FIG. 8 is a diagram illustrating the timing of the start of photography in the photography processing according to the first embodiment.

The line width measuring device 18 changes the distance from the camera of the imaging unit 30 to the pattern surface Ga of the substrate G as shown by the solid line in FIG. 8, and starts imaging when the time T1 reaches a specific timing.

For example, when the distance from the camera of the imaging unit 30 to the pattern surface Ga of the substrate G changes as shown by the broken line in FIG. 8, when the imaging starts at time T1, the imaging starts outside the specific focus range. Therefore, the image to be photographed may become an out-of-focus image.

In this regard, the line width measuring device 18 is a situation in which the distance from the camera of the imaging section 30 to the pattern surface Ga of the substrate G changes as shown by the broken line in FIG. 8, and starts imaging when the time T2 becomes a specific timing. .

In this way, the line width measuring device 18 performs photography at a specific timing based on the distance from the camera of the photography section 30 to the pattern surface Ga of the substrate G, so that the focus state of each image captured can be close status.

[effect] The line width measuring device 18 starts to photograph the substrate G when the distance from the camera of the photographing section 30 to the pattern surface Ga of the substrate G is within a specific focus range. Specifically, the line width measuring device 18 starts imaging when the distance from the camera of the imaging unit 30 to the pattern surface Ga of the substrate G becomes the imaging start distance set within the specific focus range. Furthermore, the line width measuring device 18 measures the shape of the pattern based on the image information.

According to this, the line width measuring device 18 can photograph an image in focus even when the photographing section 30 or the substrate G vibrates. Therefore, the line width measuring device 18 can accurately photograph the pattern shape of the substrate G. Therefore, the line width measuring device 18 can accurately measure the pattern shape of the substrate G.

In addition, the line width measuring device 18 shortens the distance from the camera of the imaging section 30 to the pattern surface Ga of the substrate G, and the distance from the camera of the imaging section 30 to the pattern surface Ga of the substrate G becomes the upper limit. In the case of distance, start photography.

According to this, the line width measuring device 18 can perform each shooting at a specific timing. Therefore, the line width measuring device 18 brings the in-focus states of the photographed images to a close state, and can photograph the images with the same characteristics of, for example, shaking. Therefore, the line width measuring device 18 can accurately measure the pattern shape of the substrate G.

The line width measuring device 18 moves the photographing section 30 in the Z-axis direction after the photographing section 30 is moved in the horizontal direction after a specified waiting time has elapsed so that the photographing section 30 is positioned above the measuring point. The distance to the pattern surface Ga of the substrate G.

According to this, the line width measuring device 18 can photograph an image in which the shaking in the horizontal direction is suppressed. Therefore, the line width measuring device 18 can accurately photograph the pattern shape of the substrate G, and can accurately measure the pattern shape of the substrate G.

(Second Implementation Type) Next, the configuration of the substrate processing system 1 according to the second embodiment will be described. Here, the description will be focused on differences in the configuration of the substrate processing system 1 according to the first embodiment. Regarding the same configuration of the substrate processing system 1 according to the first embodiment, the same symbols as those of the substrate processing system 1 according to the first embodiment are assigned, and detailed descriptions are omitted.

As shown in FIG. 9, the line width measuring device 18 of the substrate processing system 1 according to the second embodiment includes a discharge unit 70 that functions as an excitation unit. FIG. 9 is a schematic side view showing the configuration of the line width measuring device 18 according to the second embodiment.

The discharge unit 70 is provided above the substrate G. The discharge unit 70 is provided to move together with the imaging unit 30. The discharge unit 70 is provided on the imaging unit 30 or the mounting plate 44, for example.

The discharge part 70 is supplied with air compressed by the air supply source 71 via the air supply pipe 72, and discharges the air toward the substrate G intermittently. Specifically, the discharge unit 70 discharges air from above the substrate G toward the substrate G to excite the substrate G in the Z-axis direction.

The ejection unit 70 ejects air toward the substrate G during the imaging process to excite the substrate G. That is, the ejection unit 70 excites the substrate G when the image of the pattern of the substrate G is imaged by the imaging unit 30. The substrate G discharged from the air by the discharge unit 70 vibrates with a stable amplitude and period.

The line width measuring device 18 includes a discharge unit 70 that intermittently discharges air toward the substrate G. Accordingly, when the line width measuring device 18 is performing imaging processing, the discharge unit 70 excites the substrate G to change the distance from the camera of the imaging unit 30 to the pattern surface Ga of the substrate G. Therefore, the line width measuring device 18 can generate a specific time sequence, and can perform photography at a specific time sequence. Furthermore, the line width measuring device 18 can quickly generate a specific sequence, which can shorten the processing time of the substrate G.

Furthermore, the discharge unit 70 moves together with the imaging unit 30. In this way, the line width measuring device 18 can vibrate the vicinity of the place where the imaging is performed by the imaging unit 30, and can perform imaging at a specific timing.

In addition, the line width measuring device 18 may photograph the pattern of the substrate G by the plural photographing unit 30. In this case, the line width measuring device 18 includes a plural discharge unit 70 corresponding to the imaging unit 30. Furthermore, the lengths of the plural air supply pipes 72 for supplying air to the respective discharge parts 70 are set to the same length in accordance with the discharge timing of the air discharged from the plural discharge parts 70.

(Modification) Even if the line width measuring device 18 according to the modification example is as shown in FIG. 10, the discharge part 70 may be provided below the substrate G, and air may be discharged from below the substrate G toward the substrate G. Fig. 10 is a schematic side view showing the configuration of the line width measuring device 18 according to the modification.

The discharge part 70 discharges air toward the substrate G from between the rollers 21. The discharge part 70 is provided in plural under the substrate G. The discharge unit 70 supplies air intermittently via a branch pipe 73 branched from the air supply pipe 72. According to this, it is possible to match the discharge timing of the air discharged from the plural discharge unit 70. In addition, the line width measuring device 18 according to the modification example may discharge air toward the substrate G using a plurality of air supply sources 71 and a plurality of air supply pipes 72.

In addition, the line width measuring device 18 according to the modified example may move the discharge unit 70 provided below the substrate G together with the imaging unit 30. In addition, the line width measuring device 18 according to the modified example may move the discharge unit 70 provided below the substrate G together with the imaging unit 30.

In addition, the line width measuring device 18 according to the modification example may be provided with the discharge part 70 above the substrate G and below the substrate G, respectively. In this case, the line width measuring device 18 according to the modified example, for example, in the case where the end side of the substrate G in the Y-axis direction is photographed by the photographing section 30, the substrate G is made by the ejection section 70 provided below the substrate G. G excites. Furthermore, in the line width measuring device 18 according to the modification, for example, in the case where the center side of the substrate G in the Y-axis direction is photographed by the photographing section 30, the substrate G is made by the ejection section 70 provided above the substrate G. Excite. That is, the line width measuring device 18 according to the modified example switches between the ejection section 70 provided above the substrate G and the ejection section 70 provided below the substrate G in accordance with the position of the substrate G photographed by the photographing section 30 Spit out of the air.

In addition, the line width measuring device 18 according to the modified example does not care about the position of the substrate G photographed by the photographing section 30, even when air is discharged from the discharge section 70 provided above the substrate G and the discharge section 70 provided below the substrate G It can be. In this case, the line width measuring device 18 according to the modified example makes the air discharge timings in the respective discharge parts 70 different timings.

In addition, the line width measuring device 18 according to the modification example may excite the substrate G or the imaging section 30 in the Z-axis direction by the FFU 60 even during the imaging process. That is, the FFU60 functions as an excitation unit. The line width measuring device 18 according to the modified example changes the output of the FFU 60 to excite the substrate G or the imaging unit 30 via the chamber 18 a or the transport unit 20. Furthermore, the line width measuring device 18 according to the modified example can directly excite the substrate G even by changing the output of the FFU 60. In addition, the excitation unit that excites the substrate G or the imaging unit 30 in the Z-axis direction may be provided in the imaging unit 30, the guide rail 41, the drum 21, or the like. Even if the excitation part uses an electric motor or the like.

When the line width measuring device 18 according to the modified example performs imaging processing, the substrate G or the imaging unit 30 is excited by the excitation unit such as the discharge unit 70 or FFU 60, and the pattern surface of the board G from the camera of the imaging unit 30 is changed The distance to Ga. Accordingly, the line width measuring device 18 involved in the modification example can generate a specific time sequence, and can perform photography at a specific time sequence. Furthermore, the line width measuring device 18 according to the modified example can quickly generate a specific sequence, and the processing time of the substrate G can be shortened.

In addition, even if the line width measuring device 18 according to the modified example performs multiple photographs during the photographing process, it generates an image in which a plurality of photographed images are superimposed, and may generate image information based on the generated image. In this case, the line width measuring device 18 according to the modified example is in the case of performing multiple shootings, and each shooting starts at a specific timing.

In this way, the line width measuring device 18 according to the modified example can generate an image with less shake, and can accurately measure the pattern shape of the substrate G.

Furthermore, even if the line width measuring device 18 according to the modified example sets the imaging start distance to the lower limit imaging start distance which is shorter than the exact alignment distance. The lower limit imaging start distance is set so that the distance from the camera of the imaging section 30 to the pattern surface Ga of the substrate G within the specific focus range during the imaging time from the start of the imaging to the end of the imaging. The lower limit shooting start distance is set according to the performance of the shooting section 30, specifically, according to the shooting time. The lower limit of the shooting start distance is the shorter the shooting time, the closer to the accurate focusing distance.

In this case, the measuring section 51 increases the distance from the camera of the imaging section 30 to the pattern surface Ga of the substrate G, and the distance from the camera of the imaging section 30 to the pattern surface Ga of the substrate G becomes the lower limit imaging start distance Photography is performed at a specific timing. The line width measuring device 18 according to the modified example can achieve the same effect as the embodiment.

It is possible to combine the line width measurement device 18 according to the above-mentioned modification.

In addition, it should be understood that all points of the implementation type disclosed this time are examples and not intended to be limiting. In fact, the above-mentioned implementation types can be presented in various types. Furthermore, the above-mentioned implementation forms can be omitted, replaced or changed in various forms without departing from the scope of the appended patent application and the spirit thereof.

1: Substrate processing system 18: Line width measuring device (measuring device) 20: Handling Department 30: Photography Department 31: Camera height measurement section 40: Mobile Department 50: Measurement control device 51: Measurement Department 60: FFU (vibration unit) 70: Discharge Department

[Fig. 1] A schematic explanatory diagram showing the configuration of the substrate processing system according to the first embodiment. [Fig. 2] A schematic side view showing the configuration of the line width measuring device according to the first embodiment. [Fig. 3] A schematic perspective view showing the configuration of the line width measuring device according to the first embodiment. [Fig. 4] is a block diagram of the measurement control device according to the first embodiment. [Figure 5] A schematic enlarged view of the substrate used to illustrate the shape and position information of the memory pattern. [Fig. 6] is a flowchart showing the processing procedure of the line width measurement processing according to the first embodiment. [Fig. 7] is a flowchart showing the processing procedure of the photographing process according to the first embodiment. [Fig. 8] A diagram illustrating the timing of the start of photography in the photography process according to the first embodiment. [Fig. 9] A schematic side view showing the configuration of the line width measuring device according to the second embodiment. [Fig. 10] A schematic side view showing the configuration of the line width measuring device according to the modification example.

Claims (12)

A measuring device with: The transport part, which transports the patterned substrate; The photographing section, which starts photographing of the substrate when the distance from the substrate is within a specific focus range; and The measuring unit measures the shape of the pattern based on the image information obtained by the photography. Such as the measuring device of claim 1, wherein The imaging unit starts imaging of the substrate when the distance from the substrate becomes the imaging start distance set within the specific focus range. Such as the measuring device of claim 2, where The photographing section starts photographing of the substrate when the distance from the substrate becomes shorter and the distance from the substrate becomes the upper limit photographing start distance longer than the accurate focusing distance. Such as the measuring device of claim 2, where The imaging section starts imaging of the substrate when the distance from the substrate becomes longer and the distance from the substrate becomes a lower limit imaging start distance shorter than the accurate focusing distance. Such as the measuring device of any one of claims 1 to 4, wherein The measurement unit adjusts the distance from the substrate after a certain waiting time has elapsed after the substrate has moved to the substrate imaging position in the horizontal direction. Such as the measuring device of any one of claims 1 to 4, wherein Equipped with an excitation unit that excites the imaging unit or the substrate, The imaging unit starts imaging of the substrate in a state where the imaging unit or the substrate is excited by the excitation unit. Such as the measuring device of claim 6, wherein The excitation unit is an air supply unit that supplies clean air to the substrate. Such as the measuring device of claim 6, wherein The excitation unit intermittently supplies air to the substrate. Such as the measuring device of claim 8, wherein The excitation unit discharges the air from at least one of above the substrate and below the substrate. Such as the measuring device of claim 8 or 9, where The excitation unit can move together with the imaging unit. A substrate processing system with: Photoresist coating device, which coats photoresist on the substrate; A developing device, which develops the photoresist film formed by the photoresist coating device to form a pattern on the substrate after being exposed to a specific pattern shape; and A measuring device that measures the shape of a pattern formed on the substrate by the development process of the developing device, The above-mentioned measuring device has: The conveying part, which conveys the above-mentioned substrate with the pattern formed; The photographing section, which starts photographing of the substrate when the distance from the substrate is within a specific focus range; and The measuring unit measures the shape of the pattern based on the image information obtained by the photography. A measurement method with: Handling engineering, which is the handling of patterned substrates; The photographing process, which is to start photographing the above-mentioned substrate when the distance from the above-mentioned substrate is within a specific focus range; and The measurement process is to measure the shape of the pattern based on the image information obtained by the photography.

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