JP2004085664A - Drawing system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To draw a circuit pattern with no fault and high accuracy and to improve the work efficiency. <P>SOLUTION: The exposure system is equipped with a laser drawing apparatus 10 to draw a circuit pattern on a substrate S. The laser drawing apparatus 10 is provided with two variable focus CCD cameras 32 and 34. The position of reference holes P1 to P4 formed in the substrate S is detected based on the image photographed by the CCD cameras 32, 34 set at low magnification, and the drawing table 14 and the CCD cameras 32, 34 are relatively moved based on the detected result to position the holes P1 to P4 in the center of the viewing field of the CCD cameras 32, 34. Further, the relative position data of the of the substrate S with respect to the drawing table 14 are obtained based on the image photographed by the CCD cameras 32, 34 set at high magnification, and the substrate S is matched to the circuit pattern on drawing based on the obtained relative position data. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a laser writing apparatus that directly draws a circuit pattern on an object to be drawn by using a laser beam, and a writing system using the laser writing apparatus.
[0002]
[Prior art]
The laser drawing apparatus as described above is used in a drawing system for forming a fine circuit pattern on the surface of a substrate in, for example, a manufacturing process of an automated printed circuit board. As a conventional example, Japanese Patent Application Laid-Open No. 10-162145 discloses No. In a writing system, a photosensitive object to be drawn, for example, a substrate provided with a photoresist layer on its surface is transported to a laser writing apparatus, and the photoresist layer is exposed in the laser writing apparatus. Specifically, CAD / CAM is used. The laser beam is modulated according to the raster data of the circuit pattern designed / edited by the system, and only the circuit pattern portion of the photoresist layer is photo-cured by raster scanning, whereby the circuit pattern is directly drawn on the photoresist layer. After drawing, the uncured photoresist on the substrate discharged from the laser drawing device is washed away with a solvent and treated with a chemical that corrodes copper, etc., and the portion where the photoresist remains adhered remains without being corroded. Thus, the same circuit pattern as the designed circuit pattern is formed on the substrate.
[0003]
By the way, in the laser drawing apparatus, the substrate is placed on the drawing table, and the drawing table, that is, the substrate is relatively moved in the sub-scanning direction while the laser beam is deflected in the main scanning direction with respect to the substrate on the drawing table. The drawing is performed by. Since a laser drawing apparatus is required to always draw a circuit pattern on a plurality of substrates of the same standard at the same position, conventionally, a relative position of a reference hole having a predetermined hole diameter formed on the substrate with respect to a drawing table is determined by a CCD camera. And the like, and by controlling the drawing start position based on the obtained relative position data, each substrate and the circuit pattern are matched. The CCD camera is installed at a position away from the substrate by a certain distance, and its focal length is fixed.
[0004]
In recent years, as the precision and density of circuit patterns have increased, the drawing accuracy required for laser writing apparatuses has become on the order of microns, and there is a demand for increasing the measurement accuracy of reference holes. As a method for solving this problem, for example, it is conceivable to increase the magnification of the CCD camera. However, in this case, since the field of view of the CCD camera is narrowed, a phenomenon that the reference hole is out of the field of view and measurement becomes impossible easily occurs. This is because the position of the reference hole with respect to the drawing table may be different for each substrate due to various factors such as an outer dimension error of each substrate, a hole processing error of the reference hole, or a displacement of the transfer position of the substrate. For the substrate for which the reference hole could not be measured, the measurement had to be performed again or discarded as a defective product, resulting in a decrease in work efficiency.
[0005]
[Problems to be solved by the invention]
SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and it is an object of the present invention to draw a circuit pattern reliably and accurately and to improve work efficiency.
[0006]
[Means for Solving the Problems]
The drawing apparatus of the present invention scans a photosensitive object to be drawn placed on a table in a main scanning direction with a laser beam emitted from a scanning optical system, and relatively moves the table in a sub-scanning direction. A laser drawing device that draws a circuit pattern on the surface of a drawing object, a transfer device that transfers the drawing target object to the table, a positional shift that occurs when the drawing target object is transferred to the table, and an outer dimension error of the drawing target object, The most main feature of the present invention is to provide a matching means for resolving a processing error of a reference hole formed in a drawing object and matching a circuit pattern with the drawing object.
[0007]
The aligning means of the exposure system includes, for example, a variable focus camera provided in a laser drawing apparatus and imaging a reference hole, and an image processing means for obtaining relative position data of the reference hole with respect to the table based on an image obtained by the variable focus camera, Adjusting means for adjusting the drawing start position of the table and the scanning start position of the laser beam based on the relative position data, and is preferably obtained when the variable focus camera is set to the first magnification and the image is taken. The reference hole is detected based on the image, the table and the variable focus camera are relatively moved to position the reference hole at the center of the field of view of the variable focus camera, and the variable focus camera is set at a second magnification higher than the first magnification. Relative position data is obtained based on an image obtained when setting and imaging.
[0008]
The aligning means of the exposure system includes, for example, a first fixed-focus camera provided in the laser drawing device for imaging the reference hole at a first magnification, and a second fixed focus camera provided in the laser drawing device for setting the reference hole higher than the first magnification. A second fixed-focus camera that captures an image at a magnification of?, Image processing means for obtaining relative position data of a reference hole with respect to a table based on an image obtained by the second fixed-focus camera, and drawing of a table based on the relative position data Adjusting means for adjusting the start position and the scanning start position of the laser beam. Preferably, the reference hole is detected based on an image taken by the first fixed focus camera, and the table and the second fixed focus camera are detected. Are relatively moved to position the reference hole at the center of the field of view of the second fixed focus camera, and the relative position data is further determined based on the image captured by the second fixed focus camera. The seek.
[0009]
The aligning means of the exposure system includes, for example, a sensor for detecting the relative position of the outer peripheral edge of the object to be drawn with respect to the table, a fixed focus camera provided in the laser writing apparatus and imaging a reference hole at a predetermined magnification, and a fixed focus camera. Image processing means for obtaining relative position data of a reference hole with respect to a table based on an obtained image, and adjusting means for adjusting a drawing start position and a laser beam scanning start position of a table based on a detection result of a sensor and relative position data. May be provided.
[0010]
The aligning means of the exposure system includes, for example, a fixed member provided on a table and abutting on one side surface of the object to be drawn, an urging member for urging the object to be drawn toward the fixed member, and a reference member provided on the laser drawing apparatus. A fixed-focus camera that captures an image of the hole at a predetermined magnification; image processing means for obtaining relative position data of the reference hole with respect to the table based on an image obtained by the fixed-focus camera; a drawing start position of the table based on the relative position data; Adjusting means for adjusting the scanning start position of the laser beam may be provided, preferably after positioning the object to be drawn on the table in cooperation with the fixed member and the urging member, to the image captured by the fixed focus camera The relative position data is obtained based on the relative position data.
[0011]
The aligning means of the exposure system includes, for example, a first fixed focus camera provided in the transport device for imaging the reference hole at a first magnification, and a second fixed focus camera provided in the laser drawing device for setting the reference hole higher than the first magnification. A second fixed-focus camera for imaging at a magnification, image processing means for obtaining relative position data of a reference hole with respect to the table based on an image obtained by the second fixed-focus camera, and drawing of a table based on the relative position data Adjusting means for adjusting the position and the scanning start position of the laser beam. Preferably, the reference hole is detected based on an image captured by the first fixed focus camera in the transport device, and the laser drawing device is detected from the transport device. And the table and the second fixed focus camera are relatively moved based on the detection result of the reference hole to move the reference hole to the second fixed focus camera. Of positioning the center of the field of view, further second fixed focus camera determine the relative position data based on the video imaged.
[0012]
The aligning means of the exposure system includes, for example, a variable focus camera provided in the transport device for imaging the reference hole, an image processing means for obtaining relative position data of the reference hole with respect to the table based on an image obtained by the variable focus camera, Adjusting means for adjusting the drawing start position of the table and the scanning start position of the laser beam based on the position data may be provided. , The reference hole is detected at the center of the field of view of the variable focus camera by relatively moving the variable focus camera, and the variable focus camera is positioned at the second magnification higher than the first magnification. After the relative position data is obtained based on the image obtained when the image is set and set, the relative position data is provided to the laser drawing apparatus.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
[0014]
FIG. 1 is a view showing a first embodiment of the present invention, and is a view showing a simplified drawing system.
The drawing system includes a laser drawing device 10 that directly draws a circuit pattern on a substrate S, which is a photosensitive object to be drawn, by a laser beam, and a substrate S that is loaded into the laser drawing device 10 or ejected from the laser drawing device 10. And a transfer device for sending the substrate S to the next processing device (not shown). The transport device is, for example, a belt conveyor, and FIG. 1 shows only a carry-in belt 22 and a delivery belt 24 which are part of the belt conveyor. The substrate S has a rectangular plate shape, and a photoresist layer is provided on an upper surface thereof.
[0015]
The laser drawing apparatus 10 includes an optical unit 12 fixed at a predetermined position, and a drawing table 14 on which the substrate S is placed horizontally. The optical unit 12 includes a laser light source and an optical system (not shown), and emits a laser beam toward the substrate S on the drawing table 14 in the main scanning direction. The scanning start position in the main scanning direction with respect to the drawing table 14, that is, the substrate S, can be arbitrarily changed. The drawing table 14 is located between a preparation position (shown by a solid line) located between the carry-in belt 22 and the delivery belt 24 and a drawing start position (shown by a broken line) located substantially vertically below the optical unit 12. , Are relatively movable along the sub-scanning direction.
[0016]
An XY two-dimensional orthogonal coordinate system which is immovable with respect to the machine frame of the laser writing apparatus is set on the moving plane of the drawing table 14, and the X axis of this coordinate system extends in the sub-scanning direction, and the Y axis is the main scanning direction. Extending in the direction. The origin of the XY two-dimensional rectangular coordinate system is set at the lower right corner of the drawing table 14 in the drawing. Further, the transport direction of the substrate S by the transport device is parallel to the Y axis.
[0017]
The drawing system further includes a control device 50 that is connected to the laser drawing device 10 and the transport device, and controls the overall operation of these devices. The control device 50 is a microcomputer including a microprocessor such as a central processing unit (CPU) and a memory such as a ROM and a RAM, and is connected to the CAD / CAM system 52 via a LAN interface or the like. Before the laser drawing device 10 performs the drawing process, the vector data of the circuit pattern created and edited by the CAD / CAM system 52 is transferred to the control device 50 and converted into raster data by the control device 50. The raster data of the pattern is provided to the optical unit 12 of the laser writing apparatus 10. During the drawing process of the laser drawing device 10, the laser beam is modulated by the optical unit 12 according to the raster data.
[0018]
The operation of the laser drawing apparatus 10 will be described. First, the drawing table 14 is positioned at the preparation position indicated by the solid line, and an appropriate transfer mechanism, for example, a plurality of hollow suction pads is applied to the substrate S from the carry-in belt 22, and the air pressure in the suction pad is adjusted by a cylinder to transfer the substrate S. The substrate S is placed at a predetermined position on the drawing table 14 by a transfer mechanism provided with a suction unit (not shown) that sucks or separates along the Y axis. The substrate S is fixed on the drawing table 14 by a clamp member (not shown).
[0019]
Next, the substrate S is moved by the drawing table 14 from the preparation position to the drawing start position, that is, to the positive side of the X axis. At this time, an alignment process for matching the individual substrates S and the circuit patterns is performed prior to the drawing process.
[0020]
Then, after reaching the drawing start position, the drawing table 14 is moved from the drawing start position indicated by the broken line to the preparation position indicated by the solid line, that is, by a small amount in the negative direction of the X axis. A drawing process is performed. In this drawing process, the substrate S is scanned by the laser beam modulated by the optical unit 12 in the positive direction of the Y axis and is moved by a small amount in the negative direction of the X axis. As a result, the circuit pattern is sequentially drawn on the photoresist layer of the substrate S, and when the drawing table 14 returns to the preparation position again, only the portion of the photoresist layer of the substrate S corresponding to the circuit pattern is light-cured. Become.
[0021]
When the drawing process is completed, the drawn substrate S is released from the clamp member from the drawing table 14 returned to the preparation position, and is discharged to the delivery belt 24 by a transfer mechanism (not shown).
[0022]
FIG. 2 is a perspective view showing the appearance of the laser drawing apparatus. The optical unit 12 shown in FIG. 1 is accommodated in a substantially rectangular housing 18. An opening 30 is formed in the side surface 18 a of the housing 18, and the drawing table 14 advances and retreats in the housing 18 through the opening 30. Two rails 36 and 38 extending along the Y axis are fixed to the side surface 18a, and CCD cameras 32 and 34 are attached to the rails 36 and 38, respectively, vertically downward. The CCD cameras 32 and 34 move along the Y-axis along the rails 36 and 38 based on command signals from the control device 50 (see FIG. 1), and the Y position is constantly monitored by the control device 50. I have.
[0023]
The CCD cameras 32 and 34 are variable focus cameras, and are used for alignment processing performed prior to the above-described drawing processing. In the alignment process, in order to align the substrate S with the circuit pattern, the amount of deviation between the position where the substrate S should be originally placed and the position where the substrate S is actually placed by the transfer device is measured on the drawing table 14, and the drawing on the substrate S is performed. The drawing start position of the drawing table 14 and the scanning start position of the optical unit 12 are adjusted so that the positional deviation of the circuit pattern to be canceled out. In the alignment process, the position of the substrate S with respect to the drawing table 14 is indicated by the X and Y coordinates of the reference holes P1, P2, P3, and P4 formed at the four corners of the substrate S. Hereinafter, these coordinate data will be referred to as relative position data.
[0024]
The drawing table 14 includes an X table (not shown) relatively moved by a motor drive on a rail (not shown) extending along the X axis, and a θ table (not shown) rotated on the X table in a horizontal plane by a motor drive. And the controller 50 controls the motor drive amount, that is, the X position and the θ position of the drawing table 14. Further, the optical unit 12 can scan a range including a range to be drawn on the substrate S and wider than the drawing width, and the control start position in the Y direction is controlled by the control device 50. The control device 50 calculates the amount of displacement of the substrate S based on the relative position data of the substrate S detected by the CCD cameras 32 and 34, and sets the drawing start position ( The position (X position, θ position) is adjusted, and the scanning start position (Y position) of the laser beam emitted from the optical unit 12 is adjusted.
[0025]
The CAD / CAM system 52 transfers design data such as the outer diameter of the substrate S and the positions of the reference holes P1 to P4 from the CAD / CAM system 52 to the control device 50 of the laser drawing apparatus 10. Is stored in a memory (not shown). The control device 50 calculates a reference hole distance L1 between the two reference holes P1 and P2 arranged in the Y-axis direction on the housing 18 side of the substrate S based on the design data, and determines a distance between the CCD cameras 32 and 34 as a reference. The CCD cameras 32 and 34 are positioned so as to match the distance L1 between the holes.
[0026]
Then, the photographing optical systems (not shown) of the CCD cameras 32 and 34 are set to a relatively low magnification, and the reference hole P1 is photographed by the CCD camera 32 and the reference hole P2 is photographed by the CCD camera 34. Is transmitted to the control device 50, where the relative position data of the reference holes P1 and P2 with respect to the drawing table 14 by an appropriate image processing, for example, a pattern matching method, specifically, an XY two-dimensional orthogonal coordinate system The X and Y coordinates of the center of the reference holes P1 and P2 in are calculated.
[0027]
Next, the positions of the CCD cameras 32 and 34 in the Y-axis direction are adjusted so that the reference holes P1 and P2 are located substantially at the center of the visual fields of the CCD cameras 32 and 34, and the X-axis position and the horizontal plane of the drawing table 14 are adjusted. Is adjusted in the rotational direction θ. The rotation center in the rotation direction θ is set at the center of the drawing table 14. Then, the photographing optical systems of the CCD cameras 32 and 34 are set to have a higher magnification than that of the first photographing, that is, zoom-up is performed, and the second photographing is performed. From the obtained video signals, the reference holes P1 and P2 are obtained. Relative position data is determined. Since the CCD cameras 32 and 34 are zoomed up in the second photographing, the relative position data of the reference holes P1 and P2 obtained by the second photographing is based on the reference holes P1 and P1 obtained by the first photographing. It can be considered that the accuracy is higher than the relative position data of P2.
[0028]
Subsequently, in order to image the reference holes P3 and P4, the drawing table 14 is moved in the X-axis direction toward the drawing start position. The moving distance coincides with the reference hole distance L2 between two reference holes P1 and P3 arranged in the X direction (or the reference hole distance between P2 and P4), and the reference hole distance L2 is obtained based on design data. . Then, the photographing optical systems of the CCD cameras 32 and 34 are set to low magnification again, the reference hole P3 is photographed by the CCD camera 32, the reference hole P4 is photographed by the CCD camera 34, and the controller 50 performs the third photographing. The relative position data of the reference holes P3 and P4 with respect to the drawing table 14 is calculated based on the obtained video signal.
[0029]
Then, the Y-axis position of the CCD cameras 32 and 34 and the X-axis position and the θ-direction position of the drawing table 14 are adjusted so that the reference holes P3 and P4 are located substantially at the center of the field of view of the CCD cameras 32 and 34. Then, the photographing optical systems of the CCD cameras 32 and 34 are set to a high magnification and the fourth photographing is performed, and highly accurate relative position data of the reference holes P3 and P4 is obtained from the obtained video signals.
[0030]
When the highly accurate relative position data of the reference holes P1 to P4 is obtained by the above operation, the control device 50 determines the displacement amount X ′ of the substrate S in the X-axis direction and the displacement of the substrate S in the Y-axis direction based on the relative position data. The amount Y ′ and the deviation amount θ ′ in the θ direction are obtained, the alignment processing ends, and the processing proceeds to the above-described drawing processing. In the drawing process, the drawing start position of the drawing table 14 is adjusted based on the displacement amounts X ′, Y ′, and θ ′ obtained by the alignment process, and the scanning start position of the optical unit 12 in the Y-axis direction is adjusted. You. That is, the drawing table 14 moves along the X axis by the adjustment amount (-X ') from the drawing start position determined by design, and further moves from the position rotated by the adjustment amount (-θ') around the rotation center. The movement starts, and the optical unit 12 starts scanning from a position shifted by an adjustment amount (-Y ') from a scanning start position determined by design.
[0031]
In this way, by previously photographing the reference holes P1 to P4 at a low magnification with a relatively wide field of view, the reference holes P1 to P4 can be detected with certainty. Since the CCD cameras 32 and 34 are set at a high magnification at which a fine image can be obtained, and the CCD cameras 32 and 34 and the drawing table 14 are adjusted so that the reference holes P1 to P4 fall within the field of view, highly accurate relative position data is obtained. Can be reliably obtained. Therefore, the positions of the reference holes P1 to P4 with respect to the drawing table 14 may be different from each other due to complex factors such as an outer dimension error of each substrate S, a hole processing error of the reference holes P1 to P4, or a shift of the transport position of the substrate S. S, the drawing table 14 and the optical unit 12 are adjusted so as to reliably detect these displacement amounts (X ′, Y ′, θ ′) and eliminate the positional displacement. , A circuit pattern can be drawn reliably and with high accuracy. Further, since the reference holes P1 to P4 are reliably measured, remeasurement is not required, and a decrease in work efficiency is prevented.
[0032]
Note that the magnification in the first to fourth photographing is not particularly limited, but in the second and fourth photographing, the size of the field of view of the CCD cameras 32 and 34 is determined by the size of the reference holes P1 to P4. It is preferable to add the allowable processing error. For example, when the diameters of the reference holes P1 to P4 are 2 mm and the allowable processing error is 0.5 mm, the visual fields of the CCD cameras 32 and 34 are preferably about 3 mm square. In the first and third shootings, it is preferable that the size of the field of view of the CCD cameras 32 and 34 be the size of the reference holes P1 to P4 in consideration of the transport error and the processing error.
[0033]
FIG. 3 is a view showing a second embodiment of the present invention, and is an external perspective view of a laser drawing apparatus. The drawing system of the second embodiment has the same configuration as that of the first embodiment except that four CCD cameras are fixed focus cameras and four CCD cameras are provided, and corresponding components are shown by adding 200 to the reference numerals. .
[0034]
A rail 236 is fixed to the right side of the side surface 218a of the laser drawing apparatus 210 in the figure, and two CCD cameras 232a and 232b fixed to each other are attached to the rail 236. These CCD cameras 232a and 232b are arranged along the X axis, and move integrally along the rail 236 along the Y axis. Both the CCD cameras 232a and 232b are fixed focus cameras, the CCD camera 232a is set to a relatively high magnification, and the CCD camera 232b is set to a relatively low magnification. The two CCD cameras 234a and 234b provided on the left side of the side surface 218a in the drawing have the same configuration.
[0035]
In the alignment process, the reference holes P1 and P2 are photographed by the low-magnification CCD cameras 232b and 234b, and rough relative position data of the reference holes P1 and P2 is obtained from the obtained video signal. Then, based on the rough relative position data, the CCD cameras 232a and 234a are drawn in the direction along the Y-axis so that the reference holes P1 and P2 fall substantially in the center of the field of view of the high-magnification CCD cameras 232a and 234a. The table 14 is adjusted in the direction along the X axis and in the θ direction. Then, highly accurate relative position data of the reference holes P1 to P4 is obtained from the video signals obtained from the CCD cameras 232a and 234a. Then, after the movement of the drawing table 214, the reference holes P3 and P4 are measured by the same method.
[0036]
As described above, according to the laser drawing apparatus 210 of the second embodiment, as in the first embodiment, even if the positions of the reference holes P1 to P4 with respect to the drawing table 214 may be different for each substrate S, these deviation amounts (X ′, Y ′ and θ ′) are reliably detected, and the drawing table 214 and the optical unit (not shown) are adjusted so as to eliminate the positional deviation. Can draw with high precision. Further, since the reference holes P1 to P4 are reliably measured, remeasurement is not required, and a decrease in work efficiency is prevented.
[0037]
FIG. 4 is a view showing a third embodiment of the present invention, and is an external perspective view of a laser drawing apparatus. The drawing system of the third embodiment has the same configuration as that of the first embodiment except that the CCD camera is a fixed focus camera and a substrate edge detection sensor is provided. For the corresponding configuration, 300 is added to the reference numeral. Is shown.
[0038]
The substrate edge detection sensors 340, 342, and 344 are sensors that are fixed on the upper surface of the drawing table 314 and detect the relative position of the transported substrate S. The substrate edge detection sensors 340, 342, and 344 are, for example, known infrared sensors, but may be CCD cameras.
[0039]
In the alignment processing, the position of the side Se1 with respect to the drawing table 314, that is, the position of the substrate S in the X-axis direction and the position of the substrate S in the θ rotation direction are measured by the substrate edge detection sensors 340 and 342. , Ie, the position of the substrate S in the Y-axis direction is measured. Then, in a control device (not shown), the amounts of displacement (X ′, Y ′, and θ ′) of the substrate S with respect to the drawing table 314 are obtained based on the relative position data of the substrate edge detection sensors 340 and 342.
[0040]
Next, based on the displacement amounts X ′, Y ′ and θ ′ of the substrate S with respect to the drawing table 314 and the design data of the reference holes P1 and P2, the reference holes P1 and P2 After the CCD cameras 332 and 334 are adjusted in the Y-axis direction and the drawing table 314 is adjusted in the X-axis direction and the θ-direction so that is positioned, photographing of the reference holes P1 and P2 and calculation of highly accurate relative position data are performed. Is performed. Further, the drawing table 314 is moved toward the drawing start position by the distance between the reference holes P1 and P3, the reference holes P3 and P4 are photographed, and highly accurate relative position data of the reference holes P3 and P4 is obtained. The CCD cameras 332 and 334 are high-magnification fixed-focus cameras having a relatively narrow field of view, and the field of view has a size obtained by adding an allowable processing error to the size of the reference holes P1 to P4.
[0041]
According to the laser writing apparatus 310 of the third embodiment, the relative position of the substrate S is measured by the substrate edge detection sensors 340 and 342. Only the processing error or the outer diameter dimension error of the substrate S is caused, and the positional deviation at the time of transport is substantially eliminated. Accordingly, the displacement amounts (X ′, Y ′ and θ ′) of the substrate S are smaller than those in the first and second embodiments, and rough relative position data of the reference holes P1 to P4 is obtained using a low magnification CCD camera. No need. According to the third embodiment, similarly to the first and second embodiments, even if the positions of the reference holes P1 to P4 with respect to the drawing table 214 may be different for each substrate S, the drawing is performed so as to eliminate the displacement. Since the position of the table 214 and the scanning start position of the optical unit (not shown) are adjusted, the circuit pattern can be drawn on the substrate S reliably and with high accuracy.
[0042]
FIG. 5 is a diagram showing the fourth embodiment of the present invention, and is a perspective view of a drawing table. The drawing system of the fourth embodiment has the same configuration as that of the first embodiment except that the camera is a fixed-focus camera and that an attaching pin and an attaching cylinder are provided.
[0043]
The drawing table 414 is provided with fixing pins 414a and 414b and contact cylinders 414c and 414d. The fixing pin 414a contacts the side Se2 of the substrate S to restrict the movement of the substrate S in the Y-axis direction, and the two fixing pins 414b contact the side Se1 of the substrate S in the X-axis direction of the substrate S. Restrict movement. The contact cylinder 414c abuts the side Se3 of the substrate S, and urges the substrate S toward the fixing pins 414b. The contact cylinder 414d abuts the side Se4 of the substrate S, and urges the substrate S toward the fixing pins 414a. As a result, the substrate S is always positioned at the same position, and the positional deviation during transport is eliminated. The two CCD cameras (not shown) are high-magnification fixed-focus cameras, and have a relatively narrow field of view, specifically, a field of view obtained by adding an allowable processing error to the size of the reference holes P1 to P4.
[0044]
According to the drawing system of the fourth embodiment, the substrate S is accurately positioned at a predetermined position on the drawing table 414 by the fixing pins 414a and 414b and the abutment cylinders 414c and 414d. The only factor is a processing error of the reference holes P1 to P4 with respect to the substrate S or an error of the outer diameter of the substrate S, and the positional deviation at the time of transport is substantially eliminated. Accordingly, similarly to the first to third embodiments, even if the positions of the reference holes P1 to P4 with respect to the drawing table 414 may be different for each substrate S, the position of the drawing table 414 and the optical position can be reduced so as to eliminate the displacement. Since the scanning start position of the unit (not shown) is adjusted, a circuit pattern can be drawn on the substrate S reliably and with high accuracy.
[0045]
The substrate positioning mechanism including the fixing pins 414a and 414b and the contact cylinders 414c and 414d may be configured by the fixing pins 514b and the contact slide pins 514a, 514c and 514d as in the fifth embodiment shown in FIG. . The contact slide pin 514c relatively moves in the X-axis direction based on a control signal from a control device (not shown), and urges the substrate S from the side Se3 toward the fixing pin 514b. The contact slide pins 514a and 514d are movable in the Y-axis direction, and press the side edges Se2 and Se4 of the substrate S, respectively, to pinch the substrate S with substantially no gap and position it at a predetermined position.
[0046]
FIG. 7 is a diagram showing the sixth embodiment of the present invention, and is a top view of the drawing system. The drawing system of the sixth embodiment is different from the drawing system in that the CCD camera is a fixed focus camera, and the transfer device obtains rough relative position data of the reference holes P1 to P4 before placing the substrate S on the drawing table. Has a configuration similar to that of the first embodiment, and the corresponding configuration is shown by adding 600 to the reference numerals.
[0047]
The transfer device 620 includes a pre-alignment table 626 between the carry-in belt 622 and the drawing table 614, and the substrate S transferred to the carry-in belt 622 is first placed at a predetermined position on the pre-alignment table 650. Four CCD cameras 652, 654, 656 and 658 are arranged vertically above the four corners of the substrate S placed on the pre-alignment table 650. In the alignment process, the reference holes P1 to P4 are photographed by the CCD cameras 652, 654, 656, and 658, and the obtained video signals are subjected to image processing to obtain relative position data of the reference holes P1 to P4 with respect to the substrate S. . The CCD cameras 652, 654, 656, and 658 are relatively low magnification fixed focus cameras.
[0048]
The relative position data of the reference holes P1 to P4 is transferred to a control device that controls the laser drawing device 610, and the substrate S is moved to a predetermined position on the drawing table 614. Then, based on the relative position data transferred from the transfer device 620 and the design data transferred from the CAD / CAM system, the drawing is performed so that the reference points P1 to P4 are located at the center of the field of view of the CCD cameras 632 and 634. After the table 614 and the CCD cameras 632 and 634 are adjusted, the reference holes P1 to P4 are photographed, and highly accurate relative position data of the reference holes P1 to P4 with respect to the drawing table 614 is obtained. The CCD cameras 632 and 634 are relatively high magnification fixed focus cameras.
[0049]
According to the drawing system of the sixth embodiment, the rough relative positions of the reference holes P1 to P4 with respect to the substrate S are measured before the transfer to the drawing table 614. Since the drawing table 614 and the CCD cameras 632 and 634 are adjusted so that the position shift of P4 is offset, the cause of the position shift of the reference holes P1 to P4 in the camera field of view with respect to the substrate S placed on the drawing table 614 is the substrate. Only the displacement during the transfer of the S results in substantially eliminating the drilling error and the outer diameter dimensional error. Therefore, similarly to the first to fifth embodiments, even if the positions of the reference holes P1 to P4 with respect to the drawing table 614 may be different for each substrate S, the position of the drawing table 614 and the optical position are eliminated so as to eliminate the displacement. Since the scanning start position of the unit (not shown) is adjusted, a circuit pattern can be drawn on the substrate S reliably and with high accuracy.
[0050]
FIG. 8 is a view showing the seventh embodiment of the present invention, and is a perspective view of a drawing system. The drawing system of the seventh embodiment is the same as the sixth embodiment except that the transfer apparatus obtains high-precision relative position data of the reference holes P1 to P4 before placing the substrate S on the drawing table. The configuration is provided, and the corresponding configuration is shown by adding 100 to the reference numeral.
[0051]
Above the pre-alignment table 726 of the transport device 720, four CCD cameras 752, 754, 756, and 758 are provided. The CCD cameras 752, 754, 756, and 758 are variable focus cameras, and are relatively movable in the X-axis direction and the Y-axis direction. The transfer device 720 specifies rough relative positions of the four reference holes P1 to P4 of the substrate S based on a video signal obtained by setting the CCD cameras 752, 754, 756, and 758 at a low magnification. Next, the CCD cameras 752, 754, 756, and 758 are moved to positions where the corresponding reference holes P1 to P4 are captured, and the video signals obtained by setting the CCD cameras 752, 754, 756, and 758 at a high magnification. , High-precision relative position data of the four reference holes P1 to P4 with respect to the pre-alignment table 726 is obtained. Then, the control device (not shown) adjusts the X-axis direction adjustment amount (−X ′) and θ direction adjustment amount (−X ′) of the drawing table 714 in the laser drawing device 710 based on the highly accurate relative position data of the reference holes P1 to P4. θ ′) and the Y-axis direction adjustment amount (−Y ′) of the laser optical system are calculated.
[0052]
The pre-alignment table 726 is rotatable by θ by a drive mechanism (not shown), and is adjusted by the θ-direction adjustment amount (−θ ′). The substrate S whose position is adjusted in the θ direction in the pre-alignment table 726 is transferred to the drawing table 714 by a transfer mechanism (not shown) using a suction pad as described in the first embodiment, and the position in the θ direction is adjusted. It is positioned on the drawing table 714 while being adjusted. The transfer accuracy of the transfer mechanism is on the order of microns, and the amount of movement is monitored and controlled by a controller.
[0053]
The data of the X-axis direction adjustment amount (−X ′) and the Y-axis direction adjustment amount (−Y ′) obtained by the control device are transferred to the laser drawing device 710. The laser drawing device 710 adjusts the drawing start position of the drawing table 714 based on the transferred X-axis direction adjustment amount (−X ′), and based on the Y-axis direction adjustment amount (−Y ′). (Not shown).
[0054]
As described above, according to the exposure system of the seventh embodiment, since the laser drawing device 710 does not need to be provided with the camera measurement function and the θ rotation driving mechanism, the configuration of the laser drawing device 710 is simpler than in the sixth embodiment. In addition, the time required for the drawing operation is reduced.
[0055]
In the first to seventh embodiments, a substrate provided with four reference holes is used as the substrate S. However, the present invention can be applied to drawing of a substrate on which three reference holes are formed.
[0056]
【The invention's effect】
As described above, the drawing apparatus of the present invention can draw a circuit pattern reliably and with high accuracy and can improve work efficiency.
[Brief description of the drawings]
FIG. 1 is a diagram schematically illustrating a drawing system according to a first embodiment of the present invention.
FIG. 2 is a perspective view showing an appearance of the laser drawing apparatus shown in FIG.
FIG. 3 is a perspective view showing a laser drawing apparatus according to a second embodiment of the present invention.
FIG. 4 is a perspective view showing a laser writing apparatus according to a third embodiment of the present invention.
FIG. 5 is a perspective view illustrating a drawing table of a laser drawing apparatus according to a fourth embodiment of the present invention.
FIG. 6 is a view showing a fifth embodiment of the present invention, and is a perspective view showing a drawing table of a laser drawing apparatus.
FIG. 7 is a top view illustrating a drawing system according to a sixth embodiment of the present invention.
FIG. 8 is a perspective view illustrating a drawing system according to a seventh embodiment of the present invention.
[Explanation of symbols]
10 Laser drawing equipment
12 Optical unit
14 Drawing table
50 Control device
S substrate
P1, P2, P3, P4 Reference hole

Claims (7)

The photosensitive object to be drawn placed on the table is scanned in the main scanning direction by a laser beam emitted from the scanning optical system, and the table is relatively moved in the sub-scanning direction, so that the surface of the object to be drawn is moved. A laser drawing apparatus for drawing a circuit pattern,
A transfer device for transferring the object to be drawn to the table,
The position shift occurring when the object to be drawn is conveyed to the table, the outer dimension error of the object to be drawn, and the processing error of the reference hole formed in the object to be drawn are eliminated, and the object to be drawn is removed. And a matching system for matching the circuit pattern. A variable focus camera that is provided in the laser drawing device and captures the reference hole, and an image processing unit that obtains relative position data of the reference hole with respect to the table based on an image obtained by the variable focus camera; An adjustment unit that adjusts a drawing start position of the table and a scanning start position of the laser beam based on the relative position data,
The reference hole is detected based on an image obtained when the variable focus camera is set to a first magnification and imaged, and the table and the variable focus camera are relatively moved to move the reference hole to the variable focus camera. And the relative position data is obtained based on an image obtained when the variable focus camera is set to a second magnification higher than the first magnification and imaged. The drawing system according to claim 1. A first fixed-focus camera provided in the laser drawing device for capturing the reference hole at a first magnification, and a second fixed focus camera provided in the laser drawing device, the reference hole being higher than the first magnification. A second fixed focus camera for imaging at a magnification of 2, image processing means for obtaining relative position data of the reference hole with respect to the table based on an image obtained by the second fixed focus camera, Adjusting means for adjusting the drawing start position of the table and the scanning start position of the laser beam based on the
The reference hole is detected based on an image captured by the first fixed-focus camera, and the table and the second fixed-focus camera are relatively moved to move the reference hole into the field of view of the second fixed-focus camera. 2. The drawing system according to claim 1, wherein the relative position data is obtained based on an image captured by the second fixed-focus camera, which is positioned at a center. 3. A sensor configured to detect a relative position of an outer peripheral edge of the object to be drawn with respect to the table, a fixed focus camera provided in the laser drawing apparatus and imaging the reference hole at a predetermined magnification, and the fixed focus camera Image processing means for obtaining relative position data of the reference hole with respect to the table based on the image obtained by the step (a); The drawing system according to claim 1, further comprising an adjustment unit that adjusts a start position. A fixing member provided on the table and in contact with one side surface of the object to be drawn; an urging member for urging the object to be drawn toward the fixing member; A fixed focus camera that images the reference hole at a predetermined magnification, image processing means for obtaining relative position data of the reference hole with respect to the table based on an image obtained by the fixed focus camera, and Adjusting means for adjusting the drawing start position of the table and the scanning start position of the laser beam,
After positioning the object to be drawn on the table in cooperation with the fixed member and the urging member, the relative position data is obtained based on an image captured by the fixed focus camera. Item 2. The drawing system according to Item 1. A first fixed focus camera provided in the transfer device for capturing the reference hole at a first magnification, and a second fixed focus camera provided in the laser drawing device and having the reference hole higher than the first magnification; A second fixed focus camera that captures an image at a magnification of?, Image processing means for obtaining relative position data of the reference hole with respect to the table based on an image obtained by the second fixed focus camera, and Adjusting means for adjusting the drawing start position of the table and the scanning start position of the laser beam,
The transport device detects the reference hole based on the image captured by the first fixed focus camera, and transports the object to be drawn from the transport device to the laser drawing device, and further includes a detection result of the reference hole. Relative movement of the table and the second fixed-focus camera to position the reference hole at the center of the field of view of the second fixed-focus camera, and further based on an image captured by the second fixed-focus camera. The drawing system according to claim 1, wherein the relative position data is obtained by calculating the relative position data. A variable focus camera that is provided in the transporting device and captures the reference hole, and an image processing unit that obtains relative position data of the reference hole with respect to the table based on an image obtained by the variable focus camera; Adjustment means for adjusting a drawing start position of the table and a scanning start position of the laser beam based on the relative position data,
In the transfer device, the reference hole is detected based on an image obtained when the variable focus camera is set to a first magnification and imaged, and the variable focus camera is relatively moved to change the reference hole. After positioning at the center of the field of view of the focus camera and further calculating the relative position data based on an image obtained when the variable focus camera is set to a second magnification higher than the first magnification and imaged, The drawing system according to claim 1, wherein the relative position data is provided to the laser drawing device.

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