TWI574844B - Processing method of hard substrate laminate and method for manufacturing plate-like product - Google Patents
Processing method of hard substrate laminate and method for manufacturing plate-like product Download PDFInfo
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- TWI574844B TWI574844B TW101134635A TW101134635A TWI574844B TW I574844 B TWI574844 B TW I574844B TW 101134635 A TW101134635 A TW 101134635A TW 101134635 A TW101134635 A TW 101134635A TW I574844 B TWI574844 B TW I574844B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/06—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving conveyor belts, a sequence of travelling work-tables or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
- B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
- B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
- B24B7/241—Methods
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
- B24B7/26—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for simultaneously grinding or polishing opposite faces of continuously travelling sheets or bands
- B24B7/265—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for simultaneously grinding or polishing opposite faces of continuously travelling sheets or bands of vertical surfaces
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Surface Treatment Of Glass (AREA)
- Joining Of Glass To Other Materials (AREA)
- Laminated Bodies (AREA)
Description
本發明係關於一種硬質基板積層體之加工方法，尤其關於顯示元件的保護玻璃之製造步驟中的板玻璃積層體之加工方法。又，本發明係關於一種板狀製品之加工方法，尤其關於顯示元件的保護玻璃之製造方法。 The present invention relates to a method of processing a hard substrate laminate, and more particularly to a method for processing a sheet glass laminate in a manufacturing step of a cover glass of a display element. Further, the present invention relates to a method of processing a plate-shaped article, and more particularly to a method of manufacturing a cover glass for a display element.
於電視機、筆記型電腦、汽車導航儀、電子計算機、行動電話、電子記事本、及PDA(Personal Digital Assistant，個人數位助理)等各種電子機器的顯示裝置中，使用有液晶顯示器(LCD)、有機EL顯示器(OELD)、電致發光顯示器(ELD)、場發射顯示器(FED)、及電漿顯示器(PDP)等顯示元件。而且，為了保護顯示元件，一般係設置與顯示元件相對向地之保護用板玻璃製品。 A liquid crystal display (LCD) is used in display devices of various electronic devices such as televisions, notebook computers, car navigation systems, electronic computers, mobile phones, electronic notebooks, and PDAs (Personal Digital Assistants). Display elements such as organic EL displays (OELDs), electroluminescent displays (ELDs), field emission displays (FEDs), and plasma display devices (PDPs). Further, in order to protect the display element, a protective sheet glass product facing the display element is generally provided.
這種板玻璃製品係將板玻璃加工為適合各顯示裝置的大小及形狀者，但是為了符合市場上所要求之價格水平，需要以較高的生產效率加工大量板玻璃製品。 Such a plate glass product is processed into a size and shape suitable for each display device, but in order to meet the price level required on the market, it is required to process a large number of plate glass products with high production efficiency.
因此，於日本專利特開2009-256125號公報(專利文獻1)中提出了一種提高板玻璃製品的生產效率的方法。具體而言，已提出一種板玻璃之加工方法，其特徵在於：將多個素材板玻璃(1)堆疊，並且藉由介於各素材板玻璃(1)之間的可剝離之固著材(2)將各素材板玻璃(1)一體地固著，從而形成素材玻璃塊(A)，並在面方向上分割該素材玻璃塊(A)而形成小面積的分割玻璃塊(B)，至少加工該分割玻璃塊(B)的外周而形成為平面視製品形狀的製品玻璃塊(C)，在對該製品玻璃塊(C)進行端面加工後，將 該製品玻璃塊(C)個別地分離」(申請專利範圍第1項)。據此，記載有以下情形：由於在將多個素材板玻璃堆疊的狀態下，實施分割、外形加工、及端面加工，因此能以較少的步驟獲得多個板玻璃製品，富有生產性(段落0007)。 Therefore, a method of improving the production efficiency of a sheet glass product is proposed in Japanese Patent Laid-Open Publication No. 2009-256125 (Patent Document 1). In particular, a method of processing a sheet glass has been proposed, characterized in that a plurality of sheet glass (1) are stacked and separated by a peelable fixing material between the respective sheet glasses (1) (2) The material glass (1) is integrally fixed to form a material glass block (A), and the material glass block (A) is divided in the surface direction to form a small-area divided glass block (B), at least processed. The outer glass of the divided glass block (B) is formed into a product glass block (C) having a planar view product shape, and after the end face processing of the product glass block (C), The glass block (C) of the product is individually separated" (Patent No. 1 of the patent application). According to this, it is described that since the division, the outer shape processing, and the end surface processing are performed in a state in which a plurality of material sheets are stacked, a plurality of sheet glass products can be obtained in a small number of steps, which is productive (paragraph 0007).
關於分割玻璃塊(B)之外周加工，專利文獻1中記載有以下方案：藉由旋轉磨石來實施外周加工，藉此形成俯視形狀成為製品形狀的製品塊C(段落0013)。根據專利文獻1的圖5可知：旋轉磨石的中心軸的方向是與分割玻璃塊(B)的上下表面平行的方向。又，關於端面加工，專利文獻1中記載有以下方案：藉由使旋轉刷與製品玻璃塊(C)的端面接觸而實施端面加工(段落0014)。旋轉刷的中心軸的方向係設為與分割玻璃塊(B)的上下表面成直角的方向，且以旋轉刷的線材接觸於上下板玻璃製品之間的方式，對各板玻璃製品的上下緣(棱)進行倒角處理(參照專利文獻1的圖7)。 In the peripheral processing of the divided glass block (B), Patent Document 1 describes that the outer peripheral processing is performed by rotating the grindstone, thereby forming a product block C having a product shape in plan view (paragraph 0013). According to FIG. 5 of Patent Document 1, it is understood that the direction of the central axis of the rotating grindstone is a direction parallel to the upper and lower surfaces of the divided glass block (B). Further, in the end surface processing, Patent Document 1 describes that the end surface processing is performed by bringing the rotating brush into contact with the end surface of the product glass block (C) (paragraph 0014). The direction of the central axis of the rotating brush is set to a direction at right angles to the upper and lower surfaces of the divided glass block (B), and the upper and lower edges of the glass products of the respective plates are in contact with the wire of the rotating brush. (Edge) The chamfering process is performed (refer to FIG. 7 of Patent Document 1).
專利文獻1的「實施方式」一欄中，記載有以下方案：一面使光硬化性液狀固著劑介於各素材板玻璃之間一面堆疊20片素材板玻璃，其次，自經堆疊之素材板玻璃的上表面照射紫外線(UV光)而使固著劑硬化，形成上下各素材板玻璃一體固著的素材玻璃塊(段落0010~0011)。 In the column of "Embodiment" of Patent Document 1, there is described a method in which 20 sheets of material glass are stacked while the photocurable liquid fixing agent is interposed between the respective material glass sheets, and secondly, the materials are stacked. The upper surface of the plate glass is irradiated with ultraviolet rays (UV light) to harden the fixing agent, and a material glass block in which the upper and lower material glass are integrally fixed is formed (paragraphs 0010 to 0011).
又，日本專利特開2010-269389號公報(專利文獻2)中記載有以下方案：藉由具有平坦研磨面的旋轉研磨盤來研磨分割玻璃塊的端面。而且，記載有以下方案：藉由旋轉刷來研磨該端面，從而對各分割板玻璃的緣部進行倒角處理。 Further, Japanese Patent Laid-Open Publication No. 2010-269389 (Patent Document 2) discloses a method of polishing an end surface of a divided glass block by a rotating abrasive disk having a flat polishing surface. Further, there is described a method in which the end surface of each of the split plate glass is chamfered by polishing the end surface by a rotary brush.
[先前技術文獻] [Previous Technical Literature]
[專利文獻] [Patent Literature]
[專利文獻1]日本專利特開2009-256125號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2009-256125
[專利文獻2]日本專利特開2010-269389號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2010-269389
於專利文獻1所記載的方法中，係在製作分割玻璃塊後利用旋轉磨石實施外周加工，但由於在該方法中未預先對分割玻璃塊進行端面形狀的均勻化處理，因此尺寸精度較低，容易使最終所得的板狀玻璃製品的形狀產生誤差。又，無法去除因分割而在端面上產生的碎屑。專利文獻2所記載的方法中，由於藉由旋轉研磨盤對分割玻璃塊的端面實施研磨，因此利用該方法可一次對多個板玻璃實施端面研磨，但僅為研磨處理，而並未進行端面形狀的均勻化處理，因此尺寸精度未提高。又，雖可去除因分割而在端面上產生的較小碎屑，卻不易去除較大者。進而，由於一次僅可處理一個端面，故生產率亦不佳。 In the method described in Patent Document 1, the peripheral processing is performed by using a rotating grindstone after the split glass block is produced. However, since the split glass block is not subjected to the uniformization of the end surface shape in advance in this method, the dimensional accuracy is low. It is easy to cause an error in the shape of the finally obtained sheet glass article. Further, it is impossible to remove the debris generated on the end surface due to the division. In the method described in Patent Document 2, since the end surface of the divided glass block is polished by the rotary polishing disk, the end plate polishing of the plurality of plate glasses can be performed at one time by this method, but only the polishing process is performed, and the end face is not performed. The shape is uniformized, so the dimensional accuracy is not improved. Further, although it is possible to remove small debris generated on the end surface by the division, it is not easy to remove the larger one. Further, since only one end face can be processed at a time, productivity is also poor.
根據電子機器的情況，亦存在需要在板玻璃上形成所需之印刷圖案(例如行動電話的顯示畫面之設計)之情形，於此情形時，對印刷的圖案要求較高之位置精度(例如容許誤差為10~30 μm左右)。 Depending on the situation of the electronic device, there is also a need to form a desired printed pattern on the sheet glass (for example, the design of a display screen of a mobile phone). In this case, a higher positional accuracy is required for the printed pattern (for example, tolerance) The error is about 10~30 μm).
本發明係鑒於上述情況而創作，其課題在於：提供一種透光性硬質基板積層體之加工方法，其係用於以較高生產率製造出之端面尺寸精度較高之板狀製品。又，本發明的另一課題在於：提供一種利用該透光性硬質基板積層體之加工方法的板狀製品之製造方法。 The present invention has been made in view of the above circumstances, and an object of the invention is to provide a method for processing a light-transmissive hard substrate layered body, which is used for a plate-shaped product having a high dimensional accuracy of end face manufactured with high productivity. Moreover, another object of the present invention is to provide a method for producing a plate-shaped product using the method for processing a light-transmitting rigid substrate laminate.
本發明之一態樣係一種硬質基板積層體之加工方法，其包括以下步驟：a)準備硬質基板積層體，其係由可剝離之接著劑將2片以上之硬質基板彼此貼合而成；b)於厚度方向分割前述硬質基板積層體，形成所需之數量的經分割之硬質基板積層體(以下稱為「分割塊」)；c)使分割塊於以特定之間隔並列地配置的旋轉磨石之間相對移動，從而同時對分割塊的相對向之兩個端面進行研削，此處，分割塊的上下表面與該等旋轉磨石的中心軸正交，且分割塊在與該等旋轉磨石之中心軸正交的方向上相對移動。 An aspect of the present invention is a method for processing a hard substrate laminate, comprising the steps of: a) preparing a hard substrate laminate, wherein two or more rigid substrates are bonded to each other by a peelable adhesive; b) dividing the hard substrate laminate in the thickness direction to form a desired number of divided hard substrate laminates (hereinafter referred to as "divided blocks"); c) rotating the divided blocks in parallel at specific intervals The grindstones are relatively moved to simultaneously grind the opposite end faces of the divided blocks, where the upper and lower surfaces of the divided blocks are orthogonal to the central axes of the rotating grindstones, and the split blocks are rotated with the same The center axis of the grindstone moves relative to each other in the direction orthogonal to the axis.
於本發明之硬質基板積層體之加工方法的一實施形態中，步驟c)係於利用夾具固定分割塊後進行。 In an embodiment of the method for processing a hard substrate laminate according to the present invention, the step c) is performed after the segment is fixed by a jig.
於本發明之硬質基板積層體之加工方法的另一實施形態中，前述夾具具有用於將分割塊配置在兩個旋轉磨石之間的中央之定位手段。 In another embodiment of the method for processing a hard substrate laminate according to the present invention, the jig has a positioning means for arranging the divided block at a center between the two rotating grindstones.
進而，於本發明之硬質基板積層體之加工方法的另一實施形態中，前述夾具可在成直角地通過兩個旋轉磨石的中心軸之間的距離中央的直線軌道上移動。 Further, in another embodiment of the method for processing a hard substrate laminate according to the present invention, the jig is movable at a right angle through a linear track at a center of a distance between central axes of the two rotating grindstones.
進而，於本發明之硬質基板積層體之加工方法的另一實施形態中，就藉由步驟a)所得之硬質基板積層體中將硬質基板彼此貼合的接著劑而言，於步驟b)中預定研削之部位整體存在接著劑，且，佔各硬質基板之接著面的面積的90%以上。 Further, in another embodiment of the method for processing a hard substrate laminate according to the present invention, in the hard substrate laminate obtained in the step a), the adhesive for bonding the hard substrates to each other is in the step b) An adhesive is present throughout the predetermined portion to be ground, and is 90% or more of the area of the adhesion surface of each of the hard substrates.
進而，於本發明之硬質基板積層體之加工方法的另一實施形態中，步驟c)係藉由將複數個分割塊積層及/或橫 向排列於移動方向上，而對複數個分割塊統一實施。 Further, in another embodiment of the method for processing a hard substrate laminate according to the present invention, the step c) is by laminating a plurality of divided blocks and/or horizontally. The directions are arranged in the moving direction, and are implemented uniformly for a plurality of divided blocks.
進而，於本發明之硬質基板積層體之加工方法的另一實施形態中，於實施步驟c)之前，將連結兩個旋轉磨石的中心軸之方向上的分割塊的位置精度控制在±100 μm以內。 Further, in another embodiment of the method for processing a hard substrate laminate according to the present invention, before the step c), the positional accuracy of the divided block in the direction connecting the central axes of the two rotating grindstones is controlled to ±100. Within μm.
進而，於本發明之硬質基板積層體之加工方法的另一實施形態中，硬質基板為強化玻璃製。 Further, in another embodiment of the method for processing a hard substrate layered body of the present invention, the hard substrate is made of tempered glass.
進而，於本發明之硬質基板積層體之加工方法的另一實施形態中，於步驟b)與步驟c)之間、及/或於步驟c)之後進行形狀加工。 Further, in another embodiment of the method for processing a hard substrate laminate according to the present invention, the shape processing is performed between step b) and step c) and/or after step c).
進而，於本發明之硬質基板積層體之加工方法的另一實施形態中，於步驟c)之後，包括d)對已進行研削的端面實施研磨處理的步驟。 Further, in another embodiment of the method for processing a hard substrate laminate according to the present invention, after the step c), the step of performing a polishing treatment on the end surface which has been ground is included.
進而，於本發明之硬質基板積層體之加工方法的另一實施形態中，於步驟c)與步驟d)之間、及/或步驟d)之後進行形狀加工。 Further, in another embodiment of the method for processing a hard substrate laminate according to the present invention, the shape processing is performed between step c) and step d) and/or after step d).
本發明之另一態樣係一種板狀製品之製造方法，其包括以下步驟：於實施如本發明之硬質基板積層體之加工方法後，剝離分割塊，形成複數個板狀製品。 Another aspect of the present invention provides a method of producing a plate-shaped article comprising the steps of: after performing the method of processing a hard substrate laminate according to the present invention, peeling off the divided pieces to form a plurality of plate-like articles.
根據本發明，可以較高生產率製造出端面上之尺寸精度較高之板狀製品。本發明例如可較佳地使用於量產顯示元件的保護玻璃之方法中。 According to the present invention, a plate-like article having a high dimensional accuracy on the end face can be manufactured with high productivity. The invention can be preferably used, for example, in a method of mass producing a cover glass for a display element.
本發明之硬質基板積層體之加工方法的一實施形態中包括以下步驟：a)準備硬質基板積層體，其係由可剝離之接著劑將2 片以上之硬質基板彼此貼合而成；b)於厚度方向分割前述硬質基板積層體，形成所需之數量的經分割之硬質基板積層體(以下稱為「分割塊」)；c)使分割塊於以特定之間隔並列地配置的旋轉磨石之間相對移動，從而同時對分割塊的相對向之兩個端面進行平坦化處理，此處，分割塊的上下表面與該等旋轉磨石的中心軸正交，且分割塊在與該等旋轉磨石之中心軸正交的方向上相對移動。 An embodiment of the method for processing a hard substrate laminate according to the present invention includes the steps of: a) preparing a hard substrate laminate, which is made of a peelable adhesive; The hard substrate is bonded to each other; b) the hard substrate laminate is divided in the thickness direction to form a desired number of divided hard substrate laminates (hereinafter referred to as "divided blocks"); c) splitting The blocks are relatively moved between the rotating grindstones arranged side by side at a specific interval, thereby simultaneously flattening the opposite end faces of the divided blocks, where the upper and lower surfaces of the divided blocks and the rotating grindstones are The central axes are orthogonal and the segmented blocks are relatively moved in a direction orthogonal to the central axis of the rotating grindstones.
<步驟a> <Step a>
參照圖1，於步驟a中準備硬質基板積層體10，其係由可剝離之接著劑12將2片以上之硬質基板11彼此貼合而成。於本實施形態中，硬質基板並無特別限制。做為硬質基板，亦可使用不具有透光性的硬質基板。然而，於將光硬化性接著劑用作接著劑時或以保護顯示元件為目的而使用時，硬質基板必需具有透光性，例如可使用：板玻璃(強化板玻璃、素材板玻璃、附透明導電膜的玻璃基板、形成有電極或電路的玻璃基板等)、藍寶石基板、石英基板、塑膠基板、氟化鎂基板等。做為本發明中使用之硬質基板，尤佳為強化玻璃。強化玻璃可藉由離子交換法或風冷強化法等周知的任意方法製造。至今，由於利用旋轉磨石加工強化玻璃時會產生斷裂的問題，因此較為困難，但若使用本發明則強化玻璃之加工亦可變得容易。 Referring to Fig. 1, in step a, a hard substrate laminate 10 in which two or more hard substrates 11 are bonded to each other is prepared by a peelable adhesive 12. In the present embodiment, the hard substrate is not particularly limited. As the hard substrate, a hard substrate having no light transmittance can also be used. However, when a photocurable adhesive is used as an adhesive or when it is used for the purpose of protecting a display element, the hard substrate must have translucency, and for example, plate glass (reinforced glass, material glass, transparent) can be used. a glass substrate of a conductive film, a glass substrate on which an electrode or a circuit is formed, or the like, a sapphire substrate, a quartz substrate, a plastic substrate, a magnesium fluoride substrate, or the like. As the hard substrate used in the present invention, it is particularly preferably a tempered glass. The tempered glass can be produced by any known method such as ion exchange method or air-cooling strengthening method. Conventionally, it has been difficult to cause breakage when processing tempered glass by using a rotating grindstone. However, the use of the present invention makes it easy to process tempered glass.
硬質基板的大小並無特別限制，典型的是具有10000~250000 mm2左右的面積，且具有0.1~2 mm左右的厚度。一般而言，各硬質基板為相同尺寸。雖並無限定，但可於各硬質基板的表面上附加用於發揮板狀製品的功能之 的特定印刷圖案或鍍敷圖案。做為印刷圖案之示例，可列舉行動電話的顯示畫面之設計，做為鍍敷圖案之示例，可列舉施加有鉻鍍敷圖案的旋轉式編碼器。 The size of the hard substrate is not particularly limited, and is typically about 10,000 to 250,000 mm 2 and has a thickness of about 0.1 to 2 mm. In general, each rigid substrate has the same size. Although not limited, a specific printed pattern or a plating pattern for exerting the function of the plate-shaped product may be added to the surface of each of the rigid substrates. As an example of the printed pattern, the design of the display screen of the mobile phone can be cited. As an example of the plating pattern, a rotary encoder to which a chrome plating pattern is applied can be cited.
關於硬質基板的積層，例如可藉由使如下硬質基板彼此貼合而進行，該硬質基板的一個或兩個貼合面上塗布有可剝離之接著劑。藉由以所需的次數重複此步驟，可製作積層有所需之片數的硬質基板的硬質基板積層體。自提高板狀製品的生產效率的觀點來看，較理想的是製作積層有10片以上之硬質基板的硬質基板積層體，典型的是10~30片之硬質基板的硬質基板積層體。 The laminate of the hard substrate can be carried out, for example, by bonding the rigid substrates to each other, and one or both of the bonding surfaces of the hard substrate are coated with a peelable adhesive. By repeating this step as many times as necessary, a hard substrate laminate in which a desired number of hard substrates are laminated can be produced. From the viewpoint of improving the production efficiency of the plate-shaped product, it is preferable to form a hard substrate laminate in which ten or more hard substrates are laminated, and typically a hard substrate laminate of 10 to 30 rigid substrates.
做為可剝離之接著劑，並無限定，可列舉：濕氣硬化型接著劑、2液混合型接著劑、加熱硬化型接著劑、光硬化性接著劑等。自生產率及作業性的觀點來看，較佳為光硬化性接著劑。在使用光硬化性接著劑之情形時，可於使透光性硬質基板彼此貼合後，藉由照射用於使被夾在兩基板中並擴散的接著劑硬化之光而進行積層。光照射可於每積層一片透光性硬質基板時實施，且只要光能到達接著劑，亦可於積層複數片之後統一實施光照射。 The adhesive which is a peelable adhesive is not limited, and examples thereof include a moisture-curing adhesive, a two-liquid hybrid adhesive, a heat-curing adhesive, and a photocurable adhesive. From the viewpoint of productivity and workability, a photocurable adhesive is preferred. When a photocurable adhesive is used, after the light-transmitting rigid substrates are bonded to each other, the light can be laminated by irradiating light for curing the adhesive which is sandwiched between the two substrates and diffused. The light irradiation can be performed every time a single layer of the light-transmissive hard substrate is laminated, and as long as the light reaches the adhesive, the light irradiation can be uniformly performed after the plurality of layers are laminated.
照射之光的波長可根據使用之接著劑的特性而適當變更，例如可照射微波、紅外線、可見光、紫外線、X射線、γ射線、電子束等。因為可簡便地使用，且具有較高能量，所以照射光通常為紫外線。如此，於本發明中，所謂光不僅為可見光，而是指包含廣波長區域在內的電磁波(能量線)。 The wavelength of the light to be irradiated can be appropriately changed depending on the characteristics of the adhesive to be used, and for example, microwave, infrared, visible light, ultraviolet light, X-ray, gamma ray, electron beam or the like can be irradiated. Because it can be used simply and has a high energy, the illumination light is usually ultraviolet light. As described above, in the present invention, the light is not only visible light but an electromagnetic wave (energy line) including a wide wavelength region.
此處，照射之光的照射量為將透光性硬質基板暫時固定時所需之程度便可，利用使用365 nm的光接收器的積算 照度計進行測定，一般可設定為1~500 mJ/cm2，典型的可設定為3~300 mJ/cm2，更典型的可設定為5~200 mJ/cm2。做為照射時間，一般為1~120秒、典型的是2~60秒左右，較佳為2.5~20秒左右。 Here, the irradiation amount of the irradiated light is required to temporarily fix the light-transmitting rigid substrate, and is measured by an integrated illuminometer using a 365 nm optical receiver, and generally can be set to 1 to 500 mJ/ Cm 2 , typically configurable from 3 to 300 mJ/cm 2 , more typically from 5 to 200 mJ/cm 2 . The irradiation time is generally 1 to 120 seconds, typically 2 to 60 seconds, preferably about 2.5 to 20 seconds.
做為適於本發明使用的光硬化性接著劑，可列舉：如WO2008/018252所記載的含有(A)多官能(甲基)丙烯酸酯、(B)單官能(甲基)丙烯酸酯、及(C)光聚合起始劑的接著性組成物。 The photocurable adhesive which is suitable for use in the present invention includes (A) a polyfunctional (meth) acrylate, (B) a monofunctional (meth) acrylate, and the like, as described in WO 2008/018252. (C) An adhesive composition of a photopolymerization initiator.
做為(A)多官能(甲基)丙烯酸酯，可使用寡聚物/聚合物的末端或側鏈的2個以上經(甲基)丙烯醯基化的多官能(甲基)丙烯酸酯寡聚物/聚合物、或者具有2個以上(甲基)丙烯醯基的多官能(甲基)丙烯酸酯單體。 As the (A) polyfunctional (meth) acrylate, two or more (meth) acryloylated polyfunctional (meth) acrylate oligos of the terminal or side chain of the oligomer/polymer may be used. A polymer/polymer or a polyfunctional (meth) acrylate monomer having two or more (meth) acrylonitrile groups.
例如，做為多官能(甲基)丙烯酸酯寡聚物/聚合物，可列舉：1,2-聚丁二烯末端(甲基)丙烯酸胺基甲酸酯(例如，日本曹達公司製造的「TE-2000」、「TEA-1000」)、其氫化物(例如，日本曹達公司製造的「TEAI-1000」)、1,4-聚丁二烯末端(甲基)丙烯酸胺基甲酸酯(例如，大阪有機化學公司製造的「BAC-45」)、聚異戊二烯末端(甲基)丙烯酸酯、聚酯系(甲基)丙烯酸胺基甲酸酯(例如，日本合成化學公司製造的「UV-2000B」、「UV-3000B」、「UV-7000B」、根上工業公司製造的「KHP-11」、「KHP-17」)、聚醚系(甲基)丙烯酸胺基甲酸酯(例如，日本合成化學公司製造的「UV-3700B」、「UV-6100B」)、或雙酚A型環氧(甲基)丙烯酸酯等。 For example, as the polyfunctional (meth) acrylate oligomer/polymer, a 1,2-polybutadiene terminal (meth) acrylate urethane (for example, manufactured by Japan Soda Co., Ltd.) can be cited. TE-2000", "TEA-1000"), its hydride (for example, "TEAI-1000" manufactured by Japan Soda Co., Ltd.), 1,4-polybutadiene terminal (meth) acrylate (a) For example, "BAC-45" manufactured by Osaka Organic Chemical Co., Ltd., polyisoprene terminal (meth) acrylate, polyester (meth) acrylate urethane (for example, manufactured by Nippon Synthetic Chemical Co., Ltd.) "UV-2000B", "UV-3000B", "UV-7000B", "KHP-11" and "KHP-17" manufactured by Gensal Industries Co., Ltd.), and polyether (meth)acrylic acid urethane ( For example, "UV-3700B" and "UV-6100B" manufactured by Nippon Synthetic Chemical Co., Ltd., or bisphenol A type epoxy (meth) acrylate.
做為2官能(甲基)丙烯酸酯單體，可列舉：1,3-丁二醇二(甲基)丙烯酸酯、1,4-丁二醇二(甲基)丙烯酸酯、1,6-己二 醇二(甲基)丙烯酸酯、1,9-壬二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸、二(甲基)丙烯酸二環戊酯、2-乙基-2-丁基-丙二醇二(甲基)丙烯酸酯、新戊二醇改質三羥甲基丙烷二(甲基)丙烯酸酯、硬脂酸改質季戊四醇二(甲基)丙烯酸酯、聚丙二醇二(甲基)丙烯酸酯、2,2-雙(4-(甲基)丙烯醯氧基二乙氧基苯基)丙烷、2,2-雙(4-(甲基)丙烯醯氧基丙氧基苯基)丙烷、或2,2-雙(4-(甲基)丙烯醯氧基四乙氧苯基)丙烷等。做為3官能(甲基)丙烯酸酯單體，可列舉：三羥甲基丙烷三(甲基)丙烯酸酯、異氰尿酸三[(甲基)丙烯醯氧乙酯]等。做為4官能以上的(甲基)丙烯酸酯單體，可列舉：二羥甲基丙烷四(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、季戊四醇乙氧基四(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯、或二季戊四醇六(甲基)丙烯酸酯等。 Examples of the bifunctional (meth) acrylate monomer include 1,3-butanediol di(meth) acrylate, 1,4-butanediol di(meth) acrylate, and 1,6- Two Alcohol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, neopentyl glycol di(meth)acrylic acid, dicyclopentanyl di(meth)acrylate, 2-ethyl -2-butyl-propylene glycol di(meth)acrylate, neopentyl glycol modified trimethylolpropane di(meth)acrylate, stearic acid modified pentaerythritol di(meth)acrylate, polypropylene glycol Di(meth)acrylate, 2,2-bis(4-(methyl)propenyloxydiethoxyphenyl)propane, 2,2-bis(4-(methyl)propeneoxypropane Oxyphenyl)propane or 2,2-bis(4-(methyl)propenyloxytetraethoxyphenyl)propane. Examples of the trifunctional (meth) acrylate monomer include trimethylolpropane tri(meth) acrylate and isocyanuric acid tris[(methyl) propylene oxime). Examples of the (meth) acrylate monomer having four or more functional groups include dimethylolpropane tetra(meth) acrylate, pentaerythritol tetra(meth) acrylate, and pentaerythritol ethoxy tetra(meth) acrylate. Ester, dipentaerythritol penta (meth) acrylate, or dipentaerythritol hexa (meth) acrylate, and the like.
做為(B)單官能(甲基)丙烯酸酯單體，可列舉：(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸苯酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸二環戊酯、(甲基)丙烯酸二環戊烯酯、(甲基)丙烯酸二環戊烯氧基乙酯、(甲基)丙烯酸異降莰酯、甲氧基化環癸三烯(甲基)丙烯酸酯、(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸3-羥基丙酯、(甲基)丙烯酸4-羥丁酯、(甲基)丙烯酸四氫糠酯、(甲基)丙烯酸2-羥基-3-苯氧基丙酯、(甲基)丙烯酸縮水甘油酯、己內酯改質(甲基)丙烯酸四氫糠酯、(甲基)丙烯酸3-氯-2-羥基丙酯、(甲基)丙烯酸N,N-二甲胺基乙酯、(甲基)丙烯酸N,N-二乙基胺基 乙酯、(甲基)丙烯酸第三丁基胺基乙酯、(甲基)丙烯酸乙氧基羰基甲酯、酚環氧乙烷改質(甲基)丙烯酸酯、酚(環氧乙烷2莫耳改質)(甲基)丙烯酸酯、酚(環氧乙烷4莫耳改質)(甲基)丙烯酸酯、對異丙苯基酚環氧乙烷改質(甲基)丙烯酸酯、壬酚環氧乙烷改質(甲基)丙烯酸酯、壬酚(環氧乙烷4莫耳改質)(甲基)丙烯酸酯、壬酚(環氧乙烷8莫耳改質)(甲基)丙烯酸酯、壬酚(環氧丙烷2.5莫耳改質)(甲基)丙烯酸酯、2-乙基己基卡必醇(甲基)丙烯酸酯、環氧乙烷改質酞酸(甲基)丙烯酸酯、環氧乙烷改質琥珀酸(甲基)丙烯酸酯、(甲基)丙烯酸三氟乙酯、丙烯酸、甲基丙烯酸、順丁烯二酸、反丁烯二酸、ω-羧基-聚己內酯單(甲基)丙烯酸酯、酞酸單羥基乙基(甲基)丙烯酸酯、(甲基)丙烯酸二聚物、β-(甲基)丙烯醯基氧基乙基氫化琥珀酸酯、N-(甲基)丙烯醯氧基烷基六氫酞醯亞胺、(甲基)丙烯酸2-(1,2-環己醯亞胺基)乙酯、乙氧基乙二醇二(甲基)丙烯酸酯、(甲基)丙烯酸苄酯等。 Examples of the (B) monofunctional (meth) acrylate monomer include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, and butyl (meth) acrylate. , 2-ethylhexyl (meth)acrylate, isooctyl (meth)acrylate, isodecyl (meth)acrylate, lauryl (meth)acrylate, stearyl (meth)acrylate, (A) Phenyl acrylate, cyclohexyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, Isonorbornyl (meth)acrylate, methoxylated cyclopentene (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, (methyl) ) 3-hydroxypropyl acrylate, 4-hydroxybutyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate, (methyl) Glycidyl acrylate, caprolactone modified tetrahydrofurfuryl (meth) acrylate, 3-chloro-2-hydroxypropyl (meth) acrylate, N, N-dimethylaminoethyl (meth) acrylate , (meth)acrylic acid N,N-diethylamino Ethyl ester, tert-butylaminoethyl (meth)acrylate, ethoxycarbonyl methyl (meth)acrylate, phenol ethylene oxide modified (meth) acrylate, phenol (ethylene oxide 2 Moer modified) (meth) acrylate, phenol (ethylene oxide 4 molar modified) (meth) acrylate, p-cumyl phenol ethylene oxide modified (meth) acrylate, Indophenol oxirane modified (meth) acrylate, indophenol (ethylene oxide 4 molar modified) (meth) acrylate, indophenol (ethylene oxide 8 molar modified) (A Acrylate, indophenol (propylene oxide 2.5 mole modified) (meth) acrylate, 2-ethylhexyl carbitol (meth) acrylate, ethylene oxide modified citric acid (methyl) Acrylate, ethylene oxide modified succinic acid (meth) acrylate, trifluoroethyl (meth) acrylate, acrylic acid, methacrylic acid, maleic acid, fumaric acid, ω-carboxyl - polycaprolactone mono (meth) acrylate, decanoic acid monohydroxyethyl (meth) acrylate, (meth) acrylate dimer, β-(methyl) propylene decyl oxyethyl hydrogenated amber Acid ester, N-(methyl) propylene oxiranyl hexahydroindenimide, (methyl) Acid 2- (1,2-cyclohexane acyl imino) ethyl, ethoxy glycol di (meth) acrylate, (meth) acrylate, benzyl and the like.
做為(A)多官能(甲基)丙烯酸酯與(B)單官能(甲基)丙烯酸酯的調配比，較佳為(A)：(B)=5：95~95：5(質量份)。若為5質量份以上則不存在初期之接著性下降的問題，若為95質量份以下則可確保剝離性。將已硬化的接著劑浸漬於溫水中，藉此呈膜狀剝離。(B)單官能(甲基)丙烯酸酯的含量進而較佳為，於(A)及(B)的合計量100質量份中佔40~80質量份。 As the compounding ratio of (A) polyfunctional (meth) acrylate and (B) monofunctional (meth) acrylate, it is preferred that (A): (B) = 5: 95 to 95: 5 (parts by mass) ). When it is 5 parts by mass or more, there is no problem that the initial adhesion is lowered, and if it is 95 parts by mass or less, the peeling property can be ensured. The hardened adhesive is immersed in warm water to thereby peel off in a film form. The content of the (B) monofunctional (meth) acrylate is more preferably 40 to 80 parts by mass based on 100 parts by mass of the total of (A) and (B).
(C)光聚合起始劑係為了經由可見光或紫外線等活性光線增敏而促進樹脂組成物的光硬化而摻混者，可使用周知的各種光聚合起始劑。具體而言可列舉：二苯甲酮或其衍生物；苯偶醯或其衍生物；蒽醌或其衍生物；安息香； 安息香甲基醚、安息香乙基醚、安息香丙基醚、安息香異丁基醚、苯偶醯二甲基縮酮等安息香衍生物；二乙氧基苯乙酮、4-第三丁基三氯苯乙酮等苯乙酮衍生物；苯甲酸2-二甲胺基乙酯；苯甲酸對二甲胺基乙酯；二苯基二硫醚；噻吨酮或其衍生物；莰醌；7,7-二甲基-2,3-二氧雜二環[2.2.1]庚烷-1-羧酸、7,7-二甲基-2,3-二氧雜二環[2.2.1]庚烷-1-羧酸2-溴乙酯、7,7-二甲基-2,3-二氧雜二環[2.2.1]庚烷-1-羧酸2-甲酯、7,7-二甲基-2,3-二氧雜二環[2.2.1]庚烷-1-羧醯氯等莰醌衍生物；2-甲基-1-[4-(甲硫基)苯基]-2-嗎啉基丙烷-1-酮、2-苄基-2-二甲胺基-1-(4-嗎啉基苯基)-丁酮-1等α-胺基烷基苯酮衍生物；苯甲醯二苯基氧化膦、2,4,6-三甲基苯甲醯二苯基氧化膦、苯甲醯二乙氧基氧化膦、2,4,6-三甲基苯甲醯二甲氧基苯基氧化膦、2,4,6-三甲基苯甲醯二乙氧基苯基氧化膦等醯基氧化膦衍生物、羥苯基乙酸2-[2-側氧基-2-苯基-乙醯氧基-乙氧基]乙酯及/或羥苯基乙酸2-[2-羥基-乙氧基]乙酯等。光聚合起始劑可使用1種或將2種以上組合使用。其等之中，就效果較大的方面而言，較佳為由苯偶醯二甲基縮酮、羥苯基乙酸2-[2-側氧基-2-苯基-乙醯氧基-乙氧基]-乙酯及羥苯基乙酸2-[2-羥基-乙氧基]乙酯所組成之群組中的1種或2種以上。 (C) The photopolymerization initiator is a mixture of various photopolymerization initiators which are known to accelerate the photocuring of the resin composition by sensitization with active light such as visible light or ultraviolet rays. Specific examples thereof include: benzophenone or a derivative thereof; benzoin or a derivative thereof; an anthracene or a derivative thereof; benzoin; Benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin isobutyl ether, benzoin dimethyl ketal and other benzoin derivatives; diethoxyacetophenone, 4-tert-butyl trichloride Acetophenone derivative such as acetophenone; 2-dimethylaminoethyl benzoate; p-dimethylaminoethyl benzoate; diphenyl disulfide; thioxanthone or a derivative thereof; ,7-Dimethyl-2,3-dioxabicyclo[2.2.1]heptane-1-carboxylic acid, 7,7-dimethyl-2,3-dioxabicyclo[2.2.1 2-heptane-1-carboxylic acid 2-bromoethyl ester, 7,7-dimethyl-2,3-dioxabicyclo[2.2.1]heptane-1-carboxylic acid 2-methyl ester, 7, Anthracene derivative such as 7-dimethyl-2,3-dioxabicyclo[2.2.1]heptane-1-carboxyindole chloride; 2-methyl-1-[4-(methylthio)benzene α-Aminoalkylbenzenes such as 2-morpholinylpropan-1-one and 2-benzyl-2-dimethylamino-1-(4-morpholinylphenyl)-butanone-1 Ketone derivatives; benzamidine diphenylphosphine oxide, 2,4,6-trimethylbenzimidium diphenylphosphine oxide, benzamidine diethoxyphosphine oxide, 2,4,6-trimethyl a mercapto phosphine oxide derivative such as benzamidine dimethoxyphenylphosphine oxide or 2,4,6-trimethylbenzimidium diethoxyphenylphosphine oxide; Phenyl-acetic acid 2- [2-oxo-2-phenyl - acetyl oxy - ethoxy] ethyl ester and / or hydroxyphenyl acetic acid 2- [2-hydroxy - ethoxy] ethyl ester and the like. The photopolymerization initiator may be used alone or in combination of two or more. Among them, in terms of a more effective effect, it is preferably benzoquinone dimethyl ketal, hydroxyphenylacetic acid 2-[2-o-oxy-2-phenyl-ethoxycarbonyl- One or two or more of the group consisting of ethoxy]-ethyl ester and 2-[2-hydroxy-ethoxy]ethyl hydroxyphenylacetate.
(C)光聚合起始劑的含量較佳為相對於(A)及(B)的合計100質量份為0.1~20質量份，更佳為0.5~10質量份。若為0.1質量份以上，則可確實地獲得硬化促進效果，若為20質量份以下則可獲得充分的硬化速度。添加(C)成分1質量份以上，則可不依存光照射量地實現硬化，進而組成物的硬化體的交聯度變高，就切削加工時不會產生 位置偏移等方面或剝離性提高方面而言為更佳。 The content of the photopolymerization initiator (C) is preferably 0.1 to 20 parts by mass, more preferably 0.5 to 10 parts by mass, per 100 parts by mass of the total of (A) and (B). When the amount is 0.1 part by mass or more, the curing acceleration effect can be surely obtained, and if it is 20 parts by mass or less, a sufficient curing rate can be obtained. When the amount of the component (C) is 1 part by mass or more, the curing can be achieved without depending on the amount of light irradiation, and the degree of crosslinking of the cured body of the composition is increased, so that it does not occur during the cutting process. It is more preferable in terms of positional shift or the like or improvement in peeling property.
光硬化性接著劑較佳為含有不溶解於接著劑的成分(A)、(B)及(C)的粒狀物質(D)。藉此，由於硬化後的組成物可保持固定的厚度，故加工精度提高。進而，由於接著性組成物的硬化體與粒狀物質(D)的線膨脹係數不同，故於使用前述接著劑組成物而貼合透光性硬質基板後進行剝離時的剝離性提高。 The photocurable adhesive is preferably a particulate material (D) containing components (A), (B), and (C) which are not dissolved in the adhesive. Thereby, since the composition after hardening can maintain a fixed thickness, the processing precision improves. Further, since the linear expansion coefficient of the cured material of the adhesive composition and the particulate material (D) is different, the peeling property at the time of peeling after bonding the light-transmitting rigid substrate using the above-described adhesive composition is improved.
做為粒狀物質(D)的材質，一般使用的有機粒子、或無機粒子均可。具體而言，做為有機粒子，可列舉：聚乙烯粒子、聚丙烯粒子、交聯聚(甲基)丙烯酸甲酯粒子、交聯聚苯乙烯粒子等。做為無機粒子，可列舉：玻璃、二氧化矽、氧化鋁、鈦等陶瓷粒子。 As the material of the particulate matter (D), organic particles or inorganic particles generally used may be used. Specifically, examples of the organic particles include polyethylene particles, polypropylene particles, crosslinked poly(methyl) acrylate particles, and crosslinked polystyrene particles. Examples of the inorganic particles include ceramic particles such as glass, ceria, alumina, and titanium.
關於粒狀物質(D)，從加工精度的提高、即控制接著劑的膜厚之觀點來看，較佳為球狀。粒狀物質(D)的由雷射法所得的平均粒徑較佳為處於20~200 μm的範圍內。若前述粒狀物質的平均粒徑未達20 μm則剝離性較差，若超過200 μm則暫時固定的構件於加工時易產生偏移，在尺寸精度方面較差。從剝離性與尺寸精度的觀點來看，平均粒徑(D50)更佳為35 μm~150 μm，進而更佳為50 μm~120 μm。粒徑分布係藉由雷射繞射式粒度分布測定裝置測定。 The particulate matter (D) is preferably spherical in view of improvement in processing accuracy, that is, control of the film thickness of the adhesive. The average particle diameter of the particulate matter (D) by the laser method is preferably in the range of 20 to 200 μm. When the average particle diameter of the particulate matter is less than 20 μm, the peeling property is inferior. When the average particle diameter exceeds 200 μm, the temporarily fixed member is likely to be displaced during processing and is inferior in dimensional accuracy. The average particle diameter (D50) is preferably from 35 μm to 150 μm, and more preferably from 50 μm to 120 μm, from the viewpoints of peelability and dimensional accuracy. The particle size distribution was measured by a laser diffraction type particle size distribution measuring apparatus.
關於粒狀物質(D)的使用量，從接著性、加工精度、剝離性的觀點來看，相對於(A)及(B)的合計量100質量份，較佳為0.1~20質量份，更佳為0.2~10質量份，最佳為0.2~6質量份。 The amount of use of the particulate matter (D) is preferably 0.1 to 20 parts by mass based on 100 parts by mass of the total of (A) and (B) from the viewpoint of adhesion, processing accuracy, and peelability. More preferably, it is 0.2 to 10 parts by mass, and most preferably 0.2 to 6 parts by mass.
為了提高儲藏安定性，可向光硬化性接著劑中添加聚合抑制劑(E)。做為聚合抑制劑，可列舉：甲基對苯二酚、 對苯二酚、2,2-亞甲基-雙(4-甲基-6-第三丁基酚)、鄰苯二酚、對苯二酚單甲醚、單第三丁基對苯二酚、2,5-二第三丁基對苯二酚、對苯醌、2,5-二苯基對苯醌、2,5-二第三丁基對苯醌、苦味酸、檸檬酸、吩噻嗪、第三丁基鄰苯二酚、2-丁基-4-羥基苯甲醚及2,6-二第三丁基對甲酚等。 In order to improve storage stability, a polymerization inhibitor (E) may be added to the photocurable adhesive. As a polymerization inhibitor, methyl hydroquinone, Hydroquinone, 2,2-methylene-bis(4-methyl-6-tert-butylphenol), catechol, hydroquinone monomethyl ether, mono-tert-butyl-p-phenylene Phenol, 2,5-di-t-butyl hydroquinone, p-benzoquinone, 2,5-diphenyl-p-benzoquinone, 2,5-di-t-butyl-p-benzoquinone, picric acid, citric acid, Phenothiazine, tert-butyl catechol, 2-butyl-4-hydroxyanisole, and 2,6-di-t-butyl-p-cresol.
關於聚合抑制劑(E)的使用量，相對於(A)及(B)的合計量100質量份，較佳為0.001~3質量份，更佳為0.01~2質量份。若為0.001質量份以上則可確保儲藏安定性，若為3質量份以下則可獲得良好的接著性，亦不存在未硬化的情況。 The amount of use of the polymerization inhibitor (E) is preferably 0.001 to 3 parts by mass, more preferably 0.01 to 2 parts by mass, per 100 parts by mass of the total of (A) and (B). When it is 0.001 part by mass or more, storage stability can be ensured, and if it is 3 parts by mass or less, good adhesion can be obtained, and there is no case where it is not cured.
就光硬化性接著劑而言，為了達到提高硬化性之目的，進而亦可使用有機過氧化物。亦可於不具有透光性的硬質基板的積層時，例如代替光聚合起始劑(C)，而使用有機過氧化物做為聚合起始劑。 In the photocurable adhesive, an organic peroxide can be further used for the purpose of improving the curability. It is also possible to use an organic peroxide as a polymerization initiator when laminating a hard substrate having no light transmissive property, for example, instead of the photopolymerization initiator (C).
做為適於本發明的光硬化性接著劑，可列舉下述光硬化性接著劑1~2。 The photocurable adhesives 1 to 2 described below are exemplified as the photocurable adhesives to be used in the present invention.
1.光硬化性接著劑1 1. Photocurable adhesive 1
將以下(A)~(E)的成分混合而製作光硬化性接著劑1。 The components (A) to (E) below were mixed to prepare a photocurable adhesive 1 .
做為(A)多官能(甲基)丙烯酸酯，使用日本合成公司製造的「UV-3000B」(聚酯系丙烯酸胺基甲酸酯、重量平均分子量18000、多元醇化合物為聚酯多元醇、有機聚異氰酸酯化合物為異佛酮二異氰酸酯、(甲基)丙烯酸羥酯為丙烯酸2-羥基乙酯)15質量份、二丙烯酸二環戊酯(日本化藥公司製造的「KAYARAD R-684」)15質量份、 做為(B)單官能(甲基)丙烯酸酯，使用丙烯酸2-(1,2-環六羧基醯亞胺)乙酯(東亞合成公司製造的「ARONIX M-140」)45質量份、酚環氧乙烷2莫耳改質丙烯酸酯(東亞合成公司製造的「ARONIX M-101A」)25質量份、做為(C)光聚合起始劑，使用苯偶醯二甲基縮酮(BASF JAPAN公司製造的「IRGACURE651」))10質量份、做為(D)粒狀物質，使用平均粒徑100 μm的球狀交聯聚苯乙烯粒子(AICA工業公司製造的「GS-100S」)1質量份、做為(E)聚合抑制劑，使用2,2-亞甲基-雙(4-甲基-6-第三丁基酚)(住友化學公司製造的「SUMILIZER MDP-S」)0.1質量份 As the (A) polyfunctional (meth) acrylate, "UV-3000B" manufactured by Nippon Synthetic Co., Ltd. (polyester urethane urethane, weight average molecular weight 18,000, polyol compound is polyester polyol, The organic polyisocyanate compound is 15 parts by mass of isophorone diisocyanate, hydroxy (meth) acrylate (2-hydroxyethyl acrylate), and dicyclopentanyl diacrylate ("KAYARAD R-684" manufactured by Nippon Kayaku Co., Ltd.) 15 parts by mass, As the (B) monofunctional (meth) acrylate, using 45 parts by mass of phenol, 2-(1,2-cyclohexadecylimine)ethyl acrylate ("ARONIX M-140" manufactured by Toagosei Co., Ltd.) Ethylene oxide 2 molar modified acrylate ("ARONIX M-101A" manufactured by Toagosei Co., Ltd.) 25 parts by mass, as (C) photopolymerization initiator, using benzoin dimethyl ketal (BASF) "IRGACURE 651" manufactured by JAPAN Co., Ltd.) 10 parts by mass of (D) granular material, and spherical crosslinked polystyrene particles ("GS-100S" manufactured by AICA Industries Co., Ltd.) having an average particle diameter of 100 μm are used. As a polymerization inhibitor, (2) a polymerization inhibitor, 2,2-methylene-bis(4-methyl-6-tert-butylphenol) ("SUMILIZER MDP-S" manufactured by Sumitomo Chemical Co., Ltd.) 0.1 Parts by mass
2.光硬化性接著劑2的製作 2. Production of photocurable adhesive 2
將以下(A)~(E)的成分來製作光硬化性接著劑2。 The photocurable adhesive 2 was produced from the following components (A) to (E).
做為(A)多官能(甲基)丙烯酸酯，使用日本合成公司製造的「UV-3000B」(聚酯系丙烯酸胺基甲酸酯、重量平均分子量18000、多元醇化合物為聚酯多元醇、有機聚異氰酸酯化合物為異佛酮二異氰酸酯、(甲基)丙烯酸羥酯為丙烯酸2-羥基乙酯)20質量份、二丙烯酸二環戊酯(日本化藥公司製造的「KAYARAD R-684」)25質量份、做為(B)單官能(甲基)丙烯酸酯，使用丙烯酸2-羥基-3-苯氧基丙酯(東亞合成公司製造的「ARONIXM-5700」)35質量份、酚環氧乙烷2莫耳改質丙烯酸酯(東亞合成公司製造的「ARONIXM-101A」)20質量份、做為(C)光聚合起始劑，使用苯偶醯二甲基縮酮(BASF JAPAN公司製造的「IRGACURE651」))10質量份、 做為(D)粒狀物質，使用平均粒徑100 μm的球狀交聯聚苯乙烯粒子(AICA工業公司製造的「GS-100S」)1質量份、做為(E)聚合抑制劑，使用2,2-亞甲基-雙(4-甲基-6-第三丁基酚)(住友化學公司製造的「SUMILIZER MDP-S」)0.1質量份 As the (A) polyfunctional (meth) acrylate, "UV-3000B" manufactured by Nippon Synthetic Co., Ltd. (polyester urethane urethane, weight average molecular weight 18,000, polyol compound is polyester polyol, The organic polyisocyanate compound is 20 parts by mass of isophorone diisocyanate, hydroxy (meth) acrylate (2-hydroxyethyl acrylate), and dicyclopentanyl diacrylate ("KAYARAD R-684" manufactured by Nippon Kayaku Co., Ltd.) 25 parts by mass, as (B) monofunctional (meth) acrylate, using 2-hydroxy-3-phenoxypropyl acrylate ("ARONIXM-5700" manufactured by Toagosei Co., Ltd.), 35 parts by mass, phenol epoxy 20 parts by mass of ethane 2 molar modified acrylate ("ARONIXM-101A" manufactured by Toagosei Co., Ltd.), as (C) photopolymerization initiator, using benzoin dimethyl ketal (manufactured by BASF JAPAN Co., Ltd.) "IRGACURE651")) 10 parts by mass, As the (D) granular material, 1 part by mass of spherical crosslinked polystyrene particles ("GS-100S" manufactured by AICA Industries Co., Ltd.) having an average particle diameter of 100 μm is used as the polymerization inhibitor (E). 2,2-methylene-bis(4-methyl-6-tert-butylphenol) ("SUMILIZER MDP-S" manufactured by Sumitomo Chemical Co., Ltd.) 0.1 parts by mass
將硬質基板積層時，一般以使兩硬質基板在面方向重疊的方式進行。於形成需要較高位置精度(例如容許誤差為10~30 μm左右)的印刷圖案(例如行動電話的顯示畫面之設計)時尤為重要。做為實施該方式之方法，考慮有利用用於限制各硬質基板的移動方向以使其移動至固定位置的軌道、擋板或框之方法。為了實現更加高精度之定位，較佳者為於各透光性硬質基板的表面標注用於位置對準的記號，一面利用攝像裝置對其進行拍攝，一面進行位置調整。如此之方法例如於WO2011/089963號或WO2011/089964號中有所記載，本說明書引用該等全部揭示。 When the hard substrate is laminated, it is generally carried out so that the two rigid substrates overlap each other in the plane direction. It is particularly important to form a printed pattern that requires high positional accuracy (for example, an allowable error of about 10 to 30 μm), such as the design of a display screen of a mobile phone. As a method of carrying out the method, a method of using a rail, a baffle or a frame for restricting the moving direction of each rigid substrate to move it to a fixed position is considered. In order to achieve higher-precision positioning, it is preferable to mark the surface of each of the light-transmitting rigid substrates with a mark for alignment, and to perform position adjustment while photographing the image by the image pickup device. Such a method is described, for example, in WO 2011/089963 or WO 2011/089964, the entire disclosure of which is hereby incorporated by reference.
自防止積層時的硬質基板的撓曲而提高積層精度的觀點、防止端面加工時的碎屑的觀點、及防止進行蝕刻處理之情形時蝕刻液浸入基板之間的間隙的觀點來看，較佳者為接著劑存在於藉由步驟b中之端面加工所預定研削的部位整體上，該接著劑係使由步驟b所得之分割塊上的硬質基板彼此貼合者，且較佳者為佔各硬質基板之接著面的面積的90%以上，更佳為95%以上。如圖5(x)所示，於實施步驟b時，若分割塊的端面16上的基板之間存在無接著劑的間隙，則端面加工時易產生碎屑，另一方面，如圖5 (y)所示，由於利用接著劑填充於基板之間，故接著劑發揮加強基板的作用，且於端面加工時抑制碎屑。 From the viewpoint of preventing the deflection of the hard substrate during lamination to improve the lamination accuracy, the viewpoint of preventing chipping during end surface processing, and the gap between the substrates when the etching liquid is prevented from being etched, it is preferable. The adhesive is present on the entire portion of the portion to be ground by the end face processing in the step b, and the adhesive is used to bond the hard substrates on the divided blocks obtained in the step b to each other, and preferably The area of the adhesion surface of the hard substrate is 90% or more, and more preferably 95% or more. As shown in FIG. 5(x), when step b is performed, if there is no gap between the substrates on the end faces 16 of the divided blocks, the end faces are prone to chipping, and on the other hand, as shown in FIG. (y) shows that since the adhesive is filled between the substrates, the adhesive acts as a reinforcing substrate and suppresses chipping during end surface processing.
<步驟b> <Step b>
參照圖2，於步驟b中，在厚度方向上分割前述硬質基板積層體10，形成所需之數量的經分割的硬質基板積層體14(以下稱為「分割塊」)。向前述硬質基板積層體10的厚度方向的分割例如可沿著圖2所示的切斷線13進行。分割方法並無特別限定，可列舉以下方法：分別單獨或組合地使用圓板切割機(鑽石磨盤、硬質合金磨盤)、固定研磨粒式或游離研磨粒式線鋸、雷射光束、蝕刻(例：使用氟酸或硫酸等的化學蝕刻或電解蝕刻)、噴水及電熱帶(鎳鉻合金線)，將其分割為同尺寸的長方體形狀。蝕刻亦可用於分割後的切斷面的表面處理中。 Referring to Fig. 2, in step b, the hard substrate laminate 10 is divided in the thickness direction to form a desired number of divided hard substrate laminates 14 (hereinafter referred to as "divided blocks"). The division into the thickness direction of the hard substrate layered body 10 can be performed, for example, along the cutting line 13 shown in Fig. 2 . The dividing method is not particularly limited, and examples thereof include a disc cutting machine (diamond grinding disc, carbide grinding disc), a fixed abrasive granule or a free abrasive granule saw, a laser beam, and etching, respectively, alone or in combination. : Chemical etching or electrolytic etching using hydrofluoric acid or sulfuric acid, water spray, and electric heating (nickel-chromium wire), and dividing it into a rectangular parallelepiped shape of the same size. Etching can also be used in the surface treatment of the cut surface after the division.
於步驟b之後，若構成分割塊之各硬質基板的預定實施步驟c的相對向的兩個端面的距離(硬質基板的寬度)存在差異，則對步驟c的穩定實施造成障礙，因此較理想的是硬質基板的寬度偏差較少。具體而言，較佳為尺寸誤差為100 μm以下，更佳為80 μm以下。此處，所謂尺寸誤差係指實施步驟c的一個分割塊內的最大寬度與最小寬度的差，可例如藉由對於分割塊利用測微器測定分割塊的4個角和中央部，將測定出的最大值減去最小值後得出。 After the step b, if the distance between the opposite end faces (the width of the hard substrate) of the predetermined step c of the hard substrate constituting the divided block is different, the stable implementation of the step c is hindered, so that it is preferable. The width of the rigid substrate is less. Specifically, the dimensional error is preferably 100 μm or less, more preferably 80 μm or less. Here, the dimensional error refers to the difference between the maximum width and the minimum width in one divided block in the step c, and can be measured, for example, by measuring the four corners and the central portion of the divided block by using a micrometer for the divided block. The maximum value is subtracted from the minimum value.
<步驟c> <Step c>
參照圖3，於步驟c中，使分割塊14於以特定間隔並列地配置的旋轉磨石15之間相對移動，從而同時對分割塊的相對向的兩個端面16進行研削。由於一次加工處理除了可對複數個硬質基板的端面進行加工以外，亦可使兩個端 面平坦化，故有助於生產效率的提高。當分割塊為長方體之時，若實施本步驟合計2次，則亦可處理全部四個端面。進而，如圖3所示，亦可藉由將複數個分割塊積層及/或橫向排列於移動方向上，而對複數個分割塊統一實施步驟c。藉此，可一次性對更多硬質基板的端面處理。 Referring to Fig. 3, in step c, the divided blocks 14 are relatively moved between the rotating grindstones 15 arranged side by side at a specific interval, thereby simultaneously grinding the opposite end faces 16 of the divided blocks. Since one processing can process the end faces of a plurality of hard substrates, the two ends can also be made. The flat surface is flat, which contributes to the improvement of production efficiency. When the divided block is a rectangular parallelepiped, if this step is performed twice in total, all four end faces can be processed. Further, as shown in FIG. 3, step c may be collectively performed on a plurality of divided blocks by stacking a plurality of divided blocks and/or laterally arranging them in the moving direction. Thereby, the end faces of more rigid substrates can be processed at one time.
實施步驟c之前的分割塊的寬度與兩個旋轉磨石的中心軸連成的直線上的距離d之差，相當於一次研削處理中減少的分割塊的寬度。於實施步驟c之前的分割玻璃塊的寬度過度大於兩個旋轉磨石的中心軸連成的直線上的距離d之時，於端面處理時會施加較大的負荷，分割塊或旋轉磨石破損的危險性變高。另一方面，若實施步驟c之前的分割塊的寬度過度小於距離d，則研削效率變得低效。因此，關於因一次研削處理而減少的分割塊的寬度，就一邊的端面而言，較佳為10~300 μm左右，更佳為15~200 μm。步驟c可根據需要重複實施。從不徒勞而是有效地去除步驟b中產生的尺寸誤差或碎屑的觀點來看，就一邊的端面而言，較佳者為重複步驟c直至整體減少30~500 μm寬度為止，更佳為重複步驟c直至減少50~300 μm為止。做為分割塊的整體寬度，僅減少該數值2倍的值。 The difference between the width d of the divided block before the step c and the straight line connecting the central axes of the two rotating grindstones corresponds to the width of the divided block which is reduced in one grinding process. When the width of the split glass block before the step c is excessively larger than the distance d on the straight line connecting the central axes of the two rotating grindstones, a large load is applied during the end face treatment, and the split block or the rotating grindstone is broken. The danger is getting higher. On the other hand, if the width of the divided block before the execution of step c is excessively smaller than the distance d, the grinding efficiency becomes inefficient. Therefore, the width of the divided block which is reduced by one grinding process is preferably about 10 to 300 μm, more preferably 15 to 200 μm, with respect to one end surface. Step c can be repeated as needed. From the viewpoint of not removing the dimensional error or debris generated in the step b in a futile but effective manner, it is preferable that the end surface of one side is repeated step c until the overall width is reduced by 30 to 500 μm, more preferably Repeat step c until it is reduced by 50~300 μm. As the overall width of the segmentation block, only the value twice the value is reduced.
於重複步驟c之情形時，較佳為於最初使用表面粗糙度較大的磨石，於精加工時使用表面粗糙度較小的磨石。雖然使用表面粗糙度較小的磨石會使研削後之分割塊的端面平坦化，但由於表面粗糙度較小的磨石的研削效率較低，因此，若自最初起使用表面粗糙度較小的磨石則會增加研削所需的重複次數。又，由於表面粗糙度較小的磨石壽命較短，故可藉由使用於精加工中來減少使用頻率。藉 此可降低磨石之更換頻率。 In the case of repeating step c, it is preferred to initially use a grindstone having a large surface roughness, and to use a grindstone having a small surface roughness in finishing. Although the use of a grindstone with a small surface roughness flattens the end face of the split block after grinding, the grinding roughness of the grindstone having a small surface roughness is low, so that the surface roughness is small from the beginning. The grindstone will increase the number of iterations required for grinding. Moreover, since the grinding stone having a small surface roughness has a short life, it can be used in finishing to reduce the frequency of use. borrow This can reduce the frequency of replacement of the grindstone.
例如，於最初之重複處理中使用粒度為400號以下、較佳為150~350號的磨石，根據需要提高號數，於最後之重複處理中使用粒度超過400號、較佳為500~800號的磨石。無需超過所需要求地變更磨石的號數，一般準備粗削用與精加工用該兩種便可。號數係基於JIS(Japanese Industrial Standards，日本工業標準)R 6001。 For example, in the initial repeated treatment, a grindstone having a particle size of 400 or less, preferably 150 to 350, is used, and the number is increased as needed, and the particle size is more than 400, preferably 500 to 800 in the final repeated treatment. No. It is not necessary to change the number of grindstones more than necessary. It is generally required to use both of roughing and finishing. The number is based on JIS (Japanese Industrial Standards) R 6001.
分割塊14係以其上下表面與兩個旋轉磨石15的中心軸正交之方式配置，且分割塊14在與該等旋轉磨石15之中心軸正交的方向上相對移動。相對移動可藉由使旋轉磨石及分割塊之任一者或兩者移動而實施。相對移動亦可藉由馬達等驅動手段自動地進行。亦可藉由變換器等來控制相對移動時的速度。藉由以如此之位置關係使分割塊14與旋轉磨石15相對移動，可較大地減輕加工時對於硬質基板邊緣的負荷，使碎屑的產生機率大幅降低，因此，生產率得到較大提高。反過來說，若使分割塊14的上下表面與兩個旋轉磨石15的中心軸平行地配置，則加工時對於硬質基板的邊緣之負荷變大，易產生碎屑。 The divided block 14 is disposed such that its upper and lower surfaces are orthogonal to the central axes of the two rotating grindstones 15, and the divided blocks 14 relatively move in a direction orthogonal to the central axis of the rotating grindstones 15. Relative movement can be performed by moving either or both of the rotating grindstone and the split block. The relative movement can also be automatically performed by a driving means such as a motor. The speed at the time of relative movement can also be controlled by an inverter or the like. By relatively moving the divided block 14 and the rotating grindstone 15 in such a positional relationship, the load on the edge of the hard substrate during processing can be greatly reduced, and the probability of generation of debris is greatly reduced, so that the productivity is greatly improved. Conversely, when the upper and lower surfaces of the divided block 14 are arranged in parallel with the central axes of the two rotating grindstones 15, the load on the edges of the rigid substrate during processing becomes large, and debris is likely to be generated.
旋轉磨石之旋轉方向並無特別限制，但自研削效率的觀點來看，較佳為設定為如圖3之箭頭所示的妨礙分割塊之行進的方向。又，自均勻地對端面進行加工而使尺寸精度提高的觀點來看，一般係使兩個旋轉磨石的旋轉速度或材質相同。旋轉磨石例如係藉由結合劑使研磨粒結合而製作。做為研磨粒之材質並無特別限定，但可列舉鑽石或氮化硼等。於研削玻璃之情形時，較佳為鑽石。做為結合劑之材質並無特別限定，但可列舉：使用金屬粉末等之金屬 結合劑、使用熱硬化性樹脂等之樹脂結合劑、並用金屬粉末與熱硬化性樹脂等之金屬樹脂結合劑等。其中，於本用途中一般使用金屬結合劑。金屬結合劑係藉由將以複數種金屬為首的各種物質調配、燒結而製作。做為使用金屬結合劑之磨石，可列舉：電鍍磨石，其係藉由鎳鍍敷僅將一層鑽石埋入母材中直至達到標準量為止；及電鑄磨石，其不存在母材，經由鍍敷而緻密地貼合著鑽石。其中，自磨石形狀之維持性的觀點來看，較佳為電鑄磨石。做為鍍敷層之材質並無特別限定，但一般多將鎳做為主成分。 The direction of rotation of the rotating grindstone is not particularly limited, but from the viewpoint of the grinding efficiency, it is preferably set to a direction that hinders the travel of the divided block as indicated by an arrow in FIG. Further, from the viewpoint of uniformly processing the end faces and improving the dimensional accuracy, generally, the rotational speeds or materials of the two rotating grindstones are the same. The rotating grindstone is produced, for example, by bonding abrasive grains by a bonding agent. The material of the abrasive grains is not particularly limited, and examples thereof include diamond or boron nitride. In the case of grinding glass, it is preferably a diamond. The material of the binder is not particularly limited, but examples thereof include the use of a metal such as a metal powder. As the binder, a resin binder such as a thermosetting resin or a metal resin binder such as a metal powder or a thermosetting resin is used in combination. Among them, metal binders are generally used in the present application. The metal bond is prepared by blending and sintering various materials including a plurality of metals. As a grindstone using a metal bond, an electroplated grindstone is exemplified by embedding only one layer of diamond in a base material by nickel plating until a standard amount is reached; and an electroforming grindstone which does not have a base material The diamond is densely attached via plating. Among them, from the viewpoint of the maintenance of the shape of the grindstone, an electroforming grindstone is preferred. The material of the plating layer is not particularly limited, but nickel is generally used as a main component.
自使尺寸精度提高的觀點來看，較佳為於利用夾具17將分割塊14固定後再進行。夾具17較佳為具有夾板18，其用以於上下方向及/或行進方向夾持分割塊14。夾板18可藉由螺栓19調整緊固強度。夾具17亦可在成直角地通過兩個旋轉磨石15的中心軸之間的距離中央的直線軌道25上移動。 From the viewpoint of improving the dimensional accuracy, it is preferable to perform the fixing of the divided block 14 by the jig 17. The clamp 17 preferably has a clamping plate 18 for holding the dividing block 14 in the up and down direction and/or the traveling direction. The splint 18 can be adjusted in tightening strength by the bolts 19. The jig 17 can also be moved at a right angle through the linear track 25 at the center of the distance between the central axes of the two rotating grindstones 15.
自使尺寸精度提高的觀點來看，夾具17較佳為具有用於將分割塊14配置在兩個旋轉磨石之間的中央(中心對準)的定位手段。做為定位手段並無特別限制，例如圖4所示般，當夾具17在與分割塊14之上下表面平行且與行進方向成直角的方向上僅相距中心對準所需的距離時，利用螺栓28、29等固定手段可裝卸地安裝擋板20，從而可將其用作定位手段。可以將隔離物21夾在夾具的本體26與擋板20之間的方式來調節距離。可以分割塊14的一側端面抵接於擋板20之方式將分割塊14放置於夾具17中，藉此完成中心對準。 From the standpoint of improving the dimensional accuracy, the jig 17 preferably has a centering (center alignment) positioning means for arranging the dividing block 14 between the two rotating grindstones. The positioning means is not particularly limited. For example, as shown in FIG. 4, when the jig 17 is aligned only at a distance from the center in a direction parallel to the lower surface of the division block 14 and at right angles to the traveling direction, the bolt is used. The baffle 20 is detachably mounted by a fixing means such as 28, 29, etc., so that it can be used as a positioning means. The distance can be adjusted by sandwiching the spacer 21 between the body 26 of the clamp and the shutter 20. The dividing block 14 can be placed in the jig 17 in such a manner that one end face of the dividing block 14 abuts against the baffle 20, thereby completing center alignment.
為了實施更高精度的定位，可藉由在與前述擋板20相 反側的位置上亦經由隔離物23而可裝卸地安裝擋板22，來對設置於行進方向前後的螺栓28、29的鎖緊狀態進行調整，從而以使分割塊14的端面與進行方向平行之方式進行微調整。為了一面測定平行度一面進行微調整，可將能測定鎖緊距離的度盤式指示器27設置於分割塊14或夾具17上。完成中心對準後，可卸除擋板20、22及隔離物21、23。 In order to carry out higher-precision positioning, by being in phase with the aforementioned baffle 20 The baffle 22 is detachably attached via the spacer 23 at the position on the reverse side to adjust the locking state of the bolts 28 and 29 provided in the forward and backward directions in the traveling direction so that the end faces of the divided blocks 14 are parallel to the traveling direction. The way to make minor adjustments. In order to perform fine adjustment while measuring the parallelism, the dial indicator 27 capable of measuring the locking distance can be placed on the dividing block 14 or the jig 17. After the center alignment is completed, the baffles 20, 22 and the spacers 21, 23 can be removed.
就對分割塊14的夾具的固定而言，為了容易地實施定位，較佳者為於實施中心對準前較鬆地暫時旋緊，於實施中心對準後正式旋緊的方法。 In order to fix the jig of the split block 14, in order to facilitate the positioning, it is preferable to loosely tighten the front portion before performing the center alignment, and form a method of tightening the center after the center alignment.
<步驟d> <Step d>
較佳為於步驟c後，實施對已進行研削的端面進行研磨處理的步驟d。藉由實施步驟d，使硬質基板的端面變得更平滑，並且抑制了碎屑的產生，從而強度顯著提高。一般而言，因步驟d減少的硬質基板的寬度少於步驟c，典型的是未達50 μm，更典型的是20~45 μm。做為研磨方法並無特別限定，可列舉：機械研磨、化學研磨、電解研磨及其等的組合。做為機械研磨的具體示例可列舉利用旋轉刷所進行的研磨。此時，亦可一面使含有氧化鈰等研磨劑的漿體與研磨面接觸一面進行研磨。刷子的材質並無特別限定，例如可列舉：尼龍、PVC(polyvinyl chloride，聚氯乙烯)、及PP(Polypropylene，聚丙烯)。亦可為將豬毛、羊毛、馬毛、黃銅、氧化鈰、氧化鋁、碳化矽、及矽酸鋁等混入尼龍、PVC、及PP等中者。做為化學研磨的具體示例可列舉蝕刻。蝕刻可藉由將被處理物浸漬於蝕刻液中等使其接觸而實施。做為蝕刻液並無特別限定，例如可列舉氟酸、磷酸、鹽酸、及其等的銨鹽等。 Preferably, after step c, the step d of performing the grinding treatment on the end surface which has been ground is carried out. By performing the step d, the end surface of the hard substrate is made smoother, and the generation of debris is suppressed, so that the strength is remarkably improved. In general, the width of the rigid substrate reduced by step d is less than that of step c, typically less than 50 μm, more typically 20 to 45 μm. The polishing method is not particularly limited, and examples thereof include mechanical polishing, chemical polishing, electrolytic polishing, and the like. Specific examples of the mechanical polishing include polishing by a rotating brush. At this time, the slurry containing an abrasive such as cerium oxide may be polished while being in contact with the polishing surface. The material of the brush is not particularly limited, and examples thereof include nylon, polyvinyl chloride (polyvinyl chloride), and PP (polypropylene). It is also possible to mix pig hair, wool, horse hair, brass, cerium oxide, aluminum oxide, tantalum carbide, and aluminum silicate into nylon, PVC, and PP. Specific examples of the chemical polishing include etching. The etching can be carried out by immersing the object to be etched in an etching solution or the like. The etching liquid is not particularly limited, and examples thereof include hydrofluoric acid, phosphoric acid, hydrochloric acid, and ammonium salts thereof.
<形狀加工> <shape processing>
可於步驟b與步驟c之間、及/或步驟c之後進行任意的形狀加工。於實施步驟d之情形時，可於步驟c與步驟d之間、及/或於步驟d之後，進行任意的形狀加工。由於可在為分割塊的狀態下一體地加工為所需的板狀製品的形狀，故存在所謂顯著提高板狀製品的生產速度的優點。形狀加工可藉由周知的任意手段進行，例如可列舉：由旋轉磨石、鏤銑機(router)、鑽孔機、蝕刻等所進行的外形加工；由超音波振動鑽孔機或蝕刻所進行的開孔；使用燃燒器的火焰加工；由雷射光束及噴水等所進行的切斷加工等。形狀加工一般不以端面的平坦化做為目的，但並不限定於此。加工方法可分別單獨或組合地使用。蝕刻亦可於形狀加工後的表面處理中使用。 Any shape processing can be performed between step b and step c, and/or after step c. In the case of performing step d, any shape processing may be performed between step c and step d, and/or after step d. Since the shape of the desired plate-like product can be integrally processed in the state of dividing the block, there is an advantage that the production speed of the plate-shaped product is remarkably improved. The shape processing can be carried out by any means known per se, and examples thereof include: shape processing by a rotary grindstone, a router, a drill, etching, etc.; by an ultrasonic vibration drilling machine or etching Open hole; flame processing using a burner; cutting processing by a laser beam, water spray, or the like. The shape processing is generally not intended to flatten the end faces, but is not limited thereto. The processing methods can be used individually or in combination. Etching can also be used in surface treatment after shape processing.
<板狀製品的形成> <Formation of plate-shaped products>
於如以上所述實施硬質基板積層體的加工方法後，可剝離分割塊，而形成複數個板狀製品。分割塊的剝離方法可根據接著劑選擇，例如可藉由加熱進行剝離。做為光硬化性接著劑的加熱方法的具體示例，為了將固著劑軟化為膜狀而自各板狀製品較好地分離，較佳為將形狀加工後的透光性硬質基板積層體浸漬於溫水中。較佳的溫水溫度會根據所採用的固著劑而有所不同，但通常為60~95℃左右，較佳為80~90℃。亦可藉由照射UV等光，使剝離變得容易。 After the method of processing the hard substrate laminate as described above, the divided pieces can be peeled off to form a plurality of plate-like products. The peeling method of the divided pieces can be selected depending on the adhesive, and for example, peeling can be performed by heating. As a specific example of the heating method of the photocurable adhesive agent, in order to soften the fixing agent from the respective plate-like products in order to soften the fixing agent into a film form, it is preferred to immerse the light-transmissive hard substrate layered body after the shape processing in the shape. Warm water. The preferred warm water temperature will vary depending on the fixing agent used, but is usually about 60 to 95 ° C, preferably 80 to 90 ° C. It is also possible to facilitate the peeling by irradiating light such as UV.
以上，一面參照圖式一面對本發明的實施形態進行了說明，但本發明並不限於該等實施形態，可進行各種變更。 Although the embodiments of the present invention have been described above with reference to the drawings, the present invention is not limited to the embodiments, and various modifications can be made.
10‧‧‧硬質基板積層體 10‧‧‧Hard substrate laminate
11‧‧‧硬質基板 11‧‧‧Hard substrate
12‧‧‧接著劑 12‧‧‧Adhesive
13‧‧‧切斷線 13‧‧‧ cut line
14‧‧‧經分割之硬質基板積層體(分割塊) 14‧‧‧Segmented hard substrate laminate (segment block)
15‧‧‧旋轉磨石 15‧‧‧Rotating Millstone
16‧‧‧端面 16‧‧‧ end face
17‧‧‧夾具 17‧‧‧Clamp
18‧‧‧夾板 18‧‧‧Plywood
19‧‧‧夾緊螺栓 19‧‧‧Clamping bolts
20‧‧‧擋板 20‧‧ ‧Baffle
21‧‧‧隔離物 21‧‧‧Separators
22‧‧‧擋板 22‧‧‧Baffle
23‧‧‧隔離物 23‧‧‧Separators
25‧‧‧軌道 25‧‧‧ Track
26‧‧‧夾具本體 26‧‧‧Clamp body
27‧‧‧度盤式指示器 27‧‧‧ degree disc indicator
28‧‧‧螺栓 28‧‧‧ bolts
29‧‧‧螺栓 29‧‧‧Bolts
d‧‧‧距離 D‧‧‧distance
圖1係藉由步驟a所得之硬質基板積層體之一例的模式圖。 Fig. 1 is a schematic view showing an example of a hard substrate laminate obtained by the step a.
圖2係表示硬質基板積層體之分割方法之一例的模式圖。 Fig. 2 is a schematic view showing an example of a method of dividing a hard substrate laminate.
圖3係表示於利用兩個旋轉磨石對分割塊之兩端面進行平坦化處理時之情況的模式圖。 Fig. 3 is a schematic view showing a state in which both end faces of the divided block are flattened by two rotating grindstones.
圖4係表示將分割塊中心對準之方法之一例的模式圖。 Fig. 4 is a schematic view showing an example of a method of aligning the centers of divided blocks.
圖5係於自態樣觀察分割塊時的模式圖。 Fig. 5 is a schematic diagram of a case where a segmentation block is observed from a state.
14‧‧‧經分割之硬質基板積層體(分割塊) 14‧‧‧Segmented hard substrate laminate (segment block)
15‧‧‧旋轉磨石 15‧‧‧Rotating Millstone
16‧‧‧端面 16‧‧‧ end face
17‧‧‧夾具 17‧‧‧Clamp
18‧‧‧夾板 18‧‧‧Plywood
19‧‧‧夾緊螺栓 19‧‧‧Clamping bolts
25‧‧‧軌道 25‧‧‧ Track
d‧‧‧距離 D‧‧‧distance
Claims (9)
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| KR (1) | KR20140069034A (en) |
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| CN103435254A (en) * | 2013-08-27 | 2013-12-11 | 江西合力泰科技股份有限公司 | Cutting process of glass cover plates |
| JP6437230B2 (en) * | 2013-09-04 | 2018-12-12 | 東友ファインケム株式会社Ｄｏｎｇｗｏｏ Ｆｉｎｅ−Ｃｈｅｍ Ｃｏ．， Ｌｔｄ． | Manufacturing method of end-face processed polarizing plate |
| JP6147154B2 (en) * | 2013-09-24 | 2017-06-14 | Hoya株式会社 | Manufacturing method of glass substrate of cover glass for electronic device |
| JP5774078B2 (en) * | 2013-11-29 | 2015-09-02 | ショーダテクトロン株式会社 | Laminated glass block holder |
| CN104440413B (en) * | 2014-12-08 | 2017-04-12 | 蓝思科技股份有限公司 | Deformation polishing process and polishing clamp for 2.5D window screen |
| US10384324B2 (en) | 2015-02-02 | 2019-08-20 | Corning Incorporated | Methods for strengthening edges of laminated glass articles and laminated glass articles formed therefrom |
| KR101661278B1 (en) * | 2015-07-14 | 2016-09-29 | 에스피텍 주식회사 | Manufacturing Method of Ultra-Thin Type Glass Plate |
| KR101925616B1 (en) * | 2016-03-17 | 2019-02-27 | (주)이티에스 | Laminated sheet polishing method and apparatus performing the same |
| CN106114034B (en) * | 2016-08-23 | 2019-05-31 | 伯恩光学(深圳)有限公司 | A kind of method and device thereof of while finishing impression processing divided glass |
| CA3078296A1 (en) * | 2017-10-04 | 2019-04-11 | Saint-Gobain Glass France | Composite glass pane having chamfered through-hole |
| KR102508911B1 (en) * | 2020-03-03 | 2023-03-13 | 에이피시스템 주식회사 | Apparatus for processing ultra thin glass and method for processing ultra thin glass |
| CN112130354A (en) * | 2020-09-16 | 2020-12-25 | 江西合力泰科技有限公司 | 3D glasses product processing technology |
| KR102443795B1 (en) * | 2020-11-03 | 2022-09-16 | 주식회사 도우인시스 | Manufacturing Method of Ultra-Thin Type Glass Plate |
| CN114310555B (en) * | 2022-03-08 | 2022-05-24 | 徐州朗润木业有限公司 | Wood board cuts burnishing and polishing device behind corner cut |
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| JP2009256125A (en) * | 2008-04-15 | 2009-11-05 | Shoda Techtron Corp | Processing method of plate glass |
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| TW200817134A (en) * | 2006-10-04 | 2008-04-16 | Nippon Electric Glass Co | Grinding device for edge of glass substrate and grinding method thereof |
| JP2010269389A (en) * | 2009-05-20 | 2010-12-02 | Shoda Techtron Corp | End face machining method of plate glass |
| WO2011089964A1 (en) * | 2010-01-21 | 2011-07-28 | 電気化学工業株式会社 | Method for manufacturing hard translucent plate laminate and apparatus for bonding hard translucent plates |
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| JP5956449B2 (en) | 2016-07-27 |
| CN103813995B (en) | 2016-11-09 |
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| CN103813995A (en) | 2014-05-21 |
| KR20140069034A (en) | 2014-06-09 |
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| WO2013042689A1 (en) | 2013-03-28 |
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