WO2012077645A1

WO2012077645A1 - Method for processing hard substrate laminated body and method for manufacturing plate-shaped product

Info

Publication number: WO2012077645A1
Application number: PCT/JP2011/078094
Authority: WO
Inventors: 啓之栗村; 隼人宮崎
Original assignee: 電気化学工業株式会社
Priority date: 2010-12-08
Filing date: 2011-12-05
Publication date: 2012-06-14
Also published as: JPWO2012077645A1; TW201233646A

Abstract

Provided is a method which is capable of processing a hard substrate laminated body efficiently and preferably. The method for processing the hard substrate laminated body includes a step of preparing a hard substrate laminated body (14) obtained by bonding two or more hard substrates to each other with an adhesive and a step of cutting, at a time, edge portions of surfaces of adjacent hard substrates (11') which are opposed to each other from a side surface of the laminated body (14) with a cutting tool (16) provided with a cutting portion (18) which is provided on a position corresponding to each of adhesive layers between the hard substrates.

Description

Method for processing hard substrate laminate and method for manufacturing plate-like product

The present invention relates to a method for processing a hard substrate laminate. The present invention also relates to a method for manufacturing a plate-like product such as a protective glass of a display element.

Display devices of various electronic devices such as TVs, notebook computers, car navigation systems, calculators, mobile phones, electronic notebooks, and PDAs (Personal Digital Assistants) include liquid crystal displays (LCD), organic EL displays (OELD), electroluminescent displays ( Display elements such as ELD), field emission displays (FED), and plasma displays (PDP) are used. And in order to protect a display element, it is common to install the plate glass product for protection facing a display element.

This flat glass product is obtained by processing a flat glass into a size and shape suitable for each display device. In order to meet the price level required in the market, it is possible to process a large amount of flat glass products with high production efficiency. Desired.

Therefore, Japanese Patent Laid-Open No. 2009-256125 (Patent Document 1) proposes a method for increasing the production efficiency of a sheet glass product. Specifically, “a large number of material glass sheets (1) are stacked, and each material glass sheet (1) is integrally fixed by a peelable fixing material (2) interposed between each material glass sheet (1). Forming the material glass block (A), dividing the material glass block (A) in the plane direction to form a small-area divided glass block (B), and processing at least the outer periphery of the divided glass block (B) A product glass block (C) having a product shape in plan view is formed, and after the end face processing of the product glass block (C), the product glass block (C) is individually separated. "Processing method" is proposed (claim 1). As a result, "Since a large number of material glass sheets are stacked, division, outer shape processing, and end face processing are performed, so that a large number of glass sheet products can be obtained in a small number of steps, and the productivity is high." (Paragraph 0007).

JP 2009-256125 A

However, in the conventional processing method, when end face processing is performed at once on a laminated body in which a plurality of glass substrates are stacked, a cutting tool for cutting a glass substrate is used when the distance between the substrates is not constant. The cutting part cannot be accurately brought into contact between the substrates at the target positions, and it becomes difficult to remove chips, cracks, chips, etc. generated on the upper and lower edges of each glass substrate. .

Therefore, an object of the present invention is to provide a method capable of efficiently and satisfactorily processing a hard substrate laminate such as a glass block described in Patent Document 1. Moreover, this invention makes it another subject to provide the manufacturing method of the plate-shaped product using the said processing method.

The inventors of the present invention have intensively studied to solve the above-described problems. As a result, each cutting portion is provided at a position corresponding to an adhesive layer between a plurality of opposing substrates constituting the hard substrate laminate, and cutting is performed at a time. By machining, each of a plurality of cutting parts is brought into contact between each substrate at a target position with high accuracy, and chipping, cracks, chips, etc. generated at the edges of mutually facing surfaces between each substrate are detected. It has been found that it can be removed efficiently and efficiently.

The present invention completed on the basis of the above knowledge, in one aspect,
Preparing a hard substrate laminate in which two or more hard substrates are bonded together with an adhesive;
A cutting tool provided with a cutting portion provided at a position corresponding to each adhesive layer between the hard substrates, and from the side surface of the laminated body, the edges of the adjacent hard substrates facing each other at a time Cutting process;
It is a processing method of the hard board | substrate laminated body containing this.

In one embodiment of the method for processing a hard substrate laminate according to the present invention, the cutting with the cutting tool is performed by cutting the hard substrate from an edge portion of adjacent surfaces of the hard substrate adjacent to each other in a cross section of the hard substrate laminate. A V-shaped groove having a ridge line is formed on the adhesive layer between the substrates.

In another embodiment of the method for processing a hard substrate laminate according to the present invention, the cutting tool is attached to a spindle and rotated.

In another embodiment of the method for processing a hard substrate laminate according to the present invention, the spindle is an ultrasonic spindle.

In another embodiment of the method for processing a hard substrate laminate according to the present invention, the intervals between the plurality of hard substrates are controlled to be constant during the cutting step.

In another embodiment of the method for processing a hard substrate laminate according to the present invention, the interval between the hard substrates is controlled to be constant by including a granular material that does not dissolve in the adhesive component in the adhesive.

In yet another embodiment of the method for processing a hard substrate laminate according to the present invention, at least a portion of the cutting portion of the cutting tool that contacts the hard substrate is formed of super steel, high speed steel, or diamond. ing.

In another embodiment of the method for processing a hard substrate laminate according to the present invention, the cutting portion of the cutting tool is formed of super steel or high-speed steel with diamond electrodeposited on its surface.

In yet another embodiment, the method for processing a hard substrate laminate according to the present invention includes a step of further polishing a side surface of the hard substrate laminate cut by the cutting tool.

In another embodiment of the processing method for a hard substrate laminate according to the present invention, the hard substrate laminate is a large hard substrate laminate in which two or more large hard substrates are bonded together with an adhesive. Is cut and formed in the thickness direction.

In another embodiment of the method for processing a hard substrate laminate according to the present invention, the translucent hard substrate is a plate glass.

This invention is another one side. WHEREIN: It is a manufacturing method of the plate-shaped product including the process of forming several plate-shaped products using the hard substrate laminated body to which the processing method of the hard substrate laminated body concerning this invention was given. .

According to the present invention, a hard substrate laminate can be processed efficiently and satisfactorily, and a plate-like product with improved processing accuracy can be industrially produced. The present invention can be suitably used, for example, when mass-producing protective glass for display elements.

It is a schematic diagram of the large-sized translucent hard board | substrate laminated body before performing a cutting process. It is a schematic diagram of the translucent hard board | substrate laminated body cut out by the cutting process. It is a schematic diagram of the translucent hard board | substrate laminated body by which the outer diameter process line was shown. It is the cross-sectional schematic diagram of the cutting tool which has a cutting part by which the front-end | tip part was expanded, and the translucent hard board | substrate laminated body of cutting object. It is a cross-sectional schematic diagram of the translucent hard board | substrate laminated body after end surface cutting. It is a cross-sectional schematic diagram of the translucent hard board | substrate laminated body after an end surface process. It is a plane schematic diagram of the translucent hard board | substrate laminated body after an end surface process.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

<1. Preparation of Translucent Hard Substrate Laminate 10>
In this embodiment, although not limited, a light-transmitting hard substrate is used as the hard substrate. FIG. 1 is a schematic view of a large-sized translucent hard substrate laminate 10 before performing cutting processing and external processing. Although there is no restriction | limiting in particular as the large-sized translucent hard board | substrate 11 which comprises the large-sized translucent hard board | substrate laminated body 10, Plate glass (tempered plate glass, raw material plate glass, a glass substrate with a transparent conductive film, an electrode, and a circuit are formed. And a sapphire substrate, a quartz substrate, a plastic substrate, a magnesium fluoride substrate, and the like. Not particularly limited to the size of a single large-sized light-transmitting hard substrate 11, but typically have a ² degree of area 10000 ~ 250000mm, having a thickness of about 0.1 ~ 2 mm. In general, each large transparent translucent substrate 11 to be laminated has the same size. The large-sized translucent hard substrate laminate 10 has two or more translucent hard substrates 11 laminated thereon. If the overall thickness of the large-sized translucent hard substrate laminate 10 is too thin, the mechanical strength becomes weak, and when the translucent hard substrate laminate 10 fixed to the cradle with an adhesive is peeled off for processing. Depending on the material of the light-transmitting hard substrate 11, it is preferably 5 or more (the total thickness of the substrate 11 is 0.52 mm or more), more preferably about 10 to 30 (substrate 11). The translucent hard substrate 11 having a total thickness of about 1.5 to 66 mm is laminated via a photocurable adhesive.

Although not limited, a predetermined printing pattern or plating pattern for performing one of the functions of the plate-like product can be attached to the surface of each translucent hard substrate 11. Examples of the print pattern include a mobile phone display screen design, and examples of the plating pattern include a metal wiring pattern such as Al or AlNd, and a rotary encoder provided with a chromium plating pattern.

The translucent hard substrate 11 is laminated, for example, after pasting the translucent hard substrates 11 each having a photocurable adhesive applied to one or both of the laminating surfaces, to the translucent hard substrates 11. It can be carried out by irradiating light for curing the adhesive spread between the layers. By repeating this a desired number of times, the light transmissive hard substrate laminate 10 in which the desired number of light transmissive hard substrates 11 are laminated can be produced. The light irradiation may be performed every time one light-transmitting hard substrate 11 is stacked, or may be performed collectively after stacking a plurality of sheets as long as light reaches the adhesive. At this time, if the light irradiation amount is too strong, the peelability and appearance of the translucent hard substrate laminate are likely to deteriorate over time, while if the light irradiation amount is too weak, the adhesive will not be cured sufficiently. The amount of light irradiated to cure the adhesive each time the optical hard substrate is bonded is preferably 1000 to 10000 mJ / cm ² , more preferably 1200 to 6000 mJ / cm ^2, and 1500 to Even more preferably, it is 3000 mJ / cm ² . The irradiation time is preferably 10 to 200 seconds, more preferably 20 to 100 seconds.

Any known photocurable adhesive can be used and is not particularly limited. For example, (A) polyfunctional (meth) acrylate and (B) monofunctional (meth) acrylate as described in WO2008 / 018252. And (C) an adhesive composition containing a photopolymerization initiator is preferred.
(A) As a polyfunctional (meth) acrylate, two or more (meth) acryloylated polyfunctional (meth) acrylate oligomer / polymer or two or more (meth) acryloyl groups at the oligomer / polymer terminal or side chain Polyfunctional (meth) acrylate monomers having can be used. For example, as the polyfunctional (meth) acrylate oligomer / polymer, 1,2-polybutadiene terminated urethane (meth) acrylate (for example, “TE-2000”, “TEA-1000” manufactured by Nippon Soda Co., Ltd.), hydrogenated product thereof ( For example, “TEAI-1000” manufactured by Nippon Soda Co., Ltd.), 1,4-polybutadiene terminated urethane (meth) acrylate (eg “BAC-45” manufactured by Osaka Organic Chemical Co., Ltd.), polyisoprene terminated (meth) acrylate, polyester urethane (Meth) acrylate (for example, “UV-2000B”, “UV-3000B”, “UV-7000B” manufactured by Nippon Synthetic Chemical Co., Ltd. “KHP-11”, “KHP-17” manufactured by Negami Kogyo Co., Ltd.), polyether type Urethane (meth) acrylate (for example, “UV-3700B”, “UV” manufactured by Nippon Synthetic Chemical Co., Ltd. 6100B "), or bisphenol A type epoxy (meth) acrylate, and the like.
Here, the urethane (meth) acrylate is a reaction between a polyol compound (hereinafter represented by X), an organic polyisocyanate compound (hereinafter represented by Y), and a hydroxy (meth) acrylate (hereinafter represented by Z). The urethane (meth) acrylate obtained by this.
Examples of the polyol compound (X) include ethylene glycol, diethylene glycol, triethylene glycol, tetraethylene glycol, polyethylene glycol, propylene glycol, dipropylene glycol, polypropylene glycol, butylene glycol, 1,4-butanediol, polybutylene glycol, 1, 5-pentanediol, 1,6-hexanediol, 1,8-octanediol, 1,9-nonanediol, 3-methyl-1,5-pentanediol, 2,4-diethyl-1,5-pentanediol, 2,2-butylethyl-1,3-propanediol, neopentyl glycol, cyclohexanedimethanol, hydrogenated bisphenol A, polycaprolactone, trimethylolethane, trimethylolpropane, poly At least polyhydric alcohols such as limethylolpropane, pentaerythritol, polypentaerythritol, sorbitol, mannitol, glycerin, polyglycerin, polytetramethylene glycol, block or random copolymerization of polyethylene oxide, polypropylene oxide, ethylene oxide / propylene oxide Polyether polyol having one type of structure, a polycondensate of the polyhydric alcohol or polyether polyol and a polybasic acid such as maleic anhydride, maleic acid, fumaric acid, itaconic anhydride, itaconic acid, adipic acid, and isophthalic acid Polyester polyols, caprolactone-modified polytetramethylene polyols and other caprolactone-modified polyols, polyolefin-based polyols, polycarbonate-based poly Lumpur, polybutadiene polyols, polyisoprene polyols, hydrogenated polybutadiene polyols, polydiene polyols such as hydrogenated polyisoprene polyol, silicone polyol, such as polydimethylsiloxane polyols and the like. Among these, polyether polyol and / or polyester polyol are more preferable, and polyester polyol is most preferable.
The organic polyisocyanate compound (Y) is not particularly limited. For example, aromatic, aliphatic, cycloaliphatic, and alicyclic polyisocyanates can be used. Isocyanate (TDI), diphenylmethane diisocyanate (MDI), hydrogenated diphenylmethane diisocyanate (H-MDI), polyphenylmethane polyisocyanate (crude MDI), modified diphenylmethane diisocyanate (modified MDI), hydrogenated xylylene diisocyanate (H-XDI) ), Xylylene diisocyanate (XDI), hexamethylene diisocyanate (HMDI), trimethylhexamethylene diisocyanate (TMXDI), tetramethylxylylene diisocyanate (m-TMXDI), isophorone diisocyanate Polyisocyanates such as nate (IPDI), norbornene diisocyanate (NBDI), 1,3-bis (isocyanatomethyl) cyclohexane (H6XDI), trimer compounds of these polyisocyanates, reaction products of these polyisocyanates and polyols, etc. Preferably used. Of these, hydrogenated xylylene diisocyanate (H-XDI) and / or isophorone diisocyanate (IPDI) are preferred.
Examples of the hydroxy (meth) acrylate (Z) include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 2-hydroxyethyl acryloyl phosphate, and 4-butyl. Hydroxy (meth) acrylate, 2- (meth) acryloyloxyethyl-2-hydroxypropyl phthalate, glycerin di (meth) acrylate, 2-hydroxy-3-acryloyloxypropyl (meth) acrylate, caprolactone modified 2-hydroxyethyl (Meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol penta (meth) acrylate, caprolactone-modified 2-hydroxyethyl (meth) acrylate, etc. . Among these, one or more members selected from the group consisting of 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and 2-hydroxybutyl (meth) acrylate are preferable.
Among these, polyester-based urethane (meth) acrylate and / or polyether-based urethane (meth) acrylate are preferable, and polyester-based urethane (meth) acrylate is more preferable because of its great effect.
The weight average molecular weight of the polyfunctional (meth) acrylate oligomer / polymer is preferably 7000 to 60000, more preferably 13000 to 40000. The weight average molecular weight can be determined by preparing a calibration curve with commercially available standard polystyrene using GPC system (SC-8010 manufactured by Tosoh Corporation) using tetrahydrofuran as a solvent under the following conditions.
Flow rate: 1.0 ml / min
Set temperature: 40 ° C
Column configuration: “TSK guardcolumn MP (× L)” manufactured by Tosoh Corporation 6.0 mmID × 4.0 cm1 and “TSK-GEL MULTIPOREHXL-M” 7.8 mmID × 30.0 cm (16,000 theoretical plates) 2), 3 in total (32,000 theoretical plates as a whole)
Sample injection volume: 100 μl (sample solution concentration 1 mg / ml)
Liquid feeding pressure: 39 kg / cm ²
Detector: RI detector Bifunctional (meth) acrylate monomers include 1,3-butylene glycol di (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) Acrylate, 1,9-nonanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, dicyclopentanyl di (meth) acrylate, 2-ethyl-2-butyl-propanediol di (meth) acrylate, neo Pentyl glycol modified trimethylolpropane di (meth) acrylate, stearic acid modified pentaerythritol di (meth) acrylate, polypropylene glycol di (meth) acrylate, 2,2-bis (4- (meth) acryloxydiethoxyphenyl) propane , 2,2-bis (4 -(Meth) acryloxypropoxyphenyl) propane, 2,2-bis (4- (meth) acryloxytetraethoxyphenyl) propane, and the like. Among these, 1,6-hexadiol di (meth) acrylate and / or dicyclopentanyl di (meth) acrylate is preferable, and dicyclopentanyl di (meth) acrylate is more preferable from the viewpoint of great effect.
Examples of the trifunctional (meth) acrylate monomer include trimethylolpropane tri (meth) acrylate and tris [(meth) acryloxyethyl] isocyanurate.
Examples of the tetrafunctional or higher (meth) acrylate monomer include dimethylolpropane tetra (meth) acrylate, pentaerythritol tetra (meth) acrylate, pentaerythritol ethoxytetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, or dipenta Examples include erythritol hexa (meth) acrylate.
(A) The polyfunctional (meth) acrylate is preferably hydrophobic. Hydrophobic polyfunctional (meth) acrylate refers to (meth) acrylate having no hydroxyl group. In the case of water-solubility, the cured product of the composition swells at the time of cutting, so that the position shift occurs and the processing accuracy may be inferior. Even if it is hydrophilic, it may be used as long as the cured product of the composition is not greatly swollen or partially dissolved by water.
Among the polyfunctional (meth) acrylates, it is preferable to contain a polyfunctional (meth) acrylate oligomer / polymer and / or a bifunctional (meth) acrylate monomer in terms of high effect. It is more preferable to use a polymer and a bifunctional (meth) acrylate monomer in combination.
When the polyfunctional (meth) acrylate oligomer / polymer and the bifunctional (meth) acrylate monomer are used in combination, the content ratio is 100 parts by mass in total of the polyfunctional (meth) acrylate oligomer / polymer and the bifunctional (meth) acrylate monomer. Multifunctional (meth) acrylate oligomer / polymer: bifunctional (meth) acrylate monomer = 10 to 90:90 to 10, preferably 25 to 75:75 to 25, more preferably 30 to 70:70 to 30 Is most preferred.
(B) Monofunctional (meth) acrylate monomers include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate , Isodecyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, phenyl (meth) acrylate, cyclohexyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclo Pentenyloxyethyl (meth) acrylate, isobornyl (meth) acrylate, methoxylated cyclodecatriene (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxy Propyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate, glycidyl (meth) acrylate , Caprolactone-modified tetrahydrofurfuryl (meth) acrylate, 3-chloro-2-hydroxypropyl (meth) acrylate, N, N-dimethylaminoethyl (meth) acrylate, N, N-diethylaminoethyl (meth) acrylate, t-butyl Aminoethyl (meth) acrylate, ethoxycarbonylmethyl (meth) acrylate, phenol ethylene oxide modified (meth) acrylate, phenol (ethylene oxide 2 mol modified) (meth) Chryrate, phenol (ethylene oxide 4 mol modified) (meth) acrylate, paracumylphenol ethylene oxide modified (meth) acrylate, nonylphenol ethylene oxide modified (meth) acrylate, nonylphenol (ethylene oxide 4 mol modified) (meth) acrylate, nonylphenol ( Ethylene oxide 8 mol modified) (meth) acrylate, nonylphenol (propylene oxide 2.5 mol modified) (meth) acrylate, 2-ethylhexyl carbitol (meth) acrylate, ethylene oxide modified phthalic acid (meth) acrylate, ethylene oxide modified succinic acid ( (Meth) acrylate, trifluoroethyl (meth) acrylate, acrylic acid, methacrylic acid, ω-carboxy-polycaprolactone (Meth) acrylate, monohydroxyethyl phthalate (meth) acrylate, (meth) acrylic acid dimer, β- (meth) acryloyloxyethyl hydrogen succinate, n- (meth) acryloyloxyalkyl hexahydrophthalimide, 2 -(1,2-cyclohexacarboximido) ethyl (meth) acrylate, ethoxyethylene glycol di (meth) acrylate, benzyl (meth) acrylate and the like. Maleic acid and fumaric acid can also be used. (B) Monofunctional (meth) acrylate is more preferably hydrophobic as in (A). Hydrophobic polyfunctional (meth) acrylate refers to (meth) acrylate having no hydroxyl group. In the case of water-solubility, the cured product of the composition swells at the time of cutting, so that the position shift occurs and the processing accuracy may be inferior. Even if it is hydrophilic, it may be used as long as the cured product of the composition is not swollen or partially dissolved by water.
Among monofunctional (meth) acrylates, phenolethylene oxide 2 mol-modified (meth) acrylate, 2- (1,2-cyclohexacarboximido) ethyl (meth) acrylate and 2-hydroxy-3 are more effective. -One or more of the group consisting of phenoxypropyl (meth) acrylate is preferred. Phenol ethylene oxide 2 mol modified (meth) acrylate may be used in combination with 2- (1,2-cyclohexacarboximido) ethyl (meth) acrylate and / or 2-hydroxy-3-phenoxypropyl (meth) acrylate More preferred.
In the case of using together 2 mol of phenol ethylene oxide modified (meth) acrylate and 2- (1,2-cyclohexacarboximido) ethyl (meth) acrylate and / or 2-hydroxy-3-phenoxypropyl (meth) acrylate The content ratio is 100 parts by mass in total of phenol ethylene oxide 2 mol modified (meth) acrylate, 2- (1,2-cyclohexacarboximido) ethyl (meth) acrylate and 2-hydroxy-3-phenoxypropyl (meth) acrylate. In a mass ratio, phenol ethylene oxide 2 mol modified (meth) acrylate: 2- (1,2-cyclohexacarboximido) ethyl (meth) acrylate and / or 2-hydroxy-3-phenoxypropyl (meth) acrylate = 5-80: 9 Preferably to 20, 15 to 60: and more preferably 85 to 40 and 20 to 45 80 - 55 most preferred.
(A) The amount of polyfunctional (meth) acrylate used is preferably 5 to 95 parts by weight, more preferably 15 to 60 parts by weight, more preferably 20 to 20 parts by weight based on 100 parts by weight of the total amount of (A) and (B). 50 parts by mass is preferred. If it is 5 parts by mass or more, the property that the cured body will peel from the adherend when the cured body of the composition is immersed in warm water (hereinafter simply referred to as “peelability”) is sufficiently promoted. The cured product can be peeled into a film. If it is 95 mass parts or less, there is no possibility that initial adhesiveness will fall.
(C) The photopolymerization initiator is blended for sensitization with visible light or ultraviolet active light to promote photocuring of the resin composition, and various known photopolymerization initiators can be used. . Specifically, benzophenone or a derivative thereof; benzyl or a derivative thereof; anthraquinone or a derivative thereof; benzoin; a benzoin derivative such as benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin isobutyl ether, or benzyl dimethyl ketal; diethoxyacetophenone, 4 Acetophenone derivatives such as t-butyltrichloroacetophenone; 2-dimethylaminoethyl benzoate; p-dimethylaminoethyl benzoate; diphenyl disulfide; thioxanthone or derivatives thereof; camphorquinone; 7,7-dimethyl-2,3-dioxobicyclo [ 2.2.1] Heptane-1-carboxylic acid, 7,7-dimethyl-2,3-dioxobicyclo [2.2.1] heptane-1-carboxy-2 Bromoethyl ester, 7,7-dimethyl-2,3-dioxobicyclo [2.2.1] heptane-1-carboxy-2-methyl ester, 7,7-dimethyl-2,3-dioxobicyclo [2 2.1] Camphorquinone derivatives such as heptane-1-carboxylic acid chloride; 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropan-1-one, 2-benzyl-2-dimethyl Α-aminoalkylphenone derivatives such as amino-1- (4-morpholinophenyl) -butanone-1; benzoyldiphenylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, benzoyldiethoxyphosphine oxide, 2, 4,6-trimethylbenzoyldimethoxyphenylphosphine oxide, 2 Acylphosphine oxide derivatives such as 1,4,6-trimethylbenzoyldiethoxyphenylphosphine oxide, oxy-phenyl-acetic acid 2- [2-oxo-2-phenyl-acetoxy-ethoxy] -ethyl ester and / or oxy-phenyl -Acetic acid 2- [2-hydroxy-ethoxy] -ethyl ester and the like. A photoinitiator can be used 1 type or in combination of 2 or more types. Among these, benzyldimethyl ketal, oxy-phenyl-acetic acid 2- [2-oxo-2-phenyl-acetoxy-ethoxy] -ethyl ester and oxy-phenyl-acetic acid 2- One or more of the group consisting of [2-hydroxy-ethoxy] -ethyl ester are preferred.
(C) The content of the photopolymerization initiator is preferably 0.1 to 20 parts by mass, more preferably 0.5 to 10 parts by mass with respect to 100 parts by mass in total of (A) and (B). If it is 0.1 mass part or more, the effect of hardening acceleration | stimulation will be acquired reliably, and sufficient curing rate can be obtained if it is 20 mass parts or less. The addition of 1 part by mass or more of component (C) makes it possible to cure without depending on the amount of light irradiation, further increases the degree of crosslinking of the cured product of the composition, and does not cause misalignment during cutting, It is further preferable in terms of improving peelability.

The photo-curable adhesive preferably contains a particulate material (D) that does not dissolve in the components (A), (B), and (C) of the adhesive. Thereby, since the composition after hardening can hold | maintain fixed thickness, a process precision improves as mentioned later.

The material of the particulate material (D) may be either generally used organic particles or inorganic particles. Specifically, examples of the organic particles include polyethylene particles, polypropylene particles, crosslinked polymethyl methacrylate particles, and crosslinked polystyrene particles. Inorganic particles include ceramic particles such as glass, silica, alumina, and titanium.

The granular material is preferably spherical from the viewpoint of improving processing accuracy, that is, controlling the film thickness of the adhesive layer 12. The average particle diameter of the granular material by the laser method is preferably in the range of 50 to 200 μm. When the average particle size of the granular material is 50 μm or more, the cutting tool tip does not decrease the life even if the cutting tool tip having inferior strength is used in the cutting tool, and further, the cutting efficiency is improved. When it is 200 μm or less, the amount of adhesive used is reduced and the cost is reduced, resulting in excellent productivity. A more preferable average particle diameter (D50) is 70 to 150 μm, and further preferably 80 to 120 μm. The particle size distribution is measured by a laser diffraction type particle size distribution measuring device.
The amount of the granular material (D) used is preferably 0.01 to 20 parts by mass with respect to 100 parts by mass of the total amount of (A) and (B), from the viewpoint of adhesiveness, processing accuracy, and peelability. 0.05 to 10 parts by mass is more preferable, and 0.1 to 6 parts by mass is most preferable.
A polymerization inhibitor (E) can be added to the photocurable adhesive to improve storage stability. Polymerization inhibitors include methyl hydroquinone, hydroquinone, 2,2-methylene-bis (4-methyl-6-tertiary butylphenol), catechol, hydroquinone monomethyl ether, monotertiary butyl hydroquinone, 2,5-ditertiary butyl hydroquinone. P-benzoquinone, 2,5-diphenyl-p-benzoquinone, 2,5-ditertiarybutyl-p-benzoquinone, picric acid, citric acid, phenothiazine, tertiary butylcatechol, 2-butyl-4-hydroxyanisole and 2 , 6-ditertiary butyl-p-cresol and the like.
The amount of the polymerization inhibitor (E) used is preferably 0.001 to 3 parts by mass and more preferably 0.01 to 2 parts by mass with respect to 100 parts by mass of the total amount of (A) and (B). If it is 0.001 mass part or more, storage stability will be ensured, and if it is 3 mass parts or less, favorable adhesiveness will be obtained and it will not become uncured.

<2. Cutting processing of translucent hard substrate laminate 10>
Then, after fixing the large-sized translucent hard board | substrate laminated body 10 to a cradle, it cut | disconnects in the thickness direction along the cutting line 13 shown in FIG. 1, and divided the desired number of translucent hard board | substrates. The laminated body 14 is formed. In FIG. 2, the schematic diagram of the translucent hard board | substrate laminated body 14 cut out by this cutting process is shown. The dividing method is not particularly limited, but a disk cutter (diamond disc, cemented carbide disc), fixed abrasive type or loose abrasive type wire saw, laser beam, etching (eg, chemical etching using hydrofluoric acid, sulfuric acid, etc.) And electrolytic etching), water jet, and red tropics (nichrome wire), etc., may be used alone or in combination to divide into rectangular parallelepiped shapes of the same size. Etching can also be used for surface treatment of the cut surfaces after division. Thus, since the translucent hard board | substrate laminated body 14 is produced by dividing | segmenting it after preparing the large-sized translucent hard board | substrate laminated body 10, manufacturing efficiency becomes favorable.

<3. External processing of translucent hard substrate laminate 14>
Next, the translucent hard board | substrate laminated body 14 divided | segmented into the cradle is fixed, and a desired external shape process is performed to the translucent hard board | substrate laminated body 14 on a cradle. In FIG. 3, the schematic diagram of the translucent hard board | substrate laminated body 14 by which the outer diameter process line 15 was shown is shown. In this step, each of the divided light-transmitting hard substrate laminates 14 can be integrally processed into the shape of the target plate product, so that the production speed of the plate product can be greatly increased. There is. The outer shape processing may be performed by any known means, and examples thereof include grinding with a rotating grindstone, drilling with an ultrasonic vibration drill, processing with a rotating brush, and the like.

<4. End face processing of translucent hard substrate laminate 14>
Next, end face processing is performed on the translucent hard substrate laminate 14 that has been subjected to desired outer diameter processing. The translucent hard substrate laminate 14 after the outer diameter processing may have chipping, cracking, chipping, or the like on its end surface, but this end surface processing also has the purpose of removing them. . For the end face processing, a cutting tool 16 having a cutting portion 18 is used. Here, in FIG. 4, the cross-sectional schematic diagram of the cutting tool 16 which has the cutting part 18 with which the front-end | tip part was expanded and the translucent hard board | substrate laminated body 14 of cutting object is shown. The cutting tool 16 includes a shaft portion 17 that is attached to a spindle, which will be described later, and is rotationally driven, and a cutting portion 18 that is provided at the tip of the shaft portion 17. The cutting part 18 is configured such that a plurality of protrusions 19 having an isosceles triangular cross section are arranged at predetermined intervals so as to stand vertically from the shaft part 17 and over the entire circumference of the shaft part 17. Has been. Here, the circumferential direction of the shaft portion 17 is “a direction parallel to the adhesive layer 12 ′ between the translucent hard substrates 11 ′ when provided in opposition to the translucent hard substrate 11 ′”. . The form of the cutting part 18 is not limited to that of the above-described form. For example, the cutting part 18 includes a shaft part 17 and a contact part having a spherical tip formed so as to extend vertically from the shaft part 17. Also good. Moreover, you may be comprised by the axial part 17 and the front-end | tip protrusion contact part formed so that it might extend perpendicularly | vertically from the axial part 17. FIG. The size of the cutting tool 16 is not particularly limited. For example, as shown in FIG. 4, the shaft portion 17 is preferably 0.7 to 3.0 mm in diameter (= c), more preferably 1.0 to 2.0 mm. Diameter (= c), most preferably 1.6 mm diameter (= c). Further, the angle 19a of the protrusion 19 is not particularly limited. For example, it is preferably 30 to 60 °, more preferably 40 to 50 ° with respect to the edge portion of about 90 ° of the translucent hard substrate 11 ′, most preferably Preferably, the cross section may be formed into a right-angled isosceles triangle shape so as to take a face at 45 ° and remove the sharpness of the edge. In this case, the relationship between the height (a) of the projection 19 obtained by cutting the side surface of the translucent hard substrate 11 ′ and the diameter (b) of the bottom surface is preferably b = 1a to 3a, more preferably b = 1.5a. 2.0a, most preferably b = 2a. At this time, the remaining diameter obtained by subtracting the height (a) at the ridge portion of the protrusion 19 is preferably 1.0 to 3.0 mm (= d), more preferably 1.5 to 2.5 mm ( = D), most preferably 2.0 mm (= d). With such a configuration, it is possible to cut the substrate edge portion satisfactorily by causing the cutting portion 18 to correspond accurately between the substrates of the translucent hard substrate laminate 14. The material for forming the cutting part 18 is not particularly limited as long as it can satisfactorily scrape off the translucent hard substrate 11 ′ constituting the translucent hard substrate laminate 14 to be cut. The portion in contact with the conductive hard substrate 11 ′ is preferably made of super steel, high speed steel, or diamond. If the contact portion is formed of such a material, it is possible to cut the light-transmitting hard substrate laminate 14 to be cut particularly easily and accurately when the material constituting the light-transmitting hard substrate laminate 14 is a plate glass or the like. Moreover, the whole cutting part 18 may be formed with such a material, and may be formed by the electrodeposition etc. on the main body formed with the metal material. Specifically, for example, the cutting portion 18 main body may be formed of super steel or high speed steel, and diamond may be formed on the main body by electrodeposition.

In this embodiment, an ultrasonic spindle is used as a driving device for the cutting tool 16. The ultrasonic spindle is a hollow main body sleeve formed in the spindle, an ultrasonic vibrator provided in the main body sleeve, coaxially connected to the ultrasonic vibrator, and fixed to the inner wall of the main body sleeve. And a support horn. The support horn transmits the ultrasonic vibration excited by the ultrasonic vibrator to the cutting tool 16 to which the support horn is attached. In general, when cutting the light-transmitting hard substrate laminate 14, cutting waste enters the cutting portion 18 of the cutting tool 16 and clogging occurs. The clogging with the cutting scraps reduces the life of the cutting tool 16 and further reduces the cutting efficiency. For this reason, in cutting, it is important not to cause clogging due to cutting waste entering the cutting portion 18 of the cutting tool 16. On the other hand, if an ultrasonic spindle is used as a drive device, it is possible to proceed with processing while finely crushing and removing the processing surface by combining ultrasonic vibration with rotational motion. For this reason, it is not necessary to have a rotational speed of about 30000 rpm, which is used in normal rotational drive type cutting, and processing at a rotational speed of about 2500 rpm is possible. Therefore, there is an advantage that the life of the cutting tool 16 is improved and noise in the processing is reduced. Further, at the tip of the cutting portion 18, a cooling liquid is used at the time of processing. However, a cavitation phenomenon occurs in the cooling liquid, and the cutting waste is repelled. Furthermore, a flow is generated in the cooling liquid by a pumping action due to vibration between the translucent hard substrate laminate 14 and the cutting part 18, and the dischargeability of the cutting waste is improved. For this reason, the clogging of the cutting part 18 can be suppressed favorably. Moreover, since the usage-amount of a cooling fluid can also be suppressed, manufacturing cost becomes favorable compared with the normal rotational drive type cutting process.

Next, as the end face processing on the translucent hard substrate laminate 14 having the desired outer diameter processing, first, as shown in FIG. A cutting tool 16 attached to an unillustrated) is provided in alignment. At this time, the cutting tool 16 is provided such that the plurality of cutting portions 18 are arranged in a direction parallel to the adhesive layer 12 ′ of the translucent hard substrate laminate 14. Moreover, the space | interval of the adjacent translucent hard board | substrate laminated body 14 is each controlled uniformly. As this control method, the adhesive is controlled to be constant by including a granular material that does not dissolve in the adhesive components. Further, the interval between the substrates may be controlled to be constant using an external fixing device. Next, from the side surface of the translucent hard substrate laminate 14, the ultrasonic spindle is actuated to bring the cutting portion 18 of the cutting tool 16 into contact with rotation, so that the adjacent translucent hard substrates 11 ′ face each other. Cut the edges of the surface to be cut at once. At this time, since the intervals between the substrates of the translucent hard substrate laminate 14 are controlled to be constant, the plurality of cutting portions 18 in parallel with the cutting tool can always contact each substrate with high accuracy. Accordingly, the edges of the mutually facing surfaces of the adjacent translucent hard substrates 11 'can be cut at a desired width and depth at a time. At this time, the projecting portions 19 having an isosceles triangular cross section formed so that the cutting portion 18 stands vertically from the shaft portion 17 and over the entire circumference of the shaft portion 17 are spaced apart from each other by a predetermined interval. As shown in FIG. 5, the hard substrate laminate 14 is bonded to the hard substrate 11 ′ from the edges of the mutually opposing surfaces of the adjacent hard substrates 11 ′ in the cross section, as shown in FIG. 5. A V-shaped groove 21 having a ridge line is formed in the adhesive layer 12 ′ over the adhesive layer 12 ′. As a result, chipping, cracks, chips, or the like generated at the edge of the end face of the translucent hard substrate laminate 14 are satisfactorily removed.

In the present embodiment, the cutting portion 18 of the cutting tool 16 is brought into contact between the substrates in a state where the substrate intervals of the translucent hard substrate laminate 14 are controlled to be constant with each other. It is not limited to this. That is, when the intervals between the substrates of the translucent hard substrate laminate 14 are not constant, it is also possible to arrange the cutting parts 18 arranged in parallel so as to correspond to each other between the substrates by adjoining them. The edges of the mutually opposing surfaces of the translucent hard substrate 11 ′ can be cut at a time.

Next, the side surface of the hard substrate laminate 14 cut by the cutting tool 16 is polished. Any known polishing means can be used as long as it can satisfactorily polish the hard substrate 11 ′ to be polished. At this time, you may grind | polish with a brush, for example using the slurry containing abrasives, such as cerium oxide. The brush is not particularly limited. For example, nylon, PVC, PP, pig hair, wool, horse hair, brass, cerium oxide, aluminum oxide, silicon carbide, aluminum silicate, etc. are kneaded into nylon, PVC, PP, etc. Can be made of rare materials. Thus, by further polishing the side surface of the hard substrate 11 ′ after cutting, the substrate side surface can be finished to a smoother surface.

6 is a schematic cross-sectional view of the translucent hard substrate laminate 20 after end face processing, and FIG. 7 is a schematic plan view of the translucent hard substrate laminate 20 after end face processing. As described above, according to the present invention, chipping, cracks, chips, or the like generated at the edge of the end face of the translucent hard substrate laminate can be satisfactorily removed, so that a laminate with good end face processing accuracy can be obtained. It is done.

<5. Formation of plate products>
Subsequently, the light-transmitting hard substrates 11 ′ that have been bonded together are peeled from the light-transmitting hard substrate laminate 14, and a plurality of plate-like products are formed using this.

The embodiments of the present invention have been described above with reference to the drawings. However, the present invention is not limited to these embodiments, and various variations are possible.

In order to better understand the present invention and its advantages, the following experimental examples are provided.

<Example 1>
1. Preparation of Photocurable Adhesive (I) The following components (A) to (E) were mixed to prepare a photocurable adhesive (I).
(A) As a polyfunctional (meth) acrylate, “UV-3000B” (abbreviated as “UV-3000B” hereinafter referred to as urethane acrylate) manufactured by Nippon Gosei Co., Ltd., a weight average molecular weight of 18000, a polyol compound is a polyester polyol, and an organic polyisocyanate compound is isophorone diisocyanate. 20 parts by mass of hydroxy (meth) acrylate is 2-hydroxyethyl acrylate), 15 parts by mass of dicyclopentanyl diacrylate (“KAYARAD R-684” manufactured by Nippon Kayaku Co., Ltd., hereinafter abbreviated as “R-684”),
(B) As a monofunctional (meth) acrylate, 50 parts by mass of 2- (1,2-cyclohexacarboxyimide) ethyl acrylate (“Aronix M-140” manufactured by Toagosei Co., Ltd., hereinafter abbreviated as “M-140”); 15 parts by mass of phenol ethylene oxide 2 mol modified acrylate (“Aronix M-101A” manufactured by Toa Gosei Co., Ltd.)
(C) 10 parts by mass of benzyldimethyl ketal (“IRGACURE651” manufactured by BASF, hereinafter abbreviated as “BDK”) as a photopolymerization initiator,
(D) 1 part by weight of spherical crosslinked polystyrene particles having an average particle size of 100 μm (“GS-100S” manufactured by Ganz Kasei Co., Ltd.)
(E) 2,2-methylene-bis (4-methyl-6-tertiary butylphenol) as a polymerization inhibitor (“Sumilyzer MDP-S” manufactured by Sumitomo Chemical Co., Ltd., hereinafter abbreviated as “MDP”) 0.1 parts by mass 2 . Preparation of plate glass laminate 12 sheets of plate glass (width 530 mm × length 420 mm × thickness 0.7 mm) are prepared as a light-transmitting hard substrate, and bonded together via the photocurable adhesive containing crosslinked polystyrene particles. A laminate was produced. Specifically, after 40 g of the above-mentioned photo-curable adhesive is applied on the first sheet glass, the second sheet glass is bonded onto the first sheet glass, and the surface of the second sheet glass is then bonded. The photocurable adhesive was cured by UV irradiation. The UV irradiation amount was 3000 mJ / cm ² (measured by an integrating illuminometer with a 365 nm light receiver), and the UV irradiation time was 40 seconds. By repeating this procedure, a plate glass laminate having a thickness of 8 mm (this thickness is the total thickness of the laminate of 12 plate glasses) made of 12 plate glasses was produced.

3. Next, after fixing the plate glass laminate to the cradle, the plate glass laminate was cut in the thickness direction along a predetermined cutting line by a disc cutter to produce a divided plate glass laminate. At this time, each plate glass was divided into a width of 100 mm, a length of 50 mm, and a thickness of 0.7 mm (this thickness is the thickness of one plate glass).

4). Next, the outer shape was processed by fixing the plate glass laminate divided into the cradle and grinding the plate glass laminate on the cradle using a rotating grindstone. At this time, some of the edges of the plate glass had chipping, cracks, and / or chips.

5. End face processing of sheet glass laminate Next, a cutting tool as shown in FIG. 4 was prepared. The cutting portion of the cutting tool has a shaft portion diameter (c) shown in FIG. 4 of 1.6 mmφ, and the protrusion has a right-angled isosceles triangle shape (b = 2a) in the cross section. The remaining diameter after subtracting the height (a) was 2.0 mm (= d). In the cutting tool, the shaft portion and the protrusion main body are made of super steel, and diamond is electrodeposited on the surface of the protrusion main body.
Next, the cutting tool was attached to a 40 kHZ ultrasonic spindle unit URT40-F41 manufactured by Takesho.
Next, the cutting tool attached to the ultrasonic spindle is installed at a position where the plurality of protrusions correspond to the adhesive layers of the sheet glass laminate, and as shown in FIG. From the edge of the opposite surface of the adjacent plate glass to the adhesive layer between the plate glasses in the cross section of the plate glass laminate, the ridge line is projected to the adhesive layer from the edge of the projection to the adhesive layer. Cutting was performed so as to form a V-shaped groove having the shape. At this time, the ultrasonic spindle had a rotational frequency of 2500 rpm at 40 kHz. Cutting was performed until the V-shaped groove inclined at 45 ° on the side surface of the plate glass laminate had a depth of 0.2 mm.

The chipping, cracks, and / or chips were well removed from the edge of the sheet glass laminate that had been subjected to end face processing in this way.

<Example 2>
As Example 2, the same process as Example 1 was performed except that a cutting tool equipped with a normal spindle (not applying ultrasonic vibration) that was not an ultrasonic spindle was used in the cutting process.
In the same manner as in Example 1, chipping, cracking, and / or chipping were removed satisfactorily from the edge portion of the plate glass laminate that had been subjected to end face processing in this manner.
However, in the cutting process, compared with Example 1 using an ultrasonic spindle, noise increased, and clogging of the cut portion with cutting waste was conspicuous.

<Example 3>
As Example 3, the same process as in Example 1 was performed except that the photocurable adhesive (II) was used instead of the photocurable adhesive (I).
1. Preparation of photocurable adhesive (II) The following components (A) to (E) were mixed to prepare a photocurable adhesive (II).
(A) As a polyfunctional (meth) acrylate, 20 parts by mass of “UV-3000B” (urethane acrylate, hereinafter abbreviated as “UV-3000B”) manufactured by Nippon Gosei Co., Ltd., dicyclopentanyl diacrylate (manufactured by Nippon Kayaku Co., Ltd.) KAYARADR-684 ”, hereinafter abbreviated as“ R-684 ”), 25 parts by mass,
(B) As monofunctional (meth) acrylate, 35 parts by mass of 2-hydroxy-3-phenoxypropyl (meth) acrylate (“Aronix M-5700” manufactured by Toa Gosei Co., Ltd., hereinafter abbreviated as “M-5700”), phenolethylene 20 parts by mass of oxide 2 mol modified acrylate (“Aronix M-101A” manufactured by Toa Gosei Co., Ltd.)
(C) 10 parts by mass of benzyldimethyl ketal (“IRGACURE651” manufactured by BASF, hereinafter abbreviated as “BDK”) as a photopolymerization initiator,
(D) 1 part by weight of spherical crosslinked polystyrene particles having an average particle size of 100 μm (“GS-100S” manufactured by Ganz Kasei Co., Ltd.)
(E) 0.1 part by mass of 2,2-methylene-bis (4-methyl-6-tertiary butylphenol) (“Sumilyzer MDP-S” manufactured by Sumitomo Chemical Co., Ltd., hereinafter abbreviated as “MDP”) as a polymerization inhibitor Thus, chipping, cracks, and / or chips were well removed from the edge portion of the sheet glass laminate that had been subjected to the end face processing.

<Example 4>
As Example 4, the same process as Example 3 was performed except that a cutting tool equipped with a normal spindle (not applying ultrasonic vibration) that was not an ultrasonic spindle was used in the cutting process.
In the same manner as in Example 1, chipping, cracking, and / or chipping were removed satisfactorily from the edge portion of the plate glass laminate that had been subjected to end face processing in this manner.
However, in the cutting process, compared with Example 3 using an ultrasonic spindle, noise increased, and clogging of the cut portion with cutting waste was conspicuous.

<Comparative Example 1>
As Comparative Example 1, a sheet glass is laminated using a photocurable adhesive (I) that does not contain polystyrene particles (except that it does not contain polystyrene particles, and has the same composition as the photocurable adhesive (I)). Thus, the thickness control between the plate glasses in the plate glass laminate was not performed, and in the cutting process, in place of the cutting tool according to the present invention, except that a brush formed of nylon was used, Example 1 and A similar process was performed.
Many chippings, cracks, and / or chips remained from the edges of the plate glass laminate subjected to the end face processing in this way and were not removed well. This is because the thickness between each glass sheet is not controlled to be constant, and since it was cut with a brush made of nylon, a plurality of cutting parts could be cut at appropriate positions with respect to the edge of the glass sheet. This is probably because the edge of the laminated sheet glass could not be cut uniformly.

Table 1 shows the physical properties of the photocurable adhesive (I) and the photocurable adhesive (II) used in the above Examples and Comparative Examples. The evaluation method is as follows.
Tensile shear adhesive strength (adhesive strength): Measured according to JIS K 6850. Specifically, heat-resistant Pyrex (registered trademark) glass (25 mm × 25 mm × 2.0 mm) was used as the adherend. Adhesion site is 8mm in diameter, and two heat-resistant Pyrex (registered trademark) glass is bonded together with the produced photo-curing adhesive, and a wavelength of 365 nm is integrated by a fusion device using an electrodeless discharge lamp. Curing was performed under the condition of a light amount of 2000 mJ / cm ² to prepare a tensile shear bond strength test piece. The prepared test piece was measured for tensile shear bond strength at a tensile rate of 10 mm / min in an environment of a temperature of 23 ° C. and a humidity of 50% using a universal testing machine.
Peeling test: produced under the same conditions as above except that a photocurable adhesive was applied to the heat-resistant Pyrex (registered trademark) glass and bonded to blue plate glass (150 mm × 150 mm × thickness 1.7 mm) as a support. The cured photocurable adhesive was cured to prepare a peel test specimen. The obtained specimen was immersed in warm water (80 ° C.), the time for the heat-resistant Pyrex (registered trademark) glass to peel was measured, and the peeled state was also observed.
Standard deviation of maximum width of chip of 10 back specimens and maximum width of chip of 10 back specimens: 80 mm x horizontal by using adhesive (I) and adhesive (II) The blue plate glass (A) of 80 mm × thickness 1 mm and the blue plate glass (B) (used as a support) used in the peel test were bonded and cured in the same manner as described above. The blue sheet glass (A) portion of the adhesion test specimen was cut into a 10 mm square using a dicing apparatus. The blue plate glass (A) did not fall off during the cutting, indicating good workability. When the adhesion test body which cut | disconnected only the blue plate glass (A) part was immersed in 80 degreeC warm water, all peeled in 10 minutes. Also, 10 pieces of the peeled test specimens were taken out at random, and each piece on the back surface (surface temporarily fixed with an adhesive) of the test specimen was observed using an optical microscope, and the glass was missing. The maximum width was measured, and the average value and standard deviation were obtained.

DESCRIPTION OF SYMBOLS 10 Large-sized translucent hard board | substrate laminated body 11 Large-sized translucent hard board | substrate 11 'Translucent hard board | substrate 12 Large-sized adhesive layer 12' Adhesive layer 13 Cutting line 14 Translucent hard board | substrate laminated body 15 Outer diameter Processing line 16 Cutting tool 17 Shaft portion 18 Cutting portion 19 Protrusion portion 19a Angle 20 of protrusion portion 19 Translucent hard substrate laminate 21 after end face processing V-shaped groove

Claims

Preparing a hard substrate laminate in which two or more hard substrates are bonded together with an adhesive;
A cutting tool provided with a cutting portion provided at a position corresponding to each adhesive layer between the hard substrates, and from the side surface of the laminated body, the edges of the adjacent hard substrates facing each other at a time Cutting process;
A processing method for a hard substrate laminate including:
Cutting with the cutting tool is performed in the cross section of the hard substrate laminate, from the edge of the adjacent hard substrate to the adhesive layer between the hard substrates to the adhesive layer between the hard substrates. The processing method of the hard board | substrate laminated body of Claim 1 performed so that a character groove may be formed.
The processing method of a hard substrate laminate according to claim 1 or 2, wherein the cutting tool is attached to a spindle and driven to rotate.
The method for processing a hard substrate laminate according to claim 3, wherein the spindle is an ultrasonic spindle.
The method for processing a hard substrate laminate according to any one of claims 1 to 4, wherein the interval between the plurality of hard substrates is controlled to be constant during the cutting step.
The processing method for a hard substrate laminate according to claim 5, wherein the interval between the hard substrates is controlled to be constant by including a granular material that does not dissolve in the adhesive component in the adhesive.
The method for processing a hard substrate laminate according to any one of claims 1 to 6, wherein at least a portion of the cutting portion of the cutting tool that is in contact with the hard substrate is formed of super steel, high-speed steel, or diamond. .
The method for processing a hard substrate laminate according to claim 7, wherein the cutting portion of the cutting tool is formed of super steel or high speed steel having a surface electrodeposited with diamond.
The method for processing a hard substrate laminate according to any one of claims 1 to 8, further comprising a step of polishing a side surface of the hard substrate laminate cut by the cutting tool.
The hard substrate laminate is formed by dividing a large-sized hard substrate laminate in which two or more large-size hard substrates are bonded together with an adhesive, by cutting in the thickness direction. The processing method of the hard board | substrate laminated body in any one of 9.
The method for processing a hard substrate laminate according to any one of claims 1 to 10, wherein the translucent hard substrate is a plate glass.
A method for producing a plate-like product, including a step of forming a plurality of plate-like products using the light-transmitting hard substrate laminate subjected to the processing method of the hard substrate laminate according to any one of claims 1 to 11.