JP3897072B2 - Flat glass for electronic parts - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a glass plate for an electronic component used for an optical semiconductor package such as a surface wave filter substrate, a crystal oscillator small package, a solid-state imaging device, a light emitting device, and a light receiving device.
[0002]
[Prior art]
Conventionally, plate glass for electronic parts, for example, a plate glass used for a light transmission window of a package containing a solid-state image sensor of an optical semiconductor, as shown in FIG. A plate glass 1 having a C chamfer 1a is used.
[0003]
[Problems to be solved by the invention]
However, in the case of the conventional plate glass 1, as shown in FIG. 4, since the shape of the C chamfer 1a at each corner of the plate glass 1 and the shape of the fitting portion 3 of the package 2 are substantially equal, the C chamfer 1a where stress tends to concentrate. There is a concern that the adhesive 4 does not sufficiently wrap around and the adhesive strength of the hermetic sealing portion and the reliability against thermal stress due to the temperature cycle load are insufficient.
[0004]
An object of this invention is to provide the plate glass for electronic components which solved the above conventional problems.
[0005]
[Means for Solving the Problems]
The plate glass for an electronic component according to the present invention is made of a substantially rectangular plate glass, and is characterized in that each corner of the plate glass is chamfered in a substantially arc shape recessed inward.
[0006]
[Action]
According to the plate glass for electronic parts of the present invention, the plate glass is made of a substantially rectangular plate glass, and each corner of the plate glass is chamfered in a substantially arc shape recessed inward, so that the bonding area between the plate glass and the package is 3 than before. Since the adhesive can be sufficiently stored in the gap between each substantially chamfered chamfered portion of the plate glass and each chamfered portion of the package fitting portion, the reliability of adhesion can be improved.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is an explanatory view of an electronic component plate glass according to the present invention, wherein 1 is an electronic component plate glass, 2 is a package, 3 is an insertion portion of a package 2 into which the electronic component plate glass 1 is inserted, Reference numeral 4 denotes an adhesive, and the same parts as those in FIG. 4 described above are denoted by the same reference numerals.
[0008]
The plate glass 1 for electronic parts of the present invention (hereinafter referred to as plate glass 1) is made of, for example, borosilicate glass having an expansion coefficient of 50 to 70 × 10 ⁻⁷ / ° C., and has a long side of 11.0 mm and a short side of 10.0 mm. , Having a dimension of thickness 0.5 to 1.4 mm, the surface thereof is polished to a mirror surface, and the chamfer 1a applied to each corner has a curvature radius of 1.5 mm and a chord length of 1 It has a substantially arc shape recessed inward to be 4 mm. In addition, a thread chamfer 1b having a side of about 0.1 mm is applied to all edge portions.
[0009]
As a material constituting the plate glass 1, alkali-free glass or the like can be used in addition to borosilicate glass. The expansion coefficient of the material is preferably close to that of the electronic component package.
[0010]
The case where a solid-state image sensor is packaged using the plate glass 1 will be described.
[0011]
A thermosetting epoxy adhesive 4 is printed and applied to a portion of the plate glass 1 that comes into contact with the package 2 using a screen printer. At this time, a large amount of adhesive 4 is adhered to the substantially arc-shaped chamfer 1 a that is recessed inside the plate glass 1. Next, the plate glass 1 to which the adhesive 4 is applied is inserted into the insertion portion 3 at the top of the package 2. Next, the package 2 in which the plate glass 1 is inserted is put in an oven, the adhesive 4 is cured, and the plate glass 1 is bonded to the package 2.
[0012]
The bonding area between the chamfer 1a of the plate glass 1 and the fitting portion 3 of the package 2 is increased by about 5% compared to the conventional plate glass with C chamfering, thereby improving the bonding strength and fitting with the chamfered portion 1a. The adhesive 4 stored in the gap 3a with the part 3 forms a buffer layer for corners where stress is likely to concentrate, and protects each corner.
[0013]
When manufacturing the above-described glass plate 1 for an electronic component, as shown in FIG. 2A, for example, 50 sheets of borosilicate having a short side of 200 mm, a long side of 300 mm, and a thickness of 0.5 mm that are polished and finished. The material plate glass 10 made of glass is sequentially stacked and laminated on the base 11, and is temporarily bonded to the gap between the base 11 and the material plate glass 10 and the gap between the laminated material plate glasses 10 in a liquid state by heating. The agent 12 is filled and cooled and solidified to form the laminate 13. As shown in FIG. 2 (B), this laminated body 13 is a multi-blade cutting machine (main body) provided with a plurality of rotating cutting blades 15 having a thickness of 2 mm arranged on a rotary drive shaft 14 at a pitch of 12 mm or 10 mm. Is mounted on the base 11 and is formed in a state where 551 rectangular column bodies 16 having dimensions of 10 mm in length, 8 mm in width, and 35 mm in height are adjacent to each other.
[0014]
Next, as shown in FIG. 3 (A), as shown in FIG. 3 (B), using a chamfering device 18 in which tools 17 for chamfering composed of a plurality of rotating grindstones are arranged at a pitch of 12 mm. The tool 17 is used to grind four opposing corners 16a of the four inner rectangular prisms 16 on the base 11, two opposite corners 16b on the outer side, and an outer corner 16c. Then, the chamfers 16d are formed at the same time.
[0015]
Next, the rectangular column 16 is formed by immersing the rectangular column 16 on the base 11 and having the chamfer 16d formed in a tank (not shown) filled with an etching solution containing hydrofluoric acid. The chamfering is performed by controlling the concentration of the etching solution, the temperature, and the immersion time of the rectangular column 16 so that the edge of all the plate glasses is about 0.1 mm on one side.
[0016]
Thereafter, the temporary fixing adhesive 12 of the rectangular column 16 is dissolved in a solvent to separate the individual glass plates from the base 11, washed and dried, and the substantially circular shape with the corners recessed inward as shown in FIG. There are obtained 27,550 sheets of glass 1 for electronic parts in which the arc-shaped chamfer 1a is applied and the thread chamfer 1b is applied to the edge portion.
[0017]
The plate glass 1 for electronic parts can chamfer the four corners 16a facing each other of the aligned quadrangular columnar bodies 16 at the same time, and simultaneously immerse the quadrangular columnar bodies 16 in an etching solution. It has a shape suitable for mass production that can be chamfered.
[0018]
In the above embodiment, an electronic component glass plate that is nearly square is shown. However, the electronic component glass plate of the present invention is also applicable to a strip-shaped cover glass that protects a line sensor of an image input device such as a facsimile or a scanner. Is possible.
[0019]
【The invention's effect】
According to the glass plate for an electronic component of the present invention, it is possible to improve the airtightness of the package of the electronic component, to improve the reliability, and since it has a shape suitable for mass production, it can be manufactured at low cost. It has a practically excellent effect.
[Brief description of the drawings]
1A and 1B are explanatory views of a glass sheet for electronic parts according to the present invention, in which FIG. 1A is a perspective view of a glass sheet for electronic parts, FIG. 1B is a plan view of a solid-state imaging device package, and FIG. FIG. 2 is an explanatory view of a process for producing a glass sheet for electronic parts according to the present invention, wherein (A) is a side view of a laminated body made of a material glass sheet, and (B) is a process of cutting the laminated body. FIG. 3 is an explanatory diagram of a process of chamfering corners of a sheet glass all at once with a rotating grindstone, wherein (A) is a sectional view and (B) is a plan view. FIG. 4 is for a conventional electronic component. It is explanatory drawing of plate glass, (A) is a perspective view of the plate glass for electronic components, (B) is a top view of a solid-state image sensor package, (C) is YY sectional drawing of (B).
DESCRIPTION OF SYMBOLS 1 Glass plate for electronic parts 1a Chamfer 1b Yarn chamfer 2 Package 3 Insertion part 4 Adhesive

Claims (1)

A plate glass for electronic parts, which is made of a substantially rectangular plate glass and is chamfered in a substantially arc shape in which each corner of the plate glass is recessed inward.

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