JPH0739232Y2 - Lid for sealing electronic components - Google Patents
Lid for sealing electronic componentsInfo
- Publication number
- JPH0739232Y2 JPH0739232Y2 JP1992080272U JP8027292U JPH0739232Y2 JP H0739232 Y2 JPH0739232 Y2 JP H0739232Y2 JP 1992080272 U JP1992080272 U JP 1992080272U JP 8027292 U JP8027292 U JP 8027292U JP H0739232 Y2 JPH0739232 Y2 JP H0739232Y2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- lid
- lid member
- electronic component
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
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- Solid State Image Pick-Up Elements (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本考案は、ＣＣＤ（Charge Coupl
ed Device ）やＭＯＳ（酸化金属半導体）等の固体撮像
素子の電子部品素子を容器に収納し、封止する際に用い
られる透光性キャップガラス等の電子部品素子封止用蓋
材に関する。[Industrial application] This invention is a CCD (Charge Coupl
ED Device), MOS (Metal Oxide Semiconductor), and the like, and a lid member for sealing electronic component elements such as translucent cap glass used when housing and sealing electronic component elements such as solid-state imaging devices.
【０００２】[0002]
【従来の技術】従来より半導体素子、特に、固体撮像素
子などを凹部形状を持ったパッケージ本体に実装した
後、その機能に応じた材質の蓋材（ガラス、セラミッ
ク、金属等）を接着剤を介して接合し封止する方法が用
いられている。2. Description of the Related Art Conventionally, after mounting a semiconductor element, particularly a solid-state image pickup element, etc. on a package body having a concave shape, a lid material (glass, ceramic, metal, etc.) of a material suitable for the function is attached with an adhesive. A method of joining and sealing through is used.
【０００３】図３は、前記封止方法が適用された固体撮
像装置の一例の断面図であって、表面にフィルター５が
貼り付けられた固体撮像素子１が、ダイアタッチ剤２に
よりセラミックパッケージ９に貼り付けられている。セ
ラミックパッケージ９には、固体撮像素子１と外部回路
とを電気的に接続するリードフレーム８が低融点ガラス
３によって固定されており、そしてリードフレーム８と
の固体撮像素子１とが金ワイヤー４によって接続されて
いる。セラミックパッケージ９の開口部には、透過性の
キャップガラスからなる蓋材６が接着剤７によって接着
され、固体撮像素子１が内部に収納、封止されている。FIG. 3 is a cross-sectional view of an example of a solid-state image pickup device to which the above-mentioned sealing method is applied. In the solid-state image pickup device 1 having a filter 5 attached to the surface thereof, a ceramic package 9 is formed by a die attach agent 2. Pasted on. A lead frame 8 for electrically connecting the solid-state imaging device 1 and an external circuit is fixed to the ceramic package 9 by a low melting point glass 3, and the lead frame 8 and the solid-state imaging device 1 are connected by a gold wire 4. It is connected. A lid member 6 made of a transparent cap glass is adhered to the opening of the ceramic package 9 with an adhesive 7 so that the solid-state imaging device 1 is housed and sealed inside.
【０００４】上記のような固体撮像装置においては、例
えば、特開昭５８−１６４３８０号、同５９−１８１５
７９号公報に示されているとおり、予め低融点ガラスや
エポキシ系の有機系接着剤を塗布したキャップガラスを
セラミックパッケージの開口部を塞ぐように設置し、そ
のまま或いはクリップ等で加圧しながら加熱して接着剤
を溶かし、セラミックパッケージとキャップガラスとを
接着している。In the solid-state image pickup device as described above, for example, JP-A-58-164380 and 59-1815.
As disclosed in Japanese Patent Publication No. 79, a cap glass coated with a low-melting glass or an epoxy-based organic adhesive in advance is installed so as to close the opening of the ceramic package and heated as it is or while applying pressure with a clip or the like. To melt the adhesive and bond the ceramic package and the cap glass.
【０００５】該接着剤は、当初無機系のものが主体であ
ったが、熱処理温度の低い有機系の接着剤が使用される
ことが多くなった。Initially, the adhesive was mainly an inorganic adhesive, but an organic adhesive having a low heat treatment temperature is often used.
【０００６】このような製法においては、パッケ−ジ本
体及び蓋部の熱膨張率と有機系接着剤の熱膨張率が大き
く異なるため次のような問題が生じていた。In such a manufacturing method, since the thermal expansion coefficient of the package body and the lid portion is greatly different from that of the organic adhesive, the following problems occur.
【０００７】即ち、封止用接着剤は加熱直後から室温ま
で冷却される間に等方向に収縮しようとする。このと
き、接着剤の熱膨張率はパッケ−ジ本体及び蓋部材に比
べて大きいため、蓋材と接着剤、または、パッケージ本
体と接着剤との接着面に膨張率の差による応力が働き、
剥離が生じた。That is, the sealing adhesive tends to shrink in the same direction immediately after being heated and while being cooled to room temperature. At this time, since the coefficient of thermal expansion of the adhesive is larger than that of the package body and the lid member, stress due to the difference in the coefficient of expansion acts on the adhesive surface between the lid material and the adhesive, or the package body and the adhesive,
Peeling occurred.
【０００８】特に最近パッケージの小型化に伴いパッケ
ージ本体と蓋材とのシール幅（接着幅）が必然的に狭く
なり、従って蓋材と接着剤層との界面に前記熱膨張率の
差に起因する応力が集中しやすくなるため剥離の防止が
大きな課題となっていた。Particularly, with the recent miniaturization of the package, the seal width (bonding width) between the package body and the lid material is inevitably narrowed, and therefore, due to the difference in the coefficient of thermal expansion at the interface between the lid material and the adhesive layer. Since the stress to be applied tends to concentrate, prevention of peeling has been a major issue.
【０００９】[0009]
【考案が解決しようとする課題】本考案は、上記従来の
技術に鑑み、電子部品用パッケージを封止する際に生じ
ていた蓋材と接着剤またはパッケージ本体と接着剤との
界面での剥離の問題を、蓋材の面取りの寸法にて解決す
ることを目的とする。DISCLOSURE OF THE INVENTION In view of the above-mentioned conventional technique, the present invention is a peeling at an interface between a lid material and an adhesive agent or a package body and an adhesive agent, which is generated when an electronic component package is sealed. It is an object of the present invention to solve the above problem by the chamfering dimension of the lid material.
【００１０】[0010]
【課題を解決するための手段】本考案は、電子部品素子
をパッケージに収納して有機系接着剤を介して封止する
厚さ０．３〜２．０ｍｍのガラスからなる蓋材であっ
て、該蓋材の少なくとも接着剤への隣接面の周縁部に面
取りがなされ、かつ該面取りを構成する前記隣接面から
の距離Ａおよび蓋材の側面からの距離Ｂが０．０５〜
０．２０ｍｍの寸法を有することを特徴とする電子部品
素子封止用蓋材に関する。SUMMARY OF THE INVENTION The present invention is a lid member made of glass having a thickness of 0.3 to 2.0 mm for housing electronic component elements in a package and sealing them with an organic adhesive. A chamfer is made on at least the peripheral portion of the surface of the lid material adjacent to the adhesive, and the distance A from the adjacent surface and the distance B from the side surface of the lid material that constitute the chamfer are 0.05 to.
The present invention relates to a lid member for sealing electronic component elements, which has a dimension of 0.20 mm.
【００１１】以下、図面にもとづき本考案を詳述する。The present invention will be described below in detail with reference to the drawings.
【００１２】図１（ａ）および（ｂ）は本考案の蓋材の
断面図の１例であり、本考案はガラスキャップからなる
蓋材６の接着剤７への隣接面１０の周縁部Ｘに面取りが
なされ、かつ該面取りを構成する前記隣接面１０からの
距離Ａと側面１１からの距離Ｂが０．０５〜０．２ｍｍ
の寸法にて面取りされている。FIGS. 1 (a) and 1 (b) are examples of a sectional view of a lid member of the present invention, and the present invention shows a peripheral portion X of a surface 10 of a lid member 6 made of a glass cap adjacent to an adhesive 7. Is chamfered, and the distance A from the adjacent surface 10 and the distance B from the side surface 11 constituting the chamfer are 0.05 to 0.2 mm.
Is chamfered in the dimensions.
【００１３】その際、蓋材の厚さＴは０．３〜２．０ｍ
ｍであることが必要であり、また、蓋材の縦と横の寸法
は５〜６０ｍｍ×５〜６０ｍｍのものが本考案に適用さ
れる。蓋材の厚さが０．３ｍｍ以下であると、蓋材の強
度が低くなり実用上問題が生じ、また、蓋材の厚さが
２．０ｍｍ以上であると、パッケージの容積が厚くなり
すぎて装置の小型化の支障となり、光透過率が低下して
鮮明な画像が得られにくくなるという問題を生じる。At this time, the thickness T of the lid member is 0.3 to 2.0 m.
It is necessary that the length is m, and the length and width of the lid member are 5 to 60 mm × 5 to 60 mm, which is applied to the present invention. When the thickness of the lid material is 0.3 mm or less, the strength of the lid material becomes low, which causes a problem in practical use, and when the thickness of the lid material is 2.0 mm or more, the package volume becomes too thick. As a result, there is a problem in that the size of the device is hindered, the light transmittance is lowered, and it becomes difficult to obtain a clear image.
【００１４】そして、本考案の蓋材のもう一方の面であ
る、接着剤に非接触の面の周縁部Ｙの面取り寸法は０．
０５〜０．２ｍｍの範囲内である必要はかならずしもな
いが、前記周縁部Ｘの面取り作業時等による欠けを防止
するために所望の寸法にて面取りすることが好ましい。The chamfered dimension of the peripheral portion Y of the other surface of the lid member of the present invention which is not in contact with the adhesive is 0.
It is not absolutely necessary that the thickness is in the range of 05 to 0.2 mm, but it is preferable to chamfer the peripheral portion X at a desired size in order to prevent chipping due to chamfering work or the like.
【００１５】また、本考案でいう接着剤と隣接する面の
周縁部Ｘの形状は前記図１（ａ）のように角型でもよい
し、図１（ｂ）に示す丸味を帯びたものでもよいし、特
に形状は限定されない。The shape of the peripheral portion X of the surface adjacent to the adhesive according to the present invention may be rectangular as shown in FIG. 1 (a) or may be rounded as shown in FIG. 1 (b). However, the shape is not particularly limited.
【００１６】また、本考案でいう周縁部Ｘとは、図２で
示した本考案の蓋材６の平面図において４つの稜に対応
した周縁部Ｘ1〜Ｘ4の全てを含むものである。さらに、
また、本考案でいうＡとＢは同一寸法でもよく、異なっ
ていてもよい。Further, the peripheral portion X in the present invention is intended to include all four peripheral portions X 1 to X 4 which corresponds to the edge in a plan view of the lid 6 of the present invention shown in FIG. further,
In the present invention, A and B may have the same size or may have different sizes.
【００１７】本考案において周縁部Ｘの面取り寸法Ａ、
Ｂが０．０５ｍｍ以下の場合は、周縁部Ｘの欠けが発生
しやすく、また、０．２０ｍｍ以上であると、蓋材と接
着剤との間に剥離を生じ本考案の目的を達することがで
きない。In the present invention, the chamfering dimension A of the peripheral portion X,
When B is 0.05 mm or less, chipping of the peripheral portion X is likely to occur, and when B is 0.20 mm or more, peeling occurs between the lid material and the adhesive, and the object of the present invention can be achieved. Can not.
【００１８】また、本考案の蓋材は、図２でいう平面か
らみた４隅のコーナー部Ｚの欠けを防止するため該コー
ナー部Ｚに対し、Ｃ０．２〜Ｃ１．０（ＪＩＳＺ８３１
７の製図における寸法記入法に準ずる）の面取り（コー
ナーカット）を施すことが好ましい。Further, the lid member of the present invention is designed to prevent the corner portions Z of the four corners viewed from the plane shown in FIG. 2 from being chipped, so that C0.2 to C1.0 (JISZ831) is applied to the corner portions Z.
It is preferable to chamfer (corner cut) according to the dimensioning method in the drawing of No. 7.
【００１９】本考案の電子部品素子とは、固体撮像素
子、メモリ、マイクロプロセッサ、マイクロコントロー
ラ、リニアＩＣ、ＡＳＩＣ（APPLICATION SPECIFIC I
C） 、ディスクリート、ハイブリッドＩＣ、水晶振動
子、レーザーピックアップ等であり、特に、固体撮像素
子を封止するものに好適に適用される。The electronic component element of the present invention is a solid-state image sensor, memory, microprocessor, microcontroller, linear IC, ASIC (APPLICATION SPECIFIC I).
C) is a discrete IC, a hybrid IC, a crystal oscillator, a laser pickup, and the like, and is particularly preferably applied to one that seals a solid-state image sensor.
【００２０】本考案のパッケージとは、上述の電子部品
素子の封止用のもので、ＤＩＰ（デュアル・イン・ライ
ン・パッケージ）、チップ・キャリア、ＰＧＡ（ピン・
グリッド・アレイ）等が使用され、材質は、アルミナ、
窒化アルミ、酸化ベリリウム、炭化珪素等のセラミック
スやガラス等である。The package of the present invention is for encapsulating the above-mentioned electronic component element, and includes DIP (dual in line package), chip carrier, PGA (pin package).
Grid / array) etc. are used, the material is alumina,
Examples thereof include ceramics such as aluminum nitride, beryllium oxide, and silicon carbide, and glass.
【００２１】また、本考案の接着剤は、主として有機系
接着剤が使用され、例えばユリア樹脂接着剤、メラミン
樹脂接着剤、エポキシ樹脂接着剤、フェノール樹脂接着
剤、アクリル系接着剤、ポリエステル系接着剤、ポリウ
レタン系接着剤、シリコーン系接着剤、ポリイミド系接
着剤等の熱硬化性樹脂系接着剤や、酢酸ビニル樹脂接着
剤、エチレン・酢酸ビニル樹脂接着剤、アクリル樹脂接
着剤、シアノアクリレート系接着剤、塩化ビニル樹脂、
ポリアミド樹脂、ポリオレフィン樹脂、セルロース系樹
脂、飽和ポリエステル、ポリウレタン、嫌気性等の熱可
塑性樹脂系接着剤、更に、エラストマー系接着剤等が用
いられるが、これらは単独もしくは２種類以上を混合し
て使用可能である。The adhesive of the present invention is mainly an organic adhesive, such as urea resin adhesive, melamine resin adhesive, epoxy resin adhesive, phenol resin adhesive, acrylic adhesive, polyester adhesive. Adhesives, polyurethane adhesives, silicone adhesives, polyimide adhesives and other thermosetting resin adhesives, vinyl acetate resin adhesives, ethylene / vinyl acetate resin adhesives, acrylic resin adhesives, cyanoacrylate adhesives Agent, vinyl chloride resin,
Polyamide resin, polyolefin resin, cellulosic resin, saturated polyester, polyurethane, anaerobic thermoplastic resin adhesive, and elastomer adhesive are used, and these are used alone or in combination of two or more. It is possible.
【００２２】本考案の蓋材とは、ガラスが用いられる。Glass is used as the lid material of the present invention.
【００２３】本考案の蓋材の面取り方法は、機械加工に
よる面取り、フッ酸等で蓋材を溶かして面取り部を形成
するケミカルエッチング、溶融等の方法があるが、いず
れの方法を用いてもよい。The method for chamfering the lid material of the present invention includes methods such as chamfering by machining, chemical etching for melting the lid material with hydrofluoric acid or the like to form a chamfered portion, melting, and the like. Good.
【００２４】[0024]
【実施例】 ・エポキシ樹脂（日本化薬社製 商品名；EOCN-1027） １００．０重量部 ・酸無水物 （日本化薬社製 商品名；カヤハ-ト゛MCD） ７５．２重量部 ・シリカ （日本化学工業社製 商品名；シルスタ-） １２０．０重量部 ・メチルエチルケトン ５０．０重量部Example: Epoxy resin (Nippon Kayaku Co., Ltd., trade name; EOCN-1027) 100.0 parts by weight Acid anhydride (Nippon Kayaku Co., Ltd., trade name; Kayaha MCD) 75.2 parts by weight Silica (Nippon Kagaku Kogyo Co., Ltd., product name: Sylster) 120.0 parts by weight Methyl ethyl ketone 50.0 parts by weight
【００２５】上記の配合物をボールミルにて１００ｒｐ
ｍで１０分間攪拌して接着剤を作製し、該接着剤を、厚
さ７ｍｍ、寸法が１０ｍｍ×１０ｍｍのガラス（旭ガラ
ス社製、商品名；ＡＮ）に対して表１に示すようにそれ
ぞれ面取りした本考案のキャップガラスからなる蓋材
（実施例１〜３）に、スクリーン印刷によりキャップガ
ラスの端面から内側に向かって１．５ｍｍの幅で枠状に
塗布したのち加熱乾燥して半硬化状にし、これを電子部
品収納用パッケージの開口部に載置し、板バネにより２
ｋｇの荷重を加えながらクリーンオーブンにて室温から
１５０℃まで３０分で昇温し、１５０℃で２時間放置
後、４時間かけて室温まで徐冷した。その際、各実施例
とも２０枚のキャップガラスを使用して接着および評価
をおこない、その結果を表１に示した。100 ppm of the above compound in a ball mill
An adhesive was prepared by stirring at m for 10 minutes, and the adhesive was used as shown in Table 1 for a glass having a thickness of 7 mm and a size of 10 mm × 10 mm (Asahi Glass Co., Ltd., trade name; AN). The chamfered lid material (Examples 1 to 3) made of the cap glass of the present invention was applied in a frame shape with a width of 1.5 mm from the end surface of the cap glass to the inside by screen printing, and then dried by heating to be semi-cured. And place it in the opening of the electronic component storage package.
While applying a load of kg, the temperature was raised from room temperature to 150 ° C in 30 minutes in a clean oven, left at 150 ° C for 2 hours, and then gradually cooled to room temperature over 4 hours. At that time, 20 sheets of cap glass were used in each Example for adhesion and evaluation, and the results are shown in Table 1.
【００２６】[0026]
【表１】 [Table 1]
【００２７】比較例 蓋材の面取りの寸法を表２のように設定して比較用の蓋
材（比較例１〜２）を作製した他は実施例と同様にして
接着および評価を行った。その結果を表２に示す。Comparative Example Adhesion and evaluation were carried out in the same manner as in the example except that the chamfered dimensions of the lid material were set as shown in Table 2 to produce lid materials for comparison (Comparative Examples 1 and 2). The results are shown in Table 2.
【００２８】[0028]
【表２】 [Table 2]
【００２９】評価は、実体顕微鏡（２０倍）にて、接着
剤とキャップガラスの界面を全周観察し、２０枚のキャ
ップガラスのうち剥離の認められたものの枚数を剥離発
生回数とした。The evaluation was performed by observing the entire circumference of the interface between the adhesive and the cap glass with a stereoscopic microscope (20 times), and the number of pieces of the 20 pieces of cap glass where peeling was recognized was defined as the number of times peeling occurred.
【００３０】さらに、実体顕微鏡（２０倍）にて、キャ
ップガラスの界面を全集観察し、欠け（チッピング）の
発生についても評価し、これらについても２０枚のキャ
ップガラスのうち欠けが発生した枚数をチッピング発生
回数とした。Further, the entire interface of the cap glass was observed under a stereoscopic microscope (20 times) to evaluate the occurrence of chipping (chipping). The number of chipping occurrences was set.
【００３１】表１および表２から明らかなとおり、本考
案を例用することにより剥離発生、チッピングの発生を
防止することがわかった。As is clear from Tables 1 and 2, it was found that peeling and chipping were prevented by using the present invention as an example.
【００３２】[0032]
【考案の効果】本考案により、電子部品素子を封止する
蓋材およびパッケージ本体と接着剤との間で剥離の生じ
ない良好な電子部品素子封止用蓋材が得られた。According to the present invention, a good lid member for sealing electronic component elements and a good lid member for sealing electronic component elements in which peeling does not occur between the package body and the adhesive can be obtained.
【図１】本考案による断面図による蓋材の面取りの例FIG. 1 is an example of chamfering a lid material by a sectional view according to the present invention.
【図２】本考案の蓋材の平面図FIG. 2 is a plan view of the lid member of the present invention.
【図３】固体撮像装置の一例の断面図FIG. 3 is a sectional view of an example of a solid-state imaging device.
１ 固体撮像素子 ２ ダイアタッチ剤 ３ 低融点ガラス ４ 金ワイヤー ５ フィルター ６ キャップガラスからなる蓋材 ７ 接着剤 ８ リードフレーム ９ セラミックパッケージ １０ 接着剤への隣接面 １１ 蓋材の側面 Ａ 蓋材の接着剤への隣接面からの距離 Ｂ 蓋材の側面からの距離 Ｘ 蓋材の接着剤隣接面の周縁部 Ｙ 蓋材の接着剤非隣接面の周縁部 Ｚ 平面からみた４隅のコーナー部 Ｔ 蓋材の厚さ 1 Solid-state imaging device 2 Die attach agent 3 Low melting point glass 4 Gold wire 5 Filter 6 Cap glass lid 7 Adhesive 8 Lead frame 9 Ceramic package 10 Adjacent surface to adhesive 11 Side of lid A Adhesion of lid Distance from the adjacent surface to the agent B Distance from the side surface of the lid material X Edge of the adhesive material adjacent surface of the lid material Y Edge of the adhesive material non-adjacent surface of the lid material Z Corners at the four corners seen from the plane T Lid Material thickness
Claims (2)
機系接着剤を介して封止する厚さ０．３〜２．０ｍｍの
ガラスからなる蓋材であって、該蓋材の少なくとも接着
剤への隣接面の周縁部に面取りがなされ、かつ該面取り
を構成する前記隣接面からの距離Ａおよび蓋材の側面か
らの距離Ｂが０．０５〜０．２０ｍｍの寸法を有するこ
とを特徴とする電子部品素子封止用蓋材。[Claim 1] housing the electronic component element in the package Yes
With a thickness of 0.3-2.0 mm, which is sealed via mechanical adhesive
A lid member made of glass , which is chamfered at least at a peripheral portion of a surface of the lid member adjacent to the adhesive, and a distance A from the adjacent surface constituting the chamfer and a distance B from a side surface of the lid member. Has a dimension of 0.05 to 0.20 mm, a lid member for encapsulating an electronic component element.
項１の電子部品素子封止用蓋材。2. The lid member for encapsulating an electronic component according to claim 1, wherein the electronic component is a solid-state image sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1992080272U JPH0739232Y2 (en) | 1992-10-28 | 1992-10-28 | Lid for sealing electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1992080272U JPH0739232Y2 (en) | 1992-10-28 | 1992-10-28 | Lid for sealing electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0641145U JPH0641145U (en) | 1994-05-31 |
| JPH0739232Y2 true JPH0739232Y2 (en) | 1995-09-06 |
Family
ID=13713654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1992080272U Expired - Lifetime JPH0739232Y2 (en) | 1992-10-28 | 1992-10-28 | Lid for sealing electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0739232Y2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4637505B2 (en) * | 2004-05-26 | 2011-02-23 | 京セラ株式会社 | Magnetic sensor device |
| JP2011114838A (en) * | 2009-11-30 | 2011-06-09 | Kyocera Kinseki Corp | Piezoelectric vibrator and piezoelectric oscillator |
| WO2017094502A1 (en) * | 2015-11-30 | 2017-06-08 | ソニー株式会社 | Solid-state image capture device, method for manufacturing same, and electronic device |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5815260A (en) * | 1981-07-21 | 1983-01-28 | Denki Kagaku Kogyo Kk | Sealing agent for semiconductor package |
| JPS6119386A (en) * | 1984-07-05 | 1986-01-28 | Daicel Chem Ind Ltd | Screen printing method |
| JPH065718B2 (en) * | 1985-02-13 | 1994-01-19 | 株式会社日立製作所 | Solid-state imaging device |
| JPH066511Y2 (en) * | 1985-12-03 | 1994-02-16 | ソニー株式会社 | Solid-state imaging device |
| JPS6329974A (en) * | 1986-07-23 | 1988-02-08 | Nec Corp | Semiconductor device for ccd image sensor |
| JPS6333847A (en) * | 1986-07-29 | 1988-02-13 | Fuji Photo Film Co Ltd | Glass capping method |
| JPS63116461A (en) * | 1986-11-05 | 1988-05-20 | Tomoegawa Paper Co Ltd | Hermetic sealing for solid-state image pickup device |
| JPH0653586B2 (en) * | 1990-03-08 | 1994-07-20 | 株式会社巴川製紙所 | Method for processing cap glass for solid-state imaging device |
| JPH0453156A (en) * | 1990-06-18 | 1992-02-20 | Nippon Electric Glass Co Ltd | Plate glass for ceramic package |
| JPH0613507A (en) * | 1992-06-26 | 1994-01-21 | Sumitomo Electric Ind Ltd | Components for semiconductor sealing device |
| JPH0739232A (en) * | 1993-07-28 | 1995-02-10 | Kubota Corp | Grass-dividing structure of combine |
-
1992
- 1992-10-28 JP JP1992080272U patent/JPH0739232Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0641145U (en) | 1994-05-31 |
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| Date | Code | Title | Description |
|---|---|---|---|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 19980217 |