TWI571595B - Omni-directional led lamps - Google Patents
Omni-directional led lamps Download PDFInfo
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- TWI571595B TWI571595B TW104137668A TW104137668A TWI571595B TW I571595 B TWI571595 B TW I571595B TW 104137668 A TW104137668 A TW 104137668A TW 104137668 A TW104137668 A TW 104137668A TW I571595 B TWI571595 B TW I571595B
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- 239000002245 particle Substances 0.000 claims description 164
- 239000000919 ceramic Substances 0.000 claims description 131
- 239000000463 material Substances 0.000 claims description 39
- 239000011521 glass Substances 0.000 claims description 31
- 239000008187 granular material Substances 0.000 claims description 25
- 239000013078 crystal Substances 0.000 claims description 18
- 239000011236 particulate material Substances 0.000 claims description 15
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 13
- 230000001788 irregular Effects 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 229910010293 ceramic material Inorganic materials 0.000 claims description 6
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 5
- 229910052700 potassium Inorganic materials 0.000 claims description 5
- 239000011591 potassium Substances 0.000 claims description 5
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 4
- 229910052791 calcium Inorganic materials 0.000 claims description 4
- 239000011575 calcium Substances 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 3
- 229910052796 boron Inorganic materials 0.000 claims description 3
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims 2
- 239000013590 bulk material Substances 0.000 claims 1
- 239000003086 colorant Substances 0.000 claims 1
- 239000005355 lead glass Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 39
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 25
- 229910052594 sapphire Inorganic materials 0.000 description 19
- 239000010980 sapphire Substances 0.000 description 19
- 239000007787 solid Substances 0.000 description 18
- 239000000843 powder Substances 0.000 description 11
- 239000011324 bead Substances 0.000 description 8
- 230000017525 heat dissipation Effects 0.000 description 8
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 238000002834 transmittance Methods 0.000 description 7
- 238000005286 illumination Methods 0.000 description 6
- 239000003292 glue Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000005429 filling process Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 239000001307 helium Substances 0.000 description 3
- 229910052734 helium Inorganic materials 0.000 description 3
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011133 lead Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 238000009877 rendering Methods 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 2
- 229910001948 sodium oxide Inorganic materials 0.000 description 2
- 239000012798 spherical particle Substances 0.000 description 2
- IATRAKWUXMZMIY-UHFFFAOYSA-N strontium oxide Chemical compound [O-2].[Sr+2] IATRAKWUXMZMIY-UHFFFAOYSA-N 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 238000004383 yellowing Methods 0.000 description 2
- 229910052580 B4C Inorganic materials 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000004313 glare Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 210000004877 mucosa Anatomy 0.000 description 1
- 210000003097 mucus Anatomy 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- CHWRSCGUEQEHOH-UHFFFAOYSA-N potassium oxide Chemical compound [O-2].[K+].[K+] CHWRSCGUEQEHOH-UHFFFAOYSA-N 0.000 description 1
- 229910001950 potassium oxide Inorganic materials 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 229920001864 tannin Polymers 0.000 description 1
- 235000018553 tannin Nutrition 0.000 description 1
- 239000001648 tannin Substances 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/86—Ceramics or glass
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
- F21V3/061—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being glass
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
- F21V3/062—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being plastics
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2113/00—Combination of light sources
- F21Y2113/10—Combination of light sources of different colours
- F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Description
。本發明係關於一種LED燈管;特別關於一種全周光LED燈管。燈管內管壁與LED光源之間填充可透光陶瓷顆粒體材料,降低熱阻、避免藍光外漏。 . The present invention relates to an LED tube; in particular, to a full-circumference LED tube. The light-transmissive ceramic particle material is filled between the inner tube wall of the lamp tube and the LED light source to reduce thermal resistance and avoid blue light leakage.
通稱LED燈絲的全周光LED燈條,其所製成的LED燈絲燈逐漸受到市場注目,但過去幾年始終未能打開市場,主要是因為LED燈絲燈的散熱問題仍有待克服,使得價格與效能,離市場期待仍有一段差距。首先為了解決散熱問題,目前市面上的LED燈絲燈商品,多以玻璃燈泡充氦氣封口解熱。跟一般空氣的導熱係數相比,充氦氣可以提高6倍多的導熱能力。但LED燈絲燈即便如此忍受著火焰加工的高溫,異常低良率的製作工藝,其實氦氣的導熱係數也僅只是0.159W/m.K而已,所以目前市面上的LED燈絲燈商品都以減半LED的驅動電流,以因應玻璃燈泡充氦氣的散熱能力不足。 The full-circumference LED strips, commonly known as LED filaments, have gradually attracted attention from the market, but they have not been able to open the market in the past few years, mainly because the heat dissipation problem of LED filament lamps still has to be overcome, making prices and There is still a gap between performance and market expectations. First of all, in order to solve the problem of heat dissipation, the current LED filament lamp products on the market are mostly filled with glass bulbs to seal the heat. Compared with the thermal conductivity of ordinary air, helium gas can increase the thermal conductivity by more than 6 times. However, even if the LED filament lamp endures the high temperature of flame processing, the production process of abnormally low yield, in fact, the thermal conductivity of helium is only 0.159W/mK, so the current LED filament lamp products on the market are reduced by half. The driving current is insufficient to dissipate the heat of the glass bulb.
一般透明的樹脂膠水硬化後的導熱係數約在0.3W/m.K左右,雖然可以對全周光LED燈條直接灌注填充透明樹脂膠水,擴大發光二極體燈條工作時的發熱表面積,但透明樹脂膠水的黃化變色,影響商品的使用壽命。並且樹脂膠水化學不兼容性的不良影響最為明顯的是藍光、深藍光及 其衍生的白光LED,設計者應該充分考慮最大限度地減少化學物質之間的影響,尤其是對LED直接灌注填充的樹脂膠水。即使在萬不得已的情況下必須使用,選擇相容性好、耐候性高的樹脂膠水外,還要考慮其高貴的材料費用所帶來的製造成本壓力。 Generally, the transparent resin resin has a thermal conductivity of about 0.3 W/mK. Although the full-period LED strip can be directly filled with a transparent resin glue to expand the heat-emitting surface area of the LED strip, but the transparent resin. The yellowing of the glue discolors and affects the service life of the product. And the most adverse effects of resin glue chemistry incompatibility are blue light, deep blue light and The white LEDs that it derives should be designed to minimize the effects of chemicals, especially resin glue that is directly filled with LEDs. Even if it is necessary to use it as a last resort, choose a resin glue with good compatibility and high weather resistance, and also consider the manufacturing cost pressure caused by its expensive material cost.
為加強全周光LED燈條其自身的散熱能力,其所搭配的透明基板由玻璃改為價高、導熱好,通稱藍寶石的單晶氧化鋁基板,而且為了突顯藍寶石基板導熱好的優勢,原本塗布透明基板全周的螢光粉層,也改為塗布藍寶石基板上下兩邊,藍寶石基板左右兩側裸露於外面以增加散熱能力,但是對藍光LED加螢光粉層的白光照明而言,衍生基板左右兩側藍光外漏的問題。此外藍寶石的機械強度雖然要比玻璃好上許多,但材料價格貴,所以刻意的減小藍寶石基板厚度,因此藍寶石基板的全周光LED燈條特別脆弱易斷,此外為了抵抗環境因素水氣、硫化物等的氧化鏽蝕,搭配藍寶石基板的全周光LED燈條,需要裝配在一燈管裡以符合實際上的應用。因此如何使燈管管壁與LED光源之間,降低熱阻及避免藍光外漏是須要克服解決的問題。 In order to enhance the heat dissipation capability of the full-circumference LED strip, the transparent substrate is changed from glass to single-crystal alumina substrate with high price and good heat conductivity, which is called sapphire. In order to highlight the advantages of heat conduction of sapphire substrate, the original The phosphor powder layer coated on the entire periphery of the transparent substrate is also coated on the upper and lower sides of the sapphire substrate, and the left and right sides of the sapphire substrate are exposed to the outside to increase the heat dissipation capability, but for the white light illumination of the blue LED plus the phosphor layer, the derivative substrate The problem of blue light leakage on the left and right sides. In addition, the mechanical strength of sapphire is much better than that of glass, but the material price is expensive, so the thickness of the sapphire substrate is deliberately reduced. Therefore, the full-circumference LED strip of the sapphire substrate is particularly fragile and easy to break, in addition to resisting environmental factors, Oxidation and corrosion of sulfides, etc., with full-circumference LED strips of sapphire substrates, need to be assembled in a tube to meet practical applications. Therefore, how to reduce the thermal resistance between the tube wall and the LED light source and avoid the leakage of blue light is a problem that needs to be solved.
常見可透光介質的導熱係數;熱空氣約0.0316W/m.K、氦氣約0.18W/m.K、塑膠約0.25W/m.K、環氧樹脂約0.3W/m.K、矽膠約0.5W/m.K等。另外常見陶瓷介質的導熱係數;一般玻璃約1.1W/m.K、石英玻璃約1.5W/m.K、單晶氧化鋁46W/m.K、多晶氧化鋁28W/m.K、氧化鋯1.8W/m.K、碳化矽126W/m.K、氮化矽27W/m.K、碳化硼40W/m.K、氮化硼30W/m.K、氮化鋁160W/m.K等。 The thermal conductivity of common permeable medium; hot air is about 0.0136 W/m.K, helium is about 0.18 W/m.K, plastic is about 0.25 W/m.K, epoxy resin is about 0.3 W/m.K, tannin is about 0.5 W/m.K. In addition, the thermal conductivity of common ceramic media; general glass is about 1.1W/mK, quartz glass is about 1.5W/mK, single crystal alumina is 46W/mK, polycrystalline alumina is 28W/mK, zirconia is 1.8W/mK, and strontium carbide is 126W. /mK, tantalum nitride 27W/mK, boron carbide 40W/mK, boron nitride 30W/mK, aluminum nitride 160W/mK, and the like.
陶瓷泛指金屬或非金屬的氧化物、碳化物或氮化物,例如氧 化鉀、氧化鈉、氧化矽等。玻璃是氧化鉀、氧化鈉、氧化矽等的混合物,所以也是屬於陶瓷材料的一種。陶瓷材料耐高溫、高導熱,對LED沒有化學不兼容性的不良影響,尤其是可透光陶瓷材料,有利於LED透光導熱的應用。 Ceramic refers to a metal or non-metal oxide, carbide or nitride, such as oxygen. Potassium, sodium oxide, strontium oxide, etc. Glass is a mixture of potassium oxide, sodium oxide, cerium oxide, etc., and therefore is also a type of ceramic material. The ceramic material is resistant to high temperature and high thermal conductivity, and has no adverse effect on the chemical incompatibility of the LED, especially the permeable ceramic material, which is beneficial to the application of LED light transmission and heat conduction.
乾燥鬆散的顆粒體材料,顆粒體間摩擦力小、流動性佳,適當的振動下,緊密填充於燈管內管壁與發光二極體光源之間的間隙,過程中乾燥鬆散的顆粒體材料,如同沙漏中的流沙般掩埋發光二極體光源,這對實施例中脆弱的全周光LED燈條而言非常重要,首先顆粒體流動填充過程不會對全周光LED燈條造成機械性的表面磨擦或壓迫損壞,第二是全周光LED燈條工作時的熱脹冷縮不會受到顆粒體材料包覆限制而發生內應力疲勞損壞。 Dry loose granular material, small friction between particles, good fluidity, under proper vibration, tightly filled in the gap between the inner wall of the tube and the light source of the light-emitting diode, dry loose granular material in the process , as the sand in the hourglass buryes the light-emitting diode light source, which is very important for the fragile full-circumference LED strip in the embodiment. First, the particle flow filling process does not cause mechanicality to the full-circumference LED strip. The surface is rubbed or damaged by pressure. The second is that the thermal expansion and contraction of the full-circumference LED strip is not limited by the coating of the particulate material and internal stress fatigue damage occurs.
填充於燈管內管壁與LED光源之間的可透光陶瓷顆粒體材料,其孔隙率的大小和導熱能力成反比,孔隙率的大小和可透光陶瓷顆粒的大小成正比,可透光陶瓷顆粒的大小和透光率成正比,因此雖然顆粒小、孔隙率小、導熱能力大,但透光率小。所以顆粒的大小,選用其等效體積顆粒的計算直徑大於0.05毫米,因為0.05毫米以下的顆粒透光性較差。又孔隙率大導熱能力差,因此填充於燈管內管壁與發光二極體光源之間的可透光陶瓷顆粒體材料,其孔隙率要求小於50%。 The permeable ceramic particle material filled between the inner tube wall of the lamp tube and the LED light source has an inverse ratio of the porosity and the thermal conductivity, and the porosity is proportional to the size of the permeable ceramic particles, and is transparent. The size of the ceramic particles is proportional to the light transmittance, so although the particles are small, the porosity is small, and the heat conductivity is large, the light transmittance is small. Therefore, the size of the particles, the calculated diameter of the particles of the equivalent volume is greater than 0.05 mm, because the particles below 0.05 mm have poor light transmittance. Moreover, the porosity is large and the thermal conductivity is poor. Therefore, the permeable ceramic particle material filled between the inner tube wall of the lamp tube and the light-emitting diode light source has a porosity requirement of less than 50%.
既然孔隙率的大小和導熱能力成反比,孔隙率的大小和可透光陶瓷顆粒的大小成正比,又可透光陶瓷顆粒的大小和透光率成正比。因此在一較佳的實施例中揭露一滿足既透光又導熱的顆粒大小配置。在一實施例中大小不同的玻璃珠而言;大小個別振動填充的孔隙率分別為;0.05mm珠徑/0.3孔隙率、 0.1mm珠徑/0.33孔隙率、0.6mm珠徑/0.38孔隙率、2.0mm珠徑/0.4孔隙率。大小混合振動填充的孔隙率分別為;重量比22.7%的0.05mm珠徑+77.3%的0.6mm珠徑/0.21孔隙率重量比17.8%的0.1mm珠徑+82.2%的0.6mm珠徑/0.24孔隙率。重量比11.6%的0.6mm珠徑+88.4%的2.0mm珠徑/0.32孔隙率。由上可以看出,大小混合填充比單獨大或小填充的孔隙率來得小,而且又保有大部份大顆顆粒的透光率。 Since the porosity is inversely proportional to the thermal conductivity, the porosity is proportional to the size of the permeable ceramic particles, and the size of the transparent ceramic particles is proportional to the transmittance. Thus, in a preferred embodiment, a particle size configuration that satisfies both light transmission and thermal conductivity is disclosed. In the embodiment, the glass beads of different sizes are used; the porosity of the individual vibration filling is respectively 0.05 mm bead diameter / 0.3 porosity, 0.1 mm bead diameter / 0.33 porosity, 0.6 mm bead diameter / 0.38 porosity, 2.0 mm bead diameter / 0.4 porosity. The porosity of the mixed vibration filling is: 0.27% by weight, 0.05 mm, +77.3%, 0.6 mm, 0.20.1, and 0.21, and the weight ratio is 17.8%, 0.1 mm, and 80.2%, 0.6 mm, and 0.24. Porosity. The weight ratio is 11.6% of 0.6 mm bead diameter + 88.4% of 2.0 mm bead diameter / 0.32 porosity. As can be seen from the above, the size-mixing filling is smaller than the porosity of the large or small filling alone, and retains the transmittance of most of the large particles.
顆粒體的外觀形狀影響其顆粒間的摩擦力,摩擦力小流動性高。顆粒間的摩擦力大小與其安息角成正比,顆粒體外觀形狀的安息角,分別是球形顆粒23~28°、規則顆粒30°、不規則顆粒35°、極不規則顆粒40°。由上可知在一實施例中,相同等效體積顆粒的計算直徑下,選擇球形顆粒具有較小的孔隙率。可透光陶瓷顆粒體材料包覆接觸發光二極體燈條的不規則表面,顆粒體材料其顆粒與鄰近顆粒接觸、孔隙率小可降低熱阻、增加熱的傳導。 The appearance shape of the granules affects the friction between the particles, and the frictional force has a small fluidity. The friction between the particles is proportional to the angle of repose. The angle of repose of the shape of the granules is 23~28° for spherical particles, 30° for regular particles, 35° for irregular particles, and 40° for extremely irregular particles. From the above, it can be seen that in one embodiment, the spherical particles are selected to have a smaller porosity at the calculated diameter of the same equivalent volume of particles. The permeable ceramic granule material is coated with the irregular surface contacting the illuminating diode strip, and the granule material has contact with the adjacent particles, and the porosity is small to reduce the thermal resistance and increase the heat conduction.
此外實施例中,搭配藍寶石基板,螢光粉層塗於布基板上下兩邊,基板左右兩側裸露的全周光LED燈條,可透光陶瓷顆粒體材料對入射光的折射、漫射作用,可增加出光的顯色指數及降低色溫,同時柔和光線、避免藍光外漏。 In addition, in the embodiment, the sapphire substrate is coated with the phosphor powder layer on the upper and lower sides of the cloth substrate, and the full-perimeter LED strips exposed on the left and right sides of the substrate can refract and diffuse the incident light by the transparent ceramic particle material. It can increase the color rendering index of the light and reduce the color temperature, while softening the light and avoiding blue light leakage.
顆粒體間粘滯力影響其摩擦力,顆粒體間如果潮濕存在液體黏膜,顆粒體間的摩擦力增加、填充流動性降低,流動性降低就必須模壓或 高壓注射填充,這對脆弱的全周光LED燈條而言,會造成機械性的表面磨擦及壓迫損壞。而且這也影響可透光陶瓷顆粒填充於燈管內管壁與LED光源之間的孔隙率,顆粒與鄰近顆粒間因液體黏膜的存在而非直接接觸,使得孔隙率變大、熱阻增加。因此可透光陶瓷顆粒填充於燈管內管壁與LED光源之間前,先適當的油膜清洗、乾燥是有必要的。 The viscous force between the granules affects the friction. If there is a liquid mucus between the granules, the friction between the granules increases, the filling fluidity decreases, and the fluidity decreases. High pressure injection fill, which can cause mechanical surface friction and compression damage to fragile full-circumference LED strips. Moreover, this also affects the porosity of the permeable ceramic particles filled between the inner wall of the tube and the LED light source, and the presence of the liquid mucosa between the particles and the adjacent particles is not directly contacted, so that the porosity becomes larger and the thermal resistance increases. Therefore, before the light-transmissive ceramic particles are filled between the inner tube wall of the lamp tube and the LED light source, it is necessary to properly clean and dry the oil film.
雖然添加折射率與可透光陶瓷顆粒折射率相近的液、膠體於顆粒體間,可增加顆粒體間的透光率,但較佳的方式仍是先在燈管內管壁與發光二極體光源之間,填充孔隙率小於50%、顆粒與鄰近顆粒接觸的可透光陶瓷顆粒體材料後,再滴注該折射率相近的液、膠體。當然該液、膠體化學不兼容性的不良影響及黃化變色,影響商品的使用壽命等,變成是增加的困擾。 Although a liquid having a refractive index close to that of the permeable ceramic particles and a colloid between the particles are added, the light transmittance between the particles can be increased, but the preferred method is still in the inner tube wall and the light emitting diode. Between the body light sources, after filling the permeable ceramic particle material having a porosity of less than 50% and contacting the particles with adjacent particles, the liquid or colloid having a similar refractive index is instilled. Of course, the adverse effects of the liquid and colloidal chemical incompatibility and the yellowing discoloration, which affect the service life of the product, become an increase.
一種全周光LED燈管,該燈管有兩端開口,或燈管有一端開口。燈管內有LED光源。燈管包含透明或顏色燈管。燈管包含塑膠、玻璃、陶瓷燈管。 A full-circumference LED tube having an opening at both ends, or a tube having an opening at one end. There is an LED light source inside the tube. The tube contains a transparent or color tube. The tube contains plastic, glass and ceramic tubes.
LED光源有至少二的電性連絡線,分別由燈管的兩端開口,或一起由燈管的一端開口,接引出燈管。 The LED light source has at least two electrical connection lines, which are respectively opened at both ends of the lamp tube or open together at one end of the lamp tube to lead out the lamp tube.
燈管的兩端開口,或該燈管的一端開口,有一塞子閉合開口。 Both ends of the tube are open, or one end of the tube is open, and a plug closes the opening.
LED光源;實施例中有至少一的全周光LED燈條。全周光LED燈條有複數LED晶片,複數LED晶片包含藍光及其它色光的LED晶片。 LED light source; in the embodiment there is at least one full-circumference LED strip. The full-circle LED strip has a plurality of LED chips, and the plurality of LED chips include blue and other colored LED chips.
燈管內管壁與發光二極體光源之間,填充可透光陶瓷顆粒體材料。可透光陶瓷顆粒體材料其顆粒與鄰近顆粒接觸,孔隙率小於50%。可透光陶瓷顆粒體材料包括主要陶瓷顆粒、填缝陶瓷顆粒及零碎陶瓷顆粒。可 透光陶瓷顆粒體材料其等效體積顆粒的計算直徑分別為主要陶瓷顆粒大於0.1mm,填缝陶瓷顆粒大於0.05mm、小於0.1mm,可透光零碎陶瓷顆粒小於0.05mm。可透光陶瓷顆粒體材料其體積佔有比率為主要陶瓷顆粒大於60%,填缝陶瓷顆粒少於40%,零碎陶瓷顆粒少於20%。相異大小的主要陶瓷顆粒、填缝陶瓷顆粒及零碎陶瓷顆粒填充過程中,可分開同時連續按比率投料,並於填入燈管之際,設有葉片旋轉攪拌混合。可透光陶瓷顆粒充填過程中及、或定量充填後振動該燈管,振動的方式包括線性振動及扭轉振動。可透光陶瓷顆粒體材料其顆粒與鄰近顆粒接觸,包括主要陶瓷顆粒、填缝陶瓷顆粒及零碎陶瓷顆粒,相同或相異大小顆粒與鄰近顆粒接觸。可透光陶瓷顆粒體材料包含透明、顏色顆粒。可透光陶瓷顆粒體材料其顆粒的外觀形狀,包含規則、不規則的可透光陶瓷顆粒。可透光陶瓷顆粒體材料在一實施例中為單晶氧化鋁、多晶氧化鋁陶瓷顆粒。可透光陶瓷顆粒體材料在一實施例中為玻璃顆粒。玻璃顆粒包含石英、鈉、鈣、鉀、鉛、硼玻璃顆粒。 The light-transmissive ceramic particle material is filled between the inner tube wall of the lamp tube and the light source of the light-emitting diode. The permeable ceramic particulate material has particles in contact with adjacent particles having a porosity of less than 50%. The permeable ceramic particulate material includes primary ceramic particles, caulking ceramic particles, and fragmented ceramic particles. can The calculated diameter of the equivalent volume particles of the transparent ceramic granule material is that the main ceramic particles are larger than 0.1 mm, the caulking ceramic particles are larger than 0.05 mm, less than 0.1 mm, and the permeable ceramic particles are less than 0.05 mm. The permeable ceramic granule material has a volume occupation ratio of more than 60% of the main ceramic particles, less than 40% of the caulked ceramic particles, and less than 20% of the pulverized ceramic particles. In the filling process of the main ceramic particles, the caulking ceramic particles and the fragmented ceramic particles of different sizes, the materials can be separated and continuously fed at a constant rate, and when the lamps are filled, the blades are rotated and mixed. The lamp can be vibrated during or after the filling of the transparent ceramic particles, and the vibration mode includes linear vibration and torsional vibration. The permeable ceramic particulate material has particles in contact with adjacent particles, including primary ceramic particles, caulked ceramic particles, and fragmented ceramic particles, the same or different size particles being in contact with adjacent particles. The permeable ceramic particulate material comprises transparent, colored particles. The permeable ceramic granule material has an appearance shape of particles, and includes regular, irregular permeable ceramic particles. The permeable ceramic particulate material is, in one embodiment, a single crystal alumina, polycrystalline alumina ceramic particle. The permeable ceramic particulate material is in one embodiment glass particles. The glass particles comprise quartz, sodium, calcium, potassium, lead, and boron glass particles.
10‧‧‧LED晶片 10‧‧‧LED chip
11‧‧‧打線 11‧‧‧Line
12‧‧‧藍寶石基板 12‧‧‧Sapphire substrate
14‧‧‧螢光粉層 14‧‧‧Fluorescent powder layer
16‧‧‧藍光外漏 16‧‧‧Blue light leakage
18‧‧‧LED光源 18‧‧‧LED light source
20‧‧‧全周光LED燈條、有螢光粉層 20‧‧‧Full-circumference LED strips with phosphor layer
22‧‧‧一端開口的燈管 22‧‧‧Lights with one end open
23‧‧‧內管壁 23‧‧‧ inner wall
24‧‧‧電性連絡線 24‧‧‧Electrical connection
26‧‧‧塞子 26‧‧‧ 塞子
28‧‧‧主要陶瓷顆粒 28‧‧‧Main ceramic particles
30‧‧‧顆粒與鄰近顆粒接觸 30‧‧‧Particles in contact with adjacent particles
31‧‧‧兩端開口的燈管 31‧‧‧ lamps with open ends
32‧‧‧填缝陶瓷顆粒 32‧‧‧Filling ceramic granules
33‧‧‧零碎陶瓷顆粒 33‧‧‧Split ceramic particles
34‧‧‧全周光LED燈條、無螢光粉層 34‧‧‧Full-circumference LED strips, no phosphor layer
36‧‧‧半圓弧罩 36‧‧‧ semi-circular cover
38‧‧‧實心半圓棒 38‧‧‧solid semicircular bar
40‧‧‧內壁 40‧‧‧ inner wall
42‧‧‧固晶面 42‧‧‧Solid surface
44‧‧‧外弧壁 44‧‧‧ outer arc wall
46‧‧‧外圓壁 46‧‧‧ outer wall
48‧‧‧加寬基板的全周光LED燈條、固晶面無螢光粉層 48‧‧‧Full-circumference LED strips with widened substrate, no crystal layer on the solid surface
50‧‧‧陶瓷基板 50‧‧‧Ceramic substrate
52‧‧‧基板外表面 52‧‧‧The outer surface of the substrate
54‧‧‧固晶面 54‧‧‧Solid surface
56‧‧‧半圓溝罩 56‧‧‧Semicircular ditch cover
58‧‧‧外表面 58‧‧‧ outer surface
60‧‧‧內溝壁 60‧‧‧ inner wall
62‧‧‧入射光 62‧‧‧ incident light
64‧‧‧漫折射光 64‧‧‧ diffuse refracted light
66‧‧‧漫反射光 66‧‧‧Diffuse light
第1圖係根據本發明第1及第2實施例的LED光源;全周光LED燈條、有螢光粉層。 Fig. 1 is an LED light source according to the first and second embodiments of the present invention; a full-circumference LED strip and a phosphor layer.
第2圖係根據本發明第1實施例視圖。 Fig. 2 is a view showing a first embodiment of the present invention.
第3圖係根據本發明第1實施例放大剖視圖。 Fig. 3 is an enlarged cross-sectional view showing a first embodiment of the present invention.
第4圖係根據本發明第2實施例視圖。 Figure 4 is a view showing a second embodiment of the present invention.
第5圖係根據本發明第2實施例放大剖視圖。 Fig. 5 is an enlarged cross-sectional view showing a second embodiment of the present invention.
第6圖係根據本發明第3及第4實施例的LED光源;全周光LED燈條、無螢光粉層。 Fig. 6 is a view showing an LED light source according to the third and fourth embodiments of the present invention; a full-circumference LED strip, and a phosphor-free powder layer.
第7圖係根據本發明第3實施例視圖。 Figure 7 is a view showing a third embodiment of the present invention.
第8圖係根據本發明第3實施例放大剖視圖。 Figure 8 is an enlarged cross-sectional view showing a third embodiment of the present invention.
第9圖係根據本發明第4實施例視圖。 Figure 9 is a view showing a fourth embodiment of the present invention.
第10圖係根據本發明第4實施例放大剖視圖。 Figure 10 is an enlarged cross-sectional view showing a fourth embodiment of the present invention.
第11圖係根據本發明第5實施例的LED光源;加寬基板的全周光LED燈條、固晶面無螢光粉層。 11 is an LED light source according to a fifth embodiment of the present invention; a full-circumference LED strip of a widened substrate, and a phosphor-free layer on a solid crystal surface.
第12圖係根據本發明第5實施例視圖。 Figure 12 is a view showing a fifth embodiment of the present invention.
第13圖係根據本發明第5實施例放大剖視圖。 Figure 13 is an enlarged cross-sectional view showing a fifth embodiment of the present invention.
第14圖係可透光陶瓷顆粒體材料對光的漫折射作用示意圖 Figure 14 is a schematic diagram of the diffuse refraction of light by a permeable ceramic granule material
第1圖係根據本發明第1及第2實施例的LED光源;全周光LED燈條、有螢光粉層。全周光LED燈條、有螢光粉層20;複數LED晶片10在藍寶石基板12上下之一邊上固晶、打線11,複數LED晶片10包含藍光及其它色光的LED晶片。螢光粉層14塗布藍寶石基板12上下兩邊,藍寶石基板12左右兩側裸露於外界以增加散熱能力,對藍光LED加螢光粉層的白光照明而言,衍生基板左右兩側藍光外漏16的問題。 Fig. 1 is an LED light source according to the first and second embodiments of the present invention; a full-circumference LED strip and a phosphor layer. The full-circumference LED strip has a phosphor layer 20; the plurality of LED chips 10 are fixed on the upper and lower sides of the sapphire substrate 12, and the line 11 is printed. The plurality of LED chips 10 include blue and other colored LED chips. The phosphor layer 14 is coated on the upper and lower sides of the sapphire substrate 12, and the left and right sides of the sapphire substrate 12 are exposed to the outside to increase the heat dissipation capability. For the white light illumination of the blue LED plus the phosphor layer, the blue light leakage on the left and right sides of the substrate is 16 problem.
第2圖係根據本發明第1實施例視圖。一端開口的燈管22有一塞子26閉合該開口,一端開口的燈管22內有LED光源18,LED光源18有至少二的電性連絡線,一起由燈管的一端開口,接引出燈管。一端開口的燈管22 包含塑膠、玻璃、陶瓷材料燈管,一端開口的燈管22包含透明或顏色燈管。第1實施例中LED光源18,由2條串聯的全周光LED燈條、有螢光粉層20組成。燈管內管壁23與LED光源18之間,填充可透光陶瓷顆粒體材料。可透光陶瓷顆粒體材料其顆粒與鄰近顆粒接觸30、孔隙率小於50%。可透光陶瓷顆粒體材料包括主要陶瓷顆粒28、填缝陶瓷顆粒32及零碎陶瓷顆粒33。主要陶瓷顆粒28作為可降低熱阻,增加熱的傳導,且其對光的漫折射作用能柔和光線、避免藍光外漏,具有正面效果的主要陶瓷顆粒。填縫陶瓷顆粒32作為輔助減小孔隙率,以幫助降低熱阻,增加熱的傳導,但添加填縫陶瓷顆粒32會減少填充於燈管的內管壁23與LED光源18之間的可透光陶瓷顆粒體材料的透光率。零碎陶瓷顆粒33為附著於主要陶瓷顆粒28、填縫陶瓷顆粒32等顆粒表面上的粉塵顆粒,另外有一部份的零碎陶瓷顆粒33為填充於燈管的內管壁23與LED光源18之間的主要陶瓷顆粒28、填縫陶瓷顆粒32等,經長時間點燈工作的熱脹冷縮或運送振動衝擊等,造成主要陶瓷顆粒28、填縫陶瓷顆粒32等崩裂或風化成為零碎陶瓷顆粒,零碎陶瓷顆粒33愈少愈好,因為細小的零碎陶瓷顆粒33不利於透光。可透光陶瓷顆粒體材料其等效體積顆粒的計算直徑,分別為主要陶瓷顆粒28大於0.1mm,填缝陶瓷顆粒32大於0.05mm、小於0.1mm,零碎陶瓷顆粒33小於0.05mm。可透光陶瓷顆粒體材料其體積佔有比率;主要陶瓷顆粒28大於60%,填缝陶瓷顆粒32少於40%,零碎陶瓷顆粒33少於20%。相異大小的主要陶瓷顆粒28、填缝陶瓷顆粒32及零碎陶瓷顆粒33填充過程中,可分開同時連續按比率投料,並於填入一端開口的燈管22內之際,設有葉片旋轉攪拌混合。可透光陶瓷顆粒體材料充填過程中及、或定量充填後,振動該一端開口的燈管22,振動的方式包括線性振動及扭轉振動。 可透光陶瓷顆粒體材料其顆粒與鄰近顆粒接觸30,係包括主要陶瓷顆粒28、填缝陶瓷顆粒32及零碎陶瓷顆粒33,相同或相異大小顆粒與鄰近顆粒接觸。可透光陶瓷顆粒體材料的顆粒與鄰近顆粒接觸30意義為:鬆散可透光陶瓷顆粒體材料落下堆積於燈管的內管壁23與LED光源18之間,顆粒與顆粒間座標位置隨機分佈排列,振動緊密堆積下形成一靜止顆粒支撐結構,該顆粒支撐結構中顆粒與鄰近顆粒支撐關係的接觸。可透光陶瓷顆粒體材料包括透明、顏色顆粒。可透光陶瓷顆粒體材料其顆粒的外觀形狀,包括規則、不規則的可透光陶瓷顆粒。規則的可透光陶瓷顆粒為球型、珠型、對稱立方體型等可透光陶瓷顆粒,不規則的可透光陶瓷顆粒為片型、板塊型、不對稱立方體型等可透光陶瓷顆粒。可透光陶瓷顆粒體材料在一實施例中包括單晶氧化鋁、多晶氧化鋁陶瓷顆粒。可透光陶瓷顆粒體材料在一實施例中包括玻璃顆粒。玻璃顆粒包括石英、鈉、鈣、鉀、鉛、硼玻璃顆粒。第3圖係根據本發明第1實施例放大剖視圖。 Fig. 2 is a view showing a first embodiment of the present invention. The lamp tube 22 having an opening at one end has a plug 26 to close the opening, and the lamp tube 22 having an open end has an LED light source 18, and the LED light source 18 has at least two electrical connection lines, which are opened at one end of the lamp tube to lead out the lamp tube. The bulb 22, which is open at one end, comprises a tube of plastic, glass, ceramic material, and the tube 22 that is open at one end contains a transparent or color tube. In the first embodiment, the LED light source 18 is composed of two series-connected full-perimeter LED strips and a phosphor powder layer 20. Between the inner tube wall 23 of the tube and the LED light source 18, the permeable ceramic particle material is filled. The permeable ceramic particulate material has particles in contact with adjacent particles 30 and a porosity of less than 50%. The permeable ceramic particulate material comprises primary ceramic particles 28, caulked ceramic particles 32, and fragmented ceramic particles 33. The main ceramic particles 28 serve as main ceramic particles which can reduce the thermal resistance, increase the conduction of heat, and have a diffuse refraction effect on light to soften the light and avoid blue light leakage, and have a positive effect. The caulked ceramic particles 32 serve as an aid in reducing porosity to help reduce thermal resistance and increase heat transfer, but the addition of caulked ceramic particles 32 reduces the permeable between the inner tube wall 23 and the LED source 18 that fills the tube. Light transmittance of the photoceramic granular material. The fragmented ceramic particles 33 are dust particles attached to the surface of the main ceramic particles 28, the caulking ceramic particles 32, and the like, and a portion of the fragmented ceramic particles 33 are filled between the inner tube wall 23 of the tube and the LED light source 18. The main ceramic particles 28, caulking ceramic particles 32, etc., after long-term lighting work thermal expansion and contraction or transport vibration shock, etc., causing the main ceramic particles 28, caulking ceramic particles 32, etc. to crack or weather into ceramic particles, The less the fine ceramic particles 33, the better, because the fine ceramic particles 33 are not conducive to light transmission. The calculated diameter of the equivalent volume particles of the light transmissive ceramic granular material is greater than 0.1 mm for the main ceramic particles 28, greater than 0.05 mm for the caulking ceramic particles 32, less than 0.1 mm, and less than 0.05 mm for the ceramic particles 33. The permeable ceramic particulate material has a volume fraction; the primary ceramic particles 28 are greater than 60%, the caulked ceramic particles 32 are less than 40%, and the fragmented ceramic particles 33 are less than 20%. During the filling process of the main ceramic particles 28, the caulking ceramic particles 32 and the fragmented ceramic particles 33 of different sizes, they can be separately and continuously fed at a ratio, and when filled into the bulb 22 which is open at one end, the blade is rotated and stirred. mixing. During the filling process of the permeable ceramic granule material and after the quantitative filling, the lamp 22 which is open at one end is vibrated, and the vibration mode includes linear vibration and torsional vibration. The permeable ceramic particulate material has particles in contact with adjacent particles 30, including primary ceramic particles 28, caulked ceramic particles 32, and fragmented ceramic particles 33, the same or different sized particles being in contact with adjacent particles. The contact of the particles of the permeable ceramic granule material with the adjacent particles 30 means that the loose permeable ceramic granule material falls between the inner tube wall 23 of the tube and the LED light source 18, and the coordinates of the particles and the particles are randomly distributed. Arranged, vibrated tightly to form a static particle support structure in which the particles in the structure support the contact with adjacent particles. The permeable ceramic particulate material comprises transparent, colored particles. The permeable ceramic granule material has an appearance shape of the particles, including regular, irregular permeable ceramic particles. Rules may be light-transmissive ceramic particles are spherical, bead type, etc. may be symmetrical cubic translucent ceramic particles, irregular particles may be light-transmitting ceramic sheet type, plate type, etc. may be asymmetric cubic translucent ceramic particles. The light transmissive ceramic particulate material comprises, in one embodiment, single crystal alumina, polycrystalline alumina ceramic particles. The permeable ceramic particulate material comprises, in one embodiment, glass particles. Glass particles include quartz, sodium, calcium, potassium, lead, and boron glass particles. Fig. 3 is an enlarged cross-sectional view showing a first embodiment of the present invention.
第4圖係根據本發明第2實施例視圖。第2實施例與第1實施例的差異為燈管樣式的不同。第2實施例兩端開口的燈管31,兩端有塞子26閉合開口,兩端開口的燈管31內有發光二極體光源18。發光二極體光源18有二電性連絡線24,分別由兩端開口的燈管31的兩端開口,接引出該兩端開口的燈管31。第5圖係根據本發明第2實施例放大剖視圖。 Figure 4 is a view showing a second embodiment of the present invention. The difference between the second embodiment and the first embodiment is the difference in the lamp pattern. In the second embodiment, the lamp tube 31 which is open at both ends has a plug 26 closed at both ends, and a light-emitting diode light source 18 is disposed in the lamp tube 31 which is open at both ends. The light-emitting diode light source 18 has two electrical connection lines 24, which are respectively opened at both ends of the lamp tube 31 which are open at both ends, and the light-emitting tubes 31 which are open at both ends are taken out. Fig. 5 is an enlarged cross-sectional view showing a second embodiment of the present invention.
第6圖係根據本發明第3及第4實施例的LED光源;全周光LED 燈條、無螢光粉層。全周光LED燈條、無螢光粉層34;複數個LED晶片10在藍寶石基板12上下之一邊上固晶、打線11,複數個LED晶片10包含藍光及其它色光的LED晶片。藍寶石基板12無覆蓋螢光粉層,上下、左右裸露於外界以增加散熱能力,對藍光LED的白光照明而言,在燈管內或外管壁上製作遠程螢光粉層。 Figure 6 is an LED light source according to the third and fourth embodiments of the present invention; Light bar, no phosphor layer. A full-circumference LED strip, a phosphor-free layer 34; a plurality of LED wafers 10 are solid-crystallized and lined 11 on one of the upper and lower sides of the sapphire substrate 12, and the plurality of LED chips 10 include blue and other colored LED chips. The sapphire substrate 12 does not cover the phosphor layer, and is exposed to the outside to the left and right to increase the heat dissipation capability. For the white illumination of the blue LED, a remote phosphor layer is formed on the inner or outer tube wall of the lamp.
第7圖係根據本發明第3實施例視圖。第3實施例與第1實施例的差異為發光二極體光源18,由2條串聯的全周光LED燈條、無螢光粉層34組成。由於藍寶石基板12無覆蓋螢光粉層,上下、左右裸露於外,與可透光陶瓷顆粒體材料接觸、增加散熱能力。本實施例對於藍光發光二極體的白光照明而言,在內管壁23製作遠程螢光粉層。第8圖係根據本發明第3實施例放大剖視圖。 Figure 7 is a view showing a third embodiment of the present invention. The difference between the third embodiment and the first embodiment is that the light-emitting diode light source 18 is composed of two series-connected full-perimeter LED strips and a phosphor-free powder layer 34. Since the sapphire substrate 12 is not covered with the phosphor powder layer, it is exposed to the top, bottom, left and right, and is in contact with the permeable ceramic particle material to increase the heat dissipation capability. In this embodiment, for the white light illumination of the blue light emitting diode, a remote phosphor powder layer is formed on the inner tube wall 23. Figure 8 is an enlarged cross-sectional view showing a third embodiment of the present invention.
第9圖係根據本發明第4實施例視圖。第4實施例與第3實施例的差異為燈管樣式的不同。本實施例、一端開口的燈管,係由半圓弧罩36、實心半圓棒38構成。全周光LED燈條、無光粉層34,其藍寶石基板12貼在實心半圓棒38的固晶面42上,半圓弧罩36、實心半圓棒38由包括玻璃及單晶、多晶氧化鋁陶瓷製成、利於導熱。本實施例中,燈管內管壁與發光二極體光源之間,填充可透光陶瓷顆粒體材料;其燈管內管壁,係由半圓弧罩36的內壁40及實心半圓棒38的固晶面42構成。本實施例對於藍光LED的白光照明而言,在半圓弧罩36的外弧壁44,及實心半圓棒38的外圓壁46上,製作遠程螢光粉層。第10圖係根據本發明第4實施例放大剖視圖。 Figure 9 is a view showing a fourth embodiment of the present invention. The difference between the fourth embodiment and the third embodiment is the difference in the style of the tube. In the present embodiment, the lamp tube that is open at one end is composed of a semi-arc cover 36 and a solid semi-circle 38. The full-circumference LED strip, the matte layer 34, the sapphire substrate 12 is attached to the solid surface 42 of the solid semi-circular rod 38, and the semi-circular cover 36 and the solid semi-circular rod 38 are made of glass and single crystal, polycrystalline oxide. Made of aluminum ceramic for heat conduction. In this embodiment, between the inner tube wall of the lamp tube and the light source of the light emitting diode, the permeable ceramic particle body material is filled; the inner tube wall of the lamp tube is composed of the inner wall 40 of the semicircular arc cover 36 and the solid semicircular rod. The solid crystal surface 42 of 38 is formed. In the present embodiment, for the white light illumination of the blue LED, a remote phosphor layer is formed on the outer arc wall 44 of the semicircular arc cover 36 and the outer circular wall 46 of the solid semicircular bar 38. Figure 10 is an enlarged cross-sectional view showing a fourth embodiment of the present invention.
第11圖係根據本發明第5實施例的LED光源;加寬基板的全周光LED燈條、固晶面無螢光粉層。加寬基板的全周光LED燈條、固晶面無螢 光粉層48;複數LED晶片10在陶瓷基板50的固晶面54上固晶、打線11,固晶面54上無螢光粉層。複數LED晶片10包含藍光及其它色光的LED晶片,陶瓷基板50由包括玻璃及單晶、多晶氧化鋁陶瓷製成、利於導熱。 11 is an LED light source according to a fifth embodiment of the present invention; a full-circumference LED strip of a widened substrate, and a phosphor-free layer on a solid crystal surface. Full-circumference LED strips with widened substrates, no solid surface The photo-powder layer 48; the plurality of LED wafers 10 are fixed on the crystal-fixed surface 54 of the ceramic substrate 50, and the wires 11 are bonded, and the phosphor crystal layer is free from the phosphor layer. The plurality of LED chips 10 include blue and other colored LED chips. The ceramic substrate 50 is made of glass and single crystal, polycrystalline alumina ceramics to facilitate heat conduction.
第12圖係根據本發明第5實施例視圖。第5實施例與第1實施例的差異為LED光源及燈管樣式不同。本實施例LED光源為加寬基板的全周光LED燈條、固晶面無螢光粉層48。一端開口的燈管,係由加寬基板的全周光LED燈條、固晶面無螢光粉層48,及半圓溝罩56組成。燈管內管壁與發光二極體光源之間,填充可透光陶瓷顆粒體材料;其燈管內管壁,係由加寬基板的全周光LED燈條、固晶面無螢光粉層48,其陶瓷基板50的固晶面54及半圓溝罩56的內溝壁60構成。陶瓷基板50及半圓溝罩56,由包括玻璃及單晶、多晶氧化鋁陶瓷製成、利於導熱。對藍光LED的白光照明而言,在半圓溝罩56的外表面58,及陶瓷基板50的基板外表面52上製作遠程螢光粉層。第13圖係根據本發明第5實施例放大剖視圖。 Figure 12 is a view showing a fifth embodiment of the present invention. The difference between the fifth embodiment and the first embodiment is different in the LED light source and the lamp pattern. The LED light source of this embodiment is a full-circumference LED strip of a widened substrate, and a non-fluorescent layer 48 of a solid crystal surface. The lamp tube which is open at one end is composed of a full-circumference LED strip of a widened substrate, a non-fluorescent powder layer 48 of a solid crystal surface, and a semi-circular groove cover 56. Between the inner tube wall of the lamp tube and the light source of the light emitting diode, the light-transmissive ceramic particle material is filled; the inner wall of the lamp tube is a full-circumference LED light strip with a widened substrate, and the solid crystal surface has no phosphor powder. The layer 48 is composed of a solid crystal surface 54 of the ceramic substrate 50 and an inner groove wall 60 of the semicircular groove cover 56. The ceramic substrate 50 and the semi-circular groove cover 56 are made of glass, single crystal, and polycrystalline alumina ceramic to facilitate heat conduction. For white light illumination of a blue LED, a remote phosphor layer is formed on the outer surface 58 of the semi-circular trench cover 56 and on the outer surface 52 of the substrate of the ceramic substrate 50. Figure 13 is an enlarged cross-sectional view showing a fifth embodiment of the present invention.
第14圖係可透光陶瓷顆粒體材料對光的漫折射作用示意圖。入射光62進入可透光陶瓷顆粒體材料,部份穿透成漫折射光64,部份內反射成漫反射光66。在第1及第2實施例中全周光LED燈條、有螢光粉層20;螢光粉層14塗布藍寶石基板12上下兩邊,藍寶石基板12左右兩側裸露於外界以增加散熱能力,基板左右兩側藍光外漏16。該藍光外漏16一如入射光62,進入可透光陶瓷顆粒體材料,部份穿透成漫折射光64改變出光角度,與白光混合避免藍光外漏,部份內反射成漫反射光66進入螢光粉層14混光,可增加出光的顯色指數及降低色溫。在第3、第4及第5實施例中,可透光陶瓷顆粒體材料對光的漫折射作用,可以柔和光線、減小炫耀刺眼。 Figure 14 is a schematic diagram of the diffuse refraction of light by a permeable ceramic particle material. The incident light 62 enters the permeable ceramic particle material, partially penetrates into the diffuse refracting light 64, and partially reflects the diffuse reflected light 66. In the first and second embodiments, the full-circumference LED strip and the phosphor layer 20 are coated; the phosphor layer 14 is coated on the upper and lower sides of the sapphire substrate 12, and the left and right sides of the sapphire substrate 12 are exposed to the outside to increase the heat dissipation capability. The left and right sides of the blue light leak 16. The blue light leakage 16 enters the permeable ceramic particle material as the incident light 62, and partially penetrates into the diffuse refracting light 64 to change the light angle, and mixes with the white light to avoid blue light leakage, and partially reflects the diffused light 66. Blending light into the phosphor layer 14 can increase the color rendering index of the light and reduce the color temperature. In the third, fourth and fifth embodiments, the diffuse refraction of the light-transmitting ceramic particle material to light can soften the light and reduce the glare.
18‧‧‧LED光源 18‧‧‧LED light source
20‧‧‧全周光LED燈條,有螢光粉層 20‧‧‧Full-circumference LED strips with phosphor layer
22‧‧‧一端開口的燈管 22‧‧‧Lights with one end open
23‧‧‧內管壁 23‧‧‧ inner wall
24‧‧‧電性連絡線 24‧‧‧Electrical connection
26‧‧‧塞子 26‧‧‧ 塞子
28‧‧‧主要陶瓷顆粒 28‧‧‧Main ceramic particles
30‧‧‧顆粒與鄰近顆粒接觸 30‧‧‧Particles in contact with adjacent particles
32‧‧‧填缝陶瓷顆粒 32‧‧‧Filling ceramic granules
33‧‧‧零碎陶瓷顆粒 33‧‧‧Split ceramic particles
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TW104137668A TWI571595B (en) | 2015-11-16 | 2015-11-16 | Omni-directional led lamps |
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CN104205371A (en) * | 2012-05-31 | 2014-12-10 | 松下电器产业株式会社 | LED module and production method therefor, lighting device |
TW201447167A (en) * | 2013-06-11 | 2014-12-16 | Epistar Corp | Light emitting device |
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TWI233192B (en) * | 2004-05-04 | 2005-05-21 | Kuo-Ning Chiang | The wafer level structure of system packaging with stacked packaging units |
KR20080006304A (en) * | 2006-07-12 | 2008-01-16 | 삼성전자주식회사 | Organic light emitting diode display and method for manufacturing thereof |
JP5216858B2 (en) * | 2008-08-21 | 2013-06-19 | パナソニック株式会社 | Light source for illumination |
TWM350096U (en) * | 2008-08-22 | 2009-02-01 | Golden Sun News Tech Co Ltd | Heat-dissipation structure of LED substrate and LED lamp tube thereof |
TWI441312B (en) * | 2010-05-31 | 2014-06-11 | Nat Univ Tsing Hua | A three dimensional chip stacking electronic package with bonding wires |
EP2636938A1 (en) * | 2010-11-04 | 2013-09-11 | Panasonic Corporation | Light emitting device, bulb-type lamp, and illuminating device |
JP5899449B2 (en) * | 2012-12-13 | 2016-04-06 | パナソニックIpマネジメント株式会社 | Illumination light source and illumination device |
CN203375259U (en) * | 2013-05-24 | 2014-01-01 | 苏州世鼎电子有限公司 | Full period-luminosity sunlight lamp |
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CN104205371A (en) * | 2012-05-31 | 2014-12-10 | 松下电器产业株式会社 | LED module and production method therefor, lighting device |
TW201447167A (en) * | 2013-06-11 | 2014-12-16 | Epistar Corp | Light emitting device |
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DE102016121906A1 (en) | 2017-05-18 |
DE102016121906B4 (en) | 2020-12-10 |
TW201719079A (en) | 2017-06-01 |
CN106704843B (en) | 2019-06-21 |
CN106704843A (en) | 2017-05-24 |
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