TWI570519B - 曝光微影裝置以及曝光微影方法 - Google Patents

曝光微影裝置以及曝光微影方法 Download PDF

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Publication number
TWI570519B
TWI570519B TW102103172A TW102103172A TWI570519B TW I570519 B TWI570519 B TW I570519B TW 102103172 A TW102103172 A TW 102103172A TW 102103172 A TW102103172 A TW 102103172A TW I570519 B TWI570519 B TW I570519B
Authority
TW
Taiwan
Prior art keywords
exposure
substrate
exposed
mark
mark forming
Prior art date
Application number
TW102103172A
Other languages
English (en)
Chinese (zh)
Other versions
TW201339767A (zh
Inventor
橋口昭浩
菊池浩明
鶴井弘則
Original Assignee
亞得科技工程有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 亞得科技工程有限公司 filed Critical 亞得科技工程有限公司
Publication of TW201339767A publication Critical patent/TW201339767A/zh
Application granted granted Critical
Publication of TWI570519B publication Critical patent/TWI570519B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
TW102103172A 2012-03-30 2013-01-28 曝光微影裝置以及曝光微影方法 TWI570519B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012082561A JP5961429B2 (ja) 2012-03-30 2012-03-30 露光描画装置及び露光描画方法

Publications (2)

Publication Number Publication Date
TW201339767A TW201339767A (zh) 2013-10-01
TWI570519B true TWI570519B (zh) 2017-02-11

Family

ID=49259084

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102103172A TWI570519B (zh) 2012-03-30 2013-01-28 曝光微影裝置以及曝光微影方法

Country Status (5)

Country Link
JP (1) JP5961429B2 (ko)
KR (1) KR102024617B1 (ko)
CN (1) CN104185817B (ko)
TW (1) TWI570519B (ko)
WO (1) WO2013145798A1 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6096453B2 (ja) * 2012-09-27 2017-03-15 株式会社アドテックエンジニアリング 露光描画装置、露光描画システム、プログラム及び露光描画方法
JP6465591B2 (ja) 2014-08-27 2019-02-06 株式会社オーク製作所 描画装置
CN105607430B (zh) * 2015-12-30 2017-07-07 深圳市鑫富宝科技有限公司 软板自动曝光机
CN109466189A (zh) * 2018-12-21 2019-03-15 昆山森特斯印刷技术有限公司 套印定位设备及具有该套印定位设备的套印定位系统
JP7386742B2 (ja) 2020-03-24 2023-11-27 株式会社Ｓｃｒｅｅｎホールディングス 露光装置
JP7458950B2 (ja) 2020-09-23 2024-04-01 株式会社Ｓｃｒｅｅｎホールディングス 描画システム

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200520051A (en) * 2003-10-27 2005-06-16 Samsung Electronics Co Ltd Lithography equipment
TWI240853B (en) * 2003-04-24 2005-10-01 Asml Netherlands Bv Lithographic processing method, and device manufactured thereby
TW200907609A (en) * 2007-08-09 2009-02-16 Nanya Technology Corp Mark for alignment an-d overlay, mask having the same, and method of using the same
JP2009294337A (ja) * 2008-06-04 2009-12-17 Orc Mfg Co Ltd 描画装置
TW201100978A (en) * 2009-05-29 2011-01-01 Asml Netherlands Bv Apparatus and method for providing resist alignment marks in a double patterning lithographic process

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6701197B2 (en) * 2000-11-08 2004-03-02 Orbotech Ltd. System and method for side to side registration in a printed circuit imager
JP2005014012A (ja) * 2003-06-24 2005-01-20 Pentax Corp 描画装置および描画方法
JP4882354B2 (ja) * 2004-12-01 2012-02-22 株式会社ニコン アライメント調整方法、アライメントマークの形成方法、基材、及び透過型光学素子の製造方法
JP2006293314A (ja) * 2005-02-08 2006-10-26 Fuji Photo Film Co Ltd 画像形成装置および画像形成方法
JP2006276206A (ja) * 2005-03-28 2006-10-12 Fuji Photo Film Co Ltd 露光装置および露光方法
JP4922071B2 (ja) * 2007-05-28 2012-04-25 株式会社オーク製作所 露光描画装置
JP2009099939A (ja) * 2007-09-25 2009-05-07 Dainippon Screen Mfg Co Ltd アライメントマーク形成装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI240853B (en) * 2003-04-24 2005-10-01 Asml Netherlands Bv Lithographic processing method, and device manufactured thereby
TW200520051A (en) * 2003-10-27 2005-06-16 Samsung Electronics Co Ltd Lithography equipment
TW200907609A (en) * 2007-08-09 2009-02-16 Nanya Technology Corp Mark for alignment an-d overlay, mask having the same, and method of using the same
JP2009294337A (ja) * 2008-06-04 2009-12-17 Orc Mfg Co Ltd 描画装置
TW201100978A (en) * 2009-05-29 2011-01-01 Asml Netherlands Bv Apparatus and method for providing resist alignment marks in a double patterning lithographic process

Also Published As

Publication number Publication date
KR20150003161A (ko) 2015-01-08
CN104185817A (zh) 2014-12-03
CN104185817B (zh) 2016-05-18
JP5961429B2 (ja) 2016-08-02
WO2013145798A1 (ja) 2013-10-03
JP2013213852A (ja) 2013-10-17
TW201339767A (zh) 2013-10-01
KR102024617B1 (ko) 2019-09-24

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