TWI567954B - 光電模組 - Google Patents
光電模組 Download PDFInfo
- Publication number
- TWI567954B TWI567954B TW102112208A TW102112208A TWI567954B TW I567954 B TWI567954 B TW I567954B TW 102112208 A TW102112208 A TW 102112208A TW 102112208 A TW102112208 A TW 102112208A TW I567954 B TWI567954 B TW I567954B
- Authority
- TW
- Taiwan
- Prior art keywords
- light
- optical
- substrate
- proximity sensor
- light emitter
- Prior art date
Links
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
- H10F55/20—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers
- H10F55/25—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive devices and the electric light source are all semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
- G01S17/04—Systems determining the presence of a target
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/481—Constructional features, e.g. arrangements of optical elements
- G01S7/4811—Constructional features, e.g. arrangements of optical elements common to transmitter and receiver
- G01S7/4813—Housing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
- H10F55/20—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers
- H10F55/25—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive devices and the electric light source are all semiconductor devices
- H10F55/255—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive devices and the electric light source are all semiconductor devices formed in, or on, a common substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/40—Optical elements or arrangements
- H10F77/407—Optical elements or arrangements indirectly associated with the devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/40—Optical elements or arrangements
- H10F77/413—Optical elements or arrangements directly associated or integrated with the devices, e.g. back reflectors
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Networks & Wireless Communication (AREA)
- General Physics & Mathematics (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Electromagnetism (AREA)
- Led Device Packages (AREA)
- Light Receiving Elements (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Optical Radar Systems And Details Thereof (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261620605P | 2012-04-05 | 2012-04-05 | |
| US13/827,264 US8791489B2 (en) | 2012-04-05 | 2013-03-14 | Opto-electronic module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201349467A TW201349467A (zh) | 2013-12-01 |
| TWI567954B true TWI567954B (zh) | 2017-01-21 |
Family
ID=49291595
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102112208A TWI567954B (zh) | 2012-04-05 | 2013-04-03 | 光電模組 |
| TW105137294A TWI587491B (zh) | 2012-04-05 | 2013-04-03 | 光電模組 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105137294A TWI587491B (zh) | 2012-04-05 | 2013-04-03 | 光電模組 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US8791489B2 (enExample) |
| EP (1) | EP2834683B1 (enExample) |
| JP (2) | JP2015519545A (enExample) |
| KR (1) | KR20140147119A (enExample) |
| CN (2) | CN104303077B (enExample) |
| SG (2) | SG10201508450UA (enExample) |
| TW (2) | TWI567954B (enExample) |
| WO (1) | WO2013151507A1 (enExample) |
Families Citing this family (42)
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| JP6247633B2 (ja) * | 2011-08-10 | 2017-12-13 | ヘプタゴン・マイクロ・オプティクス・プライベート・リミテッドHeptagon Micro Optics Pte. Ltd. | 光電子モジュールおよびその製造方法 |
| US9063005B2 (en) * | 2012-04-05 | 2015-06-23 | Heptagon Micro Optics Pte. Ltd. | Reflowable opto-electronic module |
| US10585530B2 (en) | 2014-09-23 | 2020-03-10 | Neonode Inc. | Optical proximity sensor |
| US9741184B2 (en) | 2012-10-14 | 2017-08-22 | Neonode Inc. | Door handle with optical proximity sensors |
| US10324565B2 (en) | 2013-05-30 | 2019-06-18 | Neonode Inc. | Optical proximity sensor |
| US9921661B2 (en) | 2012-10-14 | 2018-03-20 | Neonode Inc. | Optical proximity sensor and associated user interface |
| US9164625B2 (en) | 2012-10-14 | 2015-10-20 | Neonode Inc. | Proximity sensor for determining two-dimensional coordinates of a proximal object |
| US8946620B2 (en) * | 2012-10-16 | 2015-02-03 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Proximity sensor device with internal channeling section |
| US9613939B2 (en) | 2013-01-10 | 2017-04-04 | Heptagon Micro Optics Pte. Ltd. | Opto-electronic modules including features to help reduce stray light and/or optical cross-talk |
| US10884551B2 (en) | 2013-05-16 | 2021-01-05 | Analog Devices, Inc. | Integrated gesture sensor module |
| US9746349B2 (en) | 2013-09-02 | 2017-08-29 | Heptagon Micro Optics Pte. Ltd. | Opto-electronic module including a non-transparent separation member between a light emitting element and a light detecting element |
| US9773765B2 (en) | 2013-11-22 | 2017-09-26 | Heptagon Micro Optics Pte. Ltd. | Compact optoelectronic modules |
| EP3080840B1 (en) * | 2013-12-09 | 2019-05-22 | Heptagon Micro Optics Pte. Ltd. | Modules having multiple optical channels including optical elements at different heights above the optoelectronic devices |
| TWI667767B (zh) * | 2014-03-31 | 2019-08-01 | 菱生精密工業股份有限公司 | Package structure of integrated optical module |
| TWI634648B (zh) * | 2014-06-13 | 2018-09-01 | 億光電子工業股份有限公司 | 光感測器的製造方法 |
| US9356185B2 (en) * | 2014-06-20 | 2016-05-31 | Heptagon Micro Optics Pte. Ltd. | Compact light sensing modules including reflective surfaces to enhance light collection and/or emission, and methods of fabricating such modules |
| US9405096B2 (en) * | 2014-08-29 | 2016-08-02 | Heptagon Micro Optics Pte, Ltd. | Image sensor modules including primary high-resolution and secondary imagers |
| US9590129B2 (en) * | 2014-11-19 | 2017-03-07 | Analog Devices Global | Optical sensor module |
| CN105679753B (zh) * | 2014-11-20 | 2018-05-08 | 日月光半导体制造股份有限公司 | 光学模块、其制造方法及电子装置 |
| WO2016085607A1 (en) * | 2014-11-28 | 2016-06-02 | Neonode Inc | Door handle with optical proximity sensors |
| TWI679442B (zh) | 2014-12-02 | 2019-12-11 | 新加坡商新加坡恒立私人有限公司 | 深度感測模組及深度感測方法 |
| KR102436320B1 (ko) | 2015-03-02 | 2022-08-25 | 엘지이노텍 주식회사 | 근조도 센서 및 이를 포함하는 휴대용 단말기 |
| JP6560006B2 (ja) * | 2015-04-08 | 2019-08-14 | 東芝ライフスタイル株式会社 | 冷蔵庫 |
| SG11201802939TA (en) * | 2015-10-07 | 2018-05-30 | Heptagon Micro Optics Pte Ltd | Molded circuit substrates |
| US11143750B2 (en) * | 2015-10-22 | 2021-10-12 | Ams Sensors Singapore Pte. Ltd. | Optical crosstalk calibration for ranging systems |
| CN205450269U (zh) * | 2015-12-18 | 2016-08-10 | 深圳市金立通信设备有限公司 | 激光测距装置、摄像装置及其终端 |
| US9911877B2 (en) * | 2016-01-14 | 2018-03-06 | Advanced Semiconductor Engineering, Inc. | Electronic device, package structure and method of manufacturing the same |
| CN114137672A (zh) * | 2016-04-15 | 2022-03-04 | 赫普塔冈微光有限公司 | 具有对准间隔件的光电子模块和用于组装所述光电子模块的方法 |
| US11226402B2 (en) | 2016-06-09 | 2022-01-18 | Ams Sensors Singapore Pte. Ltd. | Optical ranging systems including optical cross-talk reducing features |
| US20180017741A1 (en) * | 2016-07-15 | 2018-01-18 | Advanced Semiconductor Engineering, Inc. | Semiconductor package device and method of manufacturing the same |
| US11662541B2 (en) | 2017-11-07 | 2023-05-30 | Ams Sensors Singapore Pte. Ltd. | Optoelectronic modules having locking assemblies and methods for manufacturing the same |
| US10712197B2 (en) | 2018-01-11 | 2020-07-14 | Analog Devices Global Unlimited Company | Optical sensor package |
| US12178029B2 (en) | 2019-09-11 | 2024-12-24 | Apple Inc. | Opaque splits embedded in transparent media for optical emitter/detector isolation |
| US11786139B2 (en) | 2019-09-11 | 2023-10-17 | Apple Inc. | Opaque splits embedded in transparent media for optical emitter/detector isolation |
| US11805629B2 (en) | 2019-09-11 | 2023-10-31 | Apple Inc. | Opaque splits embedded in transparent media for optical emitter/detector isolation |
| CN111063621B (zh) * | 2019-12-30 | 2021-11-02 | 江苏大摩半导体科技有限公司 | 一种光电探测器及其制造方法 |
| WO2021138516A1 (en) | 2019-12-31 | 2021-07-08 | Neonode Inc. | Contactless touch input system |
| JP7511399B2 (ja) * | 2020-06-26 | 2024-07-05 | 太陽ホールディングス株式会社 | 硬化性樹脂組成物、ドライフィルム、硬化物、電子部品 |
| KR102430150B1 (ko) * | 2020-08-25 | 2022-08-08 | 서울대학교산학협력단 | 식생 모니터링을 위한 분광 센서 회로 및 이를 포함하는 스마트 분광 센서 |
| KR102849998B1 (ko) | 2020-08-26 | 2025-08-26 | 삼성전자주식회사 | 광 센서 및 이를 포함하는 전자 장치 |
| US20230048279A1 (en) * | 2021-08-12 | 2023-02-16 | Advanced Semiconductor Engineering, Inc. | Optical device |
| CN118191794B (zh) * | 2024-05-20 | 2024-08-20 | 万合(洛阳)光电技术有限公司 | 一种大气探测激光雷达防阳光直射装置及方法 |
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| US20110133941A1 (en) * | 2009-12-04 | 2011-06-09 | Avago Technologies Ecbu (Singapore) Pte. Ltd. | Optical Proximity Sensor with Improved Shield and Lenses |
| US20120037793A1 (en) * | 2010-08-10 | 2012-02-16 | Chi Boon Ong | Lens having multiple conic sections for leds and proximity sensors |
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- 2013-04-03 SG SG10201508450UA patent/SG10201508450UA/en unknown
- 2013-04-03 TW TW105137294A patent/TWI587491B/zh active
- 2013-04-03 SG SG11201405660VA patent/SG11201405660VA/en unknown
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2014
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Also Published As
| Publication number | Publication date |
|---|---|
| EP2834683A4 (en) | 2015-12-30 |
| US20130264586A1 (en) | 2013-10-10 |
| SG10201508450UA (en) | 2015-11-27 |
| TW201709491A (zh) | 2017-03-01 |
| EP2834683A1 (en) | 2015-02-11 |
| TWI587491B (zh) | 2017-06-11 |
| WO2013151507A1 (en) | 2013-10-10 |
| SG11201405660VA (en) | 2014-11-27 |
| CN104303077A (zh) | 2015-01-21 |
| CN104303077B (zh) | 2018-05-29 |
| US8975108B2 (en) | 2015-03-10 |
| JP2017152698A (ja) | 2017-08-31 |
| CN108511538A (zh) | 2018-09-07 |
| CN108511538B (zh) | 2021-09-21 |
| JP2015519545A (ja) | 2015-07-09 |
| EP2834683B1 (en) | 2020-03-25 |
| US8791489B2 (en) | 2014-07-29 |
| US20140291703A1 (en) | 2014-10-02 |
| TW201349467A (zh) | 2013-12-01 |
| KR20140147119A (ko) | 2014-12-29 |
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