JP2015519545A - 光電子モジュール - Google Patents

光電子モジュール Download PDF

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Publication number
JP2015519545A
JP2015519545A JP2015504531A JP2015504531A JP2015519545A JP 2015519545 A JP2015519545 A JP 2015519545A JP 2015504531 A JP2015504531 A JP 2015504531A JP 2015504531 A JP2015504531 A JP 2015504531A JP 2015519545 A JP2015519545 A JP 2015519545A
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JP
Japan
Prior art keywords
light
light emitting
optical
proximity sensor
sensor module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015504531A
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English (en)
Japanese (ja)
Other versions
JP2015519545A5 (enExample
Inventor
ラドマン,ハルトムート
ビーチ,アレクサンダー
ウェステンホーファー,ズザンネ
グブザー,ジーモン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Sensors Singapore Pte Ltd
Original Assignee
Heptagon Micro Optics Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heptagon Micro Optics Pte Ltd filed Critical Heptagon Micro Optics Pte Ltd
Publication of JP2015519545A publication Critical patent/JP2015519545A/ja
Publication of JP2015519545A5 publication Critical patent/JP2015519545A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
    • H10F55/20—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers
    • H10F55/25—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive devices and the electric light source are all semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
    • G01S17/04—Systems determining the presence of a target
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements
    • G01S7/4811—Constructional features, e.g. arrangements of optical elements common to transmitter and receiver
    • G01S7/4813—Housing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
    • H10F55/20—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers
    • H10F55/25—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive devices and the electric light source are all semiconductor devices
    • H10F55/255—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive devices and the electric light source are all semiconductor devices formed in, or on, a common substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/407—Optical elements or arrangements indirectly associated with the devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/413—Optical elements or arrangements directly associated or integrated with the devices, e.g. back reflectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Electromagnetism (AREA)
  • Led Device Packages (AREA)
  • Light Receiving Elements (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Optical Radar Systems And Details Thereof (AREA)
JP2015504531A 2012-04-05 2013-04-03 光電子モジュール Pending JP2015519545A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261620605P 2012-04-05 2012-04-05
US61/620,605 2012-04-05
US13/827,264 US8791489B2 (en) 2012-04-05 2013-03-14 Opto-electronic module
US13/827,264 2013-03-14
PCT/SG2013/000131 WO2013151507A1 (en) 2012-04-05 2013-04-03 Opto-electronic module

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2017037155A Division JP2017152698A (ja) 2012-04-05 2017-02-28 光電子モジュール

Publications (2)

Publication Number Publication Date
JP2015519545A true JP2015519545A (ja) 2015-07-09
JP2015519545A5 JP2015519545A5 (enExample) 2016-06-02

Family

ID=49291595

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2015504531A Pending JP2015519545A (ja) 2012-04-05 2013-04-03 光電子モジュール
JP2017037155A Pending JP2017152698A (ja) 2012-04-05 2017-02-28 光電子モジュール

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2017037155A Pending JP2017152698A (ja) 2012-04-05 2017-02-28 光電子モジュール

Country Status (8)

Country Link
US (2) US8791489B2 (enExample)
EP (1) EP2834683B1 (enExample)
JP (2) JP2015519545A (enExample)
KR (1) KR20140147119A (enExample)
CN (2) CN104303077B (enExample)
SG (2) SG10201508450UA (enExample)
TW (2) TWI587491B (enExample)
WO (1) WO2013151507A1 (enExample)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103858230B (zh) * 2011-08-10 2018-03-27 新加坡恒立私人有限公司 光电子模块和用于制造该光电子模块的方法
US9063005B2 (en) 2012-04-05 2015-06-23 Heptagon Micro Optics Pte. Ltd. Reflowable opto-electronic module
US10324565B2 (en) 2013-05-30 2019-06-18 Neonode Inc. Optical proximity sensor
US9921661B2 (en) 2012-10-14 2018-03-20 Neonode Inc. Optical proximity sensor and associated user interface
US10585530B2 (en) 2014-09-23 2020-03-10 Neonode Inc. Optical proximity sensor
US9164625B2 (en) 2012-10-14 2015-10-20 Neonode Inc. Proximity sensor for determining two-dimensional coordinates of a proximal object
US9741184B2 (en) 2012-10-14 2017-08-22 Neonode Inc. Door handle with optical proximity sensors
US8946620B2 (en) * 2012-10-16 2015-02-03 Avago Technologies General Ip (Singapore) Pte. Ltd. Proximity sensor device with internal channeling section
WO2014109711A1 (en) 2013-01-10 2014-07-17 Heptagon Micro Optics Pte. Ltd. Opto-electronic modules including features to help reduce stray light and/or optical cross-talk
US10884551B2 (en) 2013-05-16 2021-01-05 Analog Devices, Inc. Integrated gesture sensor module
WO2015030673A1 (en) 2013-09-02 2015-03-05 Heptagon Micro Optics Pte. Ltd. Opto-electronic module including a non-transparent separation member between a light emitting element and a light detecting element
US9773765B2 (en) 2013-11-22 2017-09-26 Heptagon Micro Optics Pte. Ltd. Compact optoelectronic modules
US10254158B2 (en) 2013-12-09 2019-04-09 Ams Sensors Singapore Pte. Ltd. Modules having multiple optical channels including optical elements at different heights above the optoelectronic devices
TWI667767B (zh) * 2014-03-31 2019-08-01 菱生精密工業股份有限公司 Package structure of integrated optical module
TWI634648B (zh) * 2014-06-13 2018-09-01 億光電子工業股份有限公司 光感測器的製造方法
US9356185B2 (en) * 2014-06-20 2016-05-31 Heptagon Micro Optics Pte. Ltd. Compact light sensing modules including reflective surfaces to enhance light collection and/or emission, and methods of fabricating such modules
US9405096B2 (en) * 2014-08-29 2016-08-02 Heptagon Micro Optics Pte, Ltd. Image sensor modules including primary high-resolution and secondary imagers
US9590129B2 (en) * 2014-11-19 2017-03-07 Analog Devices Global Optical sensor module
CN105679753B (zh) * 2014-11-20 2018-05-08 日月光半导体制造股份有限公司 光学模块、其制造方法及电子装置
WO2016085607A1 (en) * 2014-11-28 2016-06-02 Neonode Inc Door handle with optical proximity sensors
TWI679442B (zh) 2014-12-02 2019-12-11 新加坡商新加坡恒立私人有限公司 深度感測模組及深度感測方法
KR102436320B1 (ko) 2015-03-02 2022-08-25 엘지이노텍 주식회사 근조도 센서 및 이를 포함하는 휴대용 단말기
JP6560006B2 (ja) * 2015-04-08 2019-08-14 東芝ライフスタイル株式会社 冷蔵庫
US20180302990A1 (en) * 2015-10-07 2018-10-18 Heptagon Micro Optics Pte. Ltd. Molded Circuit Substrates
WO2017069708A1 (en) 2015-10-22 2017-04-27 Heptagon Micro Optics Pte. Ltd. Optical crosstalk calibration for ranging systems
CN205450269U (zh) * 2015-12-18 2016-08-10 深圳市金立通信设备有限公司 激光测距装置、摄像装置及其终端
US9911877B2 (en) * 2016-01-14 2018-03-06 Advanced Semiconductor Engineering, Inc. Electronic device, package structure and method of manufacturing the same
US10840396B2 (en) 2016-04-15 2020-11-17 Ams Sensors Singapore Pte. Ltd. Optoelectronic modules with alignment spacers and methods for assembling the same
US11226402B2 (en) 2016-06-09 2022-01-18 Ams Sensors Singapore Pte. Ltd. Optical ranging systems including optical cross-talk reducing features
US20180017741A1 (en) * 2016-07-15 2018-01-18 Advanced Semiconductor Engineering, Inc. Semiconductor package device and method of manufacturing the same
CN111602245B (zh) * 2017-11-07 2024-10-15 ams传感器新加坡私人有限公司 具有锁定组件的光电模块及其制造方法
US10712197B2 (en) 2018-01-11 2020-07-14 Analog Devices Global Unlimited Company Optical sensor package
US12178029B2 (en) 2019-09-11 2024-12-24 Apple Inc. Opaque splits embedded in transparent media for optical emitter/detector isolation
US11786139B2 (en) * 2019-09-11 2023-10-17 Apple Inc. Opaque splits embedded in transparent media for optical emitter/detector isolation
US11805629B2 (en) 2019-09-11 2023-10-31 Apple Inc. Opaque splits embedded in transparent media for optical emitter/detector isolation
CN111063621B (zh) * 2019-12-30 2021-11-02 江苏大摩半导体科技有限公司 一种光电探测器及其制造方法
EP4085321A4 (en) 2019-12-31 2024-01-24 Neonode Inc. CONTACTLESS TOUCH ENTRY SYSTEM
JP7511399B2 (ja) * 2020-06-26 2024-07-05 太陽ホールディングス株式会社 硬化性樹脂組成物、ドライフィルム、硬化物、電子部品
KR102430150B1 (ko) * 2020-08-25 2022-08-08 서울대학교산학협력단 식생 모니터링을 위한 분광 센서 회로 및 이를 포함하는 스마트 분광 센서
KR102849998B1 (ko) 2020-08-26 2025-08-26 삼성전자주식회사 광 센서 및 이를 포함하는 전자 장치
US20230048279A1 (en) * 2021-08-12 2023-02-16 Advanced Semiconductor Engineering, Inc. Optical device
CN118191794B (zh) * 2024-05-20 2024-08-20 万合(洛阳)光电技术有限公司 一种大气探测激光雷达防阳光直射装置及方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001194232A (ja) * 2000-01-14 2001-07-19 Sony Corp 光センサ装置及び表示装置
JP2002043922A (ja) * 2000-07-26 2002-02-08 Sunx Ltd ピッキングセンサ
WO2010120651A2 (en) * 2009-04-14 2010-10-21 Intersil Americas Inc. Optical sensors that reduce specular reflections
US7925154B2 (en) * 2008-08-08 2011-04-12 Samsung Electro-Mechanics Co., Ltd. Camera module and method of manufacturing the same
JP2011193033A (ja) * 2011-07-07 2011-09-29 Rohm Co Ltd 赤外線データ通信モジュール

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5187361A (en) 1989-04-25 1993-02-16 Copal Company Limited Object detection apparatus of the photoelectric reflection type with sampled data
US5150438A (en) * 1991-07-29 1992-09-22 Motorola, Inc. Optocoupler apparatus with reflective overcoat
JP2002324916A (ja) * 2001-04-24 2002-11-08 Rohm Co Ltd 赤外線データ通信モジュールおよびその製造方法
US6710346B2 (en) 2001-08-02 2004-03-23 International Business Machines Corporation Active infrared presence sensor
CN100550430C (zh) * 2002-09-09 2009-10-14 皇家飞利浦电子股份有限公司 半导体器件及其制造方法
JP4133896B2 (ja) * 2004-03-29 2008-08-13 シャープ株式会社 光ピックアップ装置
JP4948033B2 (ja) 2006-05-16 2012-06-06 ローム株式会社 マイクロ流体回路の製造方法およびその方法により製造したマイクロ流体回路
CN101078771A (zh) * 2006-05-24 2007-11-28 夏普株式会社 光学式测距装置及其制造方法
CH713513B1 (fr) * 2007-02-22 2018-08-31 Em Microelectronic Marin Sa Module optoélectronique muni d'au moins un circuit photorécepteur.
US20080290435A1 (en) * 2007-05-21 2008-11-27 Micron Technology, Inc. Wafer level lens arrays for image sensor packages and the like, image sensor packages, and related methods
US7898738B2 (en) * 2007-09-10 2011-03-01 Oki Data Corporation Lens array, manufacturing method thereof, LED head having lens array, exposure device having LED head, image forming apparatus having exposure device, and reading apparatus
KR101575915B1 (ko) * 2007-11-27 2015-12-08 헵타곤 마이크로 옵틱스 피티이. 리미티드 봉지된 렌즈 스택
US8217482B2 (en) * 2007-12-21 2012-07-10 Avago Technologies General Ip (Singapore) Pte. Ltd. Infrared proximity sensor package with reduced crosstalk
KR101353934B1 (ko) * 2007-12-27 2014-01-22 삼성전기주식회사 전기소자를 구비한 이미지센서 모듈 및 그 제조방법
TWI432788B (zh) * 2008-01-16 2014-04-01 Omnivision Tech Inc 膜懸置光學元件與相關方法
WO2009120568A2 (en) * 2008-03-24 2009-10-01 Nanolambda, Inc. Multi-purpose plasmonic ambient light sensor and visual range proximity sensor
US20100259766A1 (en) 2009-04-14 2010-10-14 Intersil Americas Inc. Optical sensors and methods for providing optical sensors
US8779361B2 (en) * 2009-06-30 2014-07-15 Avago Technologies General Ip (Singapore) Pte. Ltd. Optical proximity sensor package with molded infrared light rejection barrier and infrared pass components
US8716665B2 (en) * 2009-09-10 2014-05-06 Avago Technologies General Ip (Singapore) Pte. Ltd. Compact optical proximity sensor with ball grid array and windowed substrate
US8143608B2 (en) * 2009-09-10 2012-03-27 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Package-on-package (POP) optical proximity sensor
US8350216B2 (en) 2009-09-10 2013-01-08 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Miniaturized optical proximity sensor
US8232883B2 (en) 2009-12-04 2012-07-31 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Optical proximity sensor with improved shield and lenses
US20110226952A1 (en) * 2010-03-19 2011-09-22 Capella Microsystems, Corp. Reflection Sensing System
US8384559B2 (en) 2010-04-13 2013-02-26 Silicon Laboratories Inc. Sensor device with flexible interface and updatable information store
US8558161B2 (en) * 2010-08-10 2013-10-15 Avago Technologies General Ip (Singapore) Pte. Ltd. Lens having multiple conic sections for LEDs and proximity sensors
JP2012057979A (ja) * 2010-09-06 2012-03-22 Nec Tokin Corp 焦電型赤外線センサ
CN103512595B (zh) 2011-07-19 2016-08-10 赫普塔冈微光有限公司 光电模块及其制造方法与包含光电模块的电器及装置
US9366752B2 (en) * 2011-09-23 2016-06-14 Apple Inc. Proximity sensor with asymmetric optical element
TWI567953B (zh) * 2011-12-20 2017-01-21 新加坡恒立私人有限公司 光電模組及包含該模組之裝置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001194232A (ja) * 2000-01-14 2001-07-19 Sony Corp 光センサ装置及び表示装置
JP2002043922A (ja) * 2000-07-26 2002-02-08 Sunx Ltd ピッキングセンサ
US7925154B2 (en) * 2008-08-08 2011-04-12 Samsung Electro-Mechanics Co., Ltd. Camera module and method of manufacturing the same
WO2010120651A2 (en) * 2009-04-14 2010-10-21 Intersil Americas Inc. Optical sensors that reduce specular reflections
JP2011193033A (ja) * 2011-07-07 2011-09-29 Rohm Co Ltd 赤外線データ通信モジュール

Also Published As

Publication number Publication date
EP2834683B1 (en) 2020-03-25
JP2017152698A (ja) 2017-08-31
KR20140147119A (ko) 2014-12-29
US20140291703A1 (en) 2014-10-02
WO2013151507A1 (en) 2013-10-10
US8791489B2 (en) 2014-07-29
US8975108B2 (en) 2015-03-10
SG10201508450UA (en) 2015-11-27
CN104303077B (zh) 2018-05-29
TW201709491A (zh) 2017-03-01
CN104303077A (zh) 2015-01-21
SG11201405660VA (en) 2014-11-27
CN108511538A (zh) 2018-09-07
US20130264586A1 (en) 2013-10-10
EP2834683A4 (en) 2015-12-30
CN108511538B (zh) 2021-09-21
TW201349467A (zh) 2013-12-01
EP2834683A1 (en) 2015-02-11
TWI567954B (zh) 2017-01-21
TWI587491B (zh) 2017-06-11

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