TWI564606B - 光通訊模組組裝裝置 - Google Patents

光通訊模組組裝裝置 Download PDF

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TWI564606B
TWI564606B TW102108328A TW102108328A TWI564606B TW I564606 B TWI564606 B TW I564606B TW 102108328 A TW102108328 A TW 102108328A TW 102108328 A TW102108328 A TW 102108328A TW I564606 B TWI564606 B TW I564606B
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communication module
optical communication
module assembly
assembly device
probe
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TW201435412A (zh
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賴志成
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鴻海精密工業股份有限公司
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Priority to US13/931,759 priority patent/US9132513B2/en
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    • H01L2224/757—Means for aligning
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Description

光通訊模組組裝裝置
本發明關於一種光通訊模組，尤其涉及一種光通訊模組組裝裝置。
光通訊模組包括基板及設置於基板上且通過導電膠與基板電性連接的發光元件（發光二極體或鐳射二極體）。
組裝時，一般通過真空吸嘴吸附蘸取導電膠的發光元件後，吸嘴向基板方向運動使發光元件逐漸接近壓基板將發光元件黏結於基板。然而，若下壓力度過大，容易損壞發光元件及基板，而若下壓力度過小，則發光元件與基板黏結不夠緊密，發光元件與基板之間的電阻大，導致插入損耗過大。因此，下壓力度需精準控制，否則將影響組裝效果。
有鑑於此，有必要提供一種提高組裝良率的光通訊模組組裝裝置。
一種光通訊模組組裝裝置，用來將一吸嘴吸附的黏附有導電膠的發光元件組裝到基板上，所述發光元件具有相對的第一表面和第二表面，所述第一表面上具有第一電極，所述第二表面上具有第二電極，所述導電膠黏附於所述第二表面上，所述基板具有相對的第三表面和第四表面，所述第三表面上具有與所述第二電極對應的焊點，所述第四表面上具有與所述焊點電性相連的焊盤，所述光通訊模組組裝裝置包括第一探針、測量單元和控制單元，所述第一探針位於所述吸嘴上用來與所述第一電極接觸，所述測量單元連接所述第一探針和焊盤以用來測量當所述發光元件下壓到所述焊點上時所述發光元件的電阻值，所述控制單元根據所述電阻值控制所述吸嘴的移動。
相較於先前技術，本實施例的光通訊模組組裝裝置利用第一探針並結合測量單元來實時偵測發光元件下壓在基板上的電阻來獲取最佳貼合位置，使得發光元件與基板具有最佳的貼合且不會損傷發光元件和基板，提高了組裝良率。
10．．．光通訊模組組裝裝置
20．．．吸嘴
30．．．發光元件
31．．．第一表面
32．．．第二表面
33．．．第一電極
34．．．第二電極
40．．．導電膠
50．．．基板
51．．．第三表面
52．．．第四表面
53．．．焊點
54．．．焊盤
11．．．第一探針
12．．．第二探針
13．．．測量單元
14．．．控制單元
15．．．驅動單元
60．．．托盤
61．．．容置槽
圖1是本發明實施例光通訊模組組裝裝置的平面示意圖。
圖2是電阻與貼合距離之間的曲線示意圖。
請參閱圖1及圖2，本發明實施例提供的光通訊模組組裝裝置10用來將吸嘴20吸取的發光元件30下壓以組裝到基板50上，發光元件30上黏附有導電膠40，發光元件30藉由導電膠40與基板50電性相連。基板50可以為電路板，例如，硬質電路板或柔性電路板，基板50承載在托盤60上，托盤60具有容置槽61用來固定基板50，以使在組裝過程中基板50保持不動。
光通訊模組組裝裝置10包括第一探針11、第二探針12、測量單元13、控制單元14和驅動單元15。第一探針11位於吸嘴20上，第二探針12位於托盤60的容置槽61內。測量單元13連接第一探針11和第二探針12用來測量第一探針11和第二探針12之間的電阻值，即發光元件30的電阻值，測量單元13可以為測量電阻的電阻表或萬用表。控制單元14分別與測量單元13和驅動單元15相連，控制單元14控制驅動單元15驅動吸嘴20移動以下壓發光元件30。
發光元件30為發光二極體（Light Emitting Diode，LED）或鐳射二極體（Laser Diode，LD），其具有相對的第一表面31和第二表面32，第一表面31上具有第一電極33，第二表面32上具有第二電極34。其中，當吸嘴20吸附在發光元件30的第一表面31上時，第一電極33與第一探針11相接觸，導電膠40黏附在第二表面32以及第二電極34上。
基板50具有相對的第三表面51和第四表面52，第三表面51上具有焊點53，第四表面52上具有與焊點53電性連接的焊盤54。其中，當發光元件30接觸基板50時，導電膠40同樣黏附在焊點53上；第二探針12與焊盤54相接觸，從而使得第二探針12與第二電極34接觸，如此，第一探針11、第二探針12和測量單元13形成一個測量電阻的通路。
第二探針12可以埋設在托盤60的容置槽61中並指向焊盤54，以使第二探針12可以在基板50收容在容置槽61中時與焊盤54相接觸。
爲了提高組裝效率，可以在托盤60上設置多個容置槽61，用於收容更多的基板50，對應地，光通訊模組組裝裝置10可以包括更多的第二探針12以與更多的焊盤54相配合，從而使每一個容置槽61內均具有一個第二探針12。
當然，在其他實施方式中，可以不設置第二探針12，而使測量單元13直接與焊盤54相接觸，使第一探針11和測量單元13形成一個通路。
在將發光元件30貼合到基板50上的過程中，隨著吸嘴20不斷將發光元件30下壓到基板50上，導電膠40受到發光元件30和基板50的擠壓，在導電膠40變得越來越薄的同時發光元件30與基板50之間的距離越來越緊密，因此，測量單元13測得的發光元件30的電阻值不斷減小，直至導電膠40無法被繼續擠壓，電阻值基本不發生變化。
當發光元件30下壓到一定程度，測量單元13測量的電阻值不會隨著發光元件30的繼續下壓而繼續減小，而是保持穩定或者基本不發生變化，相反地，如果繼續下壓將損壞發光元件30和基板50。故，控制單元14在測量單元13測得的電阻值持續減小時控制驅動單元15繼續驅動吸嘴20下壓發光元件30，而在電阻值基本不發生變化時控制驅動單元15停止驅動吸嘴20下壓發光元件30，此位置即為發光元件30與基板50之間的最佳貼合位置。
本實施例的光通訊模組組裝裝置10利用第一探針11和第二探針12並結合測量單元13來實時偵測發光元件30下壓在基板50上的電阻來獲取最佳貼合位置，使得發光元件30與基板50具有最佳的貼合且不會損傷發光元件30和基板50，提高了組裝良率。
綜上所述，本發明確已符合發明專利之要件，遂依法提出專利申請。惟，以上所述者僅為本發明之較佳實施方式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士爰依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。
10．．．光通訊模組組裝裝置
20．．．吸嘴
30．．．發光元件
31．．．第一表面
32．．．第二表面
33．．．第一電極
34．．．第二電極
40．．．導電膠
50．．．基板
51．．．第三表面
52．．．第四表面
53．．．焊點
54．．．焊盤
11．．．第一探針
12．．．第二探針
13．．．測量單元
14．．．控制單元
15．．．驅動單元
60．．．托盤
61．．．容置槽

Claims (10)

  1. 一種光通訊模組組裝裝置，用來將一吸嘴吸附的黏附有導電膠的發光元件組裝到基板上，所述發光元件具有相對的第一表面和第二表面，所述第一表面上具有第一電極，所述第二表面上具有第二電極，所述導電膠黏附於所述第二表面上，所述基板具有相對的第三表面和第四表面，所述第三表面上具有與所述第二電極對應的焊點，所述第四表面上具有與所述焊點電性相連的焊盤，其改良在於，所述光通訊模組組裝裝置包括第一探針、測量單元和控制單元，所述第一探針位於所述吸嘴上用來與所述第一電極接觸，所述測量單元連接所述第一探針和焊盤用來測量當所述發光元件下壓到所述焊點上時所述發光元件的電阻值，所述控制單元根據所述電阻值控制所述吸嘴的移動。
  2. 如請求項1所述的光通訊模組組裝裝置，其中，所述光通訊模組組裝裝置進一步包括第二探針，所述測量單元通過所述第二探針連接所述焊盤。
  3. 如請求項1所述的光通訊模組組裝裝置，其中，所述光通訊模組組裝裝置進一步包括驅動單元，所述控制單元控制所述驅動單元移動所述吸嘴。
  4. 如請求項1所述的光通訊模組組裝裝置，其中，所述發光元件為發光二極體或鐳射二極體。
  5. 如請求項1所述的光通訊模組組裝裝置，其中，所述吸嘴為真空吸嘴。
  6. 如請求項1-5任一所述的光通訊模組組裝裝置，其中，所述基板固定在一托盤內。
  7. 如請求項6所述的光通訊模組組裝裝置，其中，所述第二探針位於所述托盤內以與所述焊盤相連接。
  8. 如請求項6所述的光通訊模組組裝裝置，其中，所述托盤具有容置槽，用來收容所述基板。
  9. 如請求項6所述的光通訊模組組裝裝置，其中，所述基板為電路板。
  10. 如請求項9所述的光通訊模組組裝裝置，其中，所述基板為硬質電路板或柔性電路板。
TW102108328A 2013-03-08 2013-03-08 光通訊模組組裝裝置 TWI564606B (zh)

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Citations (2)

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JPH09107008A (ja) * 1995-10-12 1997-04-22 Oki Electric Ind Co Ltd 半導体素子の実装方法及びその装置
US6995342B2 (en) * 2001-09-21 2006-02-07 Matsushita Electric Industrial Co., Ltd. Apparatus and method for bonding electronic component, circuit board, and electronic component mounting apparatus

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US3559054A (en) * 1965-11-15 1971-01-26 Ibm Method of and apparatus for mechanically and electrically testing the quality of joints bonding a chip device to the surface of the substrate of a microminiature module
US3462577A (en) * 1966-12-23 1969-08-19 Texas Instruments Inc Welding method and apparatus
JPH05291353A (ja) * 1992-04-15 1993-11-05 Fujitsu Ltd フェイスダウンボンディング方法とその装置
JP5093482B2 (ja) * 2007-06-26 2012-12-12 ソニーケミカル＆インフォメーションデバイス株式会社 異方性導電材料、接続構造体及びその製造方法
JP5369868B2 (ja) * 2009-04-24 2013-12-18 トヨタ自動車株式会社 半導体装置

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Publication number Priority date Publication date Assignee Title
JPH09107008A (ja) * 1995-10-12 1997-04-22 Oki Electric Ind Co Ltd 半導体素子の実装方法及びその装置
US6995342B2 (en) * 2001-09-21 2006-02-07 Matsushita Electric Industrial Co., Ltd. Apparatus and method for bonding electronic component, circuit board, and electronic component mounting apparatus

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