TWI563601B - Package device and its lead frame and manufacturing method of lead frame - Google Patents

Package device and its lead frame and manufacturing method of lead frame

Info

Publication number
TWI563601B
TWI563601B TW104139311A TW104139311A TWI563601B TW I563601 B TWI563601 B TW I563601B TW 104139311 A TW104139311 A TW 104139311A TW 104139311 A TW104139311 A TW 104139311A TW I563601 B TWI563601 B TW I563601B
Authority
TW
Taiwan
Prior art keywords
lead frame
manufacturing
package device
package
lead
Prior art date
Application number
TW104139311A
Other languages
English (en)
Other versions
TW201719807A (zh
Inventor
Wen Lin Chen
Chao Tsung Tseng
Hsien Ming Tsai
Shih Ping Hsu
Che Wei Hsu
Original Assignee
Phoenix Pioneer Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phoenix Pioneer Technology Co Ltd filed Critical Phoenix Pioneer Technology Co Ltd
Priority to TW104139311A priority Critical patent/TWI563601B/zh
Application granted granted Critical
Publication of TWI563601B publication Critical patent/TWI563601B/zh
Publication of TW201719807A publication Critical patent/TW201719807A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
TW104139311A 2015-11-26 2015-11-26 Package device and its lead frame and manufacturing method of lead frame TWI563601B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW104139311A TWI563601B (en) 2015-11-26 2015-11-26 Package device and its lead frame and manufacturing method of lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW104139311A TWI563601B (en) 2015-11-26 2015-11-26 Package device and its lead frame and manufacturing method of lead frame

Publications (2)

Publication Number Publication Date
TWI563601B true TWI563601B (en) 2016-12-21
TW201719807A TW201719807A (zh) 2017-06-01

Family

ID=58227499

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104139311A TWI563601B (en) 2015-11-26 2015-11-26 Package device and its lead frame and manufacturing method of lead frame

Country Status (1)

Country Link
TW (1) TWI563601B (zh)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200522378A (en) * 2003-12-23 2005-07-01 Siliconware Precision Industries Co Ltd Photosensitive semiconductor device, method for fabricating the same and lead frame thereof
TW200537652A (en) * 2004-05-13 2005-11-16 Mitsubishi Electric Corp Semiconductor micro device
TW201017846A (en) * 2008-10-31 2010-05-01 Advanced Semiconductor Eng Leadframe and package structure having the same
TWM393039U (en) * 2010-04-29 2010-11-21 Kun Yuan Technology Co Ltd Wire holder capable of reinforcing sealing connection and packaging structure thereof
TW201442302A (zh) * 2013-03-05 2014-11-01 Nichia Corp 導線架及半導體裝置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200522378A (en) * 2003-12-23 2005-07-01 Siliconware Precision Industries Co Ltd Photosensitive semiconductor device, method for fabricating the same and lead frame thereof
TW200537652A (en) * 2004-05-13 2005-11-16 Mitsubishi Electric Corp Semiconductor micro device
TW201017846A (en) * 2008-10-31 2010-05-01 Advanced Semiconductor Eng Leadframe and package structure having the same
TWM393039U (en) * 2010-04-29 2010-11-21 Kun Yuan Technology Co Ltd Wire holder capable of reinforcing sealing connection and packaging structure thereof
TW201442302A (zh) * 2013-03-05 2014-11-01 Nichia Corp 導線架及半導體裝置

Also Published As

Publication number Publication date
TW201719807A (zh) 2017-06-01

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