TWI563559B - Method and apparatus for substrate rinsing and drying - Google Patents
Method and apparatus for substrate rinsing and dryingInfo
- Publication number
- TWI563559B TWI563559B TW103109702A TW103109702A TWI563559B TW I563559 B TWI563559 B TW I563559B TW 103109702 A TW103109702 A TW 103109702A TW 103109702 A TW103109702 A TW 103109702A TW I563559 B TWI563559 B TW I563559B
- Authority
- TW
- Taiwan
- Prior art keywords
- drying
- substrate rinsing
- rinsing
- substrate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/024—Cleaning by means of spray elements moving over the surface to be cleaned
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/041—Cleaning travelling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361783060P | 2013-03-14 | 2013-03-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201507017A TW201507017A (zh) | 2015-02-16 |
TWI563559B true TWI563559B (en) | 2016-12-21 |
Family
ID=51521867
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103109702A TWI563559B (en) | 2013-03-14 | 2014-03-14 | Method and apparatus for substrate rinsing and drying |
Country Status (6)
Country | Link |
---|---|
US (1) | US9786523B2 (zh) |
JP (1) | JP6118451B2 (zh) |
KR (1) | KR101763505B1 (zh) |
CN (1) | CN105026058B (zh) |
TW (1) | TWI563559B (zh) |
WO (1) | WO2014152910A1 (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5779168B2 (ja) * | 2012-12-04 | 2015-09-16 | 東京エレクトロン株式会社 | 周縁部塗布装置、周縁部塗布方法及び周縁部塗布用記録媒体 |
US9704730B2 (en) | 2013-05-28 | 2017-07-11 | Tokyo Electron Limited | Substrate cleaning apparatus, substrate cleaning method and non-transitory storage medium |
KR20170134089A (ko) | 2016-05-27 | 2017-12-06 | 세메스 주식회사 | 기판 처리 방법 및 장치 |
US11342202B2 (en) | 2018-08-17 | 2022-05-24 | Taiwan Semiconductor Manufacturing Co., Ltd. | Automated wafer cleaning |
KR20210009276A (ko) * | 2019-07-16 | 2021-01-26 | 도쿄엘렉트론가부시키가이샤 | 처리액 토출 노즐, 노즐 아암, 기판 처리 장치, 및 기판 처리 방법 |
JP7341825B2 (ja) * | 2019-09-27 | 2023-09-11 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
US11276157B2 (en) | 2019-11-14 | 2022-03-15 | Tokyo Electron Limited | Systems and methods for automated video analysis detection techniques for substrate process |
US12019370B2 (en) * | 2021-08-31 | 2024-06-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and system for manufacturing a semiconductor device |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020035762A1 (en) * | 2000-09-22 | 2002-03-28 | Seiichiro Okuda | Substrate processing apparatus |
US20030079764A1 (en) * | 2001-11-01 | 2003-05-01 | Keizo Hirose | Substrate processing apparatus and substrate processing method |
US20080169008A1 (en) * | 2005-02-17 | 2008-07-17 | Seokmin Yun | Enhanced wafer cleaning method |
US20100141910A1 (en) * | 2008-12-04 | 2010-06-10 | Asml Netherlands B.V. | Member with a cleaning surface and a method of removing contamination |
US20110139188A1 (en) * | 2009-12-11 | 2011-06-16 | Hsin-Ting Tsai | Wafer cleaning devcie and method thereof |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1388164A2 (en) | 2001-05-18 | 2004-02-11 | Lam Research Corporation | Apparatus and method for substrate preparation implementing a surface tension reducing process |
JP3993048B2 (ja) * | 2002-08-30 | 2007-10-17 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP2004098805A (ja) * | 2002-09-06 | 2004-04-02 | Oi Seisakusho Co Ltd | サンルーフのドレンキャップ取付構造 |
JP2004111857A (ja) * | 2002-09-20 | 2004-04-08 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
US7997288B2 (en) | 2002-09-30 | 2011-08-16 | Lam Research Corporation | Single phase proximity head having a controlled meniscus for treating a substrate |
US7051743B2 (en) | 2002-10-29 | 2006-05-30 | Yong Bae Kim | Apparatus and method for cleaning surfaces of semiconductor wafers using ozone |
US6770424B2 (en) | 2002-12-16 | 2004-08-03 | Asml Holding N.V. | Wafer track apparatus and methods for dispensing fluids with rotatable dispense arms |
US20050211267A1 (en) | 2004-03-26 | 2005-09-29 | Yao-Hwan Kao | Rinse nozzle and method |
US7968278B2 (en) | 2004-04-13 | 2011-06-28 | Tokyo Electron Limited | Rinse treatment method and development process method |
TWI286353B (en) * | 2004-10-12 | 2007-09-01 | Tokyo Electron Ltd | Substrate processing method and substrate processing apparatus |
US20070246079A1 (en) * | 2006-04-21 | 2007-10-25 | Xuyen Pham | Multi zone shower head for cleaning and drying wafer and method of cleaning and drying wafer |
JP4937678B2 (ja) * | 2006-08-29 | 2012-05-23 | 大日本スクリーン製造株式会社 | 基板処理方法および基板処理装置 |
KR100940136B1 (ko) * | 2006-08-29 | 2010-02-03 | 다이닛뽕스크린 세이조오 가부시키가이샤 | 기판처리방법 및 기판처리장치 |
CN101165854A (zh) * | 2006-10-19 | 2008-04-23 | 大日本网目版制造株式会社 | 基板处理装置和基板处理方法 |
JP5090089B2 (ja) | 2006-10-19 | 2012-12-05 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP5151629B2 (ja) | 2008-04-03 | 2013-02-27 | 東京エレクトロン株式会社 | 基板洗浄方法、基板洗浄装置、現像方法、現像装置及び記憶媒体 |
US20100154826A1 (en) | 2008-12-19 | 2010-06-24 | Tokyo Electron Limited | System and Method For Rinse Optimization |
JP2012114409A (ja) * | 2010-11-04 | 2012-06-14 | Tokyo Electron Ltd | 基板洗浄方法、基板洗浄装置及び基板洗浄用記憶媒体 |
JP5597602B2 (ja) * | 2011-07-25 | 2014-10-01 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及びその基板処理方法を実行させるためのプログラムを記録した記憶媒体 |
NL2009284A (en) | 2011-09-22 | 2013-10-31 | Asml Netherlands Bv | A cleaning substrate for a lithography apparatus, a cleaning method for a lithography apparatus and a lithography apparatus. |
-
2014
- 2014-03-14 US US14/211,303 patent/US9786523B2/en active Active
- 2014-03-14 CN CN201480013368.XA patent/CN105026058B/zh active Active
- 2014-03-14 JP JP2016502730A patent/JP6118451B2/ja active Active
- 2014-03-14 KR KR1020157028221A patent/KR101763505B1/ko active IP Right Grant
- 2014-03-14 TW TW103109702A patent/TWI563559B/zh active
- 2014-03-14 WO PCT/US2014/028199 patent/WO2014152910A1/en active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020035762A1 (en) * | 2000-09-22 | 2002-03-28 | Seiichiro Okuda | Substrate processing apparatus |
US20030079764A1 (en) * | 2001-11-01 | 2003-05-01 | Keizo Hirose | Substrate processing apparatus and substrate processing method |
US20080169008A1 (en) * | 2005-02-17 | 2008-07-17 | Seokmin Yun | Enhanced wafer cleaning method |
US20100141910A1 (en) * | 2008-12-04 | 2010-06-10 | Asml Netherlands B.V. | Member with a cleaning surface and a method of removing contamination |
US20110139188A1 (en) * | 2009-12-11 | 2011-06-16 | Hsin-Ting Tsai | Wafer cleaning devcie and method thereof |
Also Published As
Publication number | Publication date |
---|---|
JP6118451B2 (ja) | 2017-04-19 |
WO2014152910A1 (en) | 2014-09-25 |
CN105026058B (zh) | 2017-10-10 |
KR20150127677A (ko) | 2015-11-17 |
JP2016513888A (ja) | 2016-05-16 |
US20140261569A1 (en) | 2014-09-18 |
US9786523B2 (en) | 2017-10-10 |
TW201507017A (zh) | 2015-02-16 |
CN105026058A (zh) | 2015-11-04 |
KR101763505B1 (ko) | 2017-07-31 |
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