TWI562687B - Circuit board assembly - Google Patents

Circuit board assembly

Info

Publication number
TWI562687B
TWI562687B TW103132927A TW103132927A TWI562687B TW I562687 B TWI562687 B TW I562687B TW 103132927 A TW103132927 A TW 103132927A TW 103132927 A TW103132927 A TW 103132927A TW I562687 B TWI562687 B TW I562687B
Authority
TW
Taiwan
Prior art keywords
circuit board
board assembly
assembly
circuit
board
Prior art date
Application number
TW103132927A
Other languages
English (en)
Other versions
TW201613424A (en
Inventor
Po Yu Hsiao
Original Assignee
Wistron Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wistron Corp filed Critical Wistron Corp
Priority to TW103132927A priority Critical patent/TWI562687B/zh
Priority to CN201410529666.6A priority patent/CN105578706B/zh
Publication of TW201613424A publication Critical patent/TW201613424A/zh
Application granted granted Critical
Publication of TWI562687B publication Critical patent/TWI562687B/zh

Links

TW103132927A 2014-09-24 2014-09-24 Circuit board assembly TWI562687B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW103132927A TWI562687B (en) 2014-09-24 2014-09-24 Circuit board assembly
CN201410529666.6A CN105578706B (zh) 2014-09-24 2014-10-09 电路板组件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103132927A TWI562687B (en) 2014-09-24 2014-09-24 Circuit board assembly

Publications (2)

Publication Number Publication Date
TW201613424A TW201613424A (en) 2016-04-01
TWI562687B true TWI562687B (en) 2016-12-11

Family

ID=55888215

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103132927A TWI562687B (en) 2014-09-24 2014-09-24 Circuit board assembly

Country Status (2)

Country Link
CN (1) CN105578706B (zh)
TW (1) TWI562687B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109195325A (zh) * 2018-09-29 2019-01-11 维沃移动通信有限公司 一种电路板结构及电子设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200605740A (en) * 2004-03-19 2006-02-01 Hewlett Packard Development Co Apparatuses, systems and/or methods to affect impedance
TW201106819A (en) * 2006-05-08 2011-02-16 Ibiden Co Ltd Inductor and electric power supply using it
TW201141329A (en) * 2010-01-08 2011-11-16 Dainippon Printing Co Ltd Electronic component
TW201322846A (zh) * 2011-11-23 2013-06-01 Stemco Co Ltd 撓性電路板及包括該撓性電路板的顯示裝置暨撓性電路板的製造方法
TWM482251U (zh) * 2014-01-29 2014-07-11 Giant Technology Co Ltd 電路板散熱組件

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6691407B2 (en) * 2001-12-13 2004-02-17 Intel Corporation Methods for retaining assembled components
KR100800645B1 (ko) * 2006-08-09 2008-02-01 삼성전자주식회사 적층형 집적 모듈과 그 제조 방법
CN201278627Y (zh) * 2008-10-06 2009-07-22 鸿富锦精密工业（深圳）有限公司 电磁屏蔽装置
CN101877958B (zh) * 2009-04-28 2013-06-12 英业达股份有限公司 电子装置及其组装方法
CN102088837B (zh) * 2009-12-08 2014-12-10 深圳富泰宏精密工业有限公司 散热件及具有该散热件的便携式电子装置
KR101808478B1 (ko) * 2011-08-16 2017-12-12 인텔 코포레이션 Ｐｏｐ 구조체
CN102555314A (zh) * 2011-12-30 2012-07-11 深圳市爱诺菲科技有限公司 一种散热电磁波吸收贴片及其制作方法和应用
TW201410132A (zh) * 2012-08-16 2014-03-01 Wistron Corp 電磁屏蔽組件
CN202799566U (zh) * 2012-08-21 2013-03-13 东莞宇龙通信科技有限公司 电磁屏蔽组件及含有该电磁屏蔽组件电子器件
CN203353037U (zh) * 2012-12-28 2013-12-18 中怡(苏州)科技有限公司 无线模块
CN203233642U (zh) * 2013-03-08 2013-10-09 祝琼 一种具有层叠结构的吸波导磁屏蔽膜
CN103763893B (zh) * 2014-01-14 2016-04-13 广州方邦电子股份有限公司 电磁波屏蔽膜以及包含屏蔽膜的线路板的制作方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200605740A (en) * 2004-03-19 2006-02-01 Hewlett Packard Development Co Apparatuses, systems and/or methods to affect impedance
TW201106819A (en) * 2006-05-08 2011-02-16 Ibiden Co Ltd Inductor and electric power supply using it
TW201141329A (en) * 2010-01-08 2011-11-16 Dainippon Printing Co Ltd Electronic component
TW201322846A (zh) * 2011-11-23 2013-06-01 Stemco Co Ltd 撓性電路板及包括該撓性電路板的顯示裝置暨撓性電路板的製造方法
TWM482251U (zh) * 2014-01-29 2014-07-11 Giant Technology Co Ltd 電路板散熱組件

Also Published As

Publication number Publication date
CN105578706B (zh) 2018-08-17
TW201613424A (en) 2016-04-01
CN105578706A (zh) 2016-05-11

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