TWI562306B - Semiconductor device and method of forming rdl over contact pad with high alignment tolerance or reduced interconnect pitch - Google Patents

Semiconductor device and method of forming rdl over contact pad with high alignment tolerance or reduced interconnect pitch

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Publication number
TWI562306B
TWI562306B TW100125422A TW100125422A TWI562306B TW I562306 B TWI562306 B TW I562306B TW 100125422 A TW100125422 A TW 100125422A TW 100125422 A TW100125422 A TW 100125422A TW I562306 B TWI562306 B TW I562306B
Authority
TW
Taiwan
Prior art keywords
semiconductor device
contact pad
alignment tolerance
over contact
high alignment
Prior art date
Application number
TW100125422A
Other languages
English (en)
Other versions
TW201209978A (en
Inventor
Yaojian Lin
Kang Chen
Jianmin Fang
Xia Feng
Original Assignee
Stats Chippac Ltd
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Filing date
Publication date
Application filed by Stats Chippac Ltd filed Critical Stats Chippac Ltd
Publication of TW201209978A publication Critical patent/TW201209978A/zh
Application granted granted Critical
Publication of TWI562306B publication Critical patent/TWI562306B/zh

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TW100125422A 2010-07-26 2011-07-19 Semiconductor device and method of forming rdl over contact pad with high alignment tolerance or reduced interconnect pitch TWI562306B (en)

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